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DB3

DB3

  • 厂商:

    STMICROELECTRONICS(意法半导体)

  • 封装:

    DO-204AH, DO-35, Axial

  • 描述:

    DO35-2 36V 0.3A

  • 数据手册
  • 价格&库存
DB3 数据手册
DB3, DB4, SMDB3 Datasheet Diac Features DO-35 2 • VBO : 32 V and 40 V • • Low breakover current Breakover voltage symmetry : 3V • ECOPACK®2 compliant Applications 3 1 SOT-23 Pin 1 and 3 must be shorted together • • • Triggering device for Triac or SCR based motor / light dimmer 32 V trigger device for oscillator circuit Start up triggering in lighting ballast for CFL, TL or LED lamps Description Functioning as a trigger diode with a fixed voltage reference, the DB3/DB4 series can be used in conjunction with triacs for simplified gate control circuits or as a starting element in fluorescent lamp ballasts. The surface mount SOT23-3L package allows compact, SMD based designs for automated manufacturing. Product status link DB3 DB4 SMDB3 Product summary Part number VBO SMDB3 28 - 36 V DB3 28 - 36 V DB4 35 - 45 V DS2125 - Rev 3 - December 2018 For further information contact your local STMicroelectronics sales office. www.st.com DB3, DB4, SMDB3 Characteristics 1 Characteristics Table 1. Absolute maximum ratings (limiting values), Tj = 25 °C unless otherwise specified Symbol Parameter Value Unit SMDB3 1.00 A DB3 / DB4 2.00 A ITRM Repetitive peak on-state current, tp = 20 µs, F = 120 Hz Tstg Storage junction temperature range -40 to +125 °C Operating junction temperature range -40 to +125 °C Tj Table 2. Electrical characteristics (Tj = 25 °C unless otherwise specified) Symbol VBO Parameter Test conditions Breakover voltage (1) I VBO1 - VBO2 I Breakover voltage symmetry SMDB3 DB3 DB4 Unit Min. 28 28 35 Typ. 32 32 40 Max. 36 36 45 C = 10 nF(2) Max. 3 3 3 V C = 10 nF (2) V ΔV Dynamic breakover voltage (1) VBO and VF at 10 mA Min. 10 5 5 V VO Output voltage (1) See Figure 2. Test circuit, (R = 20 Ω) Min. 10 5 5 V Max. 10 50 50 µA IBO Breakover current (1) C = 10 nF (2) tr Rise time (1) See Figure 3. Rise time measurement Max. 0.5 2 2 µs IR Leakage current (1) VR = 0.5 x VBO max Max. 1 10 10 µA IP Peak current (1) See Figure 2. Test circuit Min. 1 0.30 0.30 A 1. Applicable to both forward and reverse directions. 2. Connected in parallel to the device DS2125 - Rev 3 page 2/11 DB3, DB4, SMDB3 Characteristics Figure 1. Voltage - current characteristic curve. +IF 10 mA IBO IB -V 0,5 V BO ΔV VF +V VBO - IF Figure 2. Test circuit 10 kΩ 220 V 50 Hz 500 kΩ D.U.T Rs = 0 C = 0.1 µF IP Vo T410 R = 20 Ω DS2125 - Rev 3 page 3/11 DB3, DB4, SMDB3 Characteristics Figure 3. Rise time measurement lp 90 % 10 % tr DS2125 - Rev 3 page 4/11 DB3, DB4, SMDB3 Characteristics (curves) 1.1 Characteristics curves Figure 4. Relative variation of VBO versus junction temperature (typical values) Figure 5. On-state RMS current versus Triac gate current pulse duration tp VBO [T j ] / V BO [T j =25 °C] ITRM(A) 1.05 10.0 DB3 / DB4 1.00 f = 120 Hz Tj initial = 25°C DB3 / DB4 0.95 1.0 SMDB3 0.90 SMDB3 0.85 Tj (°C) 0.80 -40 -20 0 20 40 60 80 100 120 tp(µs) 0.1 1 10 100 Figure 6. Triac gate current pulse duration tp (to have IP > 50 mA) versus Rs and C values (typical values) tP(s) 50E-6 68 Ω 40E-6 47 Ω 30E-6 33 Ω 20E-6 22 Ω 10E-6 0Ω 00E+0 10E-9 Note: DS2125 - Rev 3 100E-9 10 Ω C(F) 1E-6 according to Figure 2. Test circuit page 5/11 DB3, DB4, SMDB3 Package information 2 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. 2.1 SOT23 package information Figure 7. SOT23-3L package outline B L 3 E H 1 2 e S c e1 D 0.25 Gauge plane A a Seating plane L1 A1 DS2125 - Rev 3 L page 6/11 DB3, DB4, SMDB3 SOT23-3L package information Table 3. SOT23-3L package mechanical data Dimensions Ref. Millimeters Min. Inches (for reference only) Typ. Max. Min. Typ. Max. A 0.89 1.40 0.0350 0.0551 A1 0.00 0.10 0.0000 0.0039 B 0.30 0.51 0.0118 0.0201 C 0.085 0.18 0.0033 0.0071 D 2.75 3.04 0.1083 0.1197 e 0.85 1.05 0.0335 0.0413 e1 1.70 2.10 0.0669 0.0827 E 1.20 1.75 0.0472 0.0689 H 2.10 3.00 0.0827 0.1181 L 0.60 0.0236 S 0.35 0.65 0.0138 0.256 L1 0.25 0.55 0.0098 0.0217 a 0° 8° 0° 8° Figure 8. SOT23-3L footprint in mm 2.42 0.97 0.73 2.89 0.79 0.395 1.05 0.48 DS2125 - Rev 3 page 7/11 DB3, DB4, SMDB3 DO-35 package information 2.2 DO-35 package information Figure 9. DO-35 package outline C C A ØD ØB Table 4. DO-35 package mechanical data Dimensions Ref. DS2125 - Rev 3 Millimeters Inches (for reference only) Min. Max. Min. Max. A 3.05 4.50 0.120 0.177 B 1.53 2.00 0.060 0.079 C 28.00 31.00 1.102 1.220 D 0.46 0.55 0.018 0.022 page 8/11 DB3, DB4, SMDB3 Ordering information 3 Ordering information Figure 10. Ordering information scheme SM DB 3 Surface mount version Diac series Breakover voltage 3 = VBO typ. = 32 V 4 = VBO typ. = 40 V Table 5. Ordering information DS2125 - Rev 3 Order code Marking Package Weight Base qty. Delivery mode SMDB3 DB3 SOT-23 0.01 g 3000 Tape and reel DB3 DB3 (Blue Body Coat) 0.15 g 5000 Tape and reel DB4 DB4 (Blue Body Coat) 0.15 g 5000 Tape and reel DO-35 page 9/11 DB3, DB4, SMDB3 Revision history Table 6. Document revision history DS2125 - Rev 3 Date Version Changes 18-Jun-2018 2 First release. 14-Dec-2018 3 Minor text change to improve readability. page 10/11 DB3, DB4, SMDB3 IMPORTANT NOTICE – PLEASE READ CAREFULLY STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement. Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers’ products. No license, express or implied, to any intellectual property right is granted by ST herein. Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. ST and the ST logo are trademarks of ST. All other product or service names are the property of their respective owners. Information in this document supersedes and replaces information previously supplied in any prior versions of this document. © 2018 STMicroelectronics – All rights reserved DS2125 - Rev 3 page 11/11

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DB3
    •  国内价格
    • 1+0.27050

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