SMA6F8.5A

SMA6FxxA Datasheet 600 W TVS Features • • • • • Peak pulse power: 600 W (10/1000 μs) and 4 kW (8/20 μs) Stand-off voltage range from 5 V to 188 V Unidirectional type Low leakage current: 0.2 μA at 25 °C and 1 μA at 85 °C Operating Tj max: 175 °C • High power capability at Tj max.: up to 400 W (10/1000 µs) • Lead finishing: matte tin plating Complies with the following standards • • • • • • UL94, V0 J-STD-020 MSL level 1 J-STD-002, JESD 22-B102 E3 and MIL-STD-750, method 2026 JESD-201 class 2 whisker test IPC7531 footprint and JEDEC registered package outline IEC 61000-4-2, C = 150 pF - R = 330 Ω exceeds level 4: – 25 kV (contact discharge) – 30 kV (air discharge) Description Product status link SMA6F SMA6F5.0A, SMA6F6.0A, SMA6F6.5A, SMA6F8.5A, SMA6F10A, SMA6F11A, SMA6F12A, SMA6F13A, SMA6F14A, SMA6F15A, SMA6F16A, SMA6F18A, SMA6F20A, SMA6F22A, SMA6F23A, SMA6F24A, SMA6F26A, SMA6F28A, SMA6F30A, SMA6F31A, SMA6F33A, SMA6F36A, SMA6F40A, SMA6F48A, SMA6F58A, SMA6F70A, SMA6F85A, SMA6F100A, SMA6F130A, SMA6F154A, SMA6F170A, SMA6F188A The SMA6F Transil series are designed to protect sensitive circuits against transient surges. The planar technology makes it compatible with high-end circuits where low leakage current and high junction temperature are required to provide long term reliability and stability. DS12564 - Rev 3 - February 2019 For further information contact your local STMicroelectronics sales office. www.st.com SMA6FxxA Characteristics 1 Characteristics Table 1. Absolute maximum ratings (Tamb = 25 °C) Symbol Parameter Value Unit Contact discharge 25 kV Air discharge 30 10/1000 µs, Tj initial = Tamb 600 W IEC 61000-4-2 (C = 150 pF, R = 330 Ω) VPP Peak pulse voltage PPP Peak pulse power dissipation Tstg Storage temperature range -65 to +175 °C Tj Operating junction temperature range -55 to +175 °C TL Maximum lead temperature for soldering during 10 s 260 °C Figure 1. Electrical characteristics - parameter definitions Unidirectional device VRM IRM VBR VCL IPP VF αT RD Stand-off voltage Leakage current @ VRM Breakdown voltage Clamping voltage Peak pulse current Forward voltage drop Voltage temperature coefficient Dynamic resistance IPP IR IRM V VRM VBR VCL VF I IF V I Figure 2. Pulse definition for electrical characteristics DS12564 - Rev 3 page 2/13 SMA6FxxA Characteristics Table 2. Electrical characteristics - parameter values (Tamb = 25 °C, unless otherwise specified) IRM max at VRM Type 25 °C 85 °C µA 10 / 1000 µs VBR at IR Min. V Typ. VCL(3) Max. V IPP Max. αT(1)(2) 8 / 20 µs RD VCL(3) Max. Max. IPP RD Max. Max. mA V A Ω V A Ω 10-4/°C SMA6F5.0A 20 50 5.0 6.4 6.74 7.1 10 9.2 68 0.031 13.4 298 0.021 5.7 SMA6F6.0A 20 50 6.0 6.7 7.05 7.4 10 10.3 61 0.048 13.7 290 0.022 5.9 SMA6F6.5A 20 50 6.5 7.2 7.58 8 10 11.2 56 0.057 14.5 276 0.024 6.1 SMA6F8.5A 20 50 8.5 9.4 9.9 10.4 1 14.4 41.7 0.096 19.5 205 0.044 7.3 SMA6F10A 0.2 1 10 11.1 11.7 12.3 1 17 37 0.127 21.7 184 0.051 7.8 SMA6F11A 0.2 1 11 12.3 13 13.7 1 18 33.8 0.127 24.2 165 0.064 8.1 SMA6F12A 0.2 1 12 13.3 14 14.7 1 19.9 31 0.168 25.3 157 0.068 8.3 SMA6F13A 0.2 1 13 14.4 15.2 16 1 21.5 29 0.190 27.2 147 0.076 8.4 SMA6F14A 0.2 1 14 15.7 16.5 17.3 1 23.1 26 0.223 29 136 0.086 8.6 SMA6F15A 0.2 1 15 16.7 17.6 18.5 1 24.4 25.1 0.235 32.5 123 0.114 8.8 SMA6F16A 0.2 1 16 17.9 18.8 19.8 1 26 23.1 0.268 34.7 115 0.130 9.0 SMA6F18A 0.2 1 18 20 21.1 22.2 1 29.2 21.5 0.326 39.3 102 0.168 9.2 SMA6F20A 0.2 1 20 22.2 23.4 24.6 1 32.4 19.4 0.402 42.8 93 0.196 9.4 SMA6F22A 0.2 1 22 24.4 25.7 27 1 35.5 17.7 0.480 48.3 83 0.257 9.6 SMA6F23A 0.2 1 23 25.7 27 28.4 1 37.8 16.4 0.573 49.2 81 0.257 9.6 SMA6F24A 0.2 1 24 26.7 28.1 29.5 1 38.9 16 0.588 50 80 0.256 9.6 SMA6F26A 0.2 1 26 28.9 30.4 31.9 1 42.1 14.9 0.685 53.5 75 0.288 9.7 SMA6F28A 0.2 1 28 31.1 32.7 34.3 1 45.4 13.8 0.804 59 68 0.363 9.8 SMA6F30A 0.2 1 30 33.2 35 36.8 1 48.4 13 0.885 64.3 62 0.442 9.9 SMA6F31A 0.2 1 31 34.2 36 37.8 1 50.2 12.3 1.01 65 61 0.45 9.9 SMA6F33A 0.2 1 33 36.7 38.6 40.5 1 53.3 11.8 1.08 69.7 57 0.512 10 SMA6F36A 0.2 1 36 40 42.1 44.2 1 58.1 10.3 1.35 76 52 0.612 10 SMA6F40A 0.2 1 40 44.4 46.7 49 1 64.5 9.7 1.60 84 48 0.729 10.1 SMA6F48A 0.2 1 48 53.2 56 58.8 1 77.4 8.1 2.28 100 40 1.03 10.3 SMA6F58A 0.2 1 58 64.6 68 71.4 1 93.6 6.7 3.34 121 33 1.51 10.4 SMA6F70A 0.2 1 70 77.9 82 86.1 1 113 5.5 4.91 146 27 2.22 10.5 SMA6F85A 0.2 1 85 95 100 105 1 137 4.6 7.17 178 22.5 3.29 10.6 SMA6F100A 0.2 1 100 111 117 123 1 162 3.8 10.3 212 19 4.68 10.7 SMA6F130A 0.2 1 130 144 152 160 1 209 3 16.3 265 15 7 10.8 SMA6F154A 0.2 1 154 171 180 189 1 246 2.4 23.8 317 12.6 10.2 10.8 SMA6F170A 0.2 1 170 190 200 210 1 275 2.2 30 353 11.3 12.7 10.8 SMA6F188A 0.2 1 188 209 220 231 1 328 2 48.5 388 10.3 15.2 10.8 1. To calculate VBR versus Tj: VBR at TJ = VBR at 25 °C x (1 + αT x (Tj - 25)) 2. To calculate VCL versus Tj: VCL at TJ = VCL at 25 °C x (1 + αT x (Tj - 25)) 3. To calculate VCLmax versus IPPappli: VCLmax = VBR max + RD x IPPappli DS12564 - Rev 3 page 3/13 SMA6FxxA Characteristics (curves) 1.1 Characteristics (curves) Figure 3. Maximum peak power dissipation versus initial junction temperature 800 Figure 4. Maximum peak pulse power versus exponential pulse duration Ppp (W) PPP (W) 10000 Tj initial = 25 °C 600 VRM < 100 V 400 1000 VRM ≥ 100 V 100 200 Tj (°C) 0 0 25 50 75 100 125 150 175 200 Figure 5. Maximum clamping voltage versus peak pulse current 1000 0.1 1 10 Figure 6. Dynamic resistance versus pulse duration 1000 Ipp (A) tp (ms) 10 0.01 RD (Ω) 8/20 µs 100 10/1000 µs 100 SMA6F188A 10 SMA6F70A 1 SMA6F188A 0.1 SMA6F70A 1 SMA6F33A SMA6F5.0A 10 0.1 SMA6F5.0A 0.01 V CL (V) 1 DS12564 - Rev 3 10 100 SMA6F33A 1000 0.001 0.01 tp (ms) 0.1 1 10 page 4/13 SMA6FxxA Characteristics (curves) Figure 7. Junction capacitance versus reverse applied voltage Figure 8. Leakage current versus junction temperature C (nF) 10 IR (nA) 10000 VR=VRM f = 1 MHz Vosc = 30 mVRMS Tj = 25 °C VRM < 10V 1000 SMA6F5.0A 1 100 VRM ≥ 10V SMA6F33A 0.1 10 SMA6F70A SMA6F188A 0.01 V R (V) 1 10 100 1 1000 Figure 9. Peak forward voltage drop versus peak forward current 50 1000 100 125 150 175 Zth(j-a) (°C/W) Single pulse on recommended footprint. Epoxy printed circuit board FR4, 35 µm Cu thickness single pulse 10 75 Figure 10. Thermal impedance junction to ambient versus pulse duration IF (A) 100 Tj (°C) 25 100 Tj = 175 °C Tj = 25 °C 10 1 VF (V) 0 0 0.5 1 1.5 2 2.5 tp (s) 1 0.01 3 0.1 1 10 100 1000 Figure 11. Thermal resistance junction to ambient versus copper area under each lead 200 Rth(j-a) (°C/W) Single pulse on recommended footprint. Epoxy printed circuit board FR4, 35 µm Cu thickness 150 100 50 0 DS12564 - Rev 3 SCu (cm²) 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 page 5/13 SMA6FxxA Package information 2 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. 2.1 SMA Flat package information Figure 12. SMA Flat package outline Table 3. SMA Flat mechanical data Symbol A Inches(1)1 Millimeters Min Typ 0.90 A1 Max Min 1.10 0.035 0.05 Typ Max 0.044 0.002 b 1.25 1.65 0.049 0.065 c 0.15 0.40 0.005 0.016 D 2.25 2.90 0.088 0.115 E 5.00 5.35 0.196 0.211 E1 3.95 4.60 0.155 0.182 G 2.00 0.079 G1 0.85 0.033 L 0.75 1.20 0.029 0.048 L1 0.45 0.018 L2 0.45 0.018 L3 0.05 0.002 V 8° 8° V1 8° 8° 1. Values in inches are converted from mm and rounded to 3 decimal digits. DS12564 - Rev 3 page 6/13 SMA6FxxA SMA Flat package information Figure 13. SMA Flat recommended footprint in mm (inches) Figure 14. SMA Flat marking Figure 15. Package orientation in reel Figure 16. Tape and reel orientation Figure 17. 13'' reel dimension values Figure 18. Inner box dimension values DS12564 - Rev 3 page 7/13 SMA6FxxA SMA Flat package information Figure 19. Tape outline Table 4. Tape dimension values Dimensions Ref. DS12564 - Rev 3 Millimeters Min. Typ. Max. D0 1.5 1.55 1.6 D1 1.5 F 5.4 5.5 5.6 K0 1.1 1.2 1.3 P0 3.9 4.0 4.1 P1 3.9 4.0 4.1 P2 1.9 2.0 2.1 W 11.7 12 12.3 page 8/13 SMA6FxxA Reflow profile 2.2 Reflow profile Figure 20. ST ECOPACK® recommended soldering reflow profile for PCB mounting 250 240-245 °C Temperature (°C) -2 °C/s 2 - 3 °C/s 60 sec (90 max) 200 -3 °C/s 150 -6 °C/s 100 0.9 °C/s 50 Time (s) 0 Note: DS12564 - Rev 3 30 60 90 120 150 180 210 240 270 300 Minimize air convection currents in the reflow oven to avoid component movement. Maximum soldering profile corresponds to the latest IPC/JEDEC J-STD-020. page 9/13 SMA6FxxA SMA6FxxA Ordering information 3 SMA6FxxA Ordering information Figure 21. Ordering information scheme SMA 6 F vv A Package: SMA Power capability (10 / 1000 µs): 600 W Flat package Stand-off voltage: VRM Type: A : unidirectional Table 5. Ordering information DS12564 - Rev 3 Order code Marking Package Weight Base qty. Delivery mode SMA6FxxA See Table 6. Marking. SMA Flat 39 mg 10000 Tape and reel page 10/13 SMA6FxxA Marking 3.1 Marking Table 6. Marking Unidirectional DS12564 - Rev 3 Order code Marking SMA6F5.0A 6AI SMA6F6.0A 6AK SMA6F6.5A 6AL SMA6F8.5A 6AP SMA6F10A 6AS SMA6F11A 6AU SMA6F12A 6AW SMA6F13A 6AY SMA6F14A 6BA SMA6F15A 6BC SMA6F16A 6BE SMA6F18A 6BI SMA6F20A 6BM SMA6F22A 6BO SMA6F23A 6BP SMA6F24A 6BQ SMA6F26A 6BS SMA6F28A 6BU SMA6F30A 6BW SMA6F31A 6BX SMA6F33A 6BZ SMA6F36A 6CC SMA6F40A 6CG SMA6F48A 6CO SMA6F58A 6CY SMA6F70A 6DK SMA6F85A 6DZ SMA6F100A 6EO SMA6F130A 6FS SMA6F154A 6GQ SMA6F170A 6HG SMA6F188A 6HY page 11/13 SMA6FxxA Revision history Table 7. Document revision history DS12564 - Rev 3 Date Version Changes 18-May-2018 1 Initial release. 09-Jul-2018 2 Corrected typo error in Table 2. Electrical characteristics - parameter values (Tamb = 25 °C, unless otherwise specified). 28-Feb-2019 3 Updated links syntax. page 12/13 SMA6FxxA IMPORTANT NOTICE – PLEASE READ CAREFULLY STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement. Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers’ products. No license, express or implied, to any intellectual property right is granted by ST herein. Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. ST and the ST logo are trademarks of ST. All other product or service names are the property of their respective owners. Information in this document supersedes and replaces information previously supplied in any prior versions of this document. © 2019 STMicroelectronics – All rights reserved DS12564 - Rev 3 page 13/13