SMA6F33AY

SMA6FxxAY Datasheet Automotive 600 W TVS in SMA Flat Features • • • • • • • AEC-Q101 qualified Peak pulse power: 600 W (10/1000 μs) and 4 kW (8/20 μs) Flat and thin package: 1 mm Stand-off voltage range from 5 V to 188 V Unidirectional type Low leakage current: 0.2 μA at 25 °C and 1 μA at 85 °C Operating Tj max: 175 °C • High power capability at Tj max.: up to 400 W (10/1000 µs) • Lead finishing: matte tin plating Complies with the following standards • • • • • • Product status link SMA6FY SMA6F5.0AY, SMA6F6.0AY, SMA6F6.5AY, SMA6F8.5AY, SMA6F10AY, SMA6F11AY, SMA6F12AY, SMA6F13AY, SMA6F14AY, SMA6F15AY, SMA6F16AY, SMA6F18AY, SMA6F20AY, SMA6F22AY, SMA6F23AY, SMA6F24AY, SMA6F26AY, SMA6F28AY, SMA6F30AY, SMA6F31AY, SMA6F33AY, SMA6F36AY, SMA6F40AY, SMA6F48AY, SMA6F58AY, SMA6F64AY, SMA6F70AY, SMA6F85AY, SMA6F100AY, SMA6F130AY, SMA6F154AY, SMA6F170AY, SMA6F188AY • • • UL94, V0 J-STD-020 MSL level 1 J-STD-002, JESD 22-B102 E3 and MIL-STD-750, method 2026 JESD-201 class 2 whisker test IPC7531 footprint and JEDEC registered package outline IEC 61000-4-4 level 4: – 4 kV ISO10605, IEC 61000-4-2, C = 150 pF - R = 330 Ω exceeds level 4: – 30 kV (contact discharge) – 30 kV (air discharge) ISO10605, C = 330 pF, R = 330 Ω exceeds level 4: – 30 kV (contact discharge) – 30 kV (air discharge) ISO7637-2 (Not applicable to parts with VRM lower than battery voltage) – Pulse 1: VS = -150 V – Pulse 2a: VS = +112 V – Pulse 3a: VS = -220 V – Pulse 3b: VS = +150 V Description The SMA6FY Transil series are designed to protect sensitive automotive circuits against surges defined in ISO 7637 series and against electrostatic discharges according to ISO 10605. The Planar technology makes it compatible with high-end circuits where low leakage current and high junction temperature are required to provide long term reliability and stability. DS12477 - Rev 3 - January 2020 For further information contact your local STMicroelectronics sales office. www.st.com SMA6FxxAY Characteristics 1 Characteristics Table 1. Absolute maximum ratings (Tamb = 25 °C) Symbol Parameter Value Unit ISO10605 (C = 330 pF, R = 330 Ω): VPP Peak pulse voltage Contact discharge 30 Air discharge 30 kV ISO10605 / IEC 61000-4-2 (C = 150 pF, R = 330 Ω) Contact discharge 30 Air discharge 30 10/1000 µs, Tj initial = Tamb 600 W PPP Peak pulse power dissipation Tstg Storage temperature range -65 to +175 °C Tj Operating junction temperature range -55 to +175 °C TL Maximum lead temperature for soldering during 10 s 260 °C Figure 1. Electrical characteristics - parameter definitions Figure 2. Pulse definition for electrical characteristics DS12477 - Rev 3 page 2/15 SMA6FxxAY Characteristics Table 2. Electrical characteristics - parameter values (Tamb = 25 °C, unless otherwise specified) Type 25 °C 85 °C µA 10 / 1000 µs VBR at IR (1) IRM max at VRM Min. V Typ. (2)(3) VCL Max. V (4) IPP Max. mA 8 / 20 µs RD (2)(3) VCL Max. Max. (4) IPP αT RD Max. Max. V A Ω V A Ω 10-4/°C SMA6F5.0AY 20 50 5.0 6.4 6.74 7.1 10 9.2 68 0.031 13.4 298 0.021 5.7 SMA6F6.0AY 20 50 6.0 6.7 7.05 7.4 10 10.3 61 0.048 13.7 290 0.022 5.9 SMA6F6.5AY 20 50 6.5 7.2 7.58 8 10 11.2 56 0.057 14.5 276 0.024 6.1 SMA6F8.5AY 20 50 8.5 9.4 9.9 10.4 1 14.4 41.7 0.096 19.5 205 0.044 7.3 SMA6F10AY 0.2 1 10 11.1 11.7 12.3 1 17 37 0.127 21.7 184 0.051 7.8 SMA6F11AY 0.2 1 11 12.3 13 13.7 1 18 33.8 0.127 24.2 165 0.064 8.1 SMA6F12AY 0.2 1 12 13.3 14 14.7 1 19.9 31 0.168 25.3 157 0.068 8.3 SMA6F13AY 0.2 1 13 14.4 15.2 16 1 21.5 29 0.190 27.2 147 0.076 8.4 SMA6F14AY 0.2 1 14 15.7 16.5 17.3 1 23.1 26 0.223 29 136 0.086 8.6 SMA6F15AY 0.2 1 15 16.7 17.6 18.5 1 24.4 25.1 0.235 32.5 123 0.114 8.8 SMA6F16AY 0.2 1 16 17.9 18.8 19.8 1 26 23.1 0.268 34.7 115 0.130 9.0 SMA6F18AY 0.2 1 18 20 21.1 22.2 1 29.2 21.5 0.326 39.3 102 0.168 9.2 SMA6F20AY 0.2 1 20 22.2 23.4 24.6 1 32.4 19.4 0.402 42.8 93 0.196 9.4 SMA6F22AY 0.2 1 22 24.4 25.7 27 1 35.5 17.7 0.480 48.3 83 0.257 9.6 SMA6F23AY 0.2 1 23 25.7 27 28.4 1 37.8 16.4 0.573 49.2 81 0.257 9.6 SMA6F24AY 0.2 1 24 26.7 28.1 29.5 1 38.9 16 0.588 50 80 0.256 9.6 SMA6F26AY 0.2 1 26 28.9 30.4 31.9 1 42.1 14.9 0.685 53.5 75 0.288 9.7 SMA6F28AY 0.2 1 28 31.1 32.7 34.3 1 45.4 13.8 0.804 59 68 0.363 9.8 SMA6F30AY 0.2 1 30 33.2 35 36.8 1 48.4 13 0.885 64.3 62 0.442 9.9 SMA6F31AY 0.2 1 31 34.2 36 37.8 1 50.2 12.3 1.01 65 61 0.45 9.9 SMA6F33AY 0.2 1 33 36.7 38.6 40.5 1 53.3 11.8 1.08 69.7 57 0.512 10 SMA6F36AY 0.2 1 36 40 42.1 44.2 1 58.1 10.3 1.35 76 52 0.612 10 SMA6F40AY 0.2 1 40 44.4 46.7 49 1 64.5 9.7 1.60 84 48 0.729 10.1 SMA6F48AY 0.2 1 48 53.2 56 58.8 1 77.4 8.1 2.28 100 40 1.03 10.3 SMA6F58AY 0.2 1 58 64.6 68 71.4 1 93.6 6.7 3.34 121 33 1.51 10.4 SMA6F64AY 0.2 1 64 71.1 74.8 78.6 1 103 5.8 4.17 134 30 1.84 10.5 SMA6F70AY 0.2 1 70 77.9 82 86.1 1 113 5.5 4.91 146 27 2.22 10.5 SMA6F85AY 0.2 1 85 95 100 105 1 137 4.6 7.17 178 22.5 3.29 10.6 SMA6F100AY 0.2 1 100 111 117 123 1 162 3.8 10.3 212 19 4.68 10.7 SMA6F130AY 0.2 1 130 144 152 160 1 209 3 16.3 265 15 7 10.8 SMA6F154AY 0.2 1 154 171 180 189 1 246 2.4 23.8 317 12.6 10.2 10.8 SMA6F170AY 0.2 1 170 190 200 210 1 275 2.2 30 353 11.3 12.7 10.8 SMA6F188AY 0.2 1 188 209 220 231 1 328 2 48.5 388 10.3 15.2 10.8 1. To calculate VBR versus Tj: VBR at TJ = VBR at 25 °C x (1 + αT x (Tj - 25)) 2. To calculate VCLmax versus IPPappli: VCLmax = VBR max + RD x IPPappli 3. To calculate VCL versus Tj: VCL at TJ = VCL at 25 °C x (1 + αT x (Tj - 25)) DS12477 - Rev 3 page 3/15 SMA6FxxAY Characteristics (curves) 4. Surge capability given for both directions 1.1 Characteristics (curves) Figure 3. Maximum peak power dissipation versus initial junction temperature 800 Figure 4. Maximum peak pulse power versus exponential pulse duration Ppp (W) PPP (W) 10000 Tj initial = 25 °C 600 VRM < 100 V 400 1000 VRM ≥ 100 V 100 200 Tj (°C) 0 0 25 50 75 100 125 150 175 200 Figure 5. Maximum clamping voltage versus peak pulse current 1000 0.1 1 10 Figure 6. Dynamic resistance versus pulse duration 1000 Ipp (A) tp (ms) 10 0.01 RD (Ω) 8/20 µs 100 10/1000 µs 100 SMA6F188AY 10 SMA6F70AY 1 SMA6F188AY 0.1 SMA6F70AY 1 SMA6F33AY SMA6F5.0AY 10 0.1 SMA6F5.0AY 0.01 V CL (V) 1 DS12477 - Rev 3 10 100 SMA6F33AY 1000 0.001 0.01 tp (ms) 0.1 1 10 page 4/15 SMA6FxxAY Characteristics (curves) Figure 7. Junction capacitance versus reverse applied voltage (unidirectional types) C (nF) 10 Figure 8. Leakage current versus junction temperature 10000 IR (nA) VR=VRM f = 1 MHz Vosc = 30 mVRMS Tj = 25 °C VRM < 10V 1000 SMA6F5.0AY 1 100 VRM ≥ 10V SMA6F33AY 0.1 10 SMA6F70AY SMA6F188AY 0.01 1 V R (V) 1 10 100 1000 Figure 9. Peak forward voltage drop versus peak forward current IF (A) 100 Tj (°C) 25 75 100 125 150 175 Figure 10. Thermal impedance junction to ambient versus pulse duration 1000 Zth(j-a) (°C/W) Single pulse on recommended footprint. Epoxy printed circuit board FR4, 70 µm Cu thickness single pulse 10 50 100 Tj = 175 °C Tj = 25 °C 10 1 VF (V) 0 0 0.5 1 1.5 2 2.5 1 0.01 3 Figure 11. Thermal resistance junction to ambient versus copper area under each lead 160 tp (s) 0.1 1 10 100 1000 Figure 12. ISO7637-2 pulse 1: Vs = -150 V with 12 V battery Rth(j-a) (°C/W) Single pulse on recommended footprint. Epoxy printed circuit board FR4, 70 µm Cu thickness 140 120 100 80 60 40 20 0 SCu (cm²) 0 0.5 DS12477 - Rev 3 1 1.5 2 2.5 3 3.5 4 4.5 5 page 5/15 SMA6FxxAY Characteristics (curves) Figure 13. ISO7637-2 pulse 2a: Vs = +112 V with 12 V battery Figure 14. ISO7637-2 pulse 3a: Vs = -220 V with 12 V battery Figure 15. ISO7637-2 pulse 3b: Vs = +150 V with 12 V battery DS12477 - Rev 3 page 6/15 SMA6FxxAY Package information 2 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: www.st.com. ECOPACK is an ST trademark. 2.1 SMA Flat package information Figure 16. SMA Flat package outline Table 3. SMA Flat mechanical data Symbol A Inches(1) Millimeters Min Typ 0.90 A1 Max Min 1.10 0.035 0.05 Typ Max 0.044 0.002 b 1.25 1.65 0.049 0.065 c 0.15 0.40 0.005 0.016 D 2.25 2.90 0.088 0.115 E 5.00 5.35 0.196 0.211 E1 3.95 4.60 0.155 0.182 G 2.00 0.079 G1 0.85 0.033 L 0.75 1.20 0.029 0.048 L1 0.45 0.018 L2 0.45 0.018 L3 0.05 0.002 V 8° 8° V1 8° 8° 1. Values in inches are converted from mm and rounded to 3 decimal digits. DS12477 - Rev 3 page 7/15 SMA6FxxAY SMA Flat package information Figure 17. SMA Flat recommended footprint in mm (inches) Figure 18. SMA Flat marking Figure 19. Package orientation in reel Figure 20. Tape and reel orientation Figure 21. 13'' reel dimension values Figure 22. Inner box dimension values DS12477 - Rev 3 page 8/15 SMA6FxxAY SMA Flat package information Figure 23. Tape outline Table 4. Tape dimension values Dimensions Ref. DS12477 - Rev 3 Millimeters Min. Typ. Max. D0 1.5 1.55 1.6 D1 1.5 F 5.4 5.5 5.6 K0 1.1 1.2 1.3 P0 3.9 4.0 4.1 P1 3.9 4.0 4.1 P2 1.9 2.0 2.1 W 11.7 12 12.3 page 9/15 SMA6FxxAY Reflow profile 2.2 Reflow profile Figure 24. ST ECOPACK recommended soldering reflow profile for PCB mounting 250 240-245 °C Temperature (°C) -2 °C/s 2 - 3 °C/s 60 sec (90 max) 200 -3 °C/s 150 -6 °C/s 100 0.9 °C/s 50 Time (s) 0 Note: DS12477 - Rev 3 30 60 90 120 150 180 210 240 270 300 Minimize air convection currents in the reflow oven to avoid component movement. Maximum soldering profile corresponds to the latest IPC/JEDEC J-STD-020. page 10/15 SMA6FxxAY Application and design guidelines 3 Application and design guidelines More information is available in the application note AN2689 “Protection of automotive electronics from electrical hazards, guidelines for design and component selection”. DS12477 - Rev 3 page 11/15 SMA6FxxAY Ordering information 4 Ordering information Figure 25. Ordering information scheme SMA 6 F vv A Y Package: SMA Power capability (10 / 1000 µs): 600 W Flat package Stand-off voltage: VRM Type: A : unidirectional Automotive grade Table 5. Ordering information DS12477 - Rev 3 Order code Marking Package Weight Base qty. Delivery mode SMA6FxxxAY See Table 6. Marking. SMA Flat 39 mg 10000 Tape and reel page 12/15 SMA6FxxAY Marking 4.1 Marking Table 6. Marking DS12477 - Rev 3 Order code Marking SMA6F5.0AY 6AIY SMA6F6.0AY 6AKY SMA6F6.5AY 6ALY SMA6F8.5AY 6APY SMA6F10AY 6ASY SMA6F11AY 6AUY SMA6F12AY 6AWY SMA6F13AY 6AYY SMA6F14AY 6BAY SMA6F15AY 6BCY SMA6F16AY 6BEY SMA6F18AY 6BIY SMA6F20AY 6BMY SMA6F22AY 6BOY SMA6F23AY 6BPY SMA6F24AY 6BQY SMA6F26AY 6BSY SMA6F28AY 6BUY SMA6F30AY 6BWY SMA6F31AY 6BXY SMA6F33AY 6BZY SMA6F36AY 6CCY SMA6F40AY 6CGY SMA6F48AY 6COY SMA6F58AY 6CYY SMA6F64AY 6DEY SMA6F70AY 6DKY SMA6F85AY 6DZY SMA6F100AY 6EOY SMA6F130AY 6FSY SMA6F154AY 6GQY SMA6F170AY 6HGY SMA6F188AY 6HYY page 13/15 SMA6FxxAY Revision history Table 7. Document revision history DS12477 - Rev 3 Date Version Changes 24-Sep-2018 1 Initial release. 26-Aug-2019 2 Updated Table 1. Absolute maximum ratings (Tamb = 25 °C), Figure 10. Thermal impedance junction to ambient versus pulse duration, Figure 11. Thermal resistance junction to ambient versus copper area under each lead. 07-Jan-2020 3 Updated links syntax. page 14/15 SMA6FxxAY IMPORTANT NOTICE – PLEASE READ CAREFULLY STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement. Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers’ products. No license, express or implied, to any intellectual property right is granted by ST herein. Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. ST and the ST logo are trademarks of ST. For additional information about ST trademarks, please refer to www.st.com/trademarks. All other product or service names are the property of their respective owners. Information in this document supersedes and replaces information previously supplied in any prior versions of this document. © 2020 STMicroelectronics – All rights reserved DS12477 - Rev 3 page 15/15