SMB6F8.5A

SMB6FxxA Datasheet 600 W TVS in SMB Flat Features • • • • • • Peak pulse power: 600 W (10/1000 μs) and 4 kW (8/20 μs) Flat and thin package: 1 mm Stand-off voltage range from 5 V to 188 V Unidirectional type Low leakage current: 0.2 μA at 25 °C and 1 μA at 85 °C Operating Tj max: 175 °C • High power capability at Tj max.: up to 470 W (10/1000 µs) • Lead finishing: matte tin plating Complies with the following standards • • • • • • • Product status link SMB6F SMB6F5.0A, SMB6F6.0A, SMB6F6.5A, SMB6F8.5A, SMB6F10A, SMB6F11A, SMB6F13A, SMB6F12A, SMB6F14A, SMB6F15A, SMB6F16A, SMB6F18A, SMB6F20A, SMB6F22A, SMB6F23A, SMB6F24A, SMB6F26A, SMB6F28A, SMB6F30A, SMB6F31A, SMB6F33A, SMB6F36A, SMB6F40A, SMB6F48A, SMB6F58A, SMB6F70A, SMB6F85A, SMB6F100A, SMB6F130A, SMB6F154A, SMB6F170A, SMB6F188A • UL94, V0 J-STD-020 MSL level 1 J-STD-002, JESD 22-B102 E3 and MIL-STD-750, method 2026 solderable matte tin plated leads JESD-201 class 2 whisker test IPC7531 footprint JEDEC registered package outline IEC 61000-4-4 level 4: – 4 kV IEC 61000-4-2, C= 150 pF - R = 330 Ω exceeds level 4: – 30 kV (air discharge) – 30 kV (contact discharge) Description The SMB6FxxA series are designed to protect sensitive circuits against surges. The Planar technology makes it compatible with high-end circuits where low leakage current and high junction temperature are required to provide long term reliability and stability. DS12898 - Rev 2 - February 2019 For further information contact your local STMicroelectronics sales office. www.st.com SMB6FxxA Characteristics 1 Characteristics Table 1. Absolute maximum ratings (Tamb = 25 °C) Symbol Parameter Value Unit ISO10605 (C = 330 pF, R = 330 Ω): VPP Peak pulse voltage Contact discharge 30 Air discharge 30 kV ISO10605 / IEC 61000-4-2 (C = 150 pF, R = 330 Ω) Contact discharge 30 Air discharge 30 10/1000 µs, Tj initial = Tamb 600 W PPP Peak pulse power dissipation Tstg Storage temperature range -65 to +175 °C Tj Operating junction temperature range -55 to +175 °C TL Maximum lead temperature for soldering during 10 s 260 °C Figure 1. Electrical characteristics - parameter definitions Figure 2. Pulse definition for electrical characteristics DS12898 - Rev 2 page 2/13 SMB6FxxA Characteristics Table 2. Electrical characteristics - parameter values (Tamb = 25 °C, unless otherwise specified) Type 25 °C 85 °C µA 10 / 1000 µs VBR at IBR (1) IRM max at VRM Min. V Typ. VCL Max. V (2)(3) (4) IPP Max. mA 8 / 20µs RD VCL (2)(3) Max. Max. IPP(4) RD αT Max. Max. V A Ω V A Ω 10-4/°C SMB6F5.0A 20 50 5.0 6.4 6.74 7.1 10 9.2 68 0.031 13.4 298 0.021 5.7 SMB6F6.0A 20 50 6.0 6.7 7.05 7.4 10 10.3 61 0.048 13.7 290 0.022 5.9 SMB6F6.5A 20 50 6.5 7.2 7.58 8 10 11.2 56 0.057 14.5 276 0.024 6.1 SMB6F8.5A 20 50 8.5 9.4 9.9 10.4 1 14.4 41.7 0.096 19.5 205 0.044 7.3 SMB6F10A 0.2 1 10 11.1 11.7 12.3 1 17 37 0.127 21.7 184 0.051 7.8 SMB6F11A 0.2 1 11 12.3 13 13.7 1 18 33.8 0.127 24.2 1665 0.064 8.1 SMB6F12A 0.2 1 12 13.3 14 14.7 1 19.9 31 0.168 25.3 157 0.068 8.3 SMB6F13A 0.2 1 13 14.4 15.2 16 1 21.5 29 0.190 27.2 147 0.076 8.4 SMB6F14A 0.2 1 14 15.7 16.5 17.3 1 23.1 26 0.223 29 136 0.086 8.6 SMB6F15A 0.2 1 15 16.7 17.6 18.5 1 24.4 25.1 0.235 32.5 123 0.114 8.8 SMB6F16A 0.2 1 16 17.9 18.8 19.8 1 26 23.1 0.268 34.7 115 0.130 9.0 SMB6F18A 0.2 1 18 20 21.1 22.2 1 29.2 21.5 0.326 39.3 102 0.168 9.2 SMB6F20A 0.2 1 20 22.2 23.4 24.6 1 32.4 19.4 0.402 42.8 93 0.196 9.4 SMB6F22A 0.2 1 22 24.4 25.7 27 1 35.5 17.7 0.480 48.3 83 0.257 9.6 SMB6F23A 0.2 1 23 25.7 27 28.4 1 37.8 16.4 0.573 49.2 81 0.257 9.6 SMB6F24A 0.2 1 24 26.7 28.1 29.5 1 38.9 16 0.588 50 80 0.256 9.6 SMB6F26A 0.2 1 26 28.9 30.4 31.9 1 42.1 14.9 0.685 53.5 75 0.288 9.7 SMB6F28A 0.2 1 28 31.1 32.7 34.3 1 45.4 13.8 0.804 59 68 0.363 9.8 SMB6F30A 0.2 1 30 33.2 35 36.8 1 48.4 13 0.885 64.3 62 0.442 9.9 SMB6F31A 0.2 1 31 34.2 36 37.8 1 50.2 12.3 1.01 65 61 0.45 9.9 SMB6F33A 0.2 1 33 36.7 38.6 40.5 1 53.3 11.8 1.08 69.7 57 0.512 10 SMB6F36A 0.2 1 36 40 42.1 44.2 1 58.1 10.3 1.35 76 52 0.612 10 SMB6F40A 0.2 1 40 44.4 46.7 49 1 64.5 9.7 1.60 84 48 0.729 10.1 SMB6F48A 0.2 1 48 53.2 56 58.8 1 77.4 8.1 2.28 100 40 1.03 10.3 SMB6F58A 0.2 1 58 64.6 68 71.4 1 93.6 6.7 3.34 121 33 1.51 10.4 SMB6F70A 0.2 1 70 77.9 82 86.1 1 113 5.5 4.91 146 27 2.22 10.5 SMB6F85A 0.2 1 85 95 100 105 1 137 4.6 7.17 178 22.5 3.29 10.6 SMB6F100A 0.2 1 100 111 117 123 1 162 3.8 10.3 212 19 4.68 10.7 SMB6F130A 0.2 1 130 144 152 160 1 209 3 16.3 265 15 7 10.8 SMB6F154A 0.2 1 154 171 180 189 1 246 2.4 23.8 317 12.6 10.2 10.8 SMB6F170A 0.2 1 170 190 200 210 1 275 2.2 30 353 11.3 12.7 10.8 SMB6F188A 0.2 1 188 209 220 231 1 328 2 48.5 388 10.3 15.2 10.8 1. To calculate VBR versus Tj : VBR at Tj = VBR at 25 °C x (1 + αT x (Tj - 25)) 2. To calculate VCL versus Tj : VCL at Tj = VCL at 25 °C x (1 + αT x (Tj - 25)) 3. To calculate VCL max versus IPPappli: VCLmax = VBR max + RD x IPPappli 4. Surge capability given for both directions DS12898 - Rev 2 page 3/13 SMB6FxxA Characteristics (curves) 1.1 Characteristics (curves) Figure 3. Maximum peak power dissipation versus initial junction temperature Ppp (W) 800 Figure 4. Maximum peak pulse power versus exponential pulse duration Ppp (W) 10000 10/1000 µs 600 Tj initial = 25 °C VRM < 100V 1000 400 VRM ≥ 100V 100 200 0 Tj (°C) 0 25 50 75 100 125 150 175 200 Figure 5. Maximum peak pulse current versus clamping voltage Ipp (A) 1000 tp (ms) 10 0.01 0.1 1 10 Figure 6. Dynamic resistance versus pulse duration 1000 RD (Ω) 8/20 µs 10/1000 µs 100 100 SMB6F188A 10 SMB6F70A 1 10 0.1 SMB6F188A SMB6F70A 0.1 SMB6F33A SMB6F5.0A 1 SMB6F5.0A 0.01 V CL (V) 1 DS12898 - Rev 2 10 100 SMB6F33A 1000 0.001 0.01 t p (ms) 0.1 1 10 page 4/13 SMB6FxxA Characteristics (curves) Figure 7. Junction capacitance versus reverse applied voltage (unidirectional types) 10000 Figure 8. Leakage current versus junction temperature 10000 C (pF) IR (nA) VR=VRM f = 1 MHz Vosc = 30 mVRMS Tj = 25 °C VRM < 10V 1000 SMB6F5.0A 1000 100 VRM ≥ 10V SMB6F33A 100 10 SMB6F70A SMB6F188A V R (V) 10 1 10 1 100 1000 Figure 9. Peak forward voltage drop versus peak forward current 1000 single pulse 10 50 75 100 125 150 175 Figure 10. Thermal impedance junction to ambient versus pulse duration IF (A) 100 T j (°C) 25 Zth(j-a) (°C/W) Single pulse on recommended footprint. Epoxy printed circuit board FR4, 70 µm Cu thickness 100 Tj = 175 °C single pulse 25 °C TTj j==175 °C 10 1 V F (V) 0 0 0.5 1 1.5 2 2.5 tp (s) 1 0.01 3 0.1 1 10 100 1000 Figure 11. Thermal resistance junction to ambient versus copper area under each lead (SMB Flat) 150 Rth(j-a) (°C/W) Single pulse on recommended footprint. Epoxy printed circuit board FR4, 70 µm Cu thickness 120 90 60 30 0 DS12898 - Rev 2 SCu (cm²) 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 page 5/13 SMB6FxxA Package information 2 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. 2.1 SMB Flat package information Figure 12. SMB Flat package outline Table 3. SMB Flat mechanical data Dimensions Min. A Inches(1) Millimeters Ref. Typ. 0.90 A1 Max. Min. 1.10 0.035 0.05 Typ. Max. 0.044 0.002 b 1.95 2.20 0.076 0.087 c 0.15 0.40 0.005 0.016 D 3.30 3.95 0.129 0.156 E 5.20 5.60 0.204 0.221 E1 4.05 4.60 0.159 0.182 G 2.00 0.079 G1 1.20 0.047 L 0.75 1.20 0.029 0.048 L1 0.30 0.012 L2 0.60 0.024 L3 0.02 0.000 V 8° 8° V1 8° 8° 1. Values in inches are converted from mm and rounded to 3 decimal digits. DS12898 - Rev 2 page 6/13 SMB6FxxA SMB Flat package information Figure 13. Footprint recommendations, dimensions in mm (inches) 1.20 (0.047) 3.44 (0.136) Figure 14. Marking layout (refer to ordering information table for marking) 1.20 (0.047) 2.07 (0.082) 5.84 (0.230) millimeters (inches) Figure 16. Tape and reel orientation Figure 15. Package orientation in reel Figure 17. Reel dimensions (mm) DS12898 - Rev 2 Figure 18. Inner box dimensions (mm) page 7/13 SMB6FxxA SMB Flat package information Figure 19. Tape and reel outline Table 4. Tape and reel mechanical data Dimensions Millimeters Ref. DS12898 - Rev 2 Min. Typ. Max. ØD0 1.45 1.50 1.55 ØD1 1.5 F 5.4 5.5 5.6 K0 1.2 1.3 1.4 P0 3.9 4.0 4.1 P1 7.9 8.0 8.1 P2 1.9 2.0 2.1 W 11.7 12.0 12.3 page 8/13 SMB6FxxA Reflow profile 2.2 Reflow profile Figure 20. ST ECOPACK® recommended soldering reflow profile for PCB mounting 250 240-245 °C Temperature (°C) -2 °C/s 2 - 3 °C/s 60 sec (90 max) 200 -3 °C/s 150 -6 °C/s 100 0.9 °C/s 50 Time (s) 0 Note: DS12898 - Rev 2 30 60 90 120 150 180 210 240 270 300 Minimize air convection currents in the reflow oven to avoid component movement. Maximum soldering profile corresponds to the latest IPC/JEDEC J-STD-020. page 9/13 SMB6FxxA SMB6F Ordering information 3 Ordering information Figure 21. Ordering information scheme SMB 6 F xx A Package: SMB Power capability (10 / 1000 µs): 600 W Flat package Stand-off voltage: VRM Type: A : unidirectional Table 5. Ordering information DS12898 - Rev 2 Order code Marking Package Weight Base qty. Delivery mode SMB6FxxA See Table 6. Marking. SMB Flat 56 mg 5000 Tape and reel page 10/13 SMB6FxxA SMB6F Ordering information Table 6. Marking DS12898 - Rev 2 Order code Marking SMB6F5.0A 7AI SMB6F6.0A 7AK SMB6F6.5A 7AL SMB6F8.5A 7AP SMB6F10A 7AS SMB6F11A 7AU SMB6F12A 7AW SMB6F13A 7AY SMB6F14A 7BA SMB6F15A 7BC SMB6F16A 7BE SMB6F18A 7BI SMB6F20A 7BM SMB6F22A 7BO SMB6F23A 7BP SMB6F24A 7BQ SMB6F26A 7BS SMB6F28A 7BU SMB6F30A 7BW SMB6F31A 7BX SMB6F33A 7BZ SMB6F36A 7CC SMB6F40A 7CG SMB6F48A 7CO SMB6F58A 7CY SMB6F70A 7DK SMB6F85A 7DZ SMB6F100A 7EO SMB6F130A 7FS SMB6F154A 7GQ SMB6F170A 7HG SMB6F188A 7HY page 11/13 SMB6FxxA Revision history Table 7. Document revision history DS12898 - Rev 2 Date Version Changes 21-Jan-2019 1 Initial release. 19-Feb-2019 2 Updated link syntax. page 12/13 SMB6FxxA IMPORTANT NOTICE – PLEASE READ CAREFULLY STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement. Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers’ products. No license, express or implied, to any intellectual property right is granted by ST herein. Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. ST and the ST logo are trademarks of ST. All other product or service names are the property of their respective owners. Information in this document supersedes and replaces information previously supplied in any prior versions of this document. © 2019 STMicroelectronics – All rights reserved DS12898 - Rev 2 page 13/13