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EMIF08-2005QEJ

EMIF08-2005QEJ

  • 厂商:

    STMICROELECTRONICS(意法半导体)

  • 封装:

    QFN16

  • 描述:

    IC EMI FILTER/ESD PROT 16-QFN

  • 数据手册
  • 价格&库存
EMIF08-2005QEJ 数据手册
EMIF08-2005QEJ ® IPAD™ EMI FILTER INCLUDING ESD PROTECTION APPLICATIONS: Where EMI filtering in ESD sensitive equipment is required : ■ Computers and printer ■ Communication systems ■ Mobile phones DESCRIPTION The EMIF08-2005QEJ is a highly integrated device designed to suppress EMI/RFI noise in all systems subjected to electromagnetic interferences. Additionally, the EMIF08-2005QEJ filter includes an ESD protection circuitry which prevents destruction when subjected to ESD discharge up to 15kV. BENEFITS ■ EMI symmetrical low-pass filter 2 ■ Low PCB space consuming: 9 mm ■ Very thin package < 1 mm ■ High reliability offered by monolithic integration 16 15 14 13 1 12 2 11 3 10 4 9 5 6 7 8 QFN 3x3mm 16 pins Table 1: Order Code Part Number EMIF08-2005QEJ Marking EM08 Figure 2: Pin Configuration Low-pass Filter Input Output 1 16 COMPLIES WITH THE FOLLOWING STANDARDS: Low-pass Filter IEC61000-4-2: Input Output 2 15kV (air discharge) 8kV (contact discharge) MIL STD 883E - Method 3015-7 Class 3: 25kV (human body test) 15 Low-pass Filter Input Output 3 14 Low-pass Filter Input Output 4 13 Figure 3: Basic Cell Configuration Low-pass Filter Input Output 5 12 Low-pass Filter Low-pass Filter Input Input Output 6 Output 11 Low-pass Filter Input Output 7 R = 200Ω C = 50pF max. 10 Low-pass Filter Input 8 Output 9 TM: IPAD is a trademark of STMicroelectronics. April 2005 REV. 4 1/6 EMIF08-2005QEJ Table 2: Absolute Ratings (Tamb = 25°C) Symbol VPP Tj Tstg TL Parameter and test conditions Value Unit ± 15 ±8 kV 125 °C - 55 +150 °C 260 °C EC61000-4-2 air discharge IEC61000-4-2 contact discharge ESD discharge Junction temperature Storage temperature range Maximum lead temperature for soldering Table 3: Electrical Characteristics (Tamb = 25 °C) Symbol Parameter VBR Breakdown voltage IRM Leakage current @ VRM VRM Stand-off voltage VCL Clamping voltage IPP Peak pulse current αT Voltage temperature coefficient VF Forward voltage drop IF VBR VCL Series resistance between Input & Output Cline Input capacitance per line Test conditions VBR IR = 1 mA IRM VRM = 3V per line Rd IPP = 10A, tp = 2.5µs RI/O Cin 2/6 VF VRM V IRM RI/O Symbol I Slope = 1/Rd Min. Typ. Max. Unit 6 8 10 V 500 nA Ω 1 180 Vbias = 0V F = 1MHz Vosc = 30mV IPP 200 220 Ω 45 50 pF EMIF08-2005QEJ Figure 3: Filtering behavior Figure 4: Capacitance versus reverse applied voltage EMIF08: S21(dB) response Aplac 7.62 User: STMicroelectronics Nov 05 2002 CLine(pF) -5.00 60 -10.00 50 40 -15.00 C(V) 30 -20.00 20 10 -25.00 0 -30.00 0.0 100.0k 1.0M 10.0M EMIF08-2005QEJ 100.0M 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 VR(V) 1.0G f/Hz Figure 5: Ordering Information Scheme EMIF 08 - xx zz QEJ EMI Filter Number of lines Information x = resistance value / 10(Ohms) z = capacitance value / 10(pF) Package QEJ = QFN 3mm x 3mm 3/6 EMIF08-2005QEJ Figure 6: QFN Package Mechanical Data DIMENSIONS A3 A REF. Millimeters Min. A1 D A 0.80 A1 0 A3 b e b D2 E2 Figure 7: Foot Print Dimensions (in millimeters) 0.30 0.30 1.00 1.40 4/6 0.05 0.20 0.30 0.012 0.118 1.55 0.049 0.061 0.118 1.55 0.049 0.50 L 0.002 0.008 3.00 1.25 Max. 0.039 0.30 0.007 1.25 K Typ. 0 3.00 e D2 Min. 1.00 0.031 0.18 E E E2 Max. 0.20 D L Typ. Inches 0.061 0.020 0.008 0.40 0.50 0.012 0.016 0.020 EMIF08-2005QEJ Table 4: Ordering Information Ordering code Marking Package Weight Base qty Delivery mode EMIF08-2005QEJ EM08 QFN 3x3 16 pins 22.1 mg 3000 Tape & reel Table 5: Revision History Date Revision Dec-2002 2A 03-Jan-2005 3 Minor template update. No content change. 4 QFN package mechanical data update: 1/ References A typ., A1 typ., b typ. D2 typ. and E2 typ. removed. 2/ Reference D2 changed from 0.25 min. to 1.25 min. and from 1.25 max. to 1.55 max. 3/ Reference E2 changed from 0.25 min. to 1.25 min. and from 1.25 max. to 1.55 max. 4/ Footprint updated, in compliance with IPC-SM-782. 01-Apr-2005 Description of Changes Last issue. 5/6 EMIF08-2005QEJ Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners © 2005 STMicroelectronics - All rights reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America www.st.com 6/6
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