STGB7NB40LZ
N-CHANNEL CLAMPED 14A - D2PAK
INTERNALLY CLAMPED PowerMESH™ IGBT
TYPE
STGB7NB40LZ
■
■
■
■
■
■
VCES
VCE(sat)
IC
CLAMPED
< 1.50 V
14 A
POLYSILICON GATE VOLTAGE DRIVEN
LOW THRESHOLD VOLTAGE
LOW ON-VOLTAGE DROP
LOW GATE CHARGE
HIGH CURRENT CAPABILITY
HIGH VOLTAGE CLAMPING FEATURE
3
1
D2PAK
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DESCRIPTION
Using the latest high voltage technology based on a
patented strip layout, STMicroelectronics has
designed an advanced family of IGBTs, the
PowerMESH™ IGBTs, with outstanding
performances. The built in collector-gate zener
exhibits a very precise active clamping while the
gate-emitter zener supplies an ESD protection.
APPLICATIONS
■ AUTOMOTIVE IGNITION
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Symbol
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Parameter
VCES
Collector-Emitter Voltage (VGS = 0)
VECR
Reverse Battery Protection
VGE
Gate-Emitter Voltage
IC
RG
PTOT
ECL
EECAV
Tstg
Tj
March 2003
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Value
Unit
CLAMPED
V
20
V
CLAMPED
V
Collector Current (continuous) at 100°C
14
A
Minimum External Gate Resistor
500
Ω
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INTERNAL SCHEMATIC DIAGRAM
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ABSOLUTE MAXIMUM RATINGS
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Total Dissipation at TC = 25°C
100
W
Derating Factor
0.66
W/°C
Single Pulse Collector to Emitter Avalanche Energy
IC= 13 A ; Tj= 150°C (see fig.1-2)
130
mJ
Reverse Avalanche Energy
IC = 7 A ;f= 100 Hz ; Tc = 25°C
10
mJ
–55 to 175
°C
Storage Temperature
Operating Junction Temperature
1/8
STGB7NB40LZ
THERMAL DATA
Rthj-case
Thermal Resistance Junction-case Max
1.5
°C/W
Rthj-amb
Thermal Resistance Junction-ambient Max (free air)
62.5
°C/W
ELECTRICAL CHARACTERISTICS (TCASE = 25°C UNLESS OTHERWISE SPECIFIED)
OFF
Symbol
Min.
Typ.
Max.
Unit
BV(CES)
Collector-Emitter Clamped
Voltage
IC = 10 mA, VGE = 0,
Tc= - 40°C to 150°C; RG= 1 KΩ
370
400
430
V
BV(ECS)
Emitter Collector Break-down
Voltage
IEC = 75 mA, VGE = 0,
20
27
BVGE
Gate Emitter Break-down
Voltage
IG = ± 2 mA
12
ICES
Collector-Emitter Leakage
Current
Gate-Emitter Leakage
Current (VCE = 0)
IGES
Parameter
Test Conditions
16
V
VGE = 200 V, VGE = 0, RG= 1 KΩ
Tc=25°C
Tc=150°C
25
250
µA
µA
VGE = ± 10 V , VCE = 0
1000
µA
Max.
Unit
2.2
1.8
V
V
1.3
1.50
1.9
V
V
10
20
30
KΩ
Min.
Typ.
Max.
Unit
ON (1)
Symbol
VGE(th)
VCE(SAT)
RGE
Parameter
Min.
VCE = VGE, IC = 1 mA, Tc=25°C
VCE = VGE, IC = 1 mA, Tc=150°C
1.2
0.75
Collector-Emitter Saturation
Voltage
VGE =4.5 V, IC = 7 A, Tj= 25°C
VGE =5.0 V, IC = 14 A, Tc= 25°C
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Gate Emitter Resistance
DYNAMIC
Cies
Input Capacitance
Coes
Output Capacitance
Cres
Reverse Transfer
Capacitance
Qg
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Parameter
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Gate Charge
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Test Conditions
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Test Conditions
Gate Threshold Voltage
Symbol
V
VCE = 25 V, f = 1 MHz, VGE = 0
Typ.
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910
VCE = 40 V, IC = 7 A,
VGE = 5 V
pF
80
pF
15
pF
22
nC
SWITCHING ON
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Symbol
2/8
Parameter
Test Conditions
Min.
Typ.
Max.
Unit
td(on)
tr
Delay Time
Current Rise Time
VCE = 14 V, RG =1KΩ ,
RL = 1Ω, VGE =5 V
0.9
4.5
µs
µs
td(off)
tf
Delay Time
Current Fall Time
VCE = 300 V, RG =1KΩ ,
RL = 46Ω, VGE =5 V
4.4
3.6
µs
µs
STGB7NB40LZ
Thermal Impedance
Transfer Characteristics
Output Characteristics
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Normalized Gate Threshold Voltage vs Temp.
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Transconductance
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3/8
STGB7NB40LZ
Normalized Collector-Emitter On Voltage vs
Temperature
Collector-Emitter On Voltage vs Gate-Emitter
Voltage
Capacitance Variations
Gate-Charge vs Gate-Emitter Voltage
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Normalized Break-down Voltage vs Temp.
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4/8
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Clamping Voltage vs Gate Resistance
STGB7NB40LZ
Fig. 1: Unclamped Inductive Load Test Circuit
Fig. 2: Unclamped Inductive Waveform
Fig. 3: Test Circuit For Inductive Load Switching
And Diode Recovery Times
Fig. 4: Gate Charge test Circuit
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5/8
STGB7NB40LZ
D2PAK MECHANICAL DATA
mm.
inch
DIM.
MIN.
TYP
MAX.
MIN.
TYP.
MAX.
A
4.4
4.6
0.173
0.181
A1
2.49
2.69
0.098
0.106
A2
0.03
0.23
0.001
0.009
B
0.7
0.93
0.027
0.036
B2
1.14
1.7
0.044
0.067
C
0.45
0.6
0.017
0.023
C2
1.23
1.36
0.048
0.053
D
8.95
9.35
0.352
D1
E
8
10.4
E1
0.393
8.5
4.88
5.28
0.192
L
15
15.85
0.590
L2
1.27
1.4
L3
1.4
1.75
M
2.4
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0º
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3.2
0.4
V2
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0.334
G
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0.315
10
)
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0.368
0.208
0.625
0.050
0.055
0.055
0.068
0.094
0.126
0.015
8º
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6/8
1
STGB7NB40LZ
D2PAK FOOTPRINT
TUBE SHIPMENT (no suffix)*
TAPE AND REEL SHIPMENT (suffix ”T4”)*
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REEL MECHANICAL DATA
DIM.
MIN.
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A
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TAPE MECHANICAL DATA
DIM.
mm
inch
MAX.
MIN.
10.7
0.413 0.421
15.9
0.618 0.626
1.6
0.059 0.063
D1
1.59
1.61
0.062 0.063
E
1.65
1.85
0.065 0.073
F
11.4
11.6
0.449 0.456
K0
4.8
5.0
0.189 0.197
D
bs
15.7
1.5
P0
3.9
4.1
0.153 0.161
P1
11.9
12.1
0.468 0.476
P2
1.9
2.1
0.075 0.082
R
50
T
0.25
0.35 0.0098 0.0137
W
23.7
24.3
* on sales type
B
1.5
C
12.8
D
20.2
G
24.4
N
100
T
MAX.
inch
MIN.
330
MAX.
12.992
0.059
13.2
0.504 0.520
0795
26.4
0.960 1.039
3.937
30.4
1.197
BASE QTY
BULK QTY
1000
1000
MAX.
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10.5
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MIN.
A0
(s)
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mm
1.574
0.933 0.956
7/8
STGB7NB40LZ
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Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the
consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from
its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications
mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information
previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or
systems without express written approval of STMicroelectronics.
© The ST logo is a registered trademark of STMicroelectronics
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© 2003 STMicroelectronics - Printed in Italy - All Rights Reserved
STMicroelectronics GROUP OF COMPANIES
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Singapore - Spain - Sweden - Switzerland - United Kingdom - United States.
© http://www.st.com
8/8
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