IRF740
N-channel 400V - 0.46Ω - 10A TO-220
PowerMESH™ II Power MOSFET
General features
Type
VDSS
(@Tjmax)
RDS(on)
ID
IRF740
400V
ID(on) x RDS(on)max,
ID = 6A
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V
2
1
50
µA
µA
± 100
nA
3
4
V
0.46
0.55
Ω
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Min.
Unit
Typ.
)
s
t(
Max.
Unit
7
S
1400
220
27
pF
pF
pF
VDD = 200V, ID = 5A,
RG = 4.7Ω, VGS = 10V
(see Figure 12)
17
10
ns
ns
VDD=320V, ID = 10.7A
VGS =10V
35
11
12
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VDS =25V, f=1 MHz,
VGS=0
1. Pulsed: pulse duration=300µs, duty cycle 1.5%
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Max.
400
VDS = Max rating @125°C
Dynamic
Symbol
Typ.
VDS = Max rating,
IDSS
Table 5.
Min.
43
nC
nC
nC
IRF740
Electrical characteristics
Table 6.
Source drain diode
Symbol
Max
Unit
Source-drain current
10
A
ISDM(1)
Source-drain current (pulsed)
40
A
VSD(2)
Forward on voltage
1.6
V
ISD
trr
Qrr
IRRM
Parameter
Test conditions
Min
Typ.
ISD=10A, VGS=0
ISD=10A,
Reverse recovery time
Reverse recovery charge
Reverse recovery current
370
3.2
17
di/dt = 100A/µs,
VDD=100V, Tj=150°C
(see Figure 12)
ns
µC
A
1. Pulse width limited by safe operating area
2. Pulsed: pulse duration=300µs, duty cycle 1.5%
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Electrical characteristics
IRF740
2.1
Electrical characteristics (curves)
Figure 1.
Safe operating area
Figure 2.
Thermal impedance
Figure 3.
Output characterisics
Figure 4.
Transfer characteristics
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Figure 5.
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Transconductance
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Figure 6.
Static drain-source on resistance
IRF740
Electrical characteristics
Figure 7.
Gate charge vs gate-source voltage Figure 8.
Figure 9.
Normalized gate threshold voltage
vs temperature
Capacitance variations
Figure 10. Normalized on resistance vs
temperature
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Figure 11. Source-drain diode forward
characteristics
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Test circuit
3
IRF740
Test circuit
Figure 12. Switching times test circuit for
resistive load
Figure 13. Gate charge test circuit
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Figure 14. Test circuit for inductive load
Figure 15. Unclamped Inductive load test
switching and diode recovery times
circuit
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Figure 16. Unclamped inductive waveform
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Figure 17. Switching time waveform
IRF740
4
Package mechanical data
Package mechanical data
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a Lead-free second level interconnect . The category of
second level interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an ST trademark.
ECOPACK specifications are available at: www.st.com
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Package mechanical data
IRF740
TO-220 MECHANICAL DATA
mm.
DIM.
MIN.
TYP
MAX.
4.60
0.173
0.181
b
0.61
0.88
0.024
0.034
b1
1.15
1.70
0.045
0.066
c
0.49
0.70
0.019
0.027
D
15.25
15.75
0.60
0.620
E
10
10.40
0.393
0.409
e
2.40
2.70
0.094
0.106
e1
4.95
5.15
0.194
0.202
F
1.23
1.32
0.048
0.052
)
s
t(
H1
6.20
6.60
0.244
0.256
J1
2.40
2.72
0.094
0.107
L
13
14
0.511
0.551
L1
3.50
3.93
0.137
d
o
r
0.645
28.90
1.137
øP
3.75
3.85
Q
2.65
2.95
u
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0.147
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e
let
0.104
uc
0.154
16.40
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10/12
TYP.
4.40
L30
s
b
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MIN.
A
L20
t
e
l
o
inch
MAX.
0.151
0.116
IRF740
5
Revision history
Revision history
Table 7.
Revision history
Date
Revision
Changes
09-Sep-2004
3
Complete version,new datasheet according to
PCN DSG/CT/2C14. special marking: IRF740 @
03-Aug-2006
4
New template, no content change
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IRF740
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