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SMB6F6.0AY

SMB6F6.0AY

  • 厂商:

    STMICROELECTRONICS(意法半导体)

  • 封装:

    SMB(DO-214AA)

  • 描述:

    10.3V 夹子 61A Ipp TVS - 二极管 表面贴装型 SMBflat

  • 数据手册
  • 价格&库存
SMB6F6.0AY 数据手册
SMB6FxxAY Datasheet Automotive 600 W TVS in SMB Flat Features • • • • • • • AEC-Q101 qualified Peak pulse power: 600 W (10/1000 μs) and 4 kW (8/20 μs) Flat and thin package: 1 mm Stand-off voltage range from 5 V to 188 V Unidirectional type Low leakage current: 0.2 μA at 25 °C and 1 μA at 85 °C Operating Tj max: 175 °C • High power capability at Tj max.: up to 470 W (10/1000 µs) • Lead finishing: matte tin plating Complies with the following standards • • • Product status link SMB6FY SMB6F5.0AY, SMB6F6.0AY, SMB6F6.5AY, SMB6F8.5AY, SMB6F10AY, SMB6F11AY, SMB6F13AY, SMB6F12AY, SMB6F14AY, SMB6F15AY, SMB6F16AY, SMB6F18AY, SMB6F20AY, SMB6F22AY, SMB6F23AY, SMB6F24AY, SMB6F26AY, SMB6F28AY, SMB6F30AY, SMB6F31AY, SMB6F33AY, SMB6F36AY, SMB6F40AY, SMB6F48AY, SMB6F58AY, SMB6F70AY, SMB6F85AY, SMB6F100AY, SMB6F130AY, SMB6F154AY, SMB6F170AY, SMB6F188AY • • • • • • • UL94, V0 J-STD-020 MSL level 1 J-STD-002, JESD 22-B102 E3 and MIL-STD-750, method 2026 solderable matte tin plated leads JESD-201 class 2 whisker test IPC7531 footprint JEDEC registered package outline IEC 61000-4-4 level 4: – 4 kV ISO10605, IEC 61000-4-2, C= 150 pF - R = 330 Ω exceeds level 4: – 30 kV (air discharge) – 30 kV (contact discharge) ISO10605 - C = 330 pF, R = 330 Ω exceeds level 4: – 30 kV (air discharge) – 30 kV (contact discharge) ISO7637-2 (Not applicable to parts with stand-off voltage lower than battery voltage) – Pulse1: VS = -150 V – Pulse 2a: VS = +112 V – Pulse 3a: VS = -220 V – Pulse 3b: VS = +150 V Description The SMB6FxxAY series are designed to protect sensitive automotive circuits against surges defined in ISO 7637-2 and against electrostatic discharges according to ISO 10605. The Planar technology makes it compatible with high-end circuits where low leakage current and high junction temperature are required to provide long term reliability and stability. DS12412 - Rev 1 - January 2019 For further information contact your local STMicroelectronics sales office. www.st.com SMB6FxxAY Characteristics 1 Characteristics Table 1. Absolute maximum ratings (Tamb = 25 °C) Symbol Parameter Value Unit ISO10605 (C = 330 pF, R = 330 Ω): VPP Peak pulse voltage Contact discharge 30 Air discharge 30 kV ISO10605 / IEC 61000-4-2 (C = 150 pF, R = 330 Ω) Contact discharge 30 Air discharge 30 10/1000 µs, Tj initial = Tamb 600 W PPP Peak pulse power dissipation Tstg Storage temperature range -65 to +175 °C Tj Operating junction temperature range -55 to +175 °C TL Maximum lead temperature for soldering during 10 s 260 °C Figure 1. Electrical characteristics - parameter definitions Figure 2. Pulse definition for electrical characteristics DS12412 - Rev 1 page 2/16 SMB6FxxAY Characteristics Table 2. Electrical characteristics - parameter values (Tamb = 25 °C, unless otherwise specified) Type 25 °C 85 °C µA 10 / 1000 µs VBR at IBR (1) IRM max at VRM (2)(3) VCL Min. Typ. Max. V V (4) IPP Max. mA V A 8 / 20µs RD (2)(3) VCL Max. Max. Ω V IPP(4) A RD αT Max. Max. Ω 10-4/°C SMB6F5.0AY 20 50 5.0 6.4 6.74 7.1 10 9.2 68 0.031 13.4 298 0.021 5.7 SMB6F6.0AY 20 50 6.0 6.7 7.05 7.4 10 10.3 61 0.048 13.7 290 0.022 5.9 SMB6F6.5AY 20 50 6.5 7.2 7.58 8 10 11.2 56 0.057 14.5 276 0.024 6.1 SMB6F8.5AY 20 50 8.5 9.4 9.9 10.4 1 14.4 41.7 0.096 19.5 205 0.044 7.3 SMB6F10AY 0.2 1 10 11.1 11.7 12.3 1 17 37 0.127 21.7 184 0.051 7.8 SMB6F11AY 0.2 1 11 12.3 13 13.7 1 18 33.8 0.127 24.2 1665 0.064 8.1 SMB6F12AY 0.2 1 12 13.3 14 14.7 1 19.9 31 0.168 25.3 157 0.068 8.3 SMB6F13AY 0.2 1 13 14.4 15.2 16 1 21.5 29 0.190 27.2 147 0.076 8.4 SMB6F14AY 0.2 1 14 15.7 16.5 17.3 1 23.1 26 0.223 29 136 0.086 8.6 SMB6F15AY 0.2 1 15 16.7 17.6 18.5 1 24.4 25.1 0.235 32.5 123 0.114 8.8 SMB6F16AY 0.2 1 16 17.9 18.8 19.8 1 26 23.1 0.268 34.7 115 0.130 9.0 SMB6F18AY 0.2 1 18 20 21.1 22.2 1 29.2 21.5 0.326 39.3 102 0.168 9.2 SMB6F20AY 0.2 1 20 22.2 23.4 24.6 1 32.4 19.4 0.402 42.8 93 0.196 9.4 SMB6F22AY 0.2 1 22 24.4 25.7 27 1 35.5 17.7 0.480 48.3 83 0.257 9.6 SMB6F23AY 0.2 1 23 25.7 27 28.4 1 37.8 16.4 0.573 49.2 81 0.257 9.6 SMB6F24AY 0.2 1 24 26.7 28.1 29.5 1 38.9 16 0.588 50 80 0.256 9.6 SMB6F26AY 0.2 1 26 28.9 30.4 31.9 1 42.1 14.9 0.685 53.5 75 0.288 9.7 SMB6F28AY 0.2 1 28 31.1 32.7 34.3 1 45.4 13.8 0.804 59 68 0.363 9.8 SMB6F30AY 0.2 1 30 33.2 35 36.8 1 48.4 13 0.885 64.3 62 0.442 9.9 SMB6F31AY 0.2 1 31 34.2 36 37.8 1 50.2 12.3 1.01 65 61 0.45 9.9 SMB6F33AY 0.2 1 33 36.7 38.6 40.5 1 53.3 11.8 1.08 69.7 57 0.512 10 SMB6F36AY 0.2 1 36 40 42.1 44.2 1 58.1 10.3 1.35 76 52 0.612 10 SMB6F40AY 0.2 1 40 44.4 46.7 49 1 64.5 9.7 1.60 84 48 0.729 10.1 SMB6F48AY 0.2 1 48 53.2 56 58.8 1 77.4 8.1 2.28 100 40 1.03 10.3 SMB6F58AY 0.2 1 58 64.6 68 71.4 1 93.6 6.7 3.34 121 33 1.51 10.4 SMB6F70AY 0.2 1 70 77.9 82 86.1 1 113 5.5 4.91 146 27 2.22 10.5 SMB6F85AY 0.2 1 85 95 100 105 1 137 4.6 7.17 178 22.5 3.29 10.6 SMB6F100AY 0.2 1 100 111 117 123 1 162 3.8 10.3 212 19 4.68 10.7 SMB6F130AY 0.2 1 130 144 152 160 1 209 3 16.3 265 15 7 10.8 SMB6F154AY 0.2 1 154 171 180 189 1 246 2.4 23.8 317 12.6 10.2 10.8 SMB6F170AY 0.2 1 170 190 200 210 1 275 2.2 30 353 11.3 12.7 10.8 SMB6F188AY 0.2 1 188 209 220 231 1 328 2 48.5 388 10.3 15.2 10.8 1. To calculate VBR versus Tj : VBR at Tj = VBR at 25 °C x (1 + αT x (Tj - 25)) 2. To calculate VCL versus Tj : VCL at Tj = VCL at 25 °C x (1 + αT x (Tj - 25)) 3. To calculate VCL max versus IPPappli: VCLmax = VBR max + RD x IPPappli 4. Surge capability given for both directions DS12412 - Rev 1 page 3/16 SMB6FxxAY Characteristics (curves) 1.1 Characteristics (curves) Figure 3. Maximum peak power dissipation versus initial junction temperature Ppp (W) 800 Figure 4. Maximum peak pulse power versus exponential pulse duration Ppp (W) 10000 10/1000 µs 600 Tj initial = 25 °C VRM < 100V 1000 400 VRM ≥ 100V 100 200 0 Tj (°C) 0 25 50 75 100 125 150 175 200 Figure 5. Maximum peak pulse current versus clamping voltage Ipp (A) 1000 tp (ms) 10 0.01 0.1 1 10 Figure 6. Dynamic resistance versus pulse duration 1000 RD (Ω) 8/20 µs 10/1000 µs 100 100 SMB6F188AY 10 SMB6F70AY 1 10 0.1 SMB6F188AY SMB6F70AY 0.1 SMB6F33AY SMB6F5.0AY 1 SMB6F5.0AY 0.01 V CL (V) 1 DS12412 - Rev 1 10 100 SMB6F33AY 1000 0.001 0.01 t p (ms) 0.1 1 10 page 4/16 SMB6FxxAY Characteristics (curves) Figure 7. Junction capacitance versus reverse applied voltage (unidirectional types) 10000 C (pF) 10000 Figure 8. Leakage current versus junction temperature IR (nA) VR=VRM f = 1 MHz Vosc = 30 mVRMS Tj = 25 °C VRM < 10V 1000 SMB6F5.0AY 1000 100 VRM ≥ 10V SMB6F33AY 100 10 SMB6F70AY SMB6F188AY V R (V) 10 1 10 100 1 1000 Figure 9. Peak forward voltage drop versus peak forward current IF (A) 100 50 75 100 125 150 175 Figure 10. Thermal impedance junction to ambient versus pulse duration 1000 single pulse T j (°C) 25 Zth(j-a) (°C/W) Single pulse on recommended footprint. Epoxy printed circuit board FR4, 70 µm Cu thickness 10 100 Tj = 175 °C single pulse 25 °C TTj j==175 °C 10 1 V F (V) 0 0 0.5 1 1.5 2 2.5 3 Figure 11. Thermal resistance junction to ambient versus copper area under each lead (SMB Flat) 150 1 0.01 tp (s) 0.1 1 10 100 1000 Figure 12. ISO7637-2 pulse 1: Vs = -150 V with 12 V battery Rth(j-a) (°C/W) Single pulse on recommended footprint. Epoxy printed circuit board FR4, 70 µm Cu thickness 120 90 60 30 0 SCu (cm²) 0 0.5 DS12412 - Rev 1 1 1.5 2 2.5 3 3.5 4 4.5 5 page 5/16 SMB6FxxAY Characteristics (curves) Figure 13. ISO7637-2 pulse 2a: Vs = +112 V with 12 V battery Figure 14. ISO7637-2 pulse 3a: Vs = -220 V with 12 V battery Figure 15. ISO7637-2 pulse 3b: Vs = +150 V with 12 V battery DS12412 - Rev 1 page 6/16 SMB6FxxAY Package information 2 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. DS12412 - Rev 1 page 7/16 SMB6FxxAY SMB Flat package information 2.1 SMB Flat package information Figure 16. SMB Flat package outline Table 3. SMB Flat mechanical data Dimensions Min. A Inches(1) Millimeters Ref. Typ. 0.90 A1 Max. Min. 1.10 0.035 0.05 Typ. Max. 0.044 0.002 b 1.95 2.20 0.076 0.087 c 0.15 0.40 0.005 0.016 D 3.30 3.95 0.129 0.156 E 5.20 5.60 0.204 0.221 E1 4.05 4.60 0.159 0.182 G 2.00 0.079 G1 1.20 0.047 L 0.75 1.20 0.029 0.048 L1 0.30 0.012 L2 0.60 0.024 L3 0.02 0.000 V 8° 8° V1 8° 8° 1. Values in inches are converted from mm and rounded to 3 decimal digits. DS12412 - Rev 1 page 8/16 SMB6FxxAY SMB Flat package information Figure 17. Footprint recommendations, dimensions in mm (inches) 1.20 (0.047) 3.44 (0.136) Figure 18. Marking layout (refer to ordering information table for marking) 1.20 (0.047) 2.07 (0.082) 5.84 (0.230) millimeters (inches) Figure 20. Tape and reel orientation Figure 19. Package orientation in reel Figure 21. Reel dimensions (mm) DS12412 - Rev 1 Figure 22. Inner box dimensions (mm) page 9/16 SMB6FxxAY SMB Flat package information Figure 23. Tape and reel outline Table 4. Tape and reel mechanical data Dimensions Millimeters Ref. DS12412 - Rev 1 Min. Typ. Max. ØD0 1.45 1.50 1.55 ØD1 1.5 F 5.4 5.5 5.6 K0 1.2 1.3 1.4 P0 3.9 4.0 4.1 P1 7.9 8.0 8.1 P2 1.9 2.0 2.1 W 11.7 12.0 12.3 page 10/16 SMB6FxxAY Reflow profile 2.2 Reflow profile Figure 24. ST ECOPACK® recommended soldering reflow profile for PCB mounting 250 240-245 °C Temperature (°C) -2 °C/s 2 - 3 °C/s 60 sec (90 max) 200 -3 °C/s 150 -6 °C/s 100 0.9 °C/s 50 Time (s) 0 Note: DS12412 - Rev 1 30 60 90 120 150 180 210 240 270 300 Minimize air convection currents in the reflow oven to avoid component movement. Maximum soldering profile corresponds to the latest IPC/JEDEC J-STD-020. page 11/16 SMB6FxxAY Application and design guidelines 3 Application and design guidelines More information is available in the application note AN2689 “Protection of automotive electronics from electrical hazards, guidelines for design and component selection”. DS12412 - Rev 1 page 12/16 SMB6FxxAY SMB6FY Ordering information 4 SMB6FY Ordering information Figure 25. Ordering information scheme SMB 6 F xx A Y Package: SMB Power capability (10 / 1000 µs): 600 W Flat package Stand-off voltage: VRM Type: A : unidirectional Automotive grade Table 5. Ordering information DS12412 - Rev 1 Order code Marking Package Weight Base qty. Delivery mode SMB6FxxAY See Table 6. Marking. SMB Flat 56 mg 5000 Tape and reel page 13/16 SMB6FxxAY Marking 4.1 Marking Table 6. Marking DS12412 - Rev 1 Order code Marking SMB6F5.0AY 7AIY SMB6F6.0AY 7AKY SMB6F6.5AY 7ALY SMB6F8.5AY 7APY SMB6F10AY 7ASY SMB6F11AY 7AUY SMB6F12AY 7AWY SMB6F13AY 7AYY SMB6F14AY 7BAY SMB6F15AY 7BCY SMB6F16AY 7BEY SMB6F18AY 7BIY SMB6F20AY 7BMY SMB6F22AY 7BOY SMB6F23AY 7BPY SMB6F24AY 7BQY SMB6F26AY 7BSY SMB6F28AY 7BUY SMB6F30AY 7BWY SMB6F31AY 7BXY SMB6F33AY 7BZY SMB6F36AY 7CCY SMB6F40AY 7CGY SMB6F48AY 7COY SMB6F58AY 7CYY SMB6F70AY 7DKY SMB6F85AY 7DZY SMB6F100AY 7EOY SMB6F130AY 7FSY SMB6F154AY 7GQY SMB6F170AY 7HGY SMB6F188AY 7HYY page 14/16 SMB6FxxAY Revision history Table 7. Document revision history DS12412 - Rev 1 Date Revision 11-Jan-2019 1 Changes Initial release. page 15/16 SMB6FxxAY IMPORTANT NOTICE – PLEASE READ CAREFULLY STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement. Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers’ products. No license, express or implied, to any intellectual property right is granted by ST herein. Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. ST and the ST logo are trademarks of ST. All other product or service names are the property of their respective owners. Information in this document supersedes and replaces information previously supplied in any prior versions of this document. © 2019 STMicroelectronics – All rights reserved DS12412 - Rev 1 page 16/16
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