EMIF02-SPK03F2

EMIF02-SPK03F2 2-channel EMI filter and ESD protection for speaker phone Datasheet − production data Features ■ 2-channel EMI symmetrical (I/O) low-pass filter ■ High efficiency in EMI filtering: – S21 attenuation, -40 dB at 900 MHz – Xtalk, in audio band, -60 dB ■ Very low PCB space consumption: 0.89 x 1.26 mm Flip Chip (5 bumps) ■ Very thin package: 0.6 mm after reflow ■ High efficiency in ESD suppression on input pins (IEC 61000-4-2 level 4) Figure 1. Pin configuration (bump side) ■ High reliability offered by monolithic integration 3 ■ High reduction of parasitic elements through integration and wafer level packaging O1 ■ 1 2 I1 Packaged in lead-free Flip Chip A B GND Complies with the following standards ■ IEC 61000-4-2 level 4: – ±15 kV (air discharge) – ±8 kV (contact discharge) Figure 2. Mobile phones ■ Portable devices ■ Connectivity devices C Functional schematic Application ■ I2 O2 L I1 O1 C C L Description I2 The EMIF02-SPK03F2 chip is a highly integrated device designed to suppress EMI/RFI noise for interface line filtering. O2 C C The EMIF02-SPK03F2 is 2-channel, ultra compact, high attenuation filter available in 0.5 mm pitch WLCSP package. Additionally, this filter includes ESD protection circuitry, which prevents damage to the protected device when subjected to ESD surges up 30 kV. June 2012 This is information on a product in full production. Doc ID 023219 Rev 1 1/10 www.st.com 10 Characteristics 1 EMIF02-SPK03F2 Characteristics Table 1. Absolute maximum ratings (Tamb = 25 °C) Symbol Value Unit VPP ESD discharge IEC 61000-4-2(1) Air discharge Contact discharge 30 kV ISPK Maximum rms currrent per channel 800 mA Maximum junction temperature 125 °C -30 to 85 °C -55 to + 150 °C Tj Parameter Top Operating temperature range Tstg Storage temperature range 1. Measurements done on IEC 61000-4-2 test bench. For further details see Application note AN3353, “IEC 61000-4-2 standard testing”. Figure 3. Electrical characteristics - definitions Symbol VBR VCL IRM VRM IPP = = = = = Parameter Breakdown voltage Clamping voltage Leakage current @ VRM Stand-off voltage Peak pulse current I = Breakdown current = Dynamic resistance R Rd IPP Slope: 1/Rd VCL VCL Slope: 1/Rd Table 2. Electrical characteristics - values (Tamb = 25 °C) Symbol VBR IR = 1 mA Min. Typ. Max. 6 tp = 100 ns IRM VRM = 3 V per line Cline 2/10 Test conditions Rd RDC_L IPP V Ω 0.2 DC resistance of the inductor 0.07 Vline = 0 V, VOSC = 30 mV, F = 1 MHz 250 Doc ID 023219 Rev 1 Unit 0.3 µA 0.1 Ω pF EMIF02-SPK03F2 Figure 4. Characteristics Insertion losses versus frequency EMIF02-SPK03F2 APLAC 8.21 User: F:Cust# 8463:STMicroelectronics - Tours:AWR Corporation:RP=111 0 S21 -10 dB -20 -30 -40 -50 -60 300k 1M 3M 10M 30M F/Hz 100M I1-O1 Figure 5. 300M 1G 3G I2-O2 Analog crosstalk versus frequency EMIF02-SPK03F2 APLAC 8.21 User: F:Cust# 8463:STMicroelectronics - Tours:AWR Corporation:RP=111 0 XTalk -10 dB -20 -30 -40 -50 -60 -70 300k 1M 3M 10M 30M F/Hz 100M 300M 1G 3G I1-O2 Doc ID 023219 Rev 1 3/10 Characteristics EMIF02-SPK03F2 Figure 6. Audio band analog crosstalk Figure 7. Clamping voltage VCL versus peak pulse current IPP for short pulse duration such as ESD surges Ipp (A) 32 30 28 26 24 22 20 18 16 14 12 10 8 6 4 2 0 Triangular pulse tP = 100 ns Direct and reverse polarity TJ initial = 25 °C V CL (V) 0 Note: 4/10 2 4 6 8 10 12 14 16 For further information on the dynamic characteristic see the STMicroelectronics’ application note AN4022, “TVS short pulse Rd measurement and correlation with TVS clamping voltage during ESD”. Doc ID 023219 Rev 1 EMIF02-SPK03F2 Figure 8. Characteristics ESD test conditions 2 x -20 dB 50 Ω input Figure 9. Output filter ESD response to IEC 61000-4-2 (+30 kV contact discharge) Ix to Ox Doc ID 023219 Rev 1 5/10 Characteristics EMIF02-SPK03F2 Figure 10. Output filter ESD response to IEC 61000-4-2 (-30 kV contact discharge) Ix to Ox Figure 11. Total harmonic distortion plus noise 6/10 Doc ID 023219 Rev 1 EMIF02-SPK03F2 2 Ordering information scheme Ordering information scheme Figure 12. Ordering information scheme EMIF yy - xxx zz Fx EMI Filter Number of lines Information x = resistance value (Ohms) z = capacitance value / 10(pF) or 3 letters = application 2 digits = version Package F = Flip Chip x = 2: lead-free, pitch = 500 µm, bump = 255 µm Doc ID 023219 Rev 1 7/10 Package information 3 EMIF02-SPK03F2 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. Figure 13. Package dimensions 500 µm ±10 650 µm ±65 0µ m ±1 5 1.26 mm ±50 µm 315 µm ±50 50 435 µm 250 µm ±10 0.89 mm ±50 µm Figure 14. Footprint Figure 15. Marking Dot, ST logo ECOPACK status xx = marking z = manufacturing location yww = datecode (y = year ww = week) Copper pad Diameter: 250 µm recommended, 300 µm max. Solder stencil opening: 330 µm recommended x x z y ww Solder mask opening recommendation: 340 µm min. for 315 µm copper pad diameter 8/10 Doc ID 023219 Rev 1 EMIF02-SPK03F2 Ordering information Figure 16. Tape and reel specification Dot identifying Pin A1 location 2.0 Ø 1.55 4.0 8.0 3.5 1.39 1.75 0.22 ST ST ST xxz yww xxz yww xxz yww 4.0 1.02 0.73± 0.05 All dimensions are typical values in mm Note: User direction of unreeling More information is available in the application notes: AN1235,”IPAD™ 400 µm Flip Chip: package description and recommendations for use” AN1751, “EMI filters: recommendations and measurements” 4 Ordering information Table 3. 5 Ordering information Order code Marking Package Weight Base qty Delivery mode EMIF02-SPK03F2 JX Flip Chip 1.8 mg 5000 Tape and reel 7” Revision history Table 4. Document revision history Date Revision 19-Jun-2012 1 Changes Initial release. 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