SPZB32W1C2.1

SPZB32W1x2.1 ZigBee™ PRO modules based on the STM32W chipset Features ■ 2.4 GHz IEEE 802.15.4-compliant SMD modules based on the ST single chip STM32W108CB featuring: – Integrated 2.4 GHz transceiver – PHY and MAC IEEE 802.15.4 features – Integrated ARM® Cortex-M3 core – Integrated 128 kB embedded Flash and 8 kB embedded RAM – Integrated encryption (AES-128) accelerator – +3 dBm output power (+8 dBm in boost mode) – -99 dBm receiver sensitivity ■ Robust Wi-Fi and Bluetooth® coexistence ■ 16 channels (IEEE 802.15.4 channel 11 to 26) ■ 24 general purpose I/O lines including analogue inputs (all GPIOs of the STM32W108CB are accessible) ■ Industry standard JTAG programming ■ Deep sleep current of sub 1 µA ■ Onboard 24 MHz and 32.768 kHz stable Xtal ■ Selectable chip integrated RC oscillator ■ Multiple antenna options: integrated antenna (SPZB32W1A2.1) or integrated UFL connector (SPZB32W1C2.1) ■ Single voltage supply (2.1 to 3.6 V) ■ FCC and CE compliant qualified ■ Small form factor: 16.4 x 26.5 mm ■ Operating temperature range: -40 °C to +85 °C July 2011 Doc ID 018899 Rev 2 !-6 1/19 www.st.com 19 Contents SPZB32W1x2.1 Contents 1 Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 2 RoHS compliance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 3 Application . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 4 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 5 Pin settings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 6 5.1 Pin connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 5.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 6.1 Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 6.2 Recommended operating conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 6.3 DC electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 6.4 Digital I/O specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 6.5 RF electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 7 Mechanical dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 8 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 9 Product approvals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 9.1 FCC approvals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 9.2 European certification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 10 Ordering information scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 11 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 2/19 Doc ID 018899 Rev 2 SPZB32W1x2.1 1 Description Description SPZB32W1A2.1 and SPZB32W1C2.1 are ready-to-use ZigBee® modules optimized for embedded applications that require low data rate communications. The modules are very compact and enable OEMs to easily add wireless capabilities to electronic devices by optimizing time-to-market, cost, size, and consumption of their target applications. No RF experience or expertise is required to add this powerful wireless networking capability to the final product. The modules are based on the ST STM32W108CB single chip which integrates a 2.4 GHz, IEEE 802.15.4-compliant transceiver together with an ARM® Cortex-M3 embedded processor. 24 MHz high stability Xtal is available aboard the modules to perform the timing requirements as per ZigBee specifications; additionally, a 32.768 kHz Xtal is also provided onboard for low power operation. A single supply voltage is requested to power the modules. The supply is in the range of 2.8 to 3.6 V. An innovative 2.5 GHz RF design and the relevant internal RF amplifier onboard ensure the optimal exploitation of the link budget, an excellent sensitivity and low power consumption for battery powered operation. The voltage supply also determines the I/O port level, allowing an easy interface with additional peripherals. To support user defined applications, a number of peripherals such as GPIO, UART, I2C, ADC, and general purpose timers are available through the 24 configurable general purpose I/O lines. The modules can run the ZigBee PRO EmberZNet firmaware packages (ZigBee PRO stack) which are accessible on the ST website. Modules are available with two different antenna options: Note: ● SPZB32W1A2.1, with an onboard integrated ceramic antenna ● SPZB32W1C2.1, with UFL RF connector for the connection of an external antenna. For details regarding STM32W108CB refer to the related datasheet available on the ST website. Doc ID 018899 Rev 2 3/19 RoHS compliance 2 SPZB32W1x2.1 RoHS compliance ST modules are RoHS compliant and comply with ECOPACK® norms. 3 4/19 Application ● Smart energy applications ● Machine2Machine industrial control ● Wireless sensor networks ● Home/building automation ● Smart appliances ● Wireless alarms and security systems ● Lighting control ● Remote monitoring Doc ID 018899 Rev 2 SPZB32W1x2.1 4 Block diagram Block diagram Figure 1. SPZB32W1A2.1 block diagram 9GG 6,) *3,2 N+] ;WDO ;7$/ 0+] ;WDO 670: 7UDQFHLYHU 5) DQWHQQD EDOXQ %3)  &21756,*1 ".W Figure 2. SPZB32W1C2.1 block diagram 9GG 6,) *3,2 N+] ;WDO  5) DQWHQQD 0+] ;WDO 670: 7UDQFHLYHU EDOXQ %3)  &21756,*1   Doc ID 018899 Rev 2 ".W 5/19 Pin settings SPZB32W1x2.1 5 Pin settings 5.1 Pin connections Figure 3. Pin connection diagram Antenna TOP VIEW 6/19 Doc ID 018899 Rev 2 AM09235V1 Pin description Table 1. Pin description Module pin n° Pin name Direction STM32W pin Description PB5 I/O 43 Digital I/O ADC0 Analog 43 ADC input 0 TIM2CLK I 43 Timer 2 external clock input TIM1MSK I 43 Timer 1 external clock mask input PA5 I/O 27 Digital I/O ADC5 Analog 27 ADC input 1 PTI_DATA O 27 Frame signal of PTI (packet trace interface) nBOOTMODE I 27 Embedded serial bootloader activation out of reset TRACEDATA3 0 27 Synchronous CPU trace data bit 3 PA4 I/O 26 Digital I/O ADC4 Analog 26 ADC input 0 PTI_EN O 26 Frame signal of PTI (packet trace interface) TRACEDATA2 O 26 Synchronous CPU trace data bit 2 PA3 I/O 25 Digital I/O SC2nSSEL I 25 SPI slave select of serial controller 2 TIM2_CH2 I/O 25 Timer 2 channel 2 output (or input - disable remap with TIM2_OR[5]) TRACECLK O 25 Synchronous CPU trace clock nRESET I 12 Active low reset (an internal pull-up of 30 kΩ typ. is provided) PB3 I/O 19 Digital I/O UART_CTS I 19 UART CTS handshake of serial controller 1 SC1SCLK I/O 19 SPI slave clock of serial controller SC1 / SPI master clock of serial controller SC1 TIM2_CH3 I/O 19 Timer 2 channel 3 input / timer 2 channel 3 output SPZB32W1x2.1 5.2 1 2 Doc ID 018899 Rev 2 3 4 5 7/19 Pin settings 6 Pin description (continued) Module pin n° Pin name Direction STM32W pin Description PB4 I/O 20 Digital I/O UART_RTS O 20 UART RTS handshake of serial controller 1 TIM2_CH4 I/O 20 Timer 2 channel 4 input / timer 2 channel 4 output SC1nSSEL I 20 SPI slave select of serial controller 1 PA0 I/O 21 Digital I/O SC2MOSI O 21 SPI master data out of serial controller 2 SC2MOSI I 21 SPI slave data in of serial controller 2 TIM2_CH1 I/O 21 Timer 2 channel 1 input / timer 2 channel 1 output PA1 I/O 22 Digital I/O SC2MISO I 22 SPI master data in of serial controller 2 SC2MISO O 22 SPI slave data out of serial controller 2 SC2SDA I/O 22 TWI (I2C) data of serial controller 2 TIM2_CH3 I/O 22 Timer 2 channel 3 input / timer 2 channel 3 output PA2 I/O 24 Digital I/O SC2SCLK O 24 SPI master clock of serial controller 2 SC2SCLK I 24 SPI slave clock of serial controller 2 SC2SCL I/O 24 TWI (I2C) clock of serial controller 2 TIM2_CH4 I/O 24 Timer 2 channel 4 input / timer 2 channel 4 output 11 GND -- 49 Ground 12 VDD Power 16,23,28,37 PC1 I/O 38 Digital I/O ADC3 Analog 38 ADC input 3 SWO O 38 Serial wire output synchronous trace output to debugger TRACEDATA0 O 38 Synchronous CPU trace data bit 0 Pin settings 8/19 Table 1. 7 8 Doc ID 018899 Rev 2 9 10 Input power supply SPZB32W1x2.1 13 Pin description (continued) Module pin n° Pin name Direction STM32W pin Description PB0 I/O 36 Digital I/O VREF (O/I) Analog 36 ADC reference output / ADC reference input TIM1CLK I 36 Timer 1 external clock input TIM2MSK I 36 Timer 2 external clock mask input IRQA I 36 External interrupt source A TRACECLK O 36 Synchronous CPU trace clock PB1 I/O 30 Digital I/O SC1TXD O 30 UART transmit data of serial controller 1 SC1MOSI / SC1MISO O 30 SPI master data out of serial controller 1 / SPI slave data out of serial controller 1 SC1SDA I/O 30 TWI (I2C) data of serial controller 1 TIM2_CH1 I/O 30 Timer 2 channel 1 input / timer 2 channel 1 output PB2 I/O 31 Digital I/O SC1RXD I 31 UART receive data of serial controller 1 SC1MISO / SC1MOSI I 31 SPI master data in of serial controller SC1 / SPI slave data in of serial controller 1 SC1SCL I/O 31 TWI (I2C) clock of serial controller 1 TIM2_CH2 I/O 31 Timer 2 channel 2 input / timer 2 channel 2 output JTCK I 32 JTAG clock input from debugger SWCLK I/O 32 Serial wire clock input/output with debugger PC2 I/O 33 Digital I/O JTDO O 33 JTAG data out to debugger SWO O 33 Serial wire output synchronous trace output to debugger PC3 I/O 34 Digital I/O JTDI I 34 JTAG data in from debugger PC4 I/O 35 Digital I/O JTMS I 35 JTAG mode select from debugger SWDIO I/O 35 Serial wire bidirectional data to/from debugger SPZB32W1x2.1 Table 1. 14 15 Doc ID 018899 Rev 2 16 17 18 9/19 20 Pin settings 19 Pin description (continued) Module pin n° Pin name Direction STM32W pin Description PC0 I/O 40 Digital I/O (high current) JRST I 40 JTAG reset input from debugger TRACEDATA1 O 40 Synchronous CPU trace data bit 1 IRQD I 40 External interrupt source D PB7 I/O 41 Digital I/O TIM1_CH2 O 41 Timer 1 channel 2 output TIM1 _CH2 I 41 Timer 1 channel 2 input IRQC I 41 External interrupt source C ADC2 I 41 ADC input 2 PB6 I/O 42 Digital I/O TIM1_CH1 O 42 Timer 1 channel 1 output TIM1_CH1 I 42 Timer 1 channel 1 input IRQB I 42 External interrupt source B ADC1 Analog 42 ADC input 1 PA6 I/O 29 Digital I/O TIM1_CH3 O 29 Timer 1 channel 3 output TIM1_CH3 I 29 Timer 1 channel 3 input PA7 I/O 18 Digital I/O TIM1_CH4 O 18 Timer 1 channel 4 output TIM1_CH4 I 18 Timer 1 channel 4 input REG_EN O 18 External regulator open drain output (enabled after reset) PC5 I/O 11 Digital I/O TX_ACTIVE O 11 Logic level control for external Rx/Tx switch Pin settings 10/19 Table 1. 21 22 Doc ID 018899 Rev 2 23 24 25 SPZB32W1x2.1 26 SPZB32W1x2.1 Electrical characteristics 6 Electrical characteristics 6.1 Absolute maximum ratings Table 2. Absolute maximum ratings Symbol 6.2 Parameter Max. Unit VDD Module supply voltage - 0.3 3.6 V Vin Input voltage on any digital pin - 0.3 Vdd + 0.3 V Tstg Storage temperature -40 +85 °C Tsold Soldering temperature < 10s 250 °C Recommended operating conditions Table 3. Recommended operating conditions Symbol 6.3 Min. Parameter VDD Module supply voltage Tstg Operating ambient temperature Conditions -40 °C < T < +85 °C Min. Typ. Max. 2.8 3.3 -40 Unit 3.6 V +85 °C DC electrical characteristics Table 4. Symbol DC electrical characteristics Parameter Conditions Min. Typ. Max. Unit IRX RX current Vdd = 3.3 V, T= 25 °C - 28 - mA ITX TX current Po = 3 dBm, Vdd = 3.3 V, T = 25 °C, F = 2450MHz - 32 - mA IDS Deep sleep current (32.768 kHz oscillator) Vdd = 3.3 V, T = 25 °C - 1.3 - µA Doc ID 018899 Rev 2 11/19 Electrical characteristics SPZB32W1x2.1 6.4 Digital I/O specifications Table 5. Digital I/O specifications Symbol Parameter Conditions Min. Typ. Max. Unit VIL Low level input voltage 2.1 < Vdd < 3.6 V 0 0.5 x Vdd V VIH High level input voltage 2.1 < Vdd < 3.6 V 0.62 x Vdd Vdd V Iil Input current for logic 0 2.1 < Vdd < 3.6 V -0.5 mA Iih Input current for logic 1 2.1 < Vdd < 3.6 V 0.5 mA Ripu Input pull-up resistor 30 kΩ Ripd Input pull-down resistor 30 kΩ VOL Low level output voltage 0 0.18 x Vdd V VOH High level output voltage 0.82 x Vdd Vdd V IOHS Output source current (standard) 4 mA IOLS Output sink current (standard) 4 mA IOHH Output source current (high current) 8 mA IOLH Output sink current (high current) 8 mA IOTot Total output current for I/O 40 mA 6.5 RF electrical characteristics Table 6. Symbol Electrical characteristics Parameter Conditions Min. Typ. Max. Unit Frequency range Vdd = 3.3 V, T= 25 °C 2405 2480 MHz TX Output power Vdd = 3.3 V, T= 25 °C 3 6 dBm RX Sensitivity Vdd = 3.3 V, 1 % PER -95 - 97 dBm ±5 MHz ±10 MHZ 35 40 Adjacent channel rejection 12/19 Doc ID 018899 Rev 2 dBm SPZB32W1x2.1 7 Mechanical dimensions Mechanical dimensions Figure 4. Mechanical dimensions Figure 5. Pin land pattern (dimensions in mm) Pitch = 1.27 Recommended land pattern top view AM09234V1 Doc ID 018899 Rev 2 13/19 Soldering 8 SPZB32W1x2.1 Soldering The soldering phase must be carefully executed; in order to avoid undesired melting phenomenon, particular attention must be paid to the set-up of the peak temperature. Below are some suggestions for the temperature profile based on IPC/JEDEC J-STD-020C, July 2004 recommendations Table 7. Soldering Profile feature Average ramp up rate (TSMAX to TP) 3 °C / sec max. Preheat Temperature min. (TS MIN) Temperature max. (TS MAX) Time (TS MIN to TS MAX) (tS) 150 °C 200 °C 60 – 100 sec Time maintained above: Temperature TL Time tL 217 °C 40 – 70 sec Peak temperature (Tp) 240 + 0 °C Time within 5 °C of actual peak temperature (tP) 10 – 20 sec Ramp down rate 6 °C / sec Time from 25 °C to peak temperature Figure 6. 14/19 PB free assembly Soldering profile Doc ID 018899 Rev 2 8 minutes max. SPZB32W1x2.1 9 Product approvals Product approvals These modules have been designed to meet national regulations for world wide use. In particular the following certifications have been obtained 9.1 FCC approvals The SPZB32W1A2.1 device, with integrated antenna, as well as the SPZB32W1C2.1, with the antenna specified in Table 8, have been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses, and can radiate, radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference can not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures: ● Reorient or relocate the receiving antenna ● Increase the separation between the equipment and receiver ● Connect the equipment to an outlet on a circuit different from that to which the receiver is connected Consult the dealer or an experienced radio/TV technician for help. Module type: ZigBee® module, SPZB32W1A2.1 / SPZB32W1C2.1 FCC-ID: S9NZB32C2 Modular type: single modular Table 8. FCC approvals ITEM Part No. Manufacturer 1 2010B4844-01 (Titanis Antenna) Antenova Any changes or modifications not expressly approved by the part responsible for compliance may cause the module to cease to comply with FCC rules part 15, and therefore render void the user’s authority to operate the equipment. While the applicant for a device into which the SPZB32W1A2.1 or the SPZB32W1C2.1 with the antenna specified in Table 8 installed is not required to obtain new authorization for the module, this does not preclude the possibility that some other form of authorization or testing may be required for the end product. Doc ID 018899 Rev 2 15/19 Product approvals SPZB32W1x2.1 FCC labelling requirements When integrating the SPZB32W1A2.1 / SPZB32W1C2.1 into the final product, it must be ensured that the FCC labelling requirements, as specified below, are satisfied. Based on the Public Notice from FCC, the product into which the ST transmitter module is installed must display a label referring to the enclosed module. The label should use wording such as “Contains Transmitter module FCC ID: S9NZB32C2 or “Contains FCC ID: S9NZB32C2, any similar wording that expressed the same meaning may be used. An example is: Contains FCC ID: S9NZB32C2 9.2 European certification The SPZB32W1A2.1 and the SPZB32W1C2.1 devices are CE certified: Expert opinion N. 0365-ARAKO0071 released by IMQ refers to the following normatives: 16/19 ● Radio: EN300 328: V1.7.1: 2006-10 ● EMS: EN301 489-17 v 2.1.1: 2009 ● Safety: EN60950-1:2006 + A11:2009 Doc ID 018899 Rev 2 SPZB32W1x2.1 Ordering information scheme 10 Ordering information scheme Table 9. Ordering information scheme SPZB 32W1 A 2 .1 ZigBee modules Based on STM32W108CB A: Integrated antenna C: Integrated UFL connector 2: Normal TX range 1: Long TX range ZigBee PRO (EmberZnet) Doc ID 018899 Rev 2 17/19 Revision history 11 SPZB32W1x2.1 Revision history Table 10. Document revision history Date Revision 22-Jun-2011 1 Initial release. 2 Updated single voltage supply in features on cover page. Updated Table 4: DC electrical characteristics. Updated test conditions in Table 5: Digital I/O specifications. Removed CFE parameter in Table 5: Digital I/O specifications. Updated description of letter C inTable 9: Ordering information scheme. Minor text changes. 25-Jul-2011 18/19 Changes Doc ID 018899 Rev 2 SPZB32W1x2.1 Please Read Carefully: Information in this document is provided solely in connection with ST products. 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The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners. © 2011 STMicroelectronics - All rights reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Philippines - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America www.st.com Doc ID 018899 Rev 2 19/19