DLPF-GP-01D3

DLPF-GP-01D3 Dual differential filter with integrated matching for GreenPeak transceiver Datasheet - production data Description RF2N The DLPF-GP-01D3 is an ultra miniature dual differential filter tailored for GreenPeak Zigbee/RF4CE RF transceivers. ANT2N GND2 The DLPF-GP-01D3 integrates also matching network and replaces 16 SMD components. Matching impedance has been customized for GreenPeak Zigbee/RF4CE RF transceivers. It is using STMicroelectronics IPD technology on nonconductive Glass substrate which optimize RF performances. ANT2P RF2P VCM Figure 1. Reference schematic (a) RF1N ANT1N GND1 ANT1P RF1P Bump view Features *3 • Nominal Input / conjugate match to GreenPeak • Low loss dual-channel differential filter • Low loss dual-channel common-mode filter • Small footprint < 1.2 x 3.4 mm² • Very low profile (< 560 µm after reflow) • High RF performance • RF BOM and area reduction Applications • 2.45 GHz impedance matched dual-differential filter • Optimized for GreenPeak GP540 and GP561 circuits October 2014 This is information on a product in full production. a. Courtesy of GreenPeak. DocID026812 Rev 1 1/9 www.st.com Absolute maximum ratings 1 DLPF-GP-01D3 Absolute maximum ratings Table 1. Absolute maximum ratings (limiting value) Value Symbol Parameter Unit Min. Typ. Max. PIN VESD TOP 2/9 Input Power RFIN 20 dBm ESD Ratings MIL STD883C (HBM:C=100 pF, R=1.5 kΩ, Air discharge) 800 V ESD ratings machine model (MM: C=200 pF, R=25 Ω, L=500 nH) 550 V Operating temperature -40 DocID026812 Rev 1 +80 ºC DLPF-GP-01D3 2 Electrical characteristics Electrical characteristics Table 2. Impedances Value Symbol ZOUT ZIN Parameter Unit Min. Typ. Max. Nominal differential output impedance - Conjugate match to GreenPeak IC - Ω Nominal differential input impedance - 100 - Ω Table 3. RF performance Value Symbol Parameter Test condition Unit Min. TOP Typ. Max. Operating temperature - -40 +80 °C f Frequency range (bandwidth) - 2400 2500 MHz IL Insertion loss in bandwidth -1.45 -1.7 dB -16 -11 dB -15 -10.5 dB RL_ANT Return loss in bandwidth RL_IC Return loss in bandwidth Tj = 25 °C 2f0 2f0 attenuation -41 -37 dB 3f0 3f0 attenuation -34 -28 dB DocID026812 Rev 1 3/9 9 Electrical characteristics 2.1 DLPF-GP-01D3 RF measurements (on board) Figure 2. Differential transmission Figure 3. DIFF mode insertion loss (dB) Figure 4. DIFF mode - 2f0 second harmonic (dB) Figure 5. DIFF mode - 3f0 third harmonic (dB) Figure 6. Return loss on ANT side (dB) 4/9 Figure 7. Return loss on IC side (dB) DocID026812 Rev 1 DLPF-GP-01D3 Package mechanical data In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. Figure 8. Mechanical specifications (bump view) 5)1 $171 *1' $173 5)3 PP 3 Package mechanical data 9&0  5)1 $171 $173     $171      $173     $171     5)3   *1'  5)1    9&0   5)3   *1'   5)1   *1' $173 5)3 PP —P DocID026812 Rev 1 5/9 9 Package mechanical data DLPF-GP-01D3 Figure 9. Layout recommendations No extra components required thanks to DLPF-GP-01D3. Dimensions (distances) from center pad to center pad (filter GP chip) shall be respected as much as possible in order to avoid any deviation in performances. Figure 10. Footprint - non solder mask defined Copper pad diameter: 220 µm recommended 180 µm minimum 260 µm maximum Figure 11. Footprint - solder mask defined Solder mask opening : 220 µm recommended 180 µm minimum 260 µm maximum Solder mask opening: 320 µm recommended 300 µm minimum 340 µm maximum Copper pad diameter : 320 µm recommended 300 µm minimum Solder stencil opening: 220 µm recommended Solder stencil opening : 220 µm recommended Line to connect copper pad on solder mask opening shopuld be smaller than copper pad diameter 6/9 DocID026812 Rev 1 DLPF-GP-01D3 Package mechanical data Figure 12. Marking specification Figure 13. Footprint coordinates 5)3 $173 *1' $171 5)1 9&0  XZZ YWW 5)3 $173 $173 $171 $173 $171 5)3 *1' 5)1 9&0 5)3 *1' 5)1                        *1' $171 5)1 Figure 14. Tape and reel specification Note: The dimensions shown on this proposed drawing are for illustrative purpose. Dimensions from actual carrier may vary slightly More information is available in the application notes AN2348: “Flip Chip: Package description and recommendations for use”. DocID026812 Rev 1 7/9 9 Ordering information 4 DLPF-GP-01D3 Ordering information Table 4. Ordering information 5 Part number Marking Weight Base qty Delivery mode DLPF-GP-01D3 SW 4.43 mg 5000 Tape and reel Revision history Table 5. Document revision history 8/9 Date Revision 10-Oct-2014 1 Changes Initial release. DocID026812 Rev 1 DLPF-GP-01D3 IMPORTANT NOTICE – PLEASE READ CAREFULLY STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement. Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers’ products. No license, express or implied, to any intellectual property right is granted by ST herein. Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. ST and the ST logo are trademarks of ST. All other product or service names are the property of their respective owners. Information in this document supersedes and replaces information previously supplied in any prior versions of this document. © 2014 STMicroelectronics – All rights reserved DocID026812 Rev 1 9/9 9