STCC2540IQTR

STCC2540 USB charging controller with integrated power switch Datasheet - production data Applications • USB ports / hubs • Personal computers, all-in-one PCs • Monitors • Notebooks, ultrabooks • Tablet PCs VFQFPN 16L 3 x 3 x 0.8 mm • Universal wall charging adapters Description Features • Compliant with USB charging specifications BC1.2, USB 2.0 and USB 3.0 standards • Compliant with Chinese telecommunications industry standard YD/T 1591-2009 • Compatible with proprietary charging mode (Apple® 1 A / 2 A, BlackBerry®, Korean tablets) • Wide bandwidth, low-loss USB 2.0 data switch • Integrated VBUS power switch with low RON of 65 mΩ • Constant current mode overcurrent protection • Soft-start to limit inrush current • Adjustable current limit up to 2.8 A • Short-circuit, thermal and undervoltage protection • Reverse voltage and reverse current protection The STCC2540 device integrates, in one package, a USB charger controller, a wide bandwidth data switch, and a high current power switch. The device emulates several profiles compatible with the USB battery charging standard, BC1.2, Chinese telecommunications standard YD/T 1591-2009, and proprietary charger modes. The device asserts the charging flag in DCP modes if the charging current is higher than the threshold. In CDP mode, it asserts the charging flag after the CDP negotiation if the charging current is higher than the threshold. After the current drops below the threshold, the output is deasserted, allowing the host to turn off the high power DC-DC converter and reduce overall consumption in S4/S5 states, which is critical when the host is battery supplied. • Deglitched fault reporting output • Supports remote wakeup in S3 • Charging indication output in DCP and CDP modes • Package: VFQFPN 16L 3 x 3 x 0.8 mm with exposed pad • Temperature range: -40 up to 85 °C • UL and CB recognized components (UL file number: E354278) February 2014 This is information on a product in full production. DocID024711 Rev 6 1/32 www.st.com Contents STCC2540 Contents 1 Functional description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 3 Absolute maximum ratings and operating conditions . . . . . . . . . . . . . 6 4 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 5 Application information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 5.1 Supported modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 5.2 Remote wakeup in S3 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 5.3 VBUS discharge . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 5.4 State machine . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 5.5 Charging detection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 5.6 Power switch . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Overcurrent conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Thermal protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Undervoltage lockout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 FAULT functionality . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Current limit programming . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 5.7 Enable input . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 5.8 Input and output capacitors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 6 Typical operating characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 7 Package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28 8 Ordering information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 9 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31 2/32 DocID024711 Rev 6 STCC2540 1 Functional description Functional description The STCC2540 device integrates, in one package, a complete solution to charge portable devices through USB ports, including: • Charger emulator compatible with USB battery charging BC1.2 standard, Chinese telecommunications standard YD/T 1591-2009 and proprietary charger such as Apple® divider mode, BlackBerry® and Korean tablet charging mode. • 3 control pins, CTL1, CTL2, CTL3 allowing the host to select the emulation profile. These pins may be controlled directly from the host USB controller or from the embedded controller. • USB data switch with wide bandwidth up to 1100 MHz compliant with USB 2.0 standard. This wide bandwidth switch features low capacitance and low RON resistance, allowing signals to pass with minimum edge and phase distortion. • N-channel power switch with low RON resistance of 65 mΩ typ., high current limiter accuracy and high current output capability, 2.5 A typ. The current limit threshold can be adjusted with a good accuracy by an external resistor in the range 500 mA to 2.8 A (max.). Constant current mode protection is used to protect the device and the host system against overcurrent or short-circuit. Other protection includes reverse current and reverse voltage protection, undervoltage lockout and thermal shutdown. • A deglitched output (FAULT) reporting the failure events of overcurrent, thermal shutdown and reverse current (backdrive) to VIN. • Charging current sensing circuit. The output CHARGING is asserted if charging current is above 20 mA in CDP and DCP modes. In CDP mode the charging flag is s asserted only if the CDP handshaking between the portable device and the host is performed before the current is above threshold. After the current drops below threshold, the output CHARGING is deasserted. The host system can then disable the high power DC-DC converter and thus reduce the power consumption. This is crucial when the host is battery supplied. • An enable input (EN) to enable/disable the device. The device is offered in a small, RoHS compliant VFQFPN 16L (3 x 3 x 0.8 mm) package with an exposed pad for effective cooling. DocID024711 Rev 6 3/32 32 Functional description STCC2540 Figure 1. Block diagram 86%GDWD VZLWFK '3B287 '0B287 '3B,1 '0B,1 (PXODWLRQ SURILOHV 9,1 )$8/7 7KHUPDOFRQWURO &+$5*,1* ,/,0 (1 &7/ &7/ &7/  9,1 89/2 /RJLFFRQWURO 5HYHUVH FXUUHQW 9,1 9,1 3RZHU VZLWFK ,1 287 2XWSXW GLVFKDUJH *1' $09 Figure 2. Pinout ,1  '0B287  '3B287  1&  ,/,0 1& *1'    )$8/7  ([SRVHG WKHUPDOSDG *1'   (1 &7/  &7/  287  '0B,1  '3B,1  &+$5*,1*  &7/ $09 4/32 DocID024711 Rev 6 STCC2540 2 Pin description Pin description Table 1. Pin description Pin no. Name Type Description 1 IN 2, 3 DM_OUT, DP_OUT I/O 4 NC - Not connected 5 EN I Logic level control input. When EN is low, power switch, data switch and emulator are OFF. 6, 7, 8 CTL1, CTL2, CTL3 I Logic level control inputs to select charger mode (see Table 5). 9 CHARGING O Active low open drain output, asserted when charging current is detected. 10, 11 DP_IN, DM_IN I/O USB 2.0 data connection to system USB connector (DM = D-, DP = D+) 12 OUT 13 FAULT O Active low open drain output, asserted when overcurrent, overtemperature or reverse voltage are detected. 14 GND - Ground 15 NC - Not connected 16 ILIM I Current limit threshold programming resistor terminal. PWR Device and USB port power supply input USB 2.0 data connection to system USB transmitter (DM = D-, DP = D+) PWR USB port power supply output (VBUS) DocID024711 Rev 6 5/32 32 Absolute maximum ratings and operating conditions 3 STCC2540 Absolute maximum ratings and operating conditions Stressing the device beyond the rating listed in Table 2: Absolute maximum ratings (AMR) may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions beyond those indicated in Table 3: Operating conditions is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Table 2. Absolute maximum ratings (AMR) Symbol Parameter Value VIN, VOUT Supply voltage -0.3 to 6.5 VEN, VCTLx Logical input voltage -0.3 to 6.5 VFAULT, VCHARGING Pull-up voltage (FAULT, CHARGING) -0.3 to 6.5 VDP_OUT, VDM_OUT, VDP_IN, VDM_IN Data switch pin voltage to ground IO(FAULT), IO(CHARGING) Maximum power switch output current, power switch ON V -0.3 to VIN +0.3 IDP_OUT, IDM_OUT, IDP_IN, Data switch current, switch ON IDM_IN IO(OUT) Unit ±50 mA Internally limited - 25 mA Logical output sink current TSTG Storage temperature (VIN OFF) TSLD Lead solder temperature for 10 seconds temperature (VIN OFF)(1) 260 Rthja Thermal resistance junction-to-ambient VFQFPN 16L(2) 60 °C/W -40 to TSTOP °C Tj VESD(OUT, DP_IN, DM_IN) VESD Maximum junction temperature (internally limited) -55 to +150 IEC61000-4-2 contact discharge (OUT, DP_IN, DM_IN pins) 8 JEDEC human body model (all pins)(3) 2 JEDEC machine model (all pins) 200 °C kV V 1. Reflow at temperature of 255 to 260 °C for time < 30 seconds (total thermal budget not to exceed 180 °C for a period from 90 to 150 seconds). 2. Rth are typical values, given when mounted on a 4-layer PCB with vias. 3. Measured in recommended application circuit with 1 μF ceramic capacitor + 150 μF low ESR electrolytic capacitor connected between OUT and GND pins (see Figure 4: Typical application diagram). Table 3. Operating conditions Symbol 6/32 Parameter Value Unit V VIN Supply voltage 4.5 to 5.5 TA Ambient operating temperature -40 to +85 TJ Junction operating temperature -40 to +125 DocID024711 Rev 6 °C STCC2540 4 Electrical characteristics Electrical characteristics Table 4. Electrical characteristics VIN = 4.5 to 5.5 V, -40 °C < TJ < 125 °C (unless otherwise specified) Symbol Parameter Conditions Min. Typ. Max. Unit Current consumption IACTIVE IDISABLED Mode CDP (111) 110 160 Mode SDP (110 - 010) 100 150 260 110 290 180 Mode DCP BC1.2 (100) 110 180 Mode DCP divider (101) 210 290 EN = 0, TJ = 25 °C 0.2 5 Mode DCP auto-detect (001) Supply current in active state – Divider mode (EN = 1) – BC1.2 Supply current in disable state TJ = 125 °C µA 60 Power switch - DC parameters RON │IREVERSE│ VREVERSE IOS TJ = 25 °C Static on-resistance 65 -40 °C < TJ < 125 °C Reverse leakage current in disabled state (absolute value) Reverse voltage protection threshold (VOUT - VIN) Current limiter threshold TSTOP Thermal shutdown threshold THYST Thermal shutdown hysteresis 95 VOUT = 5.5 V, VIN = 0, VEN = 0, TJ = 25 °C, measured at IN 1 5 µA TJ = 125 °C, other conditions the same as above 70 VUVLO < VIN < VOUT, EN = 1, power switch ON -> OFF 60 RILIM = 96 kΩ 340 RILIM = 33 kΩ 1290 1450 1595 RILIM = 19.6 kΩ 2255 2450 2645 RILIM = 17.2 kΩ 2800 140 500 mV 150 625 EN input leakage current VEN Enable input turn-on, turn-off threshold voltage VHYST(EN) Enable input turn-on, turn-off voltage hysteresis VOL(FAULT) FAULT output low voltage VIN = 5.5 V, VEN = 0 V or 5 V °C -1 1 µA 0.4 1.6 V 500 IFAULT = 1 mA DocID024711 Rev 6 mA 160 20 IEN mΩ mV 180 7/32 32 Electrical characteristics STCC2540 Table 4. Electrical characteristics VIN = 4.5 to 5.5 V, -40 °C < TJ < 125 °C (unless otherwise specified) (continued) Symbol Parameter Conditions FAULT output leakage current VIN = 5.5 V, VFAULT = 5 V tFAULT FAULT output deglitch delay FAULT assertion / deassertion delay in overcurrent condition VUVLO Undervoltage lockout VIN rising VHYST(UVLO) Undervoltage lockout hysteresis TJ = 25 °C IOL(FAULT) Min. Typ. Max. Unit 1 µA 7 9 12 ms 3.9 4.1 4.3 V 100 mV Power switch - AC parameters(1) tON Turn on, EN to OUT delay tOFF Turn off, EN to OUT delay tR OUT (VBUS) rise time tF OUT (VBUS) fall time tIOS 0.8 CLOAD = 1 µF, RLOAD = 100 Ω 0.3 CLOAD = 1 µF, RLOAD = 100 Ω Current limiter response time to short-circuit ms 0.4 0.2 VIN = 5.5 V 3.5 µs Output discharge RDISCHARGE Discharge resistor 140 200 300 4 Ω High-speed data switch - DC parameters Data switch on-resistance Switch closed, VIN = 5 V, IS = 8 mA, test voltage on DP_OUT, DM_OUT = 0.4 V 2.5 RON Data switch on-resistance Switch closed, VIN = 5 V, IS = 8 mA, test voltage on DP_OUT, DM_OUT = 3 V 2.7 IOFF OFF state leakage current VEN = 0 V, VDP/DM_IN = 3.6 V, VDP/DM_OUT = 0 V, measure IDP/DM_OUT RON Ω 4 1.5 µA High-speed data switch - AC parameters(1) XTALK OIRR Bw DP, DM crosstalk RTERM = 50 Ω, CLOAD = 5 pF, VS = 1 Vrms, signal = 0 dBm, f = 250 MHz 47 OFF state isolation RTERM = 50 Ω, CLOAD = 5 pF, VS = 1 Vrms, signal = 0 dBm, f = 250 MHz 17 Bandwidth -3 dB RTERM = 50 Ω, CLOAD = 5 pF, signal = 0 dBm 1100 CTLx configured for DCP BC1.2 100 dB MHz Charger emulator - BC1.2 DCP mode RDCP_RES 8/32 DP_IN to DM_IN short resistance DocID024711 Rev 6 170 Ω STCC2540 Electrical characteristics Table 4. Electrical characteristics VIN = 4.5 to 5.5 V, -40 °C < TJ < 125 °C (unless otherwise specified) (continued) Symbol Parameter Conditions Min. Typ. Max. Unit Charger emulator - divider mode VDM DM_IN output voltage Device set to DCP auto-detect mode or divider mode, VIN = 5.0 V VDP DP_IN output voltage RDM DM_IN output resistance RDP DP_IN output resistance 1.96 2 2.04 V 2.65 2.7 2.75 27 Device set to DCP auto-detect mode or divider mode kΩ 27 Charger emulator - BC1.2 CDP mode VDM_SRC Voltage source on DM_IN for VDP_IN = 0.6 V, device in CDP CDP detection BC1.2 mode VDAT_REF DP_IN rising voltage threshold to turn on VDM_SRC VDAT_REF_HYST VDAT_REF hysteresis VLGC_SRC DP_IN rising voltage threshold to turn off VDM_SRC VLGC_SRC_HYST VLGC_SRC hysteresis IDP_SINK 0.5 0.6 0.7 V 0.25 0.32 0.4 30 IDM_IN = -250 µA, device in CDP BC1.2 mode 0.8 mV 1 30 0.4 < VDP_IN < 0.8 V, device in CDP BC1.2 mode DP_IN sink current 50 75 V mV 150 µA Charger emulator - timings tCHG_DGL_ON Charging indication ON deglitch delay From IOUT > IOUT _TH to CHARGING asserted 0.5 tCHG_DGL_OFF Charging indication OFF deglitch delay From IOUT < IOUT_TH to CHARGING deasserted 5 tVDM_SRC_ON DM_IN voltage source turnon time From VDP_IN 0 V -> 0.6 V to VDM_IN = VDM_SRC, CTLx configured for CDP BC1.2 8 tVDM_SRC_OFF DM_IN voltage source turnoff time From VDP_IN 0.6 V -> 0 V to VDM_IN = 0 V, CTLx configured for CDP BC1.2 tVBUS_REAPP OUT discharge pulse width From VOUT falls to 0.7 V during discharge to VOUT returning to 90%. DocID024711 Rev 6 s ms 1.3 300 350 400 9/32 32 Electrical characteristics STCC2540 Table 4. Electrical characteristics VIN = 4.5 to 5.5 V, -40 °C < TJ < 125 °C (unless otherwise specified) (continued) Symbol Parameter Conditions Min. Typ. Max. Unit Charger emulator - control pins CTLx VCTLx CTLx pins threshold voltage VHYST(CTLx) Hysteresis voltage on CTLx pins Leakage current ICTLx 0.4 1.6 V 500 VIN = 5.5 V, VCTLx = 0 V or 5 V mV -1 1 µA Charger emulator - charging indication Output current threshold for charging detection DCP mode, CDP mode VOL(CHARGING) CHARGING output low voltage Charging detected (IOUT > IOUT_TH), ICHARGING = 1 mA IOL(CHARGING) CHARGING output leakage current VIN = 5.5 V, VCHARGING = 5 V IOUT_TH 20 mA 180 mV 1 µA 1. Guaranteed by design. Not tested in production. Figure 3. Timing waveforms 9(1[   WRQ 9287[ WRII   ,26 ,287 WU 9287 WU     W,26 $09 10/32 DocID024711 Rev 6 STCC2540 5 Application information Application information The STCC2540 device is designed to be implemented into the PC on a USB port in order to emulate the wall charger adapter when the PC is in standby mode or OFF, and to allow higher charge current when the USB interface is used for data communication. In order to handle these functionalities, the STCC2540 device relies on USB BC1.2 specifications, Chinese telecommunications industry standard YD/T 1591-2009, and proprietary implementations. • • BC1.2 charging profiles are – CDP: charging downstream port providing data communication plus charging (active USB data communications with 1.5 A support) – SDP: standard downstream port providing data communication with no charging (active USB 3.0 data communications with 900 mA support or USB 2.0 data communications with 500 mA support) – DCP: dedicated charging port (wall charger emulation with no data communication and 500 mA to 1.5 A support) Chinese telecommunications standard – D+ and D- shorted to allow charging • Apple divider mode (2 A max. current) • BlackBerry emulator mode • Legacy mode (allowing 500 mA charging current) • Korean tablet charging mode (D+ and D- shorted and pulled up to a certain voltage) Figure 4. Typical application diagram 7*/



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DPOUSPMMFS 1"% 3*-*. ". 1. CVBUS required by the USB specification. DocID024711 Rev 6 11/32 32 Application information 5.1 STCC2540 Supported modes For more information refer to Section 5.4: State machine. The STCC2540 device supports the following modes: • SDP BC1.2 • CDP BC1.2 • SDP with remote wakeup for all USB devices • CDP with remote wakeup for low-speed USB devices with automatic transition to DCP auto mode if a full-speed/high-speed USB device attached or after a USB device detached. • DCP auto-detect: this mode permits auto-detection of charging modes between DCP BC1.2 (shorted D+, D-) and divider charging mode. It also supports BlackBerry charging mode and can charge legacy devices and Korean tablets. • Forced DCP BC1.2 mode • Forced DCP divider mode The auto-detect mode starts in divider mode. If charging negotiation attempt is detected, there is an automatic transition to DCP BC1.2 mode. It is preceded by VBUS discharge pulse to initialize the proper BC1.2 handshake process. If the BC1.2 device is detached, the circuit automatically returns to divider mode after a 10 s (typ.) timeout. Note: From an application point of view it means that after removing one device the user should wait for approx. 15 s before attaching another device. Selection between these modes is done through the CTLx control pins. The CTLx pins may be controlled by the host in different ways: • GPIO from embedded controller • Hardware signals from USB host controller (SLP_S3#, SLP_S4#) and AC_adapter signal from embedded controller • Hardware signals SUSPEND from embedded controller and AC_ADAPTER. Table 5. Truth table control pins CTLx(1) Host state CTL1 CTL2 CTL3 Mode description 0 0 0 Device off, output discharge S0, S1, (S3)(2) 1 1 0 SDP S0, S1, (S3)(2) 1 1 1 CDP BC1.2 with charging detection. (2) 0 1 0 SDP with remote wakeup for all USB devices S3 0 1 1 CDP with remote wakeup for low-speed USB devices / DCP auto mode for full-speed or high-speed USB devices or after a USB device detached. S4, S5 0 0 1 DCP auto-detect mode without remote wakeup, with charging detection S4, S5 1 0 1 Forced DCP divider mode with charging detection S4, S5 1 0 0 Forced DCP BC1.2 mode with charging detection S3, (S0, S1) 1. On the transition from the CTLx = 111 to CTLx = 001, a synchronous transition of the CTL1 and CTL2 must be ensured. 2. See Section 5.2 for further information. 12/32 DocID024711 Rev 6 STCC2540 5.2 Application information Remote wakeup in S3 For more information refer to Section 5.4: State machine. If the CTLx pins are controlled by hardware signals (such as SLP_Sx# or SUSPEND), the CTLx combination changes when host transitions from S0 to S3 and back. In this case, the STCC2540 device can support remote wakeup of portable devices for the following transitions (i.e. no VBUS discharge pulse and data switch ON): • SDP S0 (CTLx = 110) to and from SDP S3 (CTLx = 010) for all USB devices • SDP (CTLx = x10) and CDP S0 (CTLx = 111) to and from CDP S3 (CLx = 011) for lowspeed USB devices only. If the host system is in S3 mode (CTLx = 011), the system automatically turns into DCP auto mode for already attached full-speed / high-speed USB devices or after any USB device is detached. Thus, already attached full-speed / high-speed devices or newly attached devices are charged without the need of CTLx transition. If the S0 to S3 transition is managed by GPIO from the embedded controller, the easiest solution is to keep the same levels on the CTLx pins (SDP or CDP modes). Therefore, remote wakeup in S3 is supported for all USB devices but the system does not automatically turn into DCP auto mode. 5.3 VBUS discharge The VBUS discharge pulse lasts for 350 ms typ. (tVBUS_REAPP) and is performed for any transitions between the modes listed in Table 5, except the modes allowing remote wakeup in S3 [transitions (x10) and (111) to/from (011)] (see Section 5.4). Permanent output discharge is provided in following modes: • EN = 0, CTLx = xxx (ignored) • EN = 1, CTLx = 000. DocID024711 Rev 6 13/32 32 Application information 5.4 STCC2540 State machine Figure 5. State machine 5(6(7  25  67$7 ( WUDQVLWLRQ   $ '&3 GLYLGHU  ',6&+ 25  (1 ' RI ',6&+ '&3 VKRUW $  $ 127 127  25  'LVFKDUJH  PV 127 25  25  25  $ $ 127 25   25  127 25  '&3 '&3 DXWR 6'3 $ $   '&3 WUDQVLWLRQ  6863(1' 'LVFRQQHFW $1'  $   127 25  &'3 $ $0 14/32 DocID024711 Rev 6 STCC2540 5.5 Application information Charging detection The STCC2540 device continuously monitors the current drawn by the portable device. While programmed in CDP or DCP mode, the STCC2540 device sends a charging flag to the system if the current through the USB power switch is above the charging threshold, set at 20 mA typ.: open drain active low output CHARGING is asserted. Note: In CDP mode, the charging flag is asserted only if the CDP handshaking between the portable device and the host is performed before the current is above the threshold. If a device is charging (CDP mode) while the system is turned off and the battery supplied, the risk is that the charging process stops before the end of charge due to the system power-off. To avoid this, the flag CHARGING can be used by the host to prevent the switching-off of the high power DC-DC converter when the host goes to S5 state, even if battery supplied. After the charging current drops below the threshold and the deglitch delay expires, the CHARGING output is deasserted. 5.6 Power switch Overcurrent conditions When an overcurrent condition is detected, the device maintains a constant output current and reduces the voltage accordingly. There are two overload conditions: • The first occurs when a short-circuit or a partial short-circuit is already present when the device is being powered-up or enabled. The output voltage is held near zero potential with respect to ground and the STCC2540 device ramps the output current to IOS until the overload condition is removed or the device starts thermal cycle. • The second condition is when a short-circuit, a partial short-circuit, or a transient overload occurs while the device is already enabled and powered-on. The STCC2540 device responds to an overcurrent condition within time tIOS. The current-sense amplifier is overdriven during this time and momentarily disables the internal current limit MOSFET. It then recovers and ramps the output current to IOS. Similar to previous conditions, it limits output current to IOS until the overload condition is removed or thermal cycle starts. Thermal protection The STCC2540 device has an internal thermal sensing circuit which monitors the operating temperature of the circuit. It disables the power switch operation if the die temperature exceeds temperature threshold TSTOP, set at 150 °C. The switch turns on if the temperature has cooled down by 20 °C. Undervoltage lockout The UVLO circuit disables the circuit until the input voltage reaches the UVLO turn-on threshold. Built-in hysteresis prevents unwanted on/off cycling due to input voltage drop during turn-on. DocID024711 Rev 6 15/32 32 Application information STCC2540 FAULT functionality The FAULT open drain active low output is asserted during overcurrent or overtemperature conditions. Signal is asserted until the fault is removed. For overcurrent conditions, the STCC2540 device is designed to eliminate false FAULT reporting, by using an internal deglitch delay (9 ms typ.). In the case of overtemperature, there is no deglitch delay and the FAULT signal is asserted immediately. It is deasserted with a delay after the device has cooled down and begins to turn on. This unidirectional glitch immunity prevents FAULT oscillation during an overtemperature event. In the case of a fault condition, the host may disable the power switch by toggling EN input to logic low. Current limit programming The current limit can be adjusted by an external resistor in the range 500 mA to 2.8 A (max.). The programming resistor may be calculated using these equations: Equation 1 48000 I OS ( typ ) = ---------------- ( mA, kΩ) R ILIM Equation 2 48000 I OS ( min ) = ------------------------- ( mA, kΩ) 1.037 R ILIM Equation 3 48000 I OS ( max ) = ------------------------- ( mA, kΩ) 0.962 R ILIM Equation 2 and Equation 3 allow the minimum and maximum variation to be estimated around the typical value predefined by the external resistor, RILIM, given in Equation 1. Equation 2 and Equation 3 do not take into consideration external resistor variations. 5.7 Enable input The enable input (EN, active high) serves to turn off the STCC2540 device and achieve the lowest current consumption. The behavior of the STCC2540 in disabled state (EN = 0) is following: 16/32 • Power switch, USB data switch and emulation profiles are turned off • Output discharge circuit is turned on • The FAULT and CHARGING flags are cleared (the FAULT and CHARGING outputs are set to Hi-Z mode). DocID024711 Rev 6 STCC2540 5.8 Application information Input and output capacitors For proper functionality, the STCC2540 device requires two 1 μF decoupling ceramic capacitors CIN and COUT (see Figure 4). These capacitors should be placed as close as possible to the corresponding pins. The electrolytic capacitor CVBUS (see Figure 4) is required by the USB specification to suppress the voltage and current transients caused by hot plugging/unplugging the peripheral devices. This capacitor should be placed as close as possible to the USB connector. The recommended value is 150 μF, low ESR type is preferred. If the VIN supply path is longer than approx. 150 mm, an additional capacitor is required and should be connected in parallel with the CIN to suppress VIN overvoltage transients caused by supply path inductance and fast current changes. The minimum value is 10 μF, and a low ESR type is preferred. DocID024711 Rev 6 17/32 32 Typical operating characteristics 6 STCC2540 Typical operating characteristics Figure 6. Power switch ON resistance vs. temperature   521,1287               -XQFWLRQWHPS HUDWXUH>¡&@ $0 Figure 7. OUT discharge resistance vs. temperature  5',6&+$5*(                -XQFWLRQWHPS HUDWXUH>Σ&@ $0 18/32 DocID024711 Rev 6 STCC2540 Typical operating characteristics Figure 8. OUT short-circuit current limit vs. temperature (RILIM = 96 kΩ)  ,26 >P$@              -XQFWLRQWHPS HUDWXUH>Σ&@ $0 Figure 9. OUT short-circuit current limit vs. temperature (RILIM = 33 kΩ)  ,26 >P$@               -XQFWLRQWHPS HUDWXUH>Σ&@ $0 DocID024711 Rev 6 19/32 32 Typical operating characteristics STCC2540 Figure 10. OUT short-circuit current limit vs. temperature (RILIM = 19.6 kΩ)  ,26 >P$@               -XQFWLRQWHPS HUDWXUH>Σ&@ $0 Figure 11. Disabled IN supply current vs. temperature  ,,1',6$%/(' > $@                    -XQFWLRQWHPS HUDWXUH>Σ&@ $0 20/32 DocID024711 Rev 6 STCC2540 Typical operating characteristics Figure 12. Enabled IN supply current vs. temperature (SDP mode) ,,1$&7,9(6'3 > $@               -XQFWLRQWHPS HUDWXUH>Σ&@ $0 Figure 13. Enabled IN supply current vs. temperature (CDP mode) ,,1$&7,9(&'3 > $@              -XQFWLRQWHPS HUDWXUH>Σ&@ $0 DocID024711 Rev 6 21/32 32 Typical operating characteristics STCC2540 Figure 14. Enabled IN supply current vs. temperature (DCP auto-mode) ,,1$&7,9('&3DXWR > $@               -XQFWLRQWHPS HUDWXUH>Σ&@ $0 Figure 15. Enabled IN supply current vs. temperature (DCP BC1.2 mode) ,,1$&7,9('&3%& > $@               -XQFWLRQWHPS HUDWXUH>Σ&@ $0 22/32 DocID024711 Rev 6 STCC2540 Typical operating characteristics Figure 16. Enabled IN supply current vs. temperature (DCP divider mode) ,,1$&7,9('&3GLYLGHU > $@               -XQFWLRQWHPS HUDWXUH>Σ&@ $0 Figure 17. Data switch transfer characteristics vs. frequency DocID024711 Rev 6 23/32 32 Typical operating characteristics STCC2540 Figure 18. Eye diagram using USB compliance test pattern - without STCC2540 (deskew line + cable) Figure 19. Eye diagram using USB compliance test pattern - with STCC2540 (STCC2540 + cable) 24/32 DocID024711 Rev 6 STCC2540 Typical operating characteristics Figure 20. Turn-on response (RILIM = 20 kΩ, RLOAD = 5 Ω, CLOAD = 150 µF) Figure 21. Turn-off response (RLOAD = 5 Ω, CLOAD = 150 µF) DocID024711 Rev 6 25/32 32 Typical operating characteristics STCC2540 Figure 22. Device enabled into short-circuit (RILIM = 80.6 kΩ) Figure 23. Device enabled into short-circuit - thermal cycling (RILIM = 20 kΩ) 26/32 DocID024711 Rev 6 STCC2540 Typical operating characteristics Figure 24. Short-circuit to full load recovery (RILIM = 20 kΩ, RLOAD = 5 Ω, CLOAD = 150 µF) DocID024711 Rev 6 27/32 32 Package information 7 STCC2540 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: www.st.com. ECOPACK is an ST trademark. Figure 25. VFQFPN 16L 3 x 3 x 0.8 mm with exposed pad 1.7 package outline 9)4)31/ 28/32 DocID024711 Rev 6 STCC2540 Package information Table 6. VFQFPN 16L 3 x 3 x 0.8 mm with exposed pad 1.7 package mechanical data(1), (2), (3), (4) Dimensions Symbol Data book (mm) Notes Nom. Min. Max. A 0.75 0.70 0.80 A1 0.02 0 0.05 A3 0.20 b 0.25 0.18 0.30 D 3 2.90 3.10 D2 1.70 1.50 1.80 E 3 2.90 3.10 E2 1.70 1.50 1.80 e 0.50 L 0.40 0.30 0.50 (5) 1. VFQFPN - standard for “thermally enhanced very thin fine pitch quad flat package no leads”. 2. The lead size is comprehensive of the thickness of the lead finishing material. 3. Dimensions do not include mold protrusion, not to exceed 0.15 mm. 4. Package outline exclusive of metal burr dimensions. 5. The value of “L”, a JEDEC norm, is min. 0.35 – max. 0.45. Figure 26. VFQFPN 16L 3 x 3 x 0.8 mm with exposed pad 1.7 footprint recommended $0 DocID024711 Rev 6 29/32 32 Ordering information 8 STCC2540 Ordering information Table 7. Order codes 30/32 Order code Temperature range Marking Package Packaging STCC2540IQTR -40 to 85 °C 2540CC VFQFPN 16L Tape and reel DocID024711 Rev 6 STCC2540 9 Revision history Revision history Table 8. Document revision history Date Revision 29-May-2013 1 Initial release. 2 Updated Features on page 1 (added “CB” components). Updated Section 1: Functional description (replaced 1000 MHz by 1100 MHz). Updated Table 2 (added note 3.). Updated Table 4 (updated parameters and conditions for │IREVERSE│, IEN, IOL(FAULT), ICTLx, IOL(CHARGING), added typ. value for XTALK, OIRR, and Bw, removed tPD and tSK symbols). Added Figure 4 on page 11. Added Note: in Section 5.1: Supported modes. Added Section 5.8: Input and output capacitors. Added Section 6: Typical operating characteristics. 06-Dec-2013 3 Updated Table 4 (updated min. conditions for IOS RILIM 96 kΩ and RILIM 33 kΩ). Updated Table 5 (updated Host state column, added footnote 1. and 2.below table). Updated Section 5.7 (replaced equation by Equation 1 to Equation 3). Minor modifications throughout document. 06-Jan-2014 4 Corrected units in Table 4 on page 7 (replaced “W” by “Ω “ in RDISCHARGE, RON and RDCP_RES symbols). 5 Updated Section : Features on page 1 (removed “2.5 A” from “Integrated VBUS power switch with low RON of 65 mΩ“ replaced “2.5 A” by “2.8 A (max.)” in “Adjustable current limit”) . Added List of figures on page 3. Updated Section 1: Functional description on page 3 [replaced “2.5 A” by “2.8 A (max.)”]. Updated Table 4 on page 7 (added “RILIM = 17.2 kΩ“ and typ. conditions of “RILIM = 17.2 kΩ“ for IOS symbol). Updated Section : Current limit programming on page 16 [replaced “2.5 A (typ.)” by “2.8 A (max.)”]. 6 Removed List of figures on page 3 Section 5.6: Power switch: updated Equation 2 and Equation 3 and added explanation of same. Table 7: Order codes: updated “marking” of STCC2540IQTR 24-Jun-2013 08-Jan-2014 25-Feb-2014 Changes DocID024711 Rev 6 31/32 32 STCC2540 Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. 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