M3004LD

M3004LAB1 M3004LD REMOTE CONTROL TRANSMITTER . . . . . . . . . . FLASHED OR MODULATED TRANSMISSION 7 SUB-SYSTEM ADDRESSES UP TO 64 COMMANDS PER SUB-SYSTEM ADDRESS HIGH-CURRENT REMOTE OUTPUT AT VDD = 6V (– IOH = 80mA) LOW NUMBER OF ADDITIONAL COMPONENTS KEY RELEASE DETECTION BY TOGGLE BITS VERY LOW STAND-BY CURRENT (< 2µA) OPERATIONAL CURRENT < 1mA AT 6V SUPPLY SUPPLY VOLTAGE RANGE 2 TO 6.5V CERAMIC RESONATOR CONTROLLED FREQUENCY (typ. 450kHz) DIP20 (Plastic Package) ORDER CODE : M3004LAB1 SO20 (Plastic Package) ORDER CODE : M3004LD PIN CONNECTIONS REMO 1 2 3 4 5 6 7 8 9 10 20 19 DESCRIPTION The M3004LAB1/M3004LD transmitter IC are designed for infrared remote control systems. It has a total of 448 commands which are divided into 7 sub-system groups with 64 commands each. The sub-system code may be selected by a press button, a slider switch or hard wired. The M3004LAB1/M3004LD generate the pattern for driving the output stage. These patterns are pulse distance coded. The pulses are infrared flashes or modulated. The transmission mode is defined in conjunction with the sub-system address. Modulated pulses allow receivers with narrow-band preamplifiers for improved noise rejection to be used. Flashed pulses require a wide-band preamplifier within the receiver. June 1992 VDD DRV 6N DRV 6N DRV 6N DRV 6N DRV 6N DRV 6N DRV 6N OSC OUT OSC IN 3004L-01.EPS SEN 6N SEN 5N SEN 4N SEN 3N SEN 2N SEN 1N SEN 0N ADRM VSS 18 17 16 15 14 13 12 11 1/10 M3004LAB1 - M3004LD BLOCK DIAGRAM DRV OUTPUTS 0N 1N 2N 3N 4N 5N 6N 0N S 1N E N 2N I 3N N P 4N U T S 5N 6N ADRM KEYBOARD SCAN PULSE DISTANCE MODULATOR REMO OUTPUT VDD V SS OSCI OSCO INPUTS AND OUTPUTS Key matrix inputs and outputs (DRV0N to DRV6N and SEN0N to SEN6N) The transmitter keyboard is arranged as a scanned matrix. The matrix consists of 7 driver outputs and 7 sense inputs as shown in Figure 1. The driver outputs DRV0N to DRV6N are open drain N-channel tran-sistors and they are conductive in the stand-by mode. The 7 sense inputs (SEN0N to SEN6N) enable the generation of 56 command codes. With 2 external diodes all 64 commands are addressable. The sense inputs have P-channel pull-up transistors so that they are HIGH until they are pulled LOW by connecting them to an output via a key depression to initiate a code transmission. ADDRESS MODE INPUT (ADRM) The sub-system address and the transmission mode are defined by connecting the ADRM input to one or more driver outputs (DRV0N to DRV6N) of the key matrix. If more than one driver is connected to ADRM, they must be decoupled by diode s. This allows the definition of seven sub-system addresses as shown in table 3. If driver DRV6N is connected to ADRM, the data output format of REMO is modulated or if not connected, flashed. The ADRM input has switched pull-up and pulldown loads. In the stand-by mode only the pulldown device is active. Whether ADRM is open (sub-system address 0, flashed mode) or connected to the driver outputs, this input is LOW and will not cause unwanted dissipation. When the transmitter becomes active by pressing a key, the pull-down device is switched off and the pull-up device is switched on, so that the applied driver signals are sensed for the decoding of the sub-system address and the mode of transmission. The arrangement of the sub-system address coding is such that only the driver DRVnM with the highest number (n) defines the sub-system address, e.g. if drivers DRV2N and DRV4N are connected to ADRM, only DRV4N will define the sub-system address. This option can be used in systems requiring more than one sub-system address. The transmitter may be hard-wired for subsystem address 2 by connectingDRV1N to ADRM. If now DRV3N is added to ADRM by a key or a switch, the transmitted sub-system address changes to 4. A change of the sub-system address will not start a transmission. 2/10 3004L-02.EPS OSCILLATOR CONTROL LOGIC M3004LAB1 - M3004LD REMOTE CONTROL SIGNAL OUTPUT (REMO) The REMO signal output stage is a push-pull type. In the HIGH state, a bipolar emitter-follower allows a high output current. The timing of the data output format is listed in tables 1 and 2. The information is defined by the distance tb between the leading edges of the flashed pulses or the first edge of the modulated pulses (see Figure 3). The format of the output data is given in Figures 2 and 3. The data word starts with two toggle bits T1 and T0, followed by three bits for defining the sub-system address S2, S1 and S0, and six bits F, E, D, C, B and A which are defined by the selected key. In the modulated transmission mode the first toggle bit is replaced by a constant reference time bit (REF). This can be used as a reference time for the decoding sequence. The toggle bits function is an indication for the decoder that the next instruction has to be considered as a new command. The codes for the sub-system address and the selected key are given in tables 3 and 4. The REMO output is protected against ”Lock-up”, i.e. the length of an output pulse is limited to < 1ms, even if the oscillator stops during an output pulse. This avoids the rapid discharge of the battery that would otherwise be caused by the continuous activation of the LED. OSCILLATOR INPUT / OUTPUT (OSCI and OSCO) The external components must be connected to these pins when using an oscillator with a ceramic resonator. The oscillator frequency may vary between 350kHz and 600kHz as defined by the resonator. FUNCTIONAL DESCRIPTION Keyboard operation In the stand -by mode all drivers (DRV0N to DRV6N) are on (low impedance to VSS). Whenever a key is pressed, one or more of the sense inputs (SENnN) are tied to ground. This will start the power-up sequence. First the oscillator is activated and after the debounce time tDB (see Figure 4) the output drivers (DRV0N to DRV6N) become active successively. Within the first scan cycle the transmission mode, the applied sub-system address and the selected command code are sensed and loaded into an internal data latch. In contrast to the command code, the sub-system is sensed only within the first scan cycle. If the applied sub-system address is changed while the command key is pressed, the transmitted sub-system address is not altered. In a multiple key stroke sequence (see Figure 5) the command code is always altered in accordance with the sensed key. MULTIPLE KEY-STROKE PROTECTION The keyboard is protected against multiple keystrokes. If more than one key is pressed at the same time, the circuit will not generatea new output at REMO (see Figure 5). In case of a multiple key-stroke, the scan repetition rate is increased to detect the release of a key as soon as possible. There are two restrictions caused by the special structure of the keyboard matrix : - The keys switching to ground (code numbers 7, 15, 23, 31, 39, 47, 55 and 63) and the keys connectedto SEN5N and SEN6N are not covered completely by the multiple key protection. If one sense input is switched to ground, further keys on the same sense line are ignored, i.e. the command code corresponding to ”key to ground” is transmitted. - SEN5N and SEN6N are not protected against multiple keystroke on the same driver line, because this condition has been used for the definition of additional codes (code number 56 to 63). OUTPUT SEQUENCE (data format) The output operation will start when the selected code is found. A burst of pulses, including the latched address and command codes,is generated at the output REMO as long as a key is pressed. The format of the output pulse train is given in Figures 2 and 3. The operation is terminated by releasing the key or if more than one key is pressed at the same time. Once a sequence is started, the transmitted data words will always be completed after the key is released. The toggle bits T0 and T1 are incremented if the key is released for a minimum time tREL (see Figure 4). The toggle bits remain unchanged within a multiple key-stroke sequence. 3/10 M3004LAB1 - M3004LD Table 1 : Pulse Train Timing Flashed Modulated fOSC tP tM tML tMH tW TO 2.53 2.53 455kHz 4 x tOSC 12 x tOSC 8 x tOSC 4 x tOSC 55296 x tOSC 1152 x tOSC 8.8 26.4 tOSC = 2.2µs Flashed Pulse Width Modulation Period Modulation Period Low Word Distance Basic Unit of Pulse Distance 3004L-02.TBL 17.6 8.8 121 121 Modulation Period High The following number of pulses may be selected by Metal option : N = 8, 12, 16. Note : The different dividing ratio for TO and tW between flash mode and carrier mode is obtained by changing the modulo of a particular divider from divide by 3 during flash mode to divide by 4 during carrier mode. This allows the use of a 600kHz ceramic resonator during carrier mode to obtain a better noise immunity for the receiver without a significant change in TO and tW. For first samples, the correct divider ration is obtained by a metal mask option. For final parts, this is automatically done together with the selection of flash-/carrier mode. Table 2 : Pulse Train Separation (tb) Code Logic ”0” Logic ”1” Toggle Bit Time Reference Time tb 2 x TO 2 x TO or 3 x TO 3 x TO 3004L-03.TBL 3 x TO Table 3 : Transmission Mode and Sub-system Adress Selection. The sub-system address and the transmission mode are defined by connecting the ADRM input Mode F L A S H E D M O D U L A T E D Sub-system Address # 0 1 2 3 4 5 6 0 1 2 3 4 5 6 S2 1 0 0 0 0 1 1 1 0 0 0 0 1 1 S1 1 0 0 1 1 0 0 1 0 0 1 1 0 0 S0 1 0 1 0 1 0 1 1 0 1 0 1 0 1 0 O X X X X X to one or more driver outputs (DRV0N To DRV6N) of the key matrix. If more than one driver is connected to ADRM, they must be decoupled by diodes. Driver DRVnN for n = 1 2 3 4 5 6 O X X X X O X X X O X X O X O O O O O O O O O X O O= connected to ADRM blank= not connected to ADRM X = don’t care 4/10 3004L-04.TBL O X X X X X O X X X X O X X X O X X 3004L-01.TBL Mode TO (ms) tP (µs) tM (µs) tML (µs) tMH (µs) tW (ms) M3004LAB1 - M3004LD Table 4 : Key Codes Matrix Drive DRV0N DRV1N DRV2N DRV3N DRV4N DRV5N DRV6N VSS * * * * * * * * ** Matrix Sense SEN0N SEN0N SEN0N SEN0N SEN0N SEN0N SEN0N SEN0N SEN1N SEN2N SEN3N SEN4N SEN5N SEN6N SEN5N and SEN6N Code F 0 0 0 0 0 0 0 0 0 0 0 1 1 1 1 E 0 0 0 0 0 0 0 0 0 1 1 0 0 1 1 D 0 0 0 0 0 0 0 0 1 0 1 0 1 0 1 C 0 0 0 0 1 1 1 1 B 0 0 1 1 0 0 1 1 ** ** ** ** ** * ** A 0 1 0 1 0 1 0 1 Matrix Position 0 1 2 3 4 5 6 7 8 to 15 16 to 23 24 to 31 32 to 39 40 to 47 48 to 55 56 to 63 The complete matrix drive as shown above for SEN0N is also applicable for the matrix sense inputs SEN1N to SEN6N and the combined SEN5/SEN6N. The C, B and A codes are identical to SEN0N as given above. ABSOLUTE MAXIMUM RATINGS Symbol VDD VI VO ±I - I (REMO) M Ptot Tstg TA Supply Voltage Range Input Voltage Range Output Voltage Range D.C. Current into Any Input or Output Peak REMO Output Current during 10µs, Duty Factor = 1% Power Dissipation per Package for TA = - 20 to + 70 C Storage Temperature Range Operating Ambient Temperature Range o Parameter Value - 0.3 to + 7 - 0.3 to (VDD + 0.3) - 0.3 to (VDD + 0.3) Max. 10 Max. 300 Max. 200 - 55 to + 125 - 20 to + 70 Unit V V V mA mA o o C C ELECTRICAL CHARACTERISTICS VSS = 0V, TA = 25oC (unless otherwise specified) Symbol VDD IDD Parameter Supply Voltage Supply Current • Test Conditions TA = 0 to + 70 C Active fOSC = 455kHz REMO,Output unload VDD = 3V VDD = 6V o Min. 2 Typ. 0.25 1.0 Max. 6.5 0.5 2 2 600 Unit V mA mA µA kHz • Inactive (stand-by mode) VDD = 6V 350 fOSC Oscill. Frequency VDD = 2 to 6.5V (cer resonator) KEYBOARD MATRIX - Inputs SE0N to SEN6N VIL VIH - II II Input Voltage Low Input Voltage High Input Current Input Leakage Current VDD = 2 to 6.5V VDD = 2 to 6.5V VDD = 2V, VI = 0V VDD = 6.5V, VI = 0V VDD = 6.5V, VI = VDD 0.7 x VDD 10 100 100 600 1 0.3 x VDD V V µA µA µA KEYBOARD MATRIX - Outputs DRV0N to DRV6N 3004L-07.TBL VOL IO Output Voltage ”ON” Output Current ”OFF” VDD = 2V, IO = 0.1mA VDD = 6.5V, IO = 2.5mA VDD = 6.5V, VO = 11V 0.3 0.6 10 V V µA 5/10 3004L-06.TBL mW 3004L-05.TBL M3004LAB1 - M3004LD ELECTRICAL CHARACTERISTICS VSS = 0V, TA = 25oC (unless otherwise specified) Symbol Parameter Test Conditions Min. Typ. Max. Unit CONTROL INPUT ADRM VIL VIH IIL Input Voltage Low Input Voltage High Input Current Low (switched P and N channel pull-up/pull down) Input Current High (switched P and N channel pull-up/pull down) Pull-up Act. Oper. Condition, VIN = VSS VDD = 2V VDD = 6.5V Pull-down Act. Stand-by Cond.,VIN = VDD VDD = 2V VDD = 6.5V 0.7 x VDD 10 100 10 100 100 600 100 600 0.3 x VDD V V µA µA µA µA IIH DATA OUTPUT REMO - IOH IOL tOH Output Current High Output Current Low Pulse Length VDD = 2V, V OH = 0.8V VDD = 6.5V, V OH = 5V VDD = 2V, V OL = 0.4V VDD = 6.5V, V OL = 0.4V VDD = 6.5V, Oscill. Stopped 60 80 0.6 0.6 1 mA mA mA mA mS µA µA V 0.7 V OSCILLATOR II VOH VOL Input Current Output Voltage high Output Voltage Low 3004L-08.TBL 3004L-03.EPS VDD = 2V VDD = 6.5V, OSC1 at VDD VDD = 6.5V, - IOL = 0.1mA VDD = 6.5V, I OH = 0.1mA 5 VDD - 0.8 5 7 Figure 1 : Typical Application DRV2N* DRV0N DRV1N DRV3N* DRV5N 13 14 15 16 17 18 DRV6N DRV4N 19 20 VD D SEN0N 7 15 8 7 6 REMO 1 0 8 16 24 SEN1N SEN2N 23 31 SEN3N* 5 4 3 SEN4N* SEN5N M3004LAB1 M3004LD 39 47 55 32 40 48 10 VSS SEN6N 2 63 56 9 ADRM OSCI 11 12 OSCO 6/10 M3004LAB1 - M3004LD Figure 2 : Data Format of REMO Output; REF = Reference Time; T0 and T1 = Toggle bits; S0, S1 and S2 = System address; A, B, C, D, E and F = Command bits. (a) flashed mode : transmission with 2 toggle bits and 3 address bits, followed by 6 command bits (pulses are flashed) (b) modulated mode : transmission with reference time, 1 toggle bit and 3 address bits, followed by 6 command bits (pulses are modulated) a) REMO H T1 0 T0 1 S2 0 S1 1 S0 0 F 1 E 0 D 0 tw C 1 B 0 A 0 T1 0 tw L bit data b) H REMO Ref T0 1 S2 0 S1 1 S0 0 F 1 E 0 D 0 C 1 B 0 A 0 T1 0 data Figure 3 : REMO Output Waveform (a) flashed pulse (b) modulated pulse [ tPW = (5 x tM ) + tMH) ] a) tp tb b) t MH t ML tM 3004L-05.EPS t pw tb 7/10 3004L-04.EPS L bit M3004LAB1 - M3004LD Figure 4 : Single Key - Stroke Sequence. Debounce time : tDB = 4 to 9 x TO Start time : tST = 5 to 10 x TO Minimum release time : tREL = TO key bouncing t REL closed REV released scan new key DRVnN off on t DB tW scan scan new word REMO H L t ST 3004L-06.EPS OSCO H L OSCILLATOR ACTIVE Figure 5 : Multiple Key-Stroke Sequence. Scan rate multiple key-stroke : tSM = 8 to 10 x TO key bouncing KEY A closed released key A decoded as HIGH key A decoded as LOW KEY B closed released scan scan scan DRVnN off on t DB REMO H L t ST OSCO H L word key A word key A tW t SH t DB t ST word key B 3004L-07.EPS OSCILLATOR ACTIVE 8/10 M3004LAB1 - M3004LD PACKAGE MECHANICAL DATA 20 PINS - PLASTIC DIP a1 I b Z e3 B e Z L b1 E D 20 11 F 1 10 Dimensions a1 B b b1 D E e e3 F i L Z Min. 0.254 1.39 Millimeters Typ. Max. 1.65 Min. 0.010 0.055 Inches Typ. Max. 0.065 0.45 0.25 25.4 8.5 2.54 22.86 7.1 3.93 3.3 1.34 0.018 0.010 1.000 0.335 0.100 0.900 0.280 0.155 0.130 0.053 DIP20.TBL 9/10 PM-DIP20.EPS M3004LAB1 - M3004LD PACKAGE MECHANICAL DATA 20 PINS - PLASTIC MICROPACKAGE L C c1 a2 A e3 E D M 20 11 F a1 b e s b1 1 10 Dimensions A a1 a2 b b1 C c1 D E e e3 F L M S Min. 0.1 0.35 0.23 Millimeters Typ. Max. 2.65 0.2 2.45 0.49 0.32 45o (typ.) Min. 0.004 0.014 0.009 Inches Typ. Max. 0.104 0.008 0.096 0.019 0.013 0.5 12.6 10 1.27 11.43 7.4 0.5 7.6 1.27 0.75 8o (max.) 0.291 0.020 13.0 10.65 0.496 0.394 0.020 0.510 0.419 0.050 0.450 0.300 0.050 0.030 Information furnished is believed to be accurate and reliable. However, SGS-THOMSON Microelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No licence is granted by implication or otherwise under any patent or patent rights of SGS-THOMSON Microelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. SGS-THOMSON Microelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of SGS-THOMSON Microelectronics. © 1994 SGS-THOMSON Microelectronics - All Rights Reserved Purchase of I2C Components of SGS-THOMSON Microelectronics, conveys a license under the Philips I2C Patent. Rights to use these components in a I2C system, is granted provided that the system conforms to the I2C Standard Specifications as defined by Philips. SGS-THOMSON Microelectronics GROUP OF COMPANIES Australia - Brazil - China - France - Germany - Hong Kong - Italy - Japan - Korea - Malaysia - Malta - Morocco The Netherlands - Singapore - Spain - Sweden - Switzerland - Taiwan - Thailand - United Kingdom - U.S.A. 10/10 SO20L.TBL PM-SO20L.EPS