STL115N10F7AG
Automotive-grade N-channel 100 V, 5 mΩ typ., 107 A,
STripFET™ F7 Power MOSFET in a PowerFLAT™ 5x6 package
Datasheet - production data
Features
Order code
VDS
RDS(on)
max
ID
PTOT
STL115N10F7AG
100 V
6 mΩ
107 A
136 W
AEC-Q101 qualified
Among the lowest RDS(on) on the market
Excellent FoM (figure of merit)
Low Crss/Ciss ratio for EMI immunity
High avalanche ruggedness
Applications
Figure 1: Internal schematic diagram
Switching applications
Description
This N-channel Power MOSFET utilizes
STripFET™ F7 technology with an enhanced
trench gate structure that results in very low onstate resistance, while also reducing internal
capacitance and gate charge for faster and more
efficient switching.
Table 1: Device summary
Order code
Marking
Package
Packaging
STL115N10F7AG
115N10F7
PowerFLAT™ 5x6
Tape and reel
December 2016
DocID029841 Rev 2
This is information on a product in full production.
1/15
www.st.com
Contents
STL115N10F7AG
Contents
1
Electrical ratings ............................................................................. 3
2
Electrical characteristics ................................................................ 4
2.1
Electrical characteristics (curves) ...................................................... 6
3
Test circuits ..................................................................................... 8
4
Package information ....................................................................... 9
5
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4.1
PowerFLAT™ 5x6 WF type C package information .......................... 9
4.2
PowerFLAT™ 5x6 packing information ........................................... 12
Revision history ............................................................................ 14
DocID029841 Rev 2
STL115N10F7AG
1
Electrical ratings
Electrical ratings
Table 2: Absolute maximum ratings
Symbol
Parameter
Value
Unit
VDS
Drain-source voltage
100
V
VGS
Gate-source voltage
±20
V
ID
Drain current (continuous) at TC = 25 °C
107
A
ID
Drain current (continuous) at TC = 100 °C
75
A
IDM(1)
Drain current (pulsed)
428
A
PTOT
Total dissipation at TC = 25 °C
136
W
EAS(2)
Single pulse avalanche energy
490
mJ
-55 to 175
°C
Value
Unit
TJ
Operating junction temperature range
Tstg
Storage temperature range
Notes:
(1)Pulse
width limited by safe operating area
(2)Starting
Tj = 25 °C, ID = 18 A, VDD = 50 V
Table 3: Thermal resistance
Symbol
Parameter
Rthj-case
Thermal resistance junction-case
1.1
°C/W
Rthj-pcb (1)
Thermal resistance junction-pcb
31.3
°C/W
Notes:
(1)
When mounted on FR-4 board of 1inch², 2oz Cu, t < 10 s
DocID029841 Rev 2
3/15
Electrical characteristics
2
STL115N10F7AG
Electrical characteristics
(TCASE = 25 °C unless otherwise specified)
Table 4: On/off states
Symbol
V(BR)DSS
Parameter
Test conditions
Drain-source breakdown
voltage
VGS= 0 V, ID = 250 µA
Min.
Typ.
Max.
100
Unit
V
VGS = 0 V, VDS = 100 V
1
VGS = 0 V, VDS = 100 V,
TC = 125 °C(1)
10
Gate body leakage current
VDS = 0 V, VGS = 20 V
100
nA
VGS(th)
Gate threshold voltage
VDS= VGS, ID = 250 µA
4.5
V
RDS(on)
Static drain-source
on-resistance
VGS= 10 V, ID= 53 A
5
6
mΩ
Min.
Typ.
Max.
Unit
-
5600
-
pF
-
1200
-
pF
-
50
-
pF
-
72.5
-
nC
-
35.5
-
nC
-
15
-
nC
Test conditions
Min.
Typ.
Max.
Unit
VDD = 50 V, ID = 53 A,
RG = 4.7 Ω, VGS = 10 V
(see Figure 13: "Test circuit for
resistive load switching times"
and Figure 18: "Switching time
waveform")
-
33
-
ns
-
38
-
ns
-
48
-
ns
-
20
-
ns
IDSS
Zero gate voltage drain
current
IGSS
2.5
µA
Notes:
(1)Defined
by design, not subject to production test.
Table 5: Dynamic
Symbol
Parameter
Ciss
Input capacitance
Coss
Output capacitance
Crss
Reverse transfer
capacitance
Qg
Total gate charge
Qgs
Gate-source charge
Qgd
Gate-drain charge
Test conditions
VDS = 50 V, f = 1 MHz,
VGS = 0 V
VDD = 50 V, ID = 107 A,
VGS = 10 V
(see Figure 14: "Test circuit for
gate charge behavior")
Table 6: Switching times
Symbol
td(on)
tr
td(off)
tf
4/15
Parameter
Turn-on delay time
Rise time
Turn-off delay time
Fall time
DocID029841 Rev 2
STL115N10F7AG
Electrical characteristics
Table 7: Source drain diode
Symbol
Parameter
Test conditions
Min.
Typ.
Max.
Unit
107
A
ISD
Source-drain current
-
ISDM(1)
Source-drain current
(pulsed)
-
428
A
VSD(2)
Forward on voltage
ISD = 53 A, VGS = 0 V
-
1.2
V
trr
Reverse recovery time
-
60
ns
Qrr
Reverse recovery charge
-
96
nC
IRRM
Reverse recovery current
ISD = 107 A, di/dt = 100 A/µs,
VDD = 80 V, Tj = 150 °C
(see Figure 15: "Test circuit for
inductive load switching and
diode recovery times")
-
3.2
A
Notes:
(1)Pulse
(2)
width limited by safe operating area
Pulsed: pulse duration=300 µs, duty cycle 1.5%
DocID029841 Rev 2
5/15
Electrical characteristics
2.1
STL115N10F7AG
Electrical characteristics (curves)
Figure 2: Safe operating area
Figure 3: Thermal impedance
Figure 4: Output characteristics
Figure 5: Transfer characteristics
Figure 6: Gate charge vs gate-source voltage
Figure 7: Static drain-source on-resistance
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DocID029841 Rev 2
STL115N10F7AG
Electrical characteristics
Figure 8: Capacitance variations
Figure 9: Normalized gate threshold voltage vs
temperature
Figure 10: Normalized on-resistance vs temperature
Figure 11: Source-drain diode forward
characteristics
Figure 12: Normalized V(BR)DSS vs temperature
DocID029841 Rev 2
7/15
Test circuits
3
8/15
STL115N10F7AG
Test circuits
Figure 13: Test circuit for resistive load
switching times
Figure 14: Test circuit for gate charge
behavior
Figure 15: Test circuit for inductive load
switching and diode recovery times
Figure 16: Unclamped inductive load test
circuit
Figure 17: Unclamped inductive waveform
Figure 18: Switching time waveform
DocID029841 Rev 2
STL115N10F7AG
4
Package information
Package information
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK® packages, depending on their level of environmental compliance. ECOPACK ®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK® is an ST trademark.
4.1
PowerFLAT™ 5x6 WF type C package information
Figure 19: PowerFLAT™ 5x6 WF type C package outline
8231817_WF_typeC_r14
DocID029841 Rev 2
9/15
Package information
STL115N10F7AG
Table 8: PowerFLAT™ 5x6 WF type C mechanical data
mm
Dim.
Min.
Max.
A
0.80
1.00
A1
0.02
0.05
A2
0.25
b
0.30
C
5.80
6.00
6.10
0.50
5.20
5.40
D
5.00
D2
4.15
D3
4.05
4.20
4.35
D4
4.80
5.00
5.10
D5
0.25
0.40
0.55
D6
0.15
0.30
0.45
e
10/15
Typ.
4.45
1.27
E
6.20
E2
3.50
3.70
E3
2.35
2.55
E4
0.40
0.60
E5
0.08
0.28
E6
0.20
0.325
0.45
E7
0.85
1.00
1.15
E9
4.00
4.20
4.40
E10
3.55
3.70
3.85
K
1.05
L
0.90
1.00
1.10
L1
0.175
0.275
0.375
θ
0°
DocID029841 Rev 2
6.40
6.60
1.35
12°
STL115N10F7AG
Package information
Figure 20: PowerFLAT™ 5x6 recommended footprint (dimensions are in mm)
8231817_FOOTPRINT_rev14
DocID029841 Rev 2
11/15
Package information
4.2
STL115N10F7AG
PowerFLAT™ 5x6 packing information
Figure 21: PowerFLAT™ 5x6 WF tape (dimensions are in mm)
Figure 22: PowerFLAT™ 5x6 package orientation in carrier tape
12/15
DocID029841 Rev 2
STL115N10F7AG
Package information
Figure 23: PowerFLAT™ 5x6 reel (dimensions are in mm)
DocID029841 Rev 2
13/15
Revision history
5
STL115N10F7AG
Revision history
Table 9: Document revision history
Date
07-Oct-2016
15-Dec-2016
14/15
Revision
Changes
1
First release.
2
Datasheet status promoted from preliminary to production data.
Updated features list on cover page.
Updated Section 2: "Electrical characteristics".
DocID029841 Rev 2
STL115N10F7AG
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DocID029841 Rev 2
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