STM8AF6246UCY

STM8AF6246 STM8AF6248 STM8AF6266 STM8AF6268 Automotive 8-bit MCU, with up to 32 Kbyte Flash, data EEPROM, 10-bit ADC, timers, LIN, SPI, I2C, 3 to 5.5 V Datasheet - production data Features • AEC-Q10x qualified • Core – Max fCPU: 16 MHz – Advanced STM8A core with Harvard architecture and 3-stage pipeline – Average 1.6 cycles/instruction resulting in 10 MIPS at 16 MHz fCPU for industry standard benchmark • Memories – Flash Program memory: 16 to 32 Kbyte Flash; data retention 20 years at 55 °C after 1 kcycle – Data memory: 0.5 to 1 Kbyte true data EEPROM; endurance 300 kcycle – RAM: 2 Kbyte • Clock management – Low-power crystal resonator oscillator with external clock input – Internal, user-trimmable 16 MHz RC and low-power 128 kHz RC oscillators – Clock security system with clock monitor • Reset and supply management – Wait/auto-wakeup/Halt low-power modes with user definable clock gating – Low consumption power-on and powerdown reset LQFP48 (7x7 mm) LQFP32 (7x7 mm) VFQFPN32 (5x5 mm) – Auto-wakeup timer – Window and independent watchdog timers • Communication interfaces – LINUART – LIN 2.2 compliant, master/slave modes with automatic resynchronization – SPI interface up to 8 Mbit/s or fMASTER/2 – I2C interface up to 400 Kbit/s • Analog-to-digital converter (ADC) – 10-bit accuracy, 2LSB TUE accuracy, 2LSB TUE linearity ADC and up to 10 multiplexed channels with individual data buffer – Analog watchdog, scan and continuous sampling mode • I/Os – Up to 38 user pins including 10 HS I/Os – Highly robust I/O design, immune against current injection • Operating temperature up to 150 °C • Qualification conforms to AEC-Q100 rev G • Interrupt management – Nested interrupt controller with 32 vectors – Up to 34 external interrupts on 5 vectors • Timers – Up to 2 general purpose 16-bit PWM timers with up to 3 CAPCOM channels each (IC, OC or PWM) – Advanced control timer: 16-bit, 4 CAPCOM channels, 3 complementary outputs, deadtime insertion and flexible synchronization – 8-bit AR basic timer with 8-bit prescaler June 2016 This is information on a product in full production. DocID14952 Rev 11 1/99 www.st.com Contents STM8AF6246/48/66/68 Contents 1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 2 Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 3 Product line-up . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 4 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 5 Product overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 5.1 5.2 5.1.1 Architecture and registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 5.1.2 Addressing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 5.1.3 Instruction set . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Single wire interface module (SWIM) and debug module (DM) . . . . . . . . 15 5.2.1 SWIM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 5.2.2 Debug module . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 5.3 Interrupt controller . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 5.4 Flash program and data EEPROM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 5.5 2/99 STM8A central processing unit (CPU) . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 5.4.1 Architecture . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 5.4.2 Write protection (WP) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 5.4.3 Protection of user boot code (UBC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 5.4.4 Read-out protection (ROP) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 Clock controller . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 5.5.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 5.5.2 16 MHz high-speed internal RC oscillator (HSI) . . . . . . . . . . . . . . . . . . 18 5.5.3 128 kHz low-speed internal RC oscillator (LSI) . . . . . . . . . . . . . . . . . . . 19 5.5.4 16 MHz high-speed external crystal oscillator (HSE) . . . . . . . . . . . . . . . 19 5.5.5 External clock input . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 5.5.6 Clock security system (CSS) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 5.6 Low-power operating modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 5.7 Timers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 5.7.1 Watchdog timers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 5.7.2 Auto-wakeup counter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 5.7.3 Beeper . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 DocID14952 Rev 11 STM8AF6246/48/66/68 7 5.7.4 Advanced control and general purpose timers . . . . . . . . . . . . . . . . . . . 21 5.7.5 Basic timer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 5.8 Analog-to-digital converter (ADC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 5.9 Communication interfaces . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 5.10 6 Contents 5.9.1 Serial peripheral interface (SPI) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 5.9.2 Inter integrated circuit (I2C) interface . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 5.9.3 Universal asynchronous receiver/transmitter with LIN support (LINUART) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 Input/output specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 Pinouts and pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 6.1 Package pinouts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 6.2 Alternate function remapping . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31 Memory and register map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32 7.1 Memory map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32 7.2 Register map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33 8 Interrupt table . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43 9 Option bytes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44 10 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49 10.1 Parameter conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49 10.1.1 Minimum and maximum values . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49 10.1.2 Typical values . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49 10.1.3 Typical curves . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49 10.1.4 Loading capacitor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49 10.1.5 Pin input voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50 10.2 Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50 10.3 Operating conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52 10.3.1 VCAP external capacitor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54 10.3.2 Supply current characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54 10.3.3 External clock sources and timing characteristics . . . . . . . . . . . . . . . . . 57 10.3.4 Internal clock sources and timing characteristics . . . . . . . . . . . . . . . . . 59 10.3.5 Memory characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 62 10.3.6 I/O port pin characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 63 DocID14952 Rev 11 3/99 4 Contents STM8AF6246/48/66/68 10.3.7 Reset pin characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67 10.3.8 TIM 1, 2, 3, and 4 timer specifications . . . . . . . . . . . . . . . . . . . . . . . . . . 69 10.3.9 SPI serial peripheral interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69 10.3.10 I2C interface characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 72 10.3.11 10-bit ADC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73 10.3.12 EMC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 75 11 Package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 78 11.1 VFQFPN32 package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 78 11.2 LQFP48 package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 82 11.3 LQFP32 package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 85 11.4 Thermal characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 88 11.4.1 Reference document . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 88 11.4.2 Selecting the product temperature range . . . . . . . . . . . . . . . . . . . . . . . 88 12 Ordering information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 90 13 STM8 development tools . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 91 13.1 Emulation and in-circuit debugging tools . . . . . . . . . . . . . . . . . . . . . . . . . 91 13.1.1 13.2 13.3 14 4/99 STice key features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 91 Software tools . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 92 13.2.1 STM8 toolset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 92 13.2.2 C and assembly toolchains . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 92 Programming tools . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 93 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 94 DocID14952 Rev 11 STM8AF6246/48/66/68 List of tables List of tables Table 1. Table 2. Table 3. Table 4. Table 5. Table 6. Table 7. Table 8. Table 9. Table 10. Table 11. Table 12. Table 13. Table 14. Table 15. Table 16. Table 17. Table 18. Table 19. Table 20. Table 21. Table 22. Table 23. Table 24. Table 25. Table 26. Table 27. Table 28. Table 29. Table 30. Table 31. Table 32. Table 33. Table 34. Table 35. Table 36. Table 37. Table 38. Table 39. Table 40. Table 41. Table 42. Table 43. Table 44. Table 45. Table 46. STM8AF6246/48/66/68 product line-up . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Peripheral clock gating bit assignments in CLK_PCKENR1/2 registers . . . . . . . . . . . . . . . 19 Advanced control and general purpose timers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 TIM4 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 ADC naming . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 Communication peripheral naming correspondence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 Legend/abbreviation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28 STM8AF6246/48/66/68 (32 Kbyte) microcontroller pin description . . . . . . . . . . . . . . . . . . 29 Memory model for the devices covered in this datasheet. . . . . . . . . . . . . . . . . . . . . . . . . . 33 I/O port hardware register map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33 General hardware register map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34 CPU/SWIM/debug module/interrupt controller registers . . . . . . . . . . . . . . . . . . . . . . . . . . . 41 Temporary memory unprotection registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42 STM8A interrupt table . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43 Option bytes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44 Option byte description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46 Voltage characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50 Current characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51 Thermal characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51 Operating lifetime . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51 General operating conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52 Operating conditions at power-up/power-down . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53 Total current consumption in Run, Wait and Slow mode. General conditions for VDD apply, TA = -40 to 150 °C . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54 Total current consumption in Halt and Active-halt modes. General conditions for VDD apply, TA = -40 to 55 °C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55 Oscillator current consumption . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55 Programming current consumption. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56 Typical peripheral current consumption VDD = 5.0 V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56 HSE user external clock characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57 HSE oscillator characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58 HSI oscillator characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 59 LSI oscillator characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60 Flash program memory/data EEPROM memory . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 62 Flash program memory. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 62 Data memory . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 62 I/O static characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 63 NRST pin characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67 TIM 1, 2, 3, and 4 electrical specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69 SPI characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69 I2C characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 72 ADC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73 ADC accuracy for VDDA = 5 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 74 EMS data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 75 EMI data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 76 ESD absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 76 Electrical sensitivities . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 77 VFQFPN32 - 32-pin, 5x5 mm, 0.5 mm pitch very thin profile fine pitch quad DocID14952 Rev 11 5/99 6 List of tables Table 47. Table 48. Table 49. Table 50. 6/99 STM8AF6246/48/66/68 flat package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 79 LQFP48 - 48-pin, 7 x 7 mm low-profile quad flat package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 83 LQFP32 - 32-pin, 7 x 7 mm low-profile quad flat package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 86 Thermal characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 88 Document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 94 DocID14952 Rev 11 STM8AF6246/48/66/68 List of figures List of figures Figure 1. Figure 2. Figure 3. Figure 4. Figure 5. Figure 6. Figure 7. Figure 8. Figure 9. Figure 10. Figure 11. Figure 12. Figure 13. Figure 14. Figure 15. Figure 16. Figure 17. Figure 18. Figure 19. Figure 20. Figure 21. Figure 22. Figure 23. Figure 24. Figure 25. Figure 26. Figure 27. Figure 28. Figure 29. Figure 30. Figure 31. Figure 32. Figure 33. Figure 34. Figure 35. Figure 36. Figure 37. Figure 38. Figure 39. Figure 40. Figure 41. Figure 42. Figure 43. Figure 44. Figure 45. Figure 46. STM8AF6246/48/66/68 block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Flash memory organization of STM8AF6246/48/66/68 . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 VFQFPN/LQFP 32-pin pinout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 LQFP 48-pin pinout. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28 Register and memory map of STM8A products . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32 Pin loading conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49 Pin input voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50 fCPUmax versus VDD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52 External capacitor CEXT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54 Typ. IDD(RUN)HSE vs. VDD @fCPU = 16 MHz, peripheral = on . . . . . . . . . . . . . . . . . . . . . . . 56 Typ. IDD(RUN)HSE vs. fCPU @ VDD = 5.0 V, peripheral = on . . . . . . . . . . . . . . . . . . . . . . . . 56 Typ. IDD(RUN)HSI vs. VDD @ fCPU = 16 MHz, peripheral = off . . . . . . . . . . . . . . . . . . . . . . . 57 Typ. IDD(WFI)HSE vs. VDD @ fCPU = 16 MHz, peripheral = on . . . . . . . . . . . . . . . . . . . . . . . 57 Typ. IDD(WFI)HSE vs. fCPU @ VDD = 5.0 V, peripheral = on . . . . . . . . . . . . . . . . . . . . . . . . . 57 Typ. IDD(WFI)HSI vs. VDD @ fCPU = 16 MHz, peripheral = off . . . . . . . . . . . . . . . . . . . . . . . 57 HSE external clock source . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58 HSE oscillator circuit diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 59 Typical HSI frequency vs VDD. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60 Typical LSI frequency vs VDD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 61 Typical VIL and VIH vs VDD @ four temperatures . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64 Typical pull-up resistance RPU vs VDD @ four temperatures . . . . . . . . . . . . . . . . . . . . . . . 64 Typical pull-up current Ipu vs VDD @ four temperatures . . . . . . . . . . . . . . . . . . . . . . . . . . . 65 Typ. VOL @ VDD = 3.3 V (standard ports). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 65 Typ. VOL @ VDD = 5.0 V (standard ports). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 65 Typ. VOL @ VDD = 3.3 V (true open drain ports) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 65 Typ. VOL @ VDD = 5.0 V (true open drain ports) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 65 Typ. VOL @ VDD = 3.3 V (high sink ports) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 66 Typ. VOL @ VDD = 5.0 V (high sink ports) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 66 Typ. VDD - VOH @ VDD = 3.3 V (standard ports). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 66 Typ. VDD - VOH @ VDD = 5.0 V (standard ports). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 66 Typ. VDD - VOH @ VDD = 3.3 V (high sink ports) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 66 Typ. VDD - VOH @ VDD = 5.0 V (high sink ports) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 66 Typical NRST VIL and VIH vs VDD @ four temperatures . . . . . . . . . . . . . . . . . . . . . . . . . . 67 Typical NRST pull-up resistance RPU vs VDD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 68 Typical NRST pull-up current Ipu vs VDD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 68 Recommended reset pin protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 68 SPI timing diagram where slave mode and CPHA = 0 . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70 SPI timing diagram where slave mode and CPHA = 1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70 SPI timing diagram - master mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 71 Typical application with ADC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73 ADC accuracy characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 74 VFQFPN32 - 32-pin, 5x5 mm, 0.5 mm pitch very thin profile fine pitch quad flat package outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 78 VFQFPN32 - 32-pin, 5x5 mm, 0.5 mm pitch very thin profile fine pitch quad flat package recommended footprint . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 80 VFQFPN32 marking example (package top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 81 LQFP48 - 48-pin, 7 x 7 mm low-profile quad flat package outline . . . . . . . . . . . . . . . . . . . 82 LQFP48 - 48-pin, 7 x 7 mm low-profile quad flat package DocID14952 Rev 11 7/99 8 List of figures Figure 47. Figure 48. Figure 49. Figure 50. Figure 51. 8/99 STM8AF6246/48/66/68 recommended footprint . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 84 LQFP48 marking example (package top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 84 LQFP32 - 32-pin, 7 x 7 mm low-profile quad flat package outline . . . . . . . . . . . . . . . . . . . 85 LQFP32 - 32-pin, 7 x 7 mm low-profile quad flat package recommended footprint . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 87 LQFP32 marking example (package top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 87 STM8AF6246/48/66/68 ordering information scheme(1) (2) . . . . . . . . . . . . . . . . . . . . . . . . 90 DocID14952 Rev 11 STM8AF6246/48/66/68 1 Introduction Introduction This datasheet refers to the STM8AF6246, STM8AF6248, STM8AF6266 and STM8AF6268 products with 16 to 32 Kbyte of Flash program memory. In the order code, the letter ‘F’ refers to product versions with data EEPROM and ‘H’ refers to product versions without data EEPROM. The identifiers ‘F’ and ‘H’ do not coexist in a given order code. The datasheet contains the description of family features, pinout, electrical characteristics, mechanical data and ordering information. • For complete information on the STM8A microcontroller memory, registers and peripherals, please refer to STM8S series and STM8AF series 8-bit microcontrollers reference manual (RM0016). • For information on programming, erasing and protection of the internal Flash memory please refer to the STM8 Flash programming manual (PM0051). • For information on the debug and SWIM (single wire interface module) refer to the STM8 SWIM communication protocol and debug module user manual (UM0470). • For information on the STM8 core, please refer to the STM8 CPU programming manual (PM0044). DocID14952 Rev 11 9/99 93 Description 2 STM8AF6246/48/66/68 Description The STM8AF6246, STM8AF6248, STM8AF6266 and STM8AF6268 automotive 8-bit microcontrollers offer from 16 to 32 Kbyte of Flash program memory and integrated true data EEPROM. They are referred to as medium density STM8A devices in STM8S series and STM8AF series 8-bit microcontrollers reference manual (RM0016). All devices of the STM8A product line provide the following benefits: reduced system cost, performance and robustness, short development cycles, and product longevity. The system cost is reduced thanks to an integrated true data EEPROM for up to 300 k write/erase cycles and a high system integration level with internal clock oscillators, watchdog, and brown-out reset. Device performance is ensured by a clock frequency of up to 16 MHz CPU and enhanced characteristics which include robust I/O, independent watchdogs (with a separate clock source), and a clock security system. Short development cycles are guaranteed due to application scalability across a common family product architecture with compatible pinout, memory map and modular peripherals. Full documentation is offered with a wide choice of development tools. Product longevity is ensured in the STM8A family thanks to their advanced core which is made in a state-of-the art technology for automotive applications with 3.3 V to 5 V operating supply. All STM8A and ST7 microcontrollers are supported by the same tools including STVD/STVP development environment, the STice emulator and a low-cost, third party incircuit debugging tool. 10/99 DocID14952 Rev 11 STM8AF6246/48/66/68 3 Product line-up Product line-up ² Table 1. STM8AF6246/48/66/68 product line-up Order code Package STM8AF/P6268 STM8AF/P6248 LQFP32 (7x7) STM8AF/P6266 STM8AF/P6246 RAM (byte) 32 K LQFP48 (7x7) STM8AF/P6266 STM8AF/P6246 Medium density Flash program memory (byte) 0.5 K 32 K 1K 32 K VFQFPN32 16 K Serial interfaces I/0 wakeup pins 10 1x8-bit: TIM4 3x16-bit: TIM1, TIM2, TIM3 (9/9/9) LIN(UART), SPI, I²C 38/35 7 1x8-bit: TIM4 3x16-bit: TIM1, TIM2, TIM3 (8/8/8) LIN(UART), SPI, I²C 25/23 7 1x8-bit: TIM4 3x16-bit: TIM1, TIM2, TIM3 (8/8/8) LIN(UART), SPI, I²C 25/23 1K 16 K 16 K Timers (IC/OC/PWM) Data EE 10-bit (byte) A/D ch. 2K 0.5 K 1K 0.5 K DocID14952 Rev 11 11/99 93 Block diagram 4 STM8AF6246/48/66/68 Block diagram Figure 1. STM8AF6246/48/66/68 block diagram 5HVHWEORFN ;7$/0+] &ORFNFRQWUROOHU 5HVHW 5HVHW 5&LQW0+] 'HWHFWRU 325 %25 5&LQWN+] &ORFNWRSHULSKHUDOVDQGFRUH :LQGRZ:'* 670$FRUH ,QGHSHQGHQW:'* 0DVWHUVODYH DXWRPDWLF UHV\QFKURQL]DWLRQ 'HEXJ6:,0 /,18$57 .ELWV ,& 0ELWV 63, FKDQQHOV 8SWR.E\WH SURJUDP)ODVK $GGUHVVDQGGDWDEXV 6LQJOHZLUH GHEXJLQWHUIDFH 8SWR.E\WH GDWD((3520 .E\WH5$0 %RRW520 ELWDGYDQFHGFRQWURO WLPHU7,0 ELW$'& ELWJHQHUDOSXUSRVH WLPHUV7,07,0 $:8WLPHU ELWEDVLFWLPHU 7,0 8SWR &$3&20 FKDQQHOV 069 12/99 DocID14952 Rev 11 STM8AF6246/48/66/68 Block diagram 1. Legend: ADC: Analog-to-digital converter beCAN: Controller area network BOR: Brownout reset I²C: Inter-integrated circuit multimaster interface IWDG: Independent window watchdog LINUART: Local interconnect network universal asynchronous receiver transmitter POR: Power on reset SPI: Serial peripheral interface SWIM: Single wire interface module USART: Universal synchronous asynchronous receiver transmitter Window WDG: Window watchdog DocID14952 Rev 11 13/99 93 Product overview 5 STM8AF6246/48/66/68 Product overview This section describes the family features that are implemented in the products covered by this datasheet. For more detailed information on each feature please refer to STM8S series and STM8AF series 8-bit microcontrollers reference manual (RM0016). 5.1 STM8A central processing unit (CPU) The 8-bit STM8A core is a modern CISC core and has been designed for code efficiency and performance. It contains 21 internal registers (six directly addressable in each execution context), 20 addressing modes including indexed indirect and relative addressing and 80 instructions. 5.1.1 5.1.2 5.1.3 14/99 Architecture and registers • Harvard architecture • 3-stage pipeline • 32-bit wide program memory bus with single cycle fetching for most instructions • X and Y 16-bit index registers, enabling indexed addressing modes with or without offset and read-modify-write type data manipulations • 8-bit accumulator • 24-bit program counter with 16-Mbyte linear memory space • 16-bit stack pointer with access to a 64 Kbyte stack • 8-bit condition code register with seven condition flags for the result of the last instruction. Addressing • 20 addressing modes • Indexed indirect addressing mode for look-up tables located anywhere in the address space • Stack pointer relative addressing mode for efficient implementation of local variables and parameter passing Instruction set • 80 instructions with 2-byte average instruction size • Standard data movement and logic/arithmetic functions • 8-bit by 8-bit multiplication • 16-bit by 8-bit and 16-bit by 16-bit division • Bit manipulation • Data transfer between stack and accumulator (push/pop) with direct stack access • Data transfer using the X and Y registers or direct memory-to-memory transfers DocID14952 Rev 11 STM8AF6246/48/66/68 Product overview 5.2 Single wire interface module (SWIM) and debug module (DM) 5.2.1 SWIM The single wire interface module, SWIM, together with an integrated debug module, permits non-intrusive, real-time in-circuit debugging and fast memory programming. The interface can be activated in all device operation modes and can be connected to a running device (hot plugging).The maximum data transmission speed is 145 bytes/ms. 5.2.2 Debug module The non-intrusive debugging module features a performance close to a full-flavored emulator. Besides memory and peripheral operation, CPU operation can also be monitored in real-time by means of shadow registers. 5.3 5.4 • R/W of RAM and peripheral registers in real-time • R/W for all resources when the application is stopped • Breakpoints on all program-memory instructions (software breakpoints), except the interrupt vector table • Two advanced breakpoints and 23 predefined breakpoint configurations Interrupt controller • Nested interrupts with three software priority levels • 21 interrupt vectors with hardware priority • Five vectors for external interrupts (up to 34 depending on the package) • Trap and reset interrupts Flash program and data EEPROM • 16 Kbyte to 32 Kbyte of medium density single voltage program Flash memory • Up to 1 Kbyte true (not emulated) data EEPROM • Read while write: writing in the data memory is possible while executing code in the Flash program memory The whole Flash program memory and data EEPROM are factory programmed with 0x00. 5.4.1 Architecture • The memory is organized in blocks of 128 bytes each • Read granularity: 1 word = 4 bytes • Write/erase granularity: 1 word (4 bytes) or 1 block (128 bytes) in parallel • Writing, erasing, word and block management is handled automatically by the memory interface. DocID14952 Rev 11 15/99 93 Product overview 5.4.2 STM8AF6246/48/66/68 Write protection (WP) Write protection in application mode is intended to avoid unintentional overwriting of the memory. The write protection can be removed temporarily by executing a specific sequence in the user software. 5.4.3 Protection of user boot code (UBC) If the user chooses to update the Flash program memory using a specific boot code to perform in application programming (IAP), this boot code needs to be protected against unwanted modification. In the STM8A a memory area of up to 32 Kbyte can be protected from overwriting at user option level. Other than the standard write protection, the UBC protection can exclusively be modified via the debug interface, the user software cannot modify the UBC protection status. The UBC memory area contains the reset and interrupt vectors and its size can be adjusted in increments of 512 bytes by programming the UBC and NUBC option bytes (see Section 9: Option bytes on page 44). Figure 2. Flash memory organization of STM8AF6246/48/66/68 8%&DUHD 5HPDLQVZULWHSURWHFWHGGXULQJ,$3 3URJUDPPDEOH DUHDPD[LPXP .E\WH )ODVKSURJUDP PHPRU\  )ODVKSURJUDPPHPRU\DUHD :ULWHDFFHVVSRVVLEOHIRU,$3 'DWD ((3520 PHPRU\ 'DWDPHPRU\DUHD.E\WH 2SWLRQE\WHV 069 16/99 DocID14952 Rev 11 STM8AF6246/48/66/68 5.4.4 Product overview Read-out protection (ROP) The STM8A provides a read-out protection of the code and data memory which can be activated by an option byte setting (see the ROP option byte in section 10). The read-out protection prevents reading and writing Flash program memory, data memory and option bytes via the debug module and SWIM interface. This protection is active in all device operation modes. Any attempt to remove the protection by overwriting the ROP option byte triggers a global erase of the program and data memory. The ROP circuit may provide a temporary access for debugging or failure analysis. The temporary read access is protected by a user defined, 8-byte keyword stored in the option bytes area. This keyword must be entered via the SWIM interface to temporarily unlock the device. If desired, the temporary unlock mechanism can be permanently disabled by the user through OPT6/NOPT6 option bytes. 5.5 Clock controller The clock controller distributes the system clock coming from different oscillators to the core and the peripherals. It also manages clock gating for low-power modes and ensures clock robustness. 5.5.1 Features • Clock sources – 16 MHz high-speed internal RC oscillator (HSI) – 128 kHz low-speed internal RC (LSI) – 1-16 MHz high-speed external crystal (HSE) – Up to 16 MHz high-speed user-external clock (HSE user-ext) • Reset: After reset the microcontroller restarts by default with an internal 2-MHz clock (16 MHz/8). The clock source and speed can be changed by the application program as soon as the code execution starts. • Safe clock switching: Clock sources can be changed safely on the fly in Run mode through a configuration register. The clock signal is not switched until the new clock source is ready. The design guarantees glitch-free switching. • Clock management: To reduce power consumption, the clock controller can stop the clock to the core or individual peripherals. • Wakeup: In case the device wakes up from low-power modes, the internal RC oscillator (16 MHz/8) is used for quick startup. After a stabilization time, the device switches to the clock source that was selected before Halt mode was entered. • Clock security system (CSS): The CSS permits monitoring of external clock sources and automatic switching to the internal RC (16 MHz/8) in case of a clock failure. • Configurable main clock output (CCO): This feature permits to output a clock signal for use by the application. DocID14952 Rev 11 17/99 93 Product overview 5.5.2 STM8AF6246/48/66/68 16 MHz high-speed internal RC oscillator (HSI) • Default clock after reset 2 MHz (16 MHz/8) • Fast wakeup time User trimming The register CLK_HSITRIMR with three trimming bits plus one additional bit for the sign permits frequency tuning by the application program. The adjustment range covers all possible frequency variations versus supply voltage and temperature. This trimming does not change the initial production setting. For reason of compatibility with other devices from the STM8A family, a special mode with only two trimming bits plus sign can be selected. This selection is controlled with the HSITRIM0 bit in the option byte registers OPT3 and NOPT3. 18/99 DocID14952 Rev 11 STM8AF6246/48/66/68 5.5.3 Product overview 128 kHz low-speed internal RC oscillator (LSI) The frequency of this clock is 128 kHz and it is independent from the main clock. It drives the independent watchdog or the AWU wakeup timer. In systems which do not need independent clock sources for the watchdog counters, the 128 kHz signal can be used as the system clock. This configuration has to be enabled by setting an option byte (OPT3/OPT3N, bit LSI_EN). 5.5.4 16 MHz high-speed external crystal oscillator (HSE) The external high-speed crystal oscillator can be selected to deliver the main clock in normal Run mode. It operates with quartz crystals and ceramic resonators. 5.5.5 • Frequency range: 1 MHz to 16 MHz • Crystal oscillation mode: preferred fundamental • I/Os: standard I/O pins multiplexed with OSCIN, OSCOUT External clock input An external clock signal can be applied to the OSCIN input pin of the crystal oscillator. The frequency range is 0 to 16 MHz. 5.5.6 Clock security system (CSS) The clock security system protects against a system stall in case of an external crystal clock failure. In case of a clock failure an interrupt is generated and the high-speed internal clock (HSI) is automatically selected with a frequency of 2 MHz (16 MHz/8). Table 2. Peripheral clock gating bit assignments in CLK_PCKENR1/2 registers Bit Periphera l clock Bit Peripheral clock Bit Peripheral clock Bit Peripheral clock PCKEN17 TIM1 PCKEN13 LINUART PCKEN27 Reserved PCKEN23 ADC PCKEN16 TIM3 PCKEN12 Reserved PCKEN26 Reserved PCKEN22 AWU PCKEN15 TIM2 PCKEN11 SPI PCKEN25 Reserved PCKEN21 Reserved PCKEN14 TIM4 PCKEN10 I2C PCKEN24 Reserved PCKEN20 Reserved DocID14952 Rev 11 19/99 93 Product overview 5.6 STM8AF6246/48/66/68 Low-power operating modes For efficient power management, the application can be put in one of four different low power modes. Users can configure each mode to obtain the best compromise between lowest power consumption, fastest start-up time and available wakeup sources. • Wait mode In this mode, the CPU is stopped but peripherals are kept running. The wakeup is performed by an internal or external interrupt or reset. • Active-halt mode with regulator on In this mode, the CPU and peripheral clocks are stopped. An internal wakeup is generated at programmable intervals by the auto wake up unit (AWU). The main voltage regulator is kept powered on, so current consumption is higher than in Activehalt mode with regulator off, but the wakeup time is faster. Wakeup is triggered by the internal AWU interrupt, external interrupt or reset. • Active-halt mode with regulator off This mode is the same as Active-halt with regulator on, except that the main voltage regulator is powered off, so the wake up time is slower. • Halt mode CPU and peripheral clocks are stopped, the main voltage regulator is powered off. Wakeup is triggered by external event or reset. In all modes the CPU and peripherals remain permanently powered on, the system clock is applied only to selected modules. The RAM content is preserved and the brown-out reset circuit remains activated. 5.7 Timers 5.7.1 Watchdog timers The watchdog system is based on two independent timers providing maximum security to the applications. The watchdog timer activity is controlled by the application program or option bytes. Once the watchdog is activated, it cannot be disabled by the user program without going through reset. Window watchdog timer The window watchdog is used to detect the occurrence of a software fault, usually generated by external interferences or by unexpected logical conditions, which cause the application program to abandon its normal sequence. The window function can be used to trim the watchdog behavior to match the application timing perfectly. The application software must refresh the counter before time-out and during a limited time window. If the counter is refreshed outside this time window, a reset is issued. 20/99 DocID14952 Rev 11 STM8AF6246/48/66/68 Product overview Independent watchdog timer The independent watchdog peripheral can be used to resolve malfunctions due to hardware or software failures. It is clocked by the 128 kHz LSI internal RC clock source, and thus stays active even in case of a CPU clock failure. If the hardware watchdog feature is enabled through the device option bits, the watchdog is automatically enabled at power-on, and generates a reset unless the key register is written by software before the counter reaches the end of count. 5.7.2 Auto-wakeup counter This counter is used to cyclically wakeup the device in Active-halt mode. It can be clocked by the internal 128 kHz internal low-frequency RC oscillator or external clock. LSI clock can be internally connected to TIM3 input capture channel 1 for calibration. 5.7.3 Beeper This function generates a rectangular signal in the range of 1, 2 or 4 kHz which can be output on a pin. This is useful when audible sounds without interference need to be generated for use in the application. 5.7.4 Advanced control and general purpose timers STM8A devices described in this datasheet, contain up to three 16-bit advanced control and general purpose timers providing nine CAPCOM channels in total. A CAPCOM channel can be used either as input compare, output compare or PWM channel. These timers are named TIM1, TIM2 and TIM3. Table 3. Advanced control and general purpose timers Timer Counter width TIM1 16-bit TIM2 16-bit TIM3 16-bit Counter type Prescaler Channels factor Inverted Repetition outputs counter trigger unit External trigger Break input Up/down 1 to 65536 4 3 Yes Yes Yes Yes Up 2n n = 0 to 15 3 None No No No No Up 2n n = 0 to 15 2 None No No No No DocID14952 Rev 11 21/99 93 Product overview STM8AF6246/48/66/68 TIM1: Advanced control timer This is a high-end timer designed for a wide range of control applications. With its complementary outputs, dead-time control and center-aligned PWM capability, the field of applications is extended to motor control, lighting and bridge driver. • 16-bit up, down and up/down AR (auto-reload) counter with 16-bit fractional prescaler. • Four independent CAPCOM channels configurable as input capture, output compare, PWM generation (edge and center aligned mode) and single pulse mode output • Trigger module which allows the interaction of TIM1 with other on-chip peripherals. In the present implementation it is possible to trigger the ADC upon a timer event. • External trigger to change the timer behavior depending on external signals • Break input to force the timer outputs into a defined state • Three complementary outputs with adjustable dead time • Interrupt sources: 4 x input capture/output compare, 1 x overflow/update, 1 x break TIM2 and TIM3: 16-bit general purpose timers 5.7.5 • 16-bit auto-reload up-counter • 15-bit prescaler adjustable to fixed power of two ratios 1…32768 • Timers with three or two individually configurable CAPCOM channels • Interrupt sources: 2 or 3 x input capture/output compare, 1 x overflow/update Basic timer The typical usage of this timer (TIM4) is the generation of a clock tick. Table 4. TIM4 Timer Counter width Counter type TIM4 8-bit Up 22/99 Prescaler Channels factor 2n n = 0 to 7 Inverted Repetition outputs counter 0 None No trigger unit External trigger Break input No No No • 8-bit auto-reload, adjustable prescaler ratio to any power of two from 1 to 128 • Clock source: master clock • Interrupt source: 1 x overflow/update DocID14952 Rev 11 STM8AF6246/48/66/68 5.8 Product overview Analog-to-digital converter (ADC) The STM8A products described in this datasheet contain a 10-bit successive approximation ADC with up to 16 multiplexed input channels, depending on the package. The ADC name differs between the datasheet and STM8S series and STM8AF series 8-bit microcontrollers reference manual (see Table 5). Table 5. ADC naming Peripheral name in datasheet Peripheral name in reference manual (RM0016) ADC ADC1 ADC features • 10-bit resolution • Single and continuous conversion modes • Programmable prescaler: fMASTER divided by 2 to 18 • Conversion trigger on timer events and external events • Interrupt generation at end of conversion • Selectable alignment of 10-bit data in 2 x 8 bit result register • Shadow registers for data consistency • ADC input range: VSSA ≤ VIN ≤ VDDA • Analog watchdog • Schmitt-trigger on analog inputs can be disabled to reduce power consumption • Scan mode (single and continuous) • Dedicated result register for each conversion channel • Buffer mode for continuous conversion Note: An additional AIN12 analog input is not selectable in ADC scan mode or with analog watchdog. Values converted from AIN12 are stored only into the ADC_DRH/ADC_DRL registers. 5.9 Communication interfaces The following sections give a brief overview of the communication peripheral. Some peripheral names differ between the datasheet and STM8S series and STM8AF series 8-bit microcontrollers reference manual (see Table 6). Table 6. Communication peripheral naming correspondence Peripheral name in datasheet Peripheral name in reference manual (RM0016) LINUART UART2 DocID14952 Rev 11 23/99 93 Product overview 5.9.1 STM8AF6246/48/66/68 Serial peripheral interface (SPI) The devices covered by this datasheet contain one SPI. The SPI is available on all the supported packages. 5.9.2 • Maximum speed: 10 Mbit/s or fMASTER/2 both for master and slave • Full duplex synchronous transfers • Simplex synchronous transfers on two lines with a possible bidirectional data line • Master or slave operation - selectable by hardware or software • CRC calculation • 1 byte Tx and Rx buffer • Slave mode/master mode management by hardware or software for both master and slave • Programmable clock polarity and phase • Programmable data order with MSB-first or LSB-first shifting • Dedicated transmission and reception flags with interrupt capability • SPI bus busy status flag • Hardware CRC feature for reliable communication: – CRC value can be transmitted as last byte in Tx mode – CRC error checking for last received byte Inter integrated circuit (I2C) interface The devices covered by this datasheet contain one I2C interface. The interface is available on all the supported packages. • • – Clock generation – Start and stop generation 2 I C slave features: – Programmable I2C address detection – Stop bit detection • Generation and detection of 7-bit/10-bit addressing and general call • Supports different communication speeds: • • 24/99 I2C master features: – Standard speed (up to 100 kHz), – Fast speed (up to 400 kHz) Status flags: – Transmitter/receiver mode flag – End-of-byte transmission flag – I2C busy flag Error flags: – Arbitration lost condition for master mode – Acknowledgment failure after address/data transmission – Detection of misplaced start or stop condition – Overrun/underrun if clock stretching is disabled DocID14952 Rev 11 STM8AF6246/48/66/68 • • 5.9.3 Product overview Interrupt: – Successful address/data communication – Error condition – Wakeup from Halt Wakeup from Halt on address detection in slave mode Universal asynchronous receiver/transmitter with LIN support (LINUART) The devices covered by this datasheet contain one LINUART interface. The interface is available on all the supported packages. The LINUART is an asynchronous serial communication interface which supports extensive LIN functions tailored for LIN slave applications. In LIN mode it is compliant to the LIN standards rev 1.2 to rev 2.2. Detailed feature list: LIN mode Master mode: • LIN break and delimiter generation • LIN break and delimiter detection with separate flag and interrupt source for read back checking. Slave mode: • Autonomous header handling – one single interrupt per valid header • Mute mode to filter responses • Identifier parity error checking • LIN automatic resynchronization, allowing operation with internal RC oscillator (HSI) clock source • Break detection at any time, even during a byte reception • Header errors detection: – Delimiter too short – Synch field error – Deviation error (if automatic resynchronization is enabled) – Framing error in synch field or identifier field – Header time-out DocID14952 Rev 11 25/99 93 Product overview STM8AF6246/48/66/68 UART mode • Full duplex, asynchronous communications - NRZ standard format (mark/space) • High-precision baud rate generator – 5.10 A common programmable transmit and receive baud rates up to fMASTER/16 • Programmable data word length (8 or 9 bits) – 1 or 2 stop bits – parity control • Separate enable bits for transmitter and receiver • Error detection flags • Reduced power consumption mode • Multi-processor communication - enter mute mode if address match does not occur • Wakeup from mute mode (by idle line detection or address mark detection) • Two receiver wakeup modes: – Address bit (MSB) – Idle line Input/output specifications The product features four different I/O types: • Standard I/O 2 MHz • Fast I/O up to 10 MHz • High sink 8 mA, 2 MHz • True open drain (I2C interface) To decrease EMI (electromagnetic interference), high sink I/Os have a limited maximum slew rate. The rise and fall times are similar to those of standard I/Os. The analog inputs are equipped with a low leakage analog switch. Additionally, the schmitttrigger input stage on the analog I/Os can be disabled in order to reduce the device standby consumption. STM8A I/Os are designed to withstand current injection. For a negative injection current of 4 mA, the resulting leakage current in the adjacent input does not exceed 1 µA. Thanks to this feature, external protection diodes against current injection are no longer required. 26/99 DocID14952 Rev 11 STM8AF6246/48/66/68 Pinouts and pin description 6 Pinouts and pin description 6.1 Package pinouts PD7/TLI PD6/LINUART_RX PD5/LINUART_TX PD4 (HS)/TIM2_CH1/BEEP PD3 (HS)/TIM2_CH2/ADC_ETR PD2 (HS)/TIM3_CH1/TIM2_CH3 PD1 (HS)/SWIM PD0 (HS)/TIM3_CH2/CLK_CCO/TIM1_BRK Figure 3. VFQFPN/LQFP 32-pin pinout 1 2 3 4 5 6 7 8 32 31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 9 10 11 12 13 14 1516 PC7/SPI_MISO PC6/SPI_MOSI PC5/SPI_SCK PC4 (HS)/TIM1_CH4 PC3 (HS)/TIM1_CH3 PC2 (HS)/TIM1_CH2 PC1 (HS)/TIM1_CH1 PE5/SPI_NSS VDDA VSSA I2C_SDA/AIN5/PB5 I2C_SCL/AIN4/PB4 TIM1_ETR/AIN3/PB3 TIM1_CH3N/AIN2/PB2 TIM1_CH2N/AIN1/PB1 TIM1_CH1N/AIN0/PB0 NRST OSCIN/PA1 OSCOUT/PA2 VSS VCAP VDD VDDIO AIN12/PF4 1. (HS) high sink capability. DocID14952 Rev 11 27/99 93 Pinouts and pin description STM8AF6246/48/66/68 PD7/TLI PD6/LINUART_RX PD5/LINUART_TX PD4 (HS)/TIM2_CH1/BEEP PD3 (HS)/TIM2_CH2/ADC_ETR PD2 (HS)/TIM3_CH1 PD1 (HS)/SWIM PD0 (HS)/TIM3_CH2 PE0/CLK_CCO PE1/I2C_SCL PE2/I2C_SDA PE3/TIM1_BKIN Figure 4. LQFP 48-pin pinout 48 47 46 45 44 43 42 41 40 39 38 37 36 1 2 35 3 34 33 4 32 5 31 6 30 7 29 8 28 9 27 10 26 11 25 12 13 14 15 16 17 18 19 20 21 2223 24 PG1 PG0 PC7/SPI_MISO PC6/SPI_MOSI VDDIO_2 VSSIO_2 PC5/SPI_SCK PC4 (HS)/TIM1_CH4 PC3 (HS)/TIM1_CH3 PC2 (HS)/TIM1_CH2 PC1 (HS)/TIM1_CH1 PE5/SPI_NSS VDDA VSSA AIN7/PB7 AIN6/PB6 AIN5/PB5 AIN4/PB4 TIM1_ETR/AIN3/PB3 TIM1_CH3N/AIN2/PB2 TIM1_CH2N/AIN1/PB1 TIM1_CH1N/AIN0/PB0 AIN8/PE7 AIN9/PE6 NRST OSCIN/PA1 OSCOUT/PA2 VSSIO_1 VSS VCAP VDD VDDIO_1 TIM2_CH3/PA3 PA4 PA5 PA6 2. (HS) high sink capability. Table 7. Legend/abbreviation Type I= input, O = output, S = power supply Level Input CM = CMOS (standard for all I/Os) Output HS = High sink (8 mA) Output speed O1 = Standard (up to 2 MHz) O2 = Fast (up to 10 MHz) O3 = Fast/slow programmability with slow as default state after reset O4 = Fast/slow programmability with fast as default state after reset Port and control configuration Input float = floating, wpu = weak pull-up Output T = true open drain, OD = open drain, PP = push pull Reset state 28/99 Bold X (pin state after reset release). Unless otherwise specified, the pin state is the same during the reset phase (i.e. “under reset”) and after internal reset release (i.e. at reset state). DocID14952 Rev 11 STM8AF6246/48/66/68 Pinouts and pin description Table 8. STM8AF6246/48/66/68 (32 Kbyte) microcontroller pin description(1)(2) Output floating wpu Ext. interrupt High sink Speed OD PP 1 1 NRST I/O - X - - - - - Reset - 2 2 PA1/OSCIN(3) I/O X X - - O1 X X Port A1 Resonator/crystal in - 3 3 PA2/OSCOUT I/O X X X - O1 X X Port A2 Resonator/crystal out - 4 - VSSIO_1 S - - - - - - - I/O ground - 5 4 VSS S - - - - - - - Digital ground - 6 5 VCAP S - - - - - - - 1.8 V regulator capacitor - 7 6 VDD S - - - - - - - Digital power supply - 8 7 VDDIO_1 S - - - - - I/O power supply - - O1 X X Port F4 - Pin name Type VFQFPN/LQFP32 Alternate function after remap [option bit] LQFP48 Input Main function (after reset) Pin number - - (4)(5) I/O X X Default alternate function Analog input 12 - 8 PF4/AIN12 9 - PA3/TIM2_CH3 I/O X X X - O1 X X Port A3 Timer 2 - channel 3 TIM3_CH1 [AFR1] 10 - PA4 I/O X X X - O3 X X Port A4 - 11 - PA5 I/O X X X - O3 X X Port A5 - 12 - PA6 I/O X X X - O3 X X Port A6 - 13 9 VDDA S - - - - - - - Analog power supply - 14 10 VSSA S - - - - - - - Analog ground - 15 - PB7/AIN7 I/O X X X - O1 X X Port B7 Analog input 7 - 16 - PB6/AIN6 I/O X X X - O1 X X Port B6 Analog input 6 - 17 11 PB5/AIN5 I/O X X X - O1 X X Port B5 Analog input 5 I2C_SDA [AFR6] 18 12 PB4/AIN4 I/O X X X - O1 X X Port B4 Analog input 4 I2C_SCL [AFR6] 19 13 PB3/AIN3 I/O X X X - O1 X X Port B3 Analog input 3 TIM1_ETR [AFR5] 20 14 PB2/AIN2 I/O X X X - O1 X X Port B2 Analog input TIM1_NCC3 [AFR5] 21 15 PB1/AIN1 I/O X X X - O1 X X Port B1 Analog input 1 TIM1_NCC2 [AFR5] 22 16 PB0/AIN0 I/O X X X - O1 X X Port B0 Analog input 0 TIM1_NCC1 [AFR5] I/O X X - O1 X X Port E7 - 23 - PE7/AIN8 DocID14952 Rev 11 Analog input 8 29/99 93 Pinouts and pin description STM8AF6246/48/66/68 Table 8. STM8AF6246/48/66/68 (32 Kbyte) microcontroller pin description(1)(2) (continued) OD PP I/O X X X - O1 X X Port E7 Analog input 9 25 17 PE5/SPI_NSS I/O X X X - O1 X X Port E5 SPI master/slave select - 26 18 PC1/TIM1_CH1 I/O X X X HS O3 X X Port C1 Timer 1 - channel 1 - 27 19 PC2/TIM1_CH2 I/O X X X HS O3 X X Port C2 Timer 1- channel 2 - 28 20 PC3/TIM1_CH3 I/O X X X HS O3 X X Port C3 Timer 1 - channel 3 - 29 21 PC4/TIM1_CH4 I/O X X X HS O3 X X Port C4 Timer 1 - channel 4 - 30 22 PC5/SPI_SCK I/O X X X O3 X X Port C5 SPI clock - floating PE6/AIN9 Pin name Type 24 LQFP48 Speed Alternate function after remap [option bit] High sink Main function (after reset) Output Ext. interrupt Input wpu VFQFPN/LQFP32 Pin number Default alternate function - 31 - VSSIO_2 S - - - - - - - I/O ground - 32 - VDDIO_2 S - - - - - - - I/O power supply - SPI master out/ slave in 33 23 PC6/SPI_MOSI I/O X X X - O3 X X Port C6 34 24 PC7/SPI_MISO I/O X X X - O3 X X Port C7 SPI master in/ slave out - - 35 - PG0 I/O X X - - O1 X X Port G0 - - 36 - PG1 I/O X X - - O1 X X Port G1 - - 37 - PE3/TIM1_BKIN I/O X X X - O1 X X Port E3 Timer 1 - break input - 38 - PE2/I2C_SDA I/O X - X - O1 T(6) - Port E2 I2C data - 39 - PE1/I2 I/O X - X - O1 T 40 - PE0/CLK_CCO I/O X X X - O3 C_SCL (6) 2 - Port E1 I C clock - X X Port E0 Configurable clock output - 41 25 PD0/TIM3_CH2 I/O X X X HS O3 X X Port D0 Timer 3 - channel 2 TIM1_BKIN [AFR3]/ CLK_CCO [AFR2] 42 26 PD1/SWIM(7) I/O X X X HS O4 X X Port D1 SWIM data interface - 43 27 PD2/TIM3_CH1 I/O X X X HS O3 X X Port D2 Timer 3 - channel 1 TIM2_CH3 [AFR1] 44 28 PD3/TIM2_CH2 I/O X X X HS O3 X X Port D3 Timer 2 - channel 2 ADC_ETR [AFR0] 45 29 PD4/TIM2_CH1/ BEEP I/O X X X HS O3 X X Port D4 Timer 2 - channel 1 BEEP output [AFR7] 46 30 PD5/ LINUART_TX I/O X X X X X Port D5 LINUART data transmit - 30/99 - O1 DocID14952 Rev 11 STM8AF6246/48/66/68 Pinouts and pin description Table 8. STM8AF6246/48/66/68 (32 Kbyte) microcontroller pin description(1)(2) (continued) High sink Speed OD PP 32 PD7/TLI(8) Alternate function after remap [option bit] Ext. interrupt 48 PD6/ LINUART_RX Output wpu 31 I/O X X X - O1 X X Port D6 LINUART data receive - I/O X X X - O1 X X Port D7 Top level interrupt floating VFQFPN/LQFP32 47 Pin name Type LQFP48 Input Main function (after reset) Pin number Default alternate function - 1. Refer to Table 7 for the definition of the abbreviations. 2. Reset state is shown in bold. 3. In Halt/Active-halt mode this pad behaves in the following way: - the input/output path is disabled - if the HSE clock is used for wakeup, the internal weak pull up is disabled - if the HSE clock is off, internal weak pull up setting from corresponding OR bit is used By managing the OR bit correctly, it must be ensured that the pad is not left floating during Halt/Active-halt. 4. On this pin, a pull-up resistor as specified in Table 35. I/O static characteristics is enabled during the reset phase of the product. 5. AIN12 is not selectable in ADC scan mode or with analog watchdog. 6. In the open-drain output column, ‘T’ defines a true open-drain I/O (P-buffer, week pull-up, and protection diode to VDD are not implemented) 7. The PD1 pin is in input pull-up during the reset phase and after reset release. 8. If this pin is configured as interrupt pin, it will trigger the TLI. 6.2 Alternate function remapping As shown in the rightmost column of Table 8, some alternate functions can be remapped at different I/O ports by programming one of eight AFR (alternate function remap) option bits. Refer to Section 9: Option bytes on page 44. When the remapping option is active, the default alternate function is no longer available. To use an alternate function, the corresponding peripheral must be enabled in the peripheral registers. Alternate function remapping does not effect GPIO capabilities of the I/O ports (see the GPIO section of STM8S series and STM8AF series 8-bit microcontrollers reference manual, RM0016). DocID14952 Rev 11 31/99 93 Memory and register map STM8AF6246/48/66/68 7 Memory and register map 7.1 Memory map Figure 5. Register and memory map of STM8A products [ 5$0 .E\WH 5$0HQG VWDFN 5HVHUYHG [ [ [ [ [ XSWR.E\WHGDWD((3520 5HVHUYHG 2SWLRQE\WHV 5HVHUYHG +DUGZDUHUHJLVWHUV [' 5HVHUYHG [ .E\WHRI%RRW520 [ 5HVHUYHG [) &386:,0GHEXJ,7& UHJLVWHUV [ ,QWHUUXSWYHFWRUV [ 8SWR.E\WHRI)ODVK SURJUDPPHPRU\ )ODVKSURJUDPPHPRU\HQG 069 32/99 DocID14952 Rev 11 STM8AF6246/48/66/68 Memory and register map Table 9. Memory model for the devices covered in this datasheet 7.2 Flash program memory size Flash program memory end address 32K 0x00 0FFFF 16K 0x00 0BFFF RAM size RAM end address Stack roll-over address 2K 0x00 07FF 0x00 0600 Register map In this section the memory and register map of the devices covered by this datasheet is described. For a detailed description of the functionality of the registers, refer to STM8S series and STM8AF series 8-bit microcontrollers reference manual, RM0016. Table 10. I/O port hardware register map Register label Register name Reset status 0x00 5000 PA_ODR Port A data output latch register 0x00 0x00 5001 PA_IDR Port A input pin value register 0xXX(1) PA_DDR Port A data direction register 0x00 0x00 5003 PA_CR1 Port A control register 1 0x00 0x00 5004 PA_CR2 Port A control register 2 0x00 0x00 5005 PB_ODR Port B data output latch register 0x00 0x00 5006 PB_IDR Port B input pin value register 0xXX(1) PB_DDR Port B data direction register 0x00 0x00 5008 PB_CR1 Port B control register 1 0x00 0x00 5009 PB_CR2 Port B control register 2 0x00 0x00 500A PC_ODR Port C data output latch register 0x00 0x00 500B PB_IDR Port C input pin value register 0xXX(1) PC_DDR Port C data direction register 0x00 0x00 500D PC_CR1 Port C control register 1 0x00 0x00 500E PC_CR2 Port C control register 2 0x00 0x00 500F PD_ODR Port D data output latch register 0x00 0x00 5010 PD_IDR Port D input pin value register 0xXX(1) PD_DDR Port D data direction register 0x00 0x00 5012 PD_CR1 Port D control register 1 0x02 0x00 5013 PD_CR2 Port D control register 2 0x00 Address 0x00 5002 0x00 5007 0x00 500C 0x00 5011 Block Port A Port B Port C Port D DocID14952 Rev 11 33/99 93 Memory and register map STM8AF6246/48/66/68 Table 10. I/O port hardware register map (continued) Register label Register name Reset status 0x00 5014 PE_ODR Port E data output latch register 0x00 0x00 5015 PE_IDR Port E input pin value register 0xXX(1) PE_DDR Port E data direction register 0x00 0x00 5017 PE_CR1 Port E control register 1 0x00 0x00 5018 PE_CR2 Port E control register 2 0x00 0x00 5019 PF_ODR Port F data output latch register 0x00 0x00 501A PF_IDR Port F input pin value register 0xXX(1) PF_DDR Port F data direction register 0x00 0x00 501C PF_CR1 Port F control register 1 0x00 0x00 501D PF_CR2 Port F control register 2 0x00 0x00 501E PG_ODR Port G data output latch register 0x00 0x00 501F PG_IDR Port G input pin value register 0xXX(1) PG_DDR Port G data direction register 0x00 0x00 5021 PG_CR1 Port G control register 1 0x00 0x00 5022 PG_CR2 Port G control register 2 0x00 Address 0x00 5016 0x00 501B 0x00 5020 Block Port E Port F Port G 1. Depends on the external circuitry. Table 11. General hardware register map Register label Register name Reset status 0x00 505A FLASH_CR1 Flash control register 1 0x00 0x00 505B FLASH_CR2 Flash control register 2 0x00 0x00 505C FLASH_NCR2 Flash complementary control register 2 0xFF FLASH_FPR Flash protection register 0x00 0x00 505E FLASH_NFPR Flash complementary protection register 0xFF 0x00 505F FLASH_IAPSR Address 0x00 505D Block Flash 0x00 5060 to 0x00 5061 0x00 5062 0x00 5065 to 0x00 509F 34/99 0x40 Reserved area (2 bytes) Flash FLASH_PUKR 0x00 5063 0x00 5064 Flash in-application programming status register Flash Program memory unprotection register 0x00 Reserved area (1 byte) Flash FLASH_DUKR Data EEPROM unprotection register Reserved area (59 bytes) DocID14952 Rev 11 0x00 STM8AF6246/48/66/68 Memory and register map Table 11. General hardware register map (continued) Address 0x00 50A0 0x00 50A1 Block ITC Register label Register name Reset status EXTI_CR1 External interrupt control register 1 0x00 EXTI_CR2 External interrupt control register 2 0x00 0x00 50A2 to 0x00 50B2 0x00 50B3 Reserved area (17 bytes) RST RST_SR 0x00 50B4 to 0x00 50BF 0x00 50C0 0x00 50C1 Reset status register 0xXX(1) Reserved area (12 bytes) CLK CLK_ICKR Internal clock control register 0x01 CLK_ECKR External clock control register 0x00 0x00 50C2 Reserved area (1 byte) 0x00 50C3 CLK_CMSR Clock master status register 0xE1 0x00 50C4 CLK_SWR Clock master switch register 0xE1 0x00 50C5 CLK_SWCR Clock switch control register 0xXX CLK_CKDIVR Clock divider register 0x18 CLK_PCKENR1 Peripheral clock gating register 1 0xFF 0x00 50C8 CLK_CSSR Clock security system register 0x00 0x00 50C9 CLK_CCOR Configurable clock control register 0x00 0x00 50CA CLK_PCKENR2 Peripheral clock gating register 2 0xFF 0x00 50C6 0x00 50C7 CLK 0x00 50CB Reserved area (1 byte) 0x00 50CC 0x00 50CD CLK CLK_HSITRIMR HSI clock calibration trimming register 0x00 CLK_SWIMCCR SWIM clock control register 0bXXXX XXX0 0x00 50CE to 0x00 50D0 0x00 50D1 0x00 50D2 Reserved area (3 bytes) WWDG WWDG_CR WWDG control register 0x7F WWDG_WR WWDR window register 0x7F 0x00 50D3 to 0x00 50DF Reserved area (13 bytes) 0x00 50E0 0x00 50E1 IWDG 0x00 50E2 IWDG_KR IWDG key register 0xXX(2) IWDG_PR IWDG prescaler register 0x00 IWDG_RLR IWDG reload register 0xFF 0x00 50E3 to 0x00 50EF Reserved area (13 bytes) 0x00 50F0 0x00 50F1 0x00 50F2 AWU AWU_CSR1 AWU control/status register 1 0x00 AWU_APR AWU asynchronous prescaler buffer register 0x3F AWU_TBR AWU timebase selection register 0x00 DocID14952 Rev 11 35/99 93 Memory and register map STM8AF6246/48/66/68 Table 11. General hardware register map (continued) Address Block Register label Register name Reset status 0x00 50F3 BEEP BEEP_CSR BEEP control/status register 0x1F 0x00 50F4 to 0x00 50FF Reserved area (12 bytes) 0x00 5200 SPI_CR1 SPI control register 1 0x00 0x00 5201 SPI_CR2 SPI control register 2 0x00 0x00 5202 SPI_ICR SPI interrupt control register 0x00 SPI_SR SPI status register 0x02 SPI_DR SPI data register 0x00 0x00 5205 SPI_CRCPR SPI CRC polynomial register 0x07 0x00 5206 SPI_RXCRCR SPI Rx CRC register 0xFF 0x00 5207 SPI_TXCRCR SPI Tx CRC register 0xFF 0x00 5203 0x00 5204 SPI 0x00 5208 to 0x00 520F Reserved area (8 bytes) 0x00 5210 I2C_CR1 I2C control register 1 0x00 0x00 5211 I2C_CR2 I2C control register 2 0x00 0x00 5212 I2C_FREQR I2C frequency register 0x00 0x00 5213 I2C_OARL I2C own address register low 0x00 0x00 5214 I2C_OARH I2C own address register high 0x00 0x00 5215 0x00 5216 I2C_DR I2C data register 0x00 I2C_SR1 I2C status register 1 0x00 0x00 5218 I2C_SR2 I2C status register 2 0x00 0x00 5219 I2C_SR3 I2C status register 3 0x00 0x00 521A I2C_ITR I2C interrupt control register 0x00 0x00 521B I2C_CCRL I2C clock control register low 0x00 0x00 521C I2C_CCRH I2C clock control register high 0x00 0x00 521D I2C_TRISER I2C TRISE register 0x02 0x00 5217 0x00 521E to 0x00 523F 36/99 Reserved area (1 byte) I2C Reserved area (24 bytes) DocID14952 Rev 11 STM8AF6246/48/66/68 Memory and register map Table 11. General hardware register map (continued) Register label Register name Reset status 0x00 5240 UART2_SR LINUART status register 0xC0 0x00 5241 UART2_DR LINUART data register 0xXX 0x00 5242 UART2_BRR1 LINUART baud rate register 1 0x00 0x00 5243 UART2_BRR2 LINUART baud rate register 2 0x00 UART2_CR1 LINUART control register 1 0x00 UART2_CR2 LINUART control register 2 0x00 0x00 5246 UART2_CR3 LINUART control register 3 0x00 0x00 5247 UART2_CR4 LINUART control register 4 0x00 Address 0x00 5244 0x00 5245 Block LINUART 0x00 5248 Reserved 0x00 5249 UART2_CR6 0x00 524A to 0x00 524F LINUART control register 6 0x00 Reserved area (6 bytes) 0x00 5250 TIM1_CR1 TIM1 control register 1 0x00 0x00 5251 TIM1_CR2 TIM1 control register 2 0x00 0x00 5252 TIM1_SMCR TIM1 slave mode control register 0x00 0x00 5253 TIM1_ETR TIM1 external trigger register 0x00 0x00 5254 TIM1_IER TIM1 Interrupt enable register 0x00 0x00 5255 TIM1_SR1 TIM1 status register 1 0x00 0x00 5256 TIM1_SR2 TIM1 status register 2 0x00 0x00 5257 TIM1_EGR TIM1 event generation register 0x00 0x00 5258 TIM1_CCMR1 TIM1 capture/compare mode register 1 0x00 0x00 5259 TIM1_CCMR2 TIM1 capture/compare mode register 2 0x00 TIM1_CCMR3 TIM1 capture/compare mode register 3 0x00 TIM1_CCMR4 TIM1 capture/compare mode register 4 0x00 0x00 525C TIM1_CCER1 TIM1 capture/compare enable register 1 0x00 0x00 525D TIM1_CCER2 TIM1 capture/compare enable register 2 0x00 0x00 525E TIM1_CNTRH TIM1 counter high 0x00 0x00 525F TIM1_CNTRL TIM1 counter low 0x00 0x00 5260 TIM1_PSCRH TIM1 prescaler register high 0x00 0x00 5261 TIM1_PSCRL TIM1 prescaler register low 0x00 0x00 5262 TIM1_ARRH TIM1 auto-reload register high 0xFF 0x00 5263 TIM1_ARRL TIM1 auto-reload register low 0xFF 0x00 5264 TIM1_RCR TIM1 repetition counter register 0x00 0x00 525A 0x00 525B TIM1 DocID14952 Rev 11 37/99 93 Memory and register map STM8AF6246/48/66/68 Table 11. General hardware register map (continued) Register label Register name Reset status 0x00 5265 TIM1_CCR1H TIM1 capture/compare register 1 high 0x00 0x00 5266 TIM1_CCR1L TIM1 capture/compare register 1 low 0x00 0x00 5267 TIM1_CCR2H TIM1 capture/compare register 2 high 0x00 0x00 5268 TIM1_CCR2L TIM1 capture/compare register 2 low 0x00 0x00 5269 TIM1_CCR3H TIM1 capture/compare register 3 high 0x00 TIM1_CCR3L TIM1 capture/compare register 3 low 0x00 0x00 526B TIM1_CCR4H TIM1 capture/compare register 4 high 0x00 0x00 526C TIM1_CCR4L TIM1 capture/compare register 4 low 0x00 0x00 526D TIM1_BKR TIM1 break register 0x00 0x00 526E TIM1_DTR TIM1 dead-time register 0x00 0x00 526F TIM1_OISR TIM1 output idle state register 0x00 Address 0x00 526A Block TIM1 0x00 5270 to 0x00 52FF 0x00 5300 TIM2_CR1 TIM2 control register 1 0x00 0x00 5301 TIM2_IER TIM2 interrupt enable register 0x00 0x00 5302 TIM2_SR1 TIM2 status register 1 0x00 0x00 5303 TIM2_SR2 TIM2 status register 2 0x00 0x00 5304 TIM2_EGR TIM2 event generation register 0x00 0x00 5305 TIM2_CCMR1 TIM2 capture/compare mode register 1 0x00 0x00 5306 TIM2_CCMR2 TIM2 capture/compare mode register 2 0x00 0x00 5307 TIM2_CCMR3 TIM2 capture/compare mode register 3 0x00 0x00 5308 TIM2_CCER1 TIM2 capture/compare enable register 1 0x00 TIM2_CCER2 TIM2 capture/compare enable register 2 0x00 0x00 530A TIM2_CNTRH TIM2 counter high 0x00 0x00 530B TIM2_CNTRL TIM2 counter low 0x00 00 530C0x TIM2_PSCR TIM2 prescaler register 0x00 0x00 530D TIM2_ARRH TIM2 auto-reload register high 0xFF 0x00 530E TIM2_ARRL TIM2 auto-reload register low 0xFF 0x00 530F TIM2_CCR1H TIM2 capture/compare register 1 high 0x00 0x00 5310 TIM2_CCR1L TIM2 capture/compare register 1 low 0x00 0x00 5311 TIM2_CCR2H TIM2 capture/compare reg. 2 high 0x00 0x00 5312 TIM2_CCR2L TIM2 capture/compare register 2 low 0x00 0x00 5313 TIM2_CCR3H TIM2 capture/compare register 3 high 0x00 0x00 5309 38/99 Reserved area (147 bytes) TIM2 DocID14952 Rev 11 STM8AF6246/48/66/68 Memory and register map Table 11. General hardware register map (continued) Address Block Register label Register name Reset status 0x00 5314 TIM2 TIM2_CCR3L TIM2 capture/compare register 3 low 0x00 0x00 5315 to 0x00 531F Reserved area (11 bytes) 0x00 5320 TIM3_CR1 TIM3 control register 1 0x00 0x00 5321 TIM3_IER TIM3 interrupt enable register 0x00 0x00 5322 TIM3_SR1 TIM3 status register 1 0x00 0x00 5323 TIM3_SR2 TIM3 status register 2 0x00 0x00 5324 TIM3_EGR TIM3 event generation register 0x00 0x00 5325 TIM3_CCMR1 TIM3 capture/compare mode register 1 0x00 0x00 5326 TIM3_CCMR2 TIM3 capture/compare mode register 2 0x00 0x00 5327 TIM3_CCER1 TIM3 capture/compare enable register 1 0x00 TIM3_CNTRH TIM3 counter high 0x00 0x00 5329 TIM3_CNTRL TIM3 counter low 0x00 0x00 532A TIM3_PSCR TIM3 prescaler register 0x00 0x00 532B TIM3_ARRH TIM3 auto-reload register high 0xFF 0x00 532C TIM3_ARRL TIM3 auto-reload register low 0xFF 0x00 532D TIM3_CCR1H TIM3 capture/compare register 1 high 0x00 0x00 532E TIM3_CCR1L TIM3 capture/compare register 1 low 0x00 0x00 532F TIM3_CCR2H TIM3 capture/compare register 2 high 0x00 0x00 5330 TIM3_CCR2L TIM3 capture/compare register 2 low 0x00 0x00 5328 TIM3 0x00 5331 to 0x00 533F Reserved area (15 bytes) 0x00 5340 TIM4_CR1 TIM4 control register 1 0x00 0x00 5341 TIM4_IER TIM4 interrupt enable register 0x00 0x00 5342 TIM4_SR TIM4 status register 0x00 TIM4_EGR TIM4 event generation register 0x00 0x00 5344 TIM4_CNTR TIM4 counter 0x00 0x00 5345 TIM4_PSCR TIM4 prescaler register 0x00 0x00 5346 TIM4_ARR TIM4 auto-reload register 0xFF 0x00 5343 0x00 5347 to 0x00 53DF TIM4 Reserved area (185 bytes) DocID14952 Rev 11 39/99 93 Memory and register map STM8AF6246/48/66/68 Table 11. General hardware register map (continued) Register label Register name Reset status 0x00 53E0 ADC _DB0RH ADC data buffer register 0 high 0x00 0x00 53E1 ADC _DB0RL ADC data buffer register 0 low 0x00 0x00 53E2 ADC _DB1RH ADC data buffer register 1 high 0x00 0x00 53E3 ADC _DB1RL ADC data buffer register 1 low 0x00 0x00 53E4 ADC _DB2RH ADC data buffer register 2 high 0x00 0x00 53E5 ADC _DB2RL ADC data buffer register 2 low 0x00 0x00 53E6 ADC _DB3RH ADC data buffer register 3 high 0x00 0x00 53E7 ADC _DB3RL ADC data buffer register 3 low 0x00 0x00 53E8 ADC _DB4RH ADC data buffer register 4 high 0x00 ADC _DB4RL ADC data buffer register 4 low 0x00 ADC _DB5RH ADC data buffer register 5 high 0x00 0x00 53EB ADC _DB5RL ADC data buffer register 5 low 0x00 0x00 53EC ADC _DB6RH ADC data buffer register 6 high 0x00 0x00 53ED ADC _DB6RL ADC data buffer register 6 low 0x00 0x00 53EE ADC _DB7RH ADC data buffer register 7 high 0x00 0x00 53EF ADC _DB7RL ADC data buffer register 7 low 0x00 0x00 53F0 ADC _DB8RH ADC data buffer register 8 high 0x00 0x00 53F1 ADC _DB8RL ADC data buffer register 8 low 0x00 0x00 53F2 ADC _DB9RH ADC data buffer register 9 high 0x00 0x00 53F3 ADC _DB9RL ADC data buffer register 9 low 0x00 Address 0x00 53E9 0x00 53EA Block ADC 0x00 53F4 to 0x00 53FF Reserved area (12 bytes) 0x00 5400 ADC _CSR ADC control/status register 0x00 0x00 5401 ADC_CR1 ADC configuration register 1 0x00 0x00 5402 ADC_CR2 ADC configuration register 2 0x00 0x00 5403 ADC_CR3 ADC configuration register 3 0x00 0x00 5404 ADC_DRH ADC data register high 0xXX ADC_DRL ADC data register low 0xXX 0x00 5406 ADC_TDRH ADC Schmitt trigger disable register high 0x00 0x00 5407 ADC_TDRL ADC Schmitt trigger disable register low 0x00 0x00 5408 ADC _HTRH ADC high threshold register high 0xFF 0x00 5409 ADC_HTRL ADC high threshold register low 0x03 0x00 540A ADC _LTRH ADC low threshold register high 0x00 0x00 5405 ADC 40/99 DocID14952 Rev 11 STM8AF6246/48/66/68 Memory and register map Table 11. General hardware register map (continued) Register label Register name Reset status 0x00 540B ADC_LTRL ADC low threshold register low 0x00 0x00 540C ADC _AWSRH ADC watchdog status register high 0x00 ADC_AWSRL ADC watchdog status register low 0x00 0x00 540E ADC _AWCRH ADC watchdog control register high 0x00 0x00 540F ADC _AWCRL ADC watchdog control register low 0x00 Address 0x00 540D Block ADC 0x00 5410 to 0x00 541F Reserved area (16 bytes) 1. Depends on the previous reset source. 2. Write only register. Table 12. CPU/SWIM/debug module/interrupt controller registers Register label Register name Reset status 0x00 7F00 A Accumulator 0x00 0x00 7F01 PCE Program counter extended 0x00 0x00 7F02 PCH Program counter high 0x80 0x00 7F03 PCL Program counter low 0x00 0x00 7F04 XH X index register high 0x00 XL X index register low 0x00 0x00 7F06 YH Y index register high 0x00 0x00 7F07 YL Y index register low 0x00 0x00 7F08 SPH Stack pointer high 0x17(2) 0x00 7F09 SPL Stack pointer low 0xFF 0x00 7F0A CC Condition code register 0x28 Address 0x00 7F05 Block CPU(1) 0x00 7F0B to 0x00 7F5F 0x00 7F60 Reserved area (85 bytes) CFG_GCR Global configuration register 0x00 0x00 7F70 ITC_SPR1 Interrupt software priority register 1 0xFF 0x00 7F71 ITC_SPR2 Interrupt software priority register 2 0xFF ITC_SPR3 Interrupt software priority register 3 0xFF ITC_SPR4 Interrupt software priority register 4 0xFF 0x00 7F74 ITC_SPR5 Interrupt software priority register 5 0xFF 0x00 7F75 ITC_SPR6 Interrupt software priority register 6 0xFF 0x00 7F72 0x00 7F73 CPU ITC 0x00 7F76 to 0x00 7F79 0x00 7F80 Reserved area (4 bytes) SWIM SWIM_CSR SWIM control status register DocID14952 Rev 11 0x00 41/99 93 Memory and register map STM8AF6246/48/66/68 Table 12. CPU/SWIM/debug module/interrupt controller registers (continued) Address Block Register label 0x00 7F81 to 0x00 7F8F Register name Reset status Reserved area (15 bytes) 0x00 7F90 DM_BK1RE DM breakpoint 1 register extended byte 0xFF 0x00 7F91 DM_BK1RH DM breakpoint 1 register high byte 0xFF 0x00 7F92 DM_BK1RL DM breakpoint 1 register low byte 0xFF 0x00 7F93 DM_BK2RE DM breakpoint 2 register extended byte 0xFF 0x00 7F94 DM_BK2RH DM breakpoint 2 register high byte 0xFF DM_BK2RL DM breakpoint 2 register low byte 0xFF 0x00 7F96 DM_CR1 DM debug module control register 1 0x00 0x00 7F97 DM_CR2 DM debug module control register 2 0x00 0x00 7F98 DM_CSR1 DM debug module control/status register 1 0x10 0x00 7F99 DM_CSR2 DM debug module control/status register 2 0x00 0x00 7F9A DM_ENFCTR DM enable function register 0xFF 0x00 7F95 DM 0x00 7F9B to 0x00 7F9F Reserved area (5 bytes) 1. Accessible by debug module only 2. Product dependent value, see Figure 5: Register and memory map of STM8A products. Table 13. Temporary memory unprotection registers Register label Register name Reset status 0x00 5800 TMU_K1 Temporary memory unprotection key register 1 0x00 0x00 5801 TMU_K2 Temporary memory unprotection key register 2 0x00 0x00 5802 TMU_K3 Temporary memory unprotection key register 3 0x00 0x00 5803 TMU_K4 Temporary memory unprotection key register 4 0x00 TMU_K5 Temporary memory unprotection key register 5 0x00 0x00 5805 TMU_K6 Temporary memory unprotection key register 6 0x00 0x00 5806 TMU_K7 Temporary memory unprotection key register 7 0x00 0x00 5807 TMU_K8 Temporary memory unprotection key register 8 0x00 0x00 5808 TMU_CSR Temporary memory unprotection control and status register 0x00 Address 0x00 5804 42/99 Block TMU DocID14952 Rev 11 STM8AF6246/48/66/68 8 Interrupt table Interrupt table Table 14. STM8A interrupt table Source block Priority Description Interrupt vector Wakeup address from Halt Comments - Reset Reset 0x00 8000 Yes User RESET vector - TRAP SW interrupt 0x00 8004 - - 0 TLI External top level interrupt 0x00 8008 - - 1 AWU Auto-wakeup from Halt 0x00 800C Yes - 2 Clock controller Main clock controller 0x00 8010 - - 3 MISC Ext interrupt E0 0x00 8014 Yes Port A interrupts 4 MISC Ext interrupt E1 0x00 8018 Yes Port B interrupts 5 MISC Ext interrupt E2 0x00 801C Yes Port C interrupts 6 MISC Ext interrupt E3 0x00 8020 Yes Port D interrupts 7 MISC Ext interrupt E4 0x00 8024 Yes Port E interrupts 8 (1) - - - - (1) - - - - Reserved 9 Reserved 10 SPI End of transfer 0x00 8030 Yes - 11 Timer 1 Update/overflow/ trigger/break 0x00 8034 - - 12 Timer 1 Capture/compare 0x00 8038 - - 13 Timer 2 Update/overflow 0x00 803C - - 14 Timer 2 Capture/compare 0x00 8040 - - 15 Timer 3 Update/overflow 0x00 8044 - - 16 Timer 3 Capture/compare 0x00 8048 - - - - - - - - - - I C interrupts 0x00 8054 Yes - Reserved (1) 18 Reserved (1) 19 I2 20 LINUART Tx complete/error 0x00 8058 - - 21 LINUART Receive data full reg. 0x00 805C - - 22 ADC End of conversion 0x00 8060 - - 23 Timer 4 Update/overflow 0x00 8064 - - 24 EEPROM End of Programming/ Write in not allowed area 0x00 8068 - - 17 C 2 1. All reserved and unused interrupts must be initialized with ‘IRET’ for robust programming. DocID14952 Rev 11 43/99 93 Option bytes 9 STM8AF6246/48/66/68 Option bytes Option bytes contain configurations for device hardware features as well as the memory protection of the device. They are stored in a dedicated block of the memory. Each option byte has to be stored twice, for redundancy, in a regular form (OPTx) and a complemented one (NOPTx), except for the ROP (read-out protection) option byte and option bytes 8 to 16. Option bytes can be modified in ICP mode (via SWIM) by accessing the EEPROM address shown in Table 15: Option bytes below. Option bytes can also be modified ‘on the fly’ by the application in IAP mode, except the ROP and UBC options that can only be toggled in ICP mode (via SWIM). Refer to the STM8 Flash programming manual (PM0051) and STM8 SWIM communication protocol and debug module user manual (UM0470) for information on SWIM programming procedures. Table 15. Option bytes Addr. 0x00 4800 0x00 4801 0x00 4802 0x00 4803 0x00 4804 0x00 4805 0x00 4806 0x00 4807 0x00 4808 0x00 4809 0x00 480A 44/99 Option name Option byte no. Read-out protection (ROP) OPT0 User boot code (UBC) Clock option HSE clock startup 7 6 5 4 3 2 1 0 Factory default setting 0x00 ROP[7:0] OPT1 Reserved UBC[5:0] 0x00 NOPT1 Reserved NUBC[5:0] 0xFF Alternate OPT2 function remapping NOPT2 (AFR) Watchdog option Option bits AFR7 AFR6 AFR5 AFR4 AFR3 AFR2 AFR1 AFR0 0x00 NAFR 7 NAFR 6 NAFR 5 NAFR 4 NAFR 3 NAFR 2 NAFR 1 NAFR 0 0xFF IWDG _HW OPT3 Reserved 16MHZ TRIM0 LSI _EN WWDG WWDG _HW _HALT 0x00 NOPT3 Reserved N16MHZ TRIM0 NLSI _EN NIWDG NWWD NWWG _HW G_HW _HALT 0xFF OPT4 Reserved EXT CLK CKAWU SEL PRS C1 PRS C0 0x00 NOPT4 Reserved NEXT CLK NCKAW USEL NPR SC1 NPR SC0 0xFF OPT5 HSECNT[7:0] 0x00 NOPT5 NHSECNT[7:0] 0xFF DocID14952 Rev 11 STM8AF6246/48/66/68 Option bytes Table 15. Option bytes (continued) Addr. 0x00 480B 0x00 480C 0x00 480D 0x00 480E Option name Option byte no. Option bits 7 6 5 4 3 2 1 0 Factory default setting OPT6 TMU[3:0] 0x00 NOPT6 NTMU[3:0] 0xFF TMU Flash wait states OPT7 Reserved WAIT STATE 0x00 NOPT7 Reserved NWAIT STATE 0xFF 0x00 480F Reserved 0x00 4810 OPT8 TMU_KEY 1 [7:0] 0x00 0x00 4811 OPT9 TMU_KEY 2 [7:0] 0x00 0x00 4812 OPT10 TMU_KEY 3 [7:0] 0x00 0x00 4813 OPT11 TMU_KEY 4 [7:0] 0x00 OPT12 TMU_KEY 5 [7:0] 0x00 0x00 4815 OPT13 TMU_KEY 6 [7:0] 0x00 0x00 4816 OPT14 TMU_KEY 7 [7:0] 0x00 0x00 4817 OPT15 TMU_KEY 8 [7:0] 0x00 0x00 4818 OPT16 TMU_MAXATT [7:0] 0xC7 0x00 4814 TMU 0x00 4819 to 487D 0x00 487E 0x00 487F Reserved Bootloader(1) OPT17 BL [7:0] 0x00 NOPT17 NBL[7:0] 0xFF 1. This option consists of two bytes that must have a complementary value in order to be valid. If the option is invalid, it has no effect on EMC reset. DocID14952 Rev 11 45/99 93 Option bytes STM8AF6246/48/66/68 Table 16. Option byte description 46/99 Option byte no. Description OPT0 ROP[7:0]: Memory readout protection (ROP) 0xAA: Enable readout protection (write access via SWIM protocol) Note: Refer to STM8S series and STM8AF series 8-bit microcontrollers reference manual (RM0016) section on Flash/EEPROM memory readout protection for details. OPT1 UBC[5:0]: User boot code area 0x00: No UBC, no write-protection 0x01: Page 0 to 1 defined as UBC, memory write-protected 0x02: Page 0 to 3 defined as UBC, memory write-protected 0x03 to 0x3F: Pages 4 to 63 defined as UBC, memory write-protected Note: Refer to STM8S series and STM8AF series 8-bit microcontrollers reference manual (RM0016) section on Flash/EEPROM write protection for more details. OPT2 AFR7: Alternate function remapping option 7 0: Port D4 alternate function = TIM2_CH1 1: Port D4 alternate function = BEEP AFR6: Alternate function remapping option 6 0: Port B5 alternate function = AIN5, port B4 alternate function = AIN4 1: Port B5 alternate function = I2C_SDA, port B4 alternate function = I2C_SCL. AFR5: Alternate function remapping option 5 0: Port B3 alternate function = AIN3, port B2 alternate function = AIN2, port B1 alternate function = AIN1, port B0 alternate function = AIN0. 1: Port B3 alternate function = TIM1_ETR, port B2 alternate function = TIM1_CH3N, port B1 alternate function = TIM1_CH2N, port B0 alternate function = TIM1_CH1N. AFR4: Alternate function remapping option 4 Reserved, bit must be kept at “0” AFR3: Alternate function remapping option 3 0: Port D0 alternate function = TIM3_CH2 1: Port D0 alternate function = TIM1_BKIN AFR2: Alternate function remapping option 2 0: Port D0 alternate function = TIM3_CH2 1: Port D0 alternate function = CLK_CCO Note: AFR2 option has priority over AFR3 if both are activated AFR1: Alternate function remapping option 1 0: Port A3 alternate function = TIM2_CH3, port D2 alternate function TIM3_CH1. 1: Port A3 alternate function = TIM3_CH1, port D2 alternate function TIM2_CH3. AFR0: Alternate function remapping option 0 0: Port D3 alternate function = TIM2_CH2 1: Port D3 alternate function = ADC_ETR DocID14952 Rev 11 STM8AF6246/48/66/68 Option bytes Table 16. Option byte description (continued) Option byte no. Description HSITRIM: Trimming option for 16 MHz internal RC oscillator 0: 3-bit on-the-fly trimming (compatible with devices based on the 128K silicon) 1: 4-bit on-the-fly trimming LSI_EN: Low speed internal clock enable 0: LSI clock is not available as CPU clock source 1: LSI clock is available as CPU clock source OPT3 IWDG_HW: Independent watchdog 0: IWDG independent watchdog activated by software 1: IWDG independent watchdog activated by hardware WWDG_HW: Window watchdog activation 0: WWDG window watchdog activated by software 1: WWDG window watchdog activated by hardware WWDG_HALT: Window watchdog reset on Halt 0: No reset generated on Halt if WWDG active 1: Reset generated on Halt if WWDG active EXTCLK: External clock selection 0: External crystal connected to OSCIN/OSCOUT 1: External clock signal on OSCIN OPT4 CKAWUSEL: Auto-wakeup unit/clock 0: LSI clock source selected for AWU 1: HSE clock with prescaler selected as clock source for AWU PRSC[1:0]: AWU clock prescaler 00: Reserved 01: 16 MHz to 128 kHz prescaler 10: 8 MHz to 128 kHz prescaler 11: 4 MHz to 128 kHz prescaler OPT5 HSECNT[7:0]: HSE crystal oscillator stabilization time This configures the stabilization time to 0.5, 8, 128, and 2048 HSE cycles with corresponding option byte values of 0xE1, 0xD2, 0xB4, and 0x00. OPT6 TMU[3:0]: Enable temporary memory unprotection 0101: TMU disabled (permanent ROP). Any other value: TMU enabled. OPT7 Reserved OPT8 TMU_KEY 1 [7:0]: Temporary unprotection key 0 Temporary unprotection key: Must be different from 0x00 or 0xFF OPT9 TMU_KEY 2 [7:0]: Temporary unprotection key 1 Temporary unprotection key: Must be different from 0x00 or 0xFF OPT10 TMU_KEY 3 [7:0]: Temporary unprotection key 2 Temporary unprotection key: Must be different from 0x00 or 0xFF OPT11 TMU_KEY 4 [7:0]: Temporary unprotection key 3 Temporary unprotection key: Must be different from 0x00 or 0xFF DocID14952 Rev 11 47/99 93 Option bytes STM8AF6246/48/66/68 Table 16. Option byte description (continued) Option byte no. 48/99 Description OPT12 TMU_KEY 5 [7:0]: Temporary unprotection key 4 Temporary unprotection key: Must be different from 0x00 or 0xFF OPT13 TMU_KEY 6 [7:0]: Temporary unprotection key 5 Temporary unprotection key: Must be different from 0x00 or 0xFF OPT14 TMU_KEY 7 [7:0]: Temporary unprotection key 6 Temporary unprotection key: Must be different from 0x00 or 0xFF OPT15 TMU_KEY 8 [7:0]: Temporary unprotection key 7 Temporary unprotection key: Must be different from 0x00 or 0xFF OPT16 TMU_MAXATT [7:0]: TMU access failure counter TMU_MAXATT can be initialized with the desired value only if TMU is disabled (TMU[3:0]=0101 in OPT6 option byte). When TMU is enabled, any attempt to temporary remove the readout protection by using wrong key values increments the counter. When the option byte value reaches 0x08, the Flash memory and data EEPROM are erased. OPT17 BL [7:0]: Bootloader enable If this option byte is set to 0x55 (complementary value 0xAA) the bootloader program is activated also in case of a programmed code memory (for more details, see the bootloader user manual, UM0560). DocID14952 Rev 11 STM8AF6246/48/66/68 Electrical characteristics 10 Electrical characteristics 10.1 Parameter conditions Unless otherwise specified, all voltages are referred to VSS. 10.1.1 Minimum and maximum values Unless otherwise specified the minimum and maximum values are guaranteed in the worst conditions of ambient temperature, supply voltage and frequencies by tests in production on 100% of the devices with an ambient temperature at TA = -40 °C, TA = 25 °C, and TA = TAmax (given by the selected temperature range). Data based on characterization results, design simulation and/or technology characteristics are indicated in the table footnotes and are not tested in production. 10.1.2 Typical values Unless otherwise specified, typical data are based on TA = 25 °C, VDD = 5.0 V. They are given only as design guidelines and are not tested. Typical ADC accuracy values are determined by characterization of a batch of samples from a standard diffusion lot over the full temperature range. 10.1.3 Typical curves Unless otherwise specified, all typical curves are given only as design guidelines and are not tested. 10.1.4 Loading capacitor The loading conditions used for pin parameter measurement are shown in Figure 6. Figure 6. Pin loading conditions 670$3,1 S) 06Y9 DocID14952 Rev 11 49/99 93 Electrical characteristics 10.1.5 STM8AF6246/48/66/68 Pin input voltage The input voltage measurement on a pin of the device is described in Figure 7. Figure 7. Pin input voltage 670$3,1 9,1 06Y9 10.2 Absolute maximum ratings Stresses above those listed as ‘absolute maximum ratings’ may cause permanent damage to the device. This is a stress rating only and functional operation of the device under these conditions is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability. Table 17. Voltage characteristics Symbol Min Max Unit -0.3 6.5 V VSS - 0.3 6.5 VSS - 0.3 VDD + 0.3 |VDDx - VDD| Variations between different power pins - 50 |VSSx - VSS| Variations between all the different ground pins - 50 VDDx - VSS VIN VESD Ratings Supply voltage (including VDDA and VDDIO)(1) Input voltage on true open drain pins (PE1, PE2)(2) Input voltage on any other pin(2) Electrostatic discharge voltage V mV see Absolute maximum ratings (electrical sensitivity) on page 76 1. All power (VDD, VDDIO, VDDA) and ground (VSS, VSSIO, VSSA) pins must always be connected to the external power supply 2. IINJ(PIN) must never be exceeded. This is implicitly insured if VIN maximum is respected. If VIN maximum cannot be respected, the injection current must be limited externally to the IINJ(PIN) value. A positive injection is induced by VIN > VDD while a negative injection is induced by VIN < VSS. For true open-drain pads, there is no positive injection current, and the corresponding VIN maximum must always be respected 50/99 DocID14952 Rev 11 STM8AF6246/48/66/68 Electrical characteristics Table 18. Current characteristics Symbol Ratings Max. IVDDIO Total current into VDDIO power lines (source)(1)(2)(3) 100 IVSSIO (1)(2)(3) 100 IIO IINJ(PIN)(4) IINJ(TOT) Total current out of VSS IO ground lines (sink) Output current sunk by any I/O and control pin 20 Output current source by any I/Os and control pin -20 Injected current on any pin ±10 Sum of injected currents 50 Unit mA 1. All power (VDD, VDDIO, VDDA) and ground (VSS, VSSIO, VSSA) pins must always be connected to the external supply. 2. The total limit applies to the sum of operation and injected currents. 3. VDDIO includes the sum of the positive injection currents. VSSIO includes the sum of the negative injection currents. 4. This condition is implicitly insured if VIN maximum is respected. If VIN maximum cannot be respected, the injection current must be limited externally to the IINJ(PIN) value. A positive injection is induced by VIN > VDD while a negative injection is induced by VIN < VSS. For true open-drain pads, there is no positive injection current allowed and the corresponding VIN maximum must always be respected. Table 19. Thermal characteristics Symbol TSTG TJ Ratings Storage temperature range Maximum junction temperature Value -65 to 150 160 Unit °C Table 20. Operating lifetime(1) Symbol OLF Ratings Conforming to AEC-Q100 rev G Value Unit -40 to 125 °C Grade 1 -40 to 150 °C Grade 0 1. For detailed mission profile analysis, please contact the nearest local ST Sales Office. DocID14952 Rev 11 51/99 93 Electrical characteristics 10.3 STM8AF6246/48/66/68 Operating conditions Table 21. General operating conditions Symbol fCPU VDD/VDDIO VCAP(1) Parameter Conditions Min Max Unit TA = -40 °C to 150 °C 0 16 MHz Standard operating voltage - 3.0 5.5 V CEXT: capacitance of external capacitor - 470 3300 nF - 0.3 Ω - 15 nH LQFP32 - 85 VFQFPN32 - 200 LQFP48 - 88 Internal CPU clock frequency ESR of external capacitor ESL of external capacitor PD TA Power dissipation (all temperature ranges) at 1 MHz(2) Ambient temperature Suffix A 85 Suffix C 125 Suffix D -40 Suffix A TJ Junction temperature range mW 150 °C 90 Suffix C 130 Suffix D 155 1. Care should be taken when selecting the capacitor, due to its tolerance, as well as the parameter dependency on temperature, DC bias and frequency in addition to other factors. The parameter maximum value must be respected for the full application range. 2. This frequency of 1 MHz as a condition for VCAP parameters is given by design of internal regulator. Figure 8. fCPUmax versus VDD I&380+]  )XQFWLRQDOLW\ QRW JXDUDQWHHGLQ ϭϲ WKLVDUHD ϭϮ )XQFWLRQDOLW\JXDUDQWHHG #7$WRƒ& ϴ ϰ Ϭ     6XSSO\YROWDJH9 06Y9 52/99 DocID14952 Rev 11 STM8AF6246/48/66/68 Electrical characteristics Table 22. Operating conditions at power-up/power-down Symbol tVDD tTEMP Parameter Conditions Min Typ Max VDD rise time rate - 2(1) - ∞ VDD fall time rate - 2(1) - ∞ Reset release delay VDD rising - 1 1.7 ms Reset generation delay VDD falling - 3 - µs VIT+ Power-on reset threshold(2) (3) - 2.65 2.8 2.95 VIT- Brown-out reset threshold - 2.58 2.73 2.88 VHYS(BOR) Brown-out reset hysteresis - - 70(1) - Unit µs/V V mV 1. Guaranteed by design, not tested in production 2. If VDD is below 3 V, the code execution is guaranteed above the VIT- and VIT+ thresholds. RAM content is kept. The EEPROM programming sequence must not be initiated. 3. There is inrush current into VDD present after device power on to charge CEXT capacitor. This inrush energy depends from CEXT capacitor value. For example, a CEXT of 1μF requires Q=1 μF x 1.8V = 1.8 μC. DocID14952 Rev 11 53/99 93 Electrical characteristics 10.3.1 STM8AF6246/48/66/68 VCAP external capacitor Stabilization for the main regulator is achieved connecting an external capacitor CEXT to the VCAP pin. CEXT is specified in Table 21. Care should be taken to limit the series inductance to less than 15 nH. Figure 9. External capacitor CEXT (6/ & (65 5/HDN 06Y9 1. Legend: ESR is the equivalent series resistance and ESL is the equivalent inductance. 10.3.2 Supply current characteristics The current consumption is measured as described in Figure 6 on page 49 and Figure 7 on page 50. If not explicitly stated, general conditions of temperature and voltage apply. Table 23. Total current consumption in Run, Wait and Slow mode. General conditions for VDD apply, TA = −40 to 150 °C Symbol IDD(RUN)(1) IDD(RUN)(1) IDD(WFI)(1) Parameter Supply current in Run mode Supply current in Run mode Supply current in Wait mode Supply IDD(SLOW)(1) current in Slow mode Conditions Max All peripherals clocked, code executed from Flash program memory, HSE external clock (without resonator) fCPU = 16 MHz 7.4 14 fCPU = 8 MHz 4.0 7.4(2) fCPU = 4 MHz 2.4 4.1(2) fCPU = 2 MHz 1.5 2.5 All peripherals clocked, code executed from RAM and EEPROM, HSE external clock (without resonator) fCPU = 16 MHz 3.7 5.0 fCPU = 8 MHz 2.2 3.0(2) fCPU = 4 MHz 1.4 2.0(2) fCPU = 2 MHz 1.0 1.5 fCPU = 16 MHz 1.65 2.5 fCPU = 8 MHz 1.15 1.9(2) fCPU = 4 MHz 0.90 1.6(2) fCPU = 2 MHz 0.80 1.5 Ext. clock 16 MHz fCPU = 125 kHz 1.50 1.95 LSI internal RC fCPU = 128 kHz 1.50 1.80(2) CPU stopped, all peripherals off, HSE external clock fCPU scaled down, all peripherals off, code executed from RAM 1. The current due to I/O utilization is not taken into account in these values. 2. Values not tested in production. Design guidelines only. 54/99 Typ DocID14952 Rev 11 Unit mA STM8AF6246/48/66/68 Electrical characteristics Table 24. Total current consumption in Halt and Active-halt modes. General conditions for VDD apply, TA = −40 to 55 °C Conditions Symbol IDD(H) Parameter Main voltage regulator (MVR)(1) Flash mode(2) Off Powerdown On Powerdown Supply current in Halt mode Supply current in Active-halt mode with regulator on IDD(AH) tWU(AH) Supply current in Active-halt mode with regulator off Off Wakeup time from Activehalt mode with regulator on On Wakeup time from Activehalt mode with regulator off Off Powerdown Operating mode Clock source and specific temperature condition Typ Max Clocks stopped 5 35(3) Clocks stopped, TA = 25 °C 5 25 Ext. clock 16 MHz fMASTER = 125 kHz 770 900(3) LSI clock 128 kHz 150 230(3) LSI clock 128 kHz 25 42(3) LSI clock 128 kHz, TA = 25 °C 25 30 10 30(3) 50 80(3) TA = -40 to 150 °C Unit µA µs 1. Configured by the REGAH bit in the CLK_ICKR register. 2. Configured by the AHALT bit in the FLASH_CR1 register. 3. Data based on characterization results. Not tested in production. Current consumption for on-chip peripherals Table 25. Oscillator current consumption Symbol IDD(OSC) Parameter Conditions HSE oscillator current consumption(2) Typ Max(1) Quartz or ceramic resonator, CL = 33 pF VDD = 5 V fOSC = 24 MHz 1 2.0(3) fOSC = 16 MHz 0.6 - fOSC = 8 MHz 0.57 - Quartz or ceramic resonator, CL = 33 pF VDD = 3.3 V fOSC = 24 MHz 0.5 1.0(3) fOSC = 16 MHz 0.25 - fOSC = 8 MHz 0.18 - Unit mA 1. During startup, the oscillator current consumption may reach 6 mA. 2. The supply current of the oscillator can be further optimized by selecting a high quality resonator with small Rm value. Refer to crystal manufacturer for more details 3. Informative data. DocID14952 Rev 11 55/99 93 Electrical characteristics STM8AF6246/48/66/68 Table 26. Programming current consumption Symbol Parameter IDD(PROG) Programming current Conditions Typ Max Unit VDD = 5 V, -40 °C to 150 °C, erasing and programming data or Flash program memory 1.0 1.7 mA Table 27. Typical peripheral current consumption VDD = 5.0 V(1) Symbol Parameter Typ. fmaster = 2 MHz Typ. fmaster = 16 MHz 0.03 0.23 0.02 0.12 TIM1 supply current(2) IDD(TIM1) (2) IDD(TIM2) TIM2 supply current IDD(TIM3) TIM3 supply current(2) 0.01 0.1 IDD(TIM4) current(2) 0.004 0.03 TIM4 supply LINUART supply current(2) 0.03 0.11 IDD(SPI) SPI supply current(2) 0.01 0.04 IDD(I2C) I2C supply current(2) 0.02 0.06 0.003 0.02 All digital peripherals on 0.22 1 ADC supply current when converting(3) 0.93 0.95 IDD(LINUART) AWU supply IDD(AWU) IDD(TOT_DIG) IDD(ADC) current(2) Unit mA 1. Typical values not tested in production. Since the peripherals are powered by an internally regulated, constant digital supply voltage, the values are similar in the full supply voltage range. 2. Data based on a differential IDD measurement between no peripheral clocked and a single active peripheral. This measurement does not include the pad toggling consumption. 3. Data based on a differential IDD measurement between reset configuration and continuous A/D conversions. Current consumption curves Figure 10 to Figure 15 show typical current consumption measured with code executing in RAM. Figure 10. Typ. IDD(RUN)HSE vs. VDD @fCPU = 16 MHz, peripheral = on 9 25°C 8 85°C 7 125°C 10 6 5 4 3 2 1 8 85°C 7 125°C 6 5 4 3 2 1 0 0 2.5 3 3.5 4 4.5 5 5.5 6 VDD [V] 56/99 25°C 9 IDD(RUN)HSE [mA] IDD(RUN)HSE [mA] 10 Figure 11. Typ. IDD(RUN)HSE vs. fCPU @ VDD = 5.0 V, peripheral = on 0 5 10 15 fcpu [MHz] DocID14952 Rev 11 20 25 30 Electrical characteristics Figure 12. Typ. IDD(RUN)HSI vs. VDD @ fCPU = 16 MHz, peripheral = off Figure 13. Typ. IDD(WFI)HSE vs. VDD @ fCPU = 16 MHz, peripheral = on 4 6 3 2 25°C 85°C 125°C 1 0 2.5 3.5 4.5 5.5 IDD(WFI)HSE [mA] IDD(RUN)HSI [mA] STM8AF6246/48/66/68 5 4 3 2 25°C 85°C 125°C 1 0 2.5 6.5 3.5 Figure 14. Typ. IDD(WFI)HSE vs. fCPU @ VDD = 5.0 V, peripheral = on 6.5 2.5 IDD(WFI)HSI [mA] 5 4 3 25°C 2 85°C 1 5 10 15 20 25 1.5 1 25°C 85°C 0.5 0 0 0 2 125°C 125°C 2.5 30 3 3.5 4 4.5 5 5.5 6 VDD [V] fcpu [MHz] 10.3.3 5.5 Figure 15. Typ. IDD(WFI)HSI vs. VDD @ fCPU = 16 MHz, peripheral = off 6 IDD(WFI)HSE [mA] 4.5 VDD [V] VDD [V] External clock sources and timing characteristics HSE user external clock Subject to general operating conditions for VDD and TA. Table 28. HSE user external clock characteristics Symbol Parameter Conditions Min Typ Max Unit fHSE_ext User external clock source frequency TA is -40 to 150 °C 0(1) - 16 MHz VHSEdHL Comparator hysteresis - 0.1 x VDD - - VHSEH OSCIN input pin high level voltage - 0.7 x VDD - VDD VHSEL OSCIN input pin low level voltage - VSS - 0.3 x VDD VSS < VIN < VDD -1 - +1 ILEAK_HSE OSCIN input leakage current V µA 1. In CSS is used, the external clock must have a frequency above 500 kHz. DocID14952 Rev 11 57/99 93 Electrical characteristics STM8AF6246/48/66/68 Figure 16. HSE external clock source 9 +6(+ 9 +6(/ ([WHUQDOFORFN VRXUFH I+6( 26&,1 670 069 HSE crystal/ceramic resonator oscillator The HSE clock can be supplied using a crystal/ceramic resonator oscillator of up to 16 MHz. All the information given in this paragraph is based on characterization results with specified typical external components. In the application, the resonator and the load capacitors have to be placed as close as possible to the oscillator pins in order to minimize output distortion and startup stabilization time. Refer to the crystal resonator manufacturer for more details (frequency, package, accuracy...). Table 29. HSE oscillator characteristics Symbol RF CL1/CL2 (1) gm tSU(HSE)(2) Parameter Conditions Min Typ Max Unit Feedback resistor - - 220 - kΩ Recommended load capacitance - - - 20 pF Oscillator transconductance - 5 - - mA/V VDD is stabilized - 2.8 - ms Startup time 1. The oscillator needs two load capacitors, CL1 and CL2, to act as load for the crystal. The total load capacitance (Cload) is (CL1 * CL2)/(CL1 + CL2). If CL1 = CL2, Cload = CL1 / 2. Some oscillators have built-in load capacitors, CL1 and CL2. 2. This value is the startup time, measured from the moment it is enabled (by software) until a stabilized 16 MHz oscillation is reached. It can vary with the crystal type that is used. 58/99 DocID14952 Rev 11 STM8AF6246/48/66/68 Electrical characteristics Figure 17. HSE oscillator circuit diagram 5P /P I+6(WRFRUH &2 5) &/ &P 26&,1 JP 5HVRQDWRU &XUUHQWFRQWURO 5HVRQDWRU 26&287 &/ 670 06Y9 HSE oscillator critical gm formula The crystal characteristics have to be checked with the following formula: g m » g mcrit where gmcrit can be calculated with the crystal parameters as follows: f 2 g mcrit = ( 2 × Π × HSE ) × R m ( 2Co + C ) 2 Rm: Notional resistance (see crystal specification) Lm: Notional inductance (see crystal specification) Cm: Notional capacitance (see crystal specification) Co: Shunt capacitance (see crystal specification) CL1 = CL2 = C: Grounded external capacitance 10.3.4 Internal clock sources and timing characteristics Subject to general operating conditions for VDD and TA. High speed internal RC oscillator (HSI) Table 30. HSI oscillator characteristics Symbol fHSI Parameter Frequency Conditions Min Typ Max Unit - - 16 - MHz DocID14952 Rev 11 59/99 93 Electrical characteristics STM8AF6246/48/66/68 Table 30. HSI oscillator characteristics Symbol Parameter HSI oscillator user trimming accuracy ACCHS HSI oscillator accuracy (factory calibrated) tsu(HSI) Conditions Min Trimmed by the application for any VDD and TA conditions -1(1) - -0.5(1) - 0.5(1) 3.0 V ≤ VDD ≤ 5.5 V, -40 °C ≤ TA ≤ 150 °C -5 - 5 3.0V ≤ VDD ≤ 5.5V, -40°C ≤ TA ≤ 125 °C -2.5(2) - 2.5(2) - - 2(3) HSI oscillator wakeup time - Typ Max Unit (1) 1 % µs 1. Depending on option byte setting (OPT3 and NOPT3) 2. These values are guaranteed for STM8AF62x6ITx order codes only. 3. Guaranteed by characterization, not tested in production Figure 18. Typical HSI frequency vs VDD 3% HSI frequency variation [%] -40°C 2% 25°C 85°C 1% 125°C 0% -1% -2% -3% 2.5 3 3.5 4 4.5 5 5.5 6 VDD [V] Low speed internal RC oscillator (LSI) Subject to general operating conditions for VDD and TA. Table 31. LSI oscillator characteristics Symbol fLSI tsu(LSI) Parameter Conditions Min Typ Max Unit Frequency - 112 128 144 kHz LSI oscillator wakeup time - - - 7(1) µs 1. Data based on characterization results, not tested in production. 60/99 DocID14952 Rev 11 STM8AF6246/48/66/68 Electrical characteristics Figure 19. Typical LSI frequency vs VDD LSI frequency variation [%] 3% 2% 1% 25°C 0% -1% -2% -3% 2.5 3 3.5 4 VDD [V] DocID14952 Rev 11 4.5 5 5.5 6 61/99 93 Electrical characteristics 10.3.5 STM8AF6246/48/66/68 Memory characteristics Flash program memory/data EEPROM memory General conditions: TA = -40 to 150 °C. Table 32. Flash program memory/data EEPROM memory Symbol Parameter Conditions Min Typ Max - 5.5 VDD Operating voltage (all modes, execution/write/erase) fCPU is 0 to 16 MHz with 0 ws 3.0 VDD Operating voltage (code execution) fCPU is 0 to 16 MHz with 0 ws 2.6 - 5.5 Standard programming time (including erase) for byte/word/block (1 byte/4 bytes/128 bytes) - - 6 6.6 Fast programming time for 1 block (128 bytes) - - 3 3.3 Erase time for 1 block (128 bytes) - - 3 3.3 tprog terase Unit V ms Table 33. Flash program memory Symbol Parameter Condition Min Max Unit TWE Temperature for writing and erasing - -40 150 °C NWE Flash program memory endurance (erase/write cycles)(1) TA = 25 °C 1000 - cycles tRET Data retention time TA = 25 °C 40 - TA = 55 °C 20 - years 1. The physical granularity of the memory is four bytes, so cycling is performed on four bytes even when a write/erase operation addresses a single byte. Table 34. Data memory Symbol Parameter Condition Min Max Unit TWE Temperature for writing and erasing - -40 150 °C NWE Data memory endurance(1) (erase/write cycles) TA = 25 °C 300 k - tRET Data retention time k(2) - TA = 25 °C 40(2)(3) - TA = 55 °C 20(2)(3) - TA = -40°C to 125 °C 100 cycles years 1. The physical granularity of the memory is four bytes, so cycling is performed on four bytes even when a write/erase operation addresses a single byte. 2. More information on the relationship between data retention time and number of write/erase cycles is available in a separate technical document. 3. Retention time for 256B of data memory after up to 1000 cycles at 125 °C. 62/99 DocID14952 Rev 11 STM8AF6246/48/66/68 10.3.6 Electrical characteristics I/O port pin characteristics General characteristics Subject to general operating conditions for VDD and TA unless otherwise specified. All unused pins must be kept at a fixed voltage, using the output mode of the I/O for example or an external pull-up or pull-down resistor. Table 35. I/O static characteristics Symbol Parameter VIL Input low level voltage VIH Input high level voltage Vhys Hysteresis(1) VOH VOL Rpu tR, tF Output high level voltage Output low level voltage Pull-up resistor Rise and fall time (10% - 90%) Ilkg Digital input pad leakage current Ilkg ana Analog input pad leakage current Ilkg(inj) Leakage current in adjacent I/O(3) IDDIO Total current on either VDDIO or VSSIO Conditions Min Typ Max -0.3 V - 0.3 x VDD 0.7 x VDD - VDD + 0.3 V - 0.1 x VDD - Standard I/0, VDD = 5 V, I = 3 mA VDD - 0.5 V - - Standard I/0, VDD = 3 V, I = 1.5 mA VDD - 0.4 V - - High sink and true open drain I/0, VDD = 5 V I = 8 mA - - 0.5 Standard I/0, VDD = 5 V I = 3 mA - - 0.6 Standard I/0, VDD = 3 V I = 1.5 mA - - 0.4 VDD = 5 V, VIN = VSS 35 50 65 Fast I/Os Load = 50 pF - - 35(2) Standard and high sink I/Os Load = 50 pF - - 125(2) Fast I/Os Load = 20 pF - - 20(2) Standard and high sink I/Os Load = 20 pF - - 50(2) VSS ≤VIN ≤VDD - - ±1 VSS ≤ VIN ≤ VDD -40 °C < TA < 125 °C - - ±250 VSS ≤ VIN ≤ VDD -40 °C < TA < 150 °C - - ±500 Injection current ±4 mA - - ±1(3) µA Including injection currents - - 60 mA - Unit V kΩ ns µA nA 1. Hysteresis voltage between Schmitt trigger switching levels. Based on characterization results, not tested in production. DocID14952 Rev 11 63/99 93 Electrical characteristics STM8AF6246/48/66/68 2. Guaranteed by design. 3. Data based on characterization results, not tested in production. Figure 20. Typical VIL and VIH vs VDD @ four temperatures 6 -40°C 25°C 5 85°C VIL / V IH [V] 4 125°C 3 2 1 0 2.5 3 3.5 4 4.5 5 5.5 6 VDD [V] Figure 21. Typical pull-up resistance RPU vs VDD @ four temperatures 60 Pull-Up resistance [k ohm] 55 50 45 -40°C 40 25°C 85°C 35 125°C 30 2.5 3 3.5 4 4.5 VDD [V] 64/99 DocID14952 Rev 11 5 5.5 6 STM8AF6246/48/66/68 Electrical characteristics Figure 22. Typical pull-up current Ipu vs VDD @ four temperatures 140 Pull-Up current [µA] 120 100 80 -40°C 60 25°C 40 85°C 125°C 20 0 0 1 2 3 4 5 6 VDD [V] Note: The pull-up is a pure resistor (slope goes through 0). Typical output level curves Figure 23 to Figure 32 show typical output level curves measured with output on a single pin. Figure 23. Typ. VOL @ VDD = 3.3 V (standard ports) Figure 24. Typ. VOL @ VDD = 5.0 V (standard ports) -40°C 1.5 -40°C 1.5 25°C 25°C 85°C 1.25 85°C 1.25 125°C 125°C 1 VOL [V] VOL [V] 1 0.75 0.75 0.5 0.5 0.25 0.25 0 0 0 1 2 3 4 5 6 7 0 2 4 6 IOL [mA] Figure 25. Typ. VOL @ VDD = 3.3 V (true open drain ports) 25°C 1.75 85°C 125°C 1.5 85°C 125°C 1.5 1.25 1.25 VOL [V] VOL [V] 12 -40°C 2 25°C 1.75 10 Figure 26. Typ. VOL @ VDD = 5.0 V (true open drain ports) -40°C 2 8 IOL [mA] 1 0.75 1 0.75 0.5 0.5 0.25 0.25 0 0 0 2 4 6 8 10 12 14 IOL [mA] 0 5 10 15 20 25 IOL [mA] DocID14952 Rev 11 65/99 93 Electrical characteristics STM8AF6246/48/66/68 Figure 27. Typ. VOL @ VDD = 3.3 V (high sink ports) Figure 28. Typ. VOL @ VDD = 5.0 V (high sink ports) -40°C 1.5 25°C 85°C 1.25 -40°C 1.5 25°C 85°C 1.25 125°C 125°C 1 VOL [V] VOL [V] 1 0.75 0.75 0.5 0.5 0.25 0.25 0 0 0 2 4 6 8 10 12 14 0 5 10 IOL [mA] Figure 29. Typ. VDD - VOH @ VDD = 3.3 V (standard ports) 125°C 85°C 125°C 1.5 1.25 VDD - V OH [V] VDD - V OH [V] 25°C 1.75 85°C 1.5 1 0.75 1.25 1 0.75 0.5 0.5 0.25 0.25 0 0 0 1 2 3 4 5 6 7 0 2 4 6 IOH [mA] 125°C 85°C 125°C 1.5 1.25 VDD - V OH [V] VDD - V OH [V] 25°C 1.75 85°C 1.5 12 -40°C 2 25°C 1.75 10 Figure 32. Typ. VDD - VOH @ VDD = 5.0 V (high sink ports) -40°C 2 8 IOH [mA] Figure 31. Typ. VDD - VOH @ VDD = 3.3 V (high sink ports) 1 0.75 1.25 1 0.75 0.5 0.5 0.25 0.25 0 0 0 2 4 6 8 10 12 14 IOH [mA] 66/99 25 -40°C 2 25°C 1.75 20 Figure 30. Typ. VDD - VOH @ VDD = 5.0 V (standard ports) -40°C 2 15 IOL [mA] 0 5 10 15 IOH [mA] DocID14952 Rev 11 20 25 STM8AF6246/48/66/68 Reset pin characteristics Subject to general operating conditions for VDD and TA unless otherwise specified. Table 36. NRST pin characteristics Symbol Parameter Conditions Min Typ Max VIL(NRST) NRST input low level voltage(1) - VSS - 0.3 x VDD VIH(NRST) NRST input high level voltage(1) - 0.7 x VDD - VDD VOL(NRST) NRST output low level voltage(1) IOL= 3 mA - - 0.6 RPU(NRST) NRST pull-up resistor - 30 40 60 NRST input filtered pulse(1) - 85 - 315 NRST Input not filtered pulse duration(2) - 500 - - tIFP tINFP(NRST) Unit V kΩ ns 1. Data based on characterization results, not tested in production. 2. Data guaranteed by design, not tested in production. Figure 33. Typical NRST VIL and VIH vs VDD @ four temperatures -40°C 6 25°C 85°C 5 125°C 4 VIL / V IH [V] 10.3.7 Electrical characteristics 3 2 1 0 2.5 3 3.5 4 4.5 5 5.5 6 VDD [V] DocID14952 Rev 11 67/99 93 Electrical characteristics STM8AF6246/48/66/68 Figure 34. Typical NRST pull-up resistance RPU vs VDD -40°C 60 NRST Pull-Up resistance [k ohm] 25°C 55 85°C 125°C 50 45 40 35 30 2.5 3 3.5 4 4.5 5 5.5 6 VDD [V] Figure 35. Typical NRST pull-up current Ipu vs VDD 140 NRST Pull-Up current [µA] 120 100 80 60 -40°C 25°C 40 85°C 20 125°C 0 0 1 2 3 VDD [V] 4 5 6 The reset network shown in Figure 36 protects the device against parasitic resets. The user must ensure that the level on the NRST pin can go below VIL(NRST) max (see Table 36: NRST pin characteristics), otherwise the reset is not taken into account internally. Figure 36. Recommended reset pin protection 670$ 9'' 538 ([WHUQDO UHVHW FLUFXLW 1567 )LOWHU ,QWHUQDOUHVHW ȝ) 2SWLRQDO 06Y9 68/99 DocID14952 Rev 11 STM8AF6246/48/66/68 10.3.8 Electrical characteristics TIM 1, 2, 3, and 4 timer specifications Subject to general operating conditions for VDD, fMASTER, and TA unless otherwise specified. Table 37. TIM 1, 2, 3, and 4 electrical specifications Symbol fEXT Parameter Conditions Min Typ Max Unit - - - 16 MHz Timer external clock frequency(1) 1. Not tested in production. On 64 Kbyte devices, the frequency is limited to 16 MHz. SPI serial peripheral interface 10.3.9 Unless otherwise specified, the parameters given in Table 38 are derived from tests performed under ambient temperature, fMASTER frequency and VDD supply voltage conditions. tMASTER = 1/fMASTER. Refer to I/O port characteristics for more details on the input/output alternate function characteristics (NSS, SCK, MOSI, MISO). Table 38. SPI characteristics Symbol Parameter Conditions Master mode fSCK 1/tc(SCK) tr(SCK) tf(SCK) tsu(NSS)(3) th(NSS) (3) SPI clock frequency Slave mode VDD < 4.5 V VDD = 4.5 V to 5.5 V SPI clock rise and fall time Capacitive load: C = 30 pF Min Max 0 10 0 6(1) 0 8(1) - 25(2) NSS setup time Slave mode 4 * tMASTER - NSS hold time Slave mode 70 - tw(SCKH)(3) SCK high and low time tw(SCKL)(3) Master mode 5 - Slave mode 5 - Master mode 7 - Slave mode 10 - ta(SO)(3)(4) Data output access time Slave mode - 3* tMASTER tdis(SO)(3)(5) Data output disable time Slave mode 25 tv(SO)(3) Data output valid time VDD < 4.5 V Slave mode (after enable edge) V = 4.5 V to 5.5 V DD - 75 - 53 tv(MO)(3) Data output valid time Master mode (after enable edge) - 30 Slave mode (after enable edge) 31 - Master mode (after enable edge) 12 - Data input setup time th(MI)(3) th(SI)(3) Data input hold time th(SO)(3) th(MO)(3) Data output hold time MHz tSCK/2 - 15 tSCK/2 + 15 Master mode tsu(MI)(3) tsu(SI)(3) Unit ns 1. fSCK < fMASTER/2. 2. The pad has to be configured accordingly (fast mode). DocID14952 Rev 11 69/99 93 Electrical characteristics STM8AF6246/48/66/68 3. Values based on design simulation and/or characterization results, and not tested in production. 4. Min time is for the minimum time to drive the output and the max time is for the maximum time to validate the data. 5. Min time is for the minimum time to invalidate the output and the max time is for the maximum time to put the data in Hi-Z. Figure 37. SPI timing diagram where slave mode and CPHA = 0 166LQSXW 6&.,QSXW W68166 &3+$  &32/  WK166 WF6&. WZ6&.+ WZ6&./ &3+$  &32/  W962 WD62 0,62 287387 WU6&. WI6&. WK62 06%287 %,7287 06%,1 %,7,1 WGLV62 /6%287 WVX6, 026, ,1387 /6%,1 WK6, DLF 1. Measurement points are at CMOS levels: 0.3 VDD and 0.7 VDD. Figure 38. SPI timing diagram where slave mode and CPHA = 1 166LQSXW 6&.LQSXW W68166 &3+$  &32/  &3+$  &32/  WZ6&.+ WZ6&./ WK62 WY62 WD62 0,62 287387 06%287 %,7287 WU6&. WI6&. WGLV62 /6%287 WK6, WVX6, 026, ,1387 WK166 WF6&. 06%,1 %,7,1 /6%,1 DLE 1. Measurement points are at CMOS levels: 0.3 VDD and 0.7 VDD. 70/99 DocID14952 Rev 11 STM8AF6246/48/66/68 Electrical characteristics Figure 39. SPI timing diagram - master mode +LJK 166LQSXW 6&.2XWSXW &3+$  &32/  6&.2XWSXW WF6&. &3+$  &32/  &3+$  &32/  &3+$  &32/  WVX0, 0,62 ,13 87 WZ6&.+ WZ6&./ WU6&. WI6&. %,7,1 06%,1 /6%,1 WK0, 026, 287387 % , 7287 06%287 WY02 /6%287 WK02 DLF 1. Measurement points are at CMOS levels: 0.3 VDD and 0.7 VDD. DocID14952 Rev 11 71/99 93 Electrical characteristics 10.3.10 STM8AF6246/48/66/68 I2C interface characteristics Table 39. I2C characteristics Standard mode I2C Fast mode I2C(1) Symbol Parameter Unit Min(2) Max(2) Min(2) Max(2) tw(SCLL) SCL clock low time 4.7 - 1.3 - tw(SCLH) SCL clock high time 4.0 - 0.6 - tsu(SDA) SDA setup time 250 - 100 - th(SDA) SDA data hold time 0(3) - 0(4) 900(3) tr(SDA) tr(SCL) SDA and SCL rise time (VDD = 3 to 5.5 V) - 1000 - 300 tf(SDA) tf(SCL) SDA and SCL fall time (VDD = 3 to 5.5 V) - 300 - 300 th(STA) START condition hold time 4.0 - 0.6 - tsu(STA) Repeated START condition setup time 4.7 - 0.6 - tsu(STO) STOP condition setup time 4.0 - 0.6 - STOP to START condition time (bus free) 4.7 - 1.3 - - 400 - 400 tw(STO:STA) Cb Capacitive load for each bus line 1. fMASTER, must be at least 8 MHz to achieve max fast I2C speed (400 kHz) 2. Data based on standard I2C protocol requirement, not tested in production 3. The maximum hold time of the start condition has only to be met if the interface does not stretch the low time 4. The device must internally provide a hold time of at least 300 ns for the SDA signal in order to bridge the undefined region of the falling edge of SCL 72/99 DocID14952 Rev 11 µs ns µs pF STM8AF6246/48/66/68 10.3.11 Electrical characteristics 10-bit ADC characteristics Subject to general operating conditions for VDDA, fMASTER, and TA unless otherwise specified. Table 40. ADC characteristics Symbol Parameter Conditions Min Typ Max Unit kHz/MHz fADC ADC clock frequency - 111 kHz - 4 MHz VDDA Analog supply - 3 - 5.5 VREF+ Positive reference voltage - 2.75 - VDDA VREF- Negative reference voltage - VSSA - 0.5 - VSSA - VDDA Devices with external VREF+/ VREF- pins VREF- - VREF+ - - - 3 fADC = 2 MHz - 1.5 - fADC = 4 MHz - 0.75 - fADC = 2 MHz - 7 - fADC = 4 MHz - 3.5 - fADC = 2 MHz - 7 - fADC = 4 MHz - 3.5 - - - - 30 Conversion voltage range(1) VAIN Csamp Internal sample and hold capacitor tS(1) Sampling time (3 x 1/fADC) tSTAB Wakeup time from standby tCONV Total conversion time including sampling time (14 x 1/fADC) Rswitch Equivalent switch resistance V pF µs kΩ 1. During the sample time, the sampling capacitance, Csamp (3 pF typ), can be charged/discharged by the external source. The internal resistance of the analog source must allow the capacitance to reach its final voltage level within tS. After the end of the sample time tS, changes of the analog input voltage have no effect on the conversion result. Figure 40. Typical application with ADC s 9$,1 5$,1 /Edž ^dDϴ 97 9 5VZLWFK 7V &$,1 97 9 ,/ ELW$' FRQYHUVLRQ &VDPS 06Y9 1. Legend: RAIN = external resistance, CAIN = capacitors, Csamp = internal sample and hold capacitor. DocID14952 Rev 11 73/99 93 Electrical characteristics STM8AF6246/48/66/68 Table 41. ADC accuracy for VDDA = 5 V Symbol Parameter Conditions Typ Max(1) |ET| Total unadjusted error(2) 1.4 3(3) |EO| Offset error(2) 0.8 3 |EG| Gain error(2) 0.1 2 0.9 1 0.7 1.5 |ED| fADC = 2 MHz Differential linearity error(2) (2) |EL| Integral linearity error |ET| Total unadjusted error(2) 1.9(4) 4(4) |EO| Offset error(2) 1.3(4) 4(4) |EG| Gain error(2) 0.6(4) 3(4) |ED| Differential linearity error(2) 1.5(4) 2(4) |EL| Integral linearity error(2) 1.2(4) 1.5(4) fADC = 4 MHz Unit LSB 1. Max value is based on characterization, not tested in production. 2. ADC accuracy vs. injection current: Any positive or negative injection current within the limits specified for IINJ(PIN) and ΣIINJ(PIN) in Section 10.3.6 does not affect the ADC accuracy. 3. TUE 2LSB can be reached on specific sales types on the whole temperature range. 4. Target values. Figure 41. ADC accuracy characteristics 1023 1022 1021 EG V –V DDA SSA 1LSB = ----------------------------------------IDEAL 1024 (2) ET 7 (3) (1) 6 5 4 EO EL 3 ED 2 1 LSBIDEAL 1 0 1 VSSA 2 3 4 5 6 7 1021102210231024 VDDA 1. Example of an actual transfer curve 2. The ideal transfer curve 3. End point correlation line ET = Total unadjusted error: Maximum deviation between the actual and the ideal transfer curves. EO = Offset error: Deviation between the first actual transition and the first ideal one. EG = Gain error: Deviation between the last ideal transition and the last actual one. ED = Differential linearity error: Maximum deviation between actual steps and the ideal one. EL = Integral linearity error: Maximum deviation between any actual transition and the end point correlation line. 74/99 DocID14952 Rev 11 STM8AF6246/48/66/68 10.3.12 Electrical characteristics EMC characteristics Susceptibility tests are performed on a sample basis during product characterization. Functional EMS (electromagnetic susceptibility) While executing a simple application (toggling 2 LEDs through I/O ports), the product is stressed by two electromagnetic events until a failure occurs (indicated by the LEDs). • ESD: Electrostatic discharge (positive and negative) is applied on all pins of the device until a functional disturbance occurs. This test conforms with the IEC 1000-4-2 standard. • FTB: A burst of fast transient voltage (positive and negative) is applied to VDD and VSS through a 100 pF capacitor, until a functional disturbance occurs. This test conforms with the IEC 1000-4-4 standard. A device reset allows normal operations to be resumed. The test results are given in the table below based on the EMS levels and classes defined in application note AN1709. Designing hardened software to avoid noise problems EMC characterization and optimization are performed at component level with a typical application environment and simplified MCU software. It should be noted that good EMC performance is highly dependent on the user application and the software in particular. Therefore it is recommended that the user applies EMC software optimization and prequalification tests in relation with the EMC level requested for his application. Software recommendations The software flowchart must include the management of runaway conditions such as: • Corrupted program counter • Unexpected reset • Critical data corruption (control registers...) Prequalification trials Most of the common failures (unexpected reset and program counter corruption) can be recovered by applying a low state on the NRST pin or the oscillator pins for 1 second. To complete these trials, ESD stress can be applied directly on the device, over the range of specification values. When unexpected behavior is detected, the software can be hardened to prevent unrecoverable errors occurring (see application note AN1015). Table 42. EMS data Symbol Parameter Conditions Level/class VFESD Voltage limits to be applied on any I/O pin to induce a functional disturbance VDD = 3.3 V, TA= 25 °C, fMASTER = 16 MHz (HSI clock), Conforms to IEC 1000-4-2 3/B VEFTB Fast transient voltage burst limits to be applied through 100 pF on VDD and VSS pins to induce a functional disturbance VDD= 3.3 V, TA= 25 °C, fMASTER = 16 MHz (HSI clock), Conforms to IEC 1000-4-4 4/A DocID14952 Rev 11 75/99 93 Electrical characteristics STM8AF6246/48/66/68 Electromagnetic interference (EMI) Emission tests conform to the IEC 61967-2 standard for test software, board layout and pin loading. Table 43. EMI data Conditions Symbol Parameter General conditions SEMI Peak level EMI level VDD = 5 V, TA = 25 °C, LQFP80 package conforming to IEC 61967-2 Monitored frequency band Max fCPU(1) 8 MHz 16 MHz 0.1 MHz to 30 MHz 15 17 30 MHz to 130 MHz 18 22 130 MHz to 1 GHz -1 3 - 2 2.5 Unit dBµV 1. Data based on characterization results, not tested in production. Absolute maximum ratings (electrical sensitivity) Based on two different tests (ESD and LU) using specific measurement methods, the product is stressed to determine its performance in terms of electrical sensitivity. For more details, refer to the application note AN1181. Electrostatic discharge (ESD) Electrostatic discharges (3 positive then 3 negative pulses separated by 1 second) are applied to the pins of each sample according to each pin combination. The sample size depends on the number of supply pins in the device (3 parts*(n+1) supply pin). This test conforms to the JESD22-A114A/A115A standard. For more details, refer to the application note AN1181. Table 44. ESD absolute maximum ratings Symbol Ratings Conditions Class VESD(HBM) Electrostatic discharge voltage (Human body model) TA = 25°C, conforming to JESD22-A114 3A 4000 VESD(CDM) Electrostatic discharge voltage (Charge device model) TA= 25°C, conforming to JESD22-C101 3 500 VESD(MM) Electrostatic discharge voltage (Machine model) TA= 25°C, conforming to JESD22-A115 B 200 1. Data based on characterization results, not tested in production 76/99 Maximum Unit value(1) DocID14952 Rev 11 V STM8AF6246/48/66/68 Electrical characteristics Static latch-up Two complementary static tests are required on 10 parts to assess the latch-up performance. • A supply overvoltage (applied to each power supply pin) and • A current injection (applied to each input, output and configurable I/O pin) are performed on each sample. This test conforms to the EIA/JESD 78 IC latch-up standard. For more details, refer to the application note AN1181. Table 45. Electrical sensitivities Symbol Parameter Conditions Class(1) TA = 25 °C LU TA = 85 °C Static latch-up class TA = 125 °C A TA = 150 °C 1. Class description: A Class is an STMicroelectronics internal specification. All its limits are higher than the JEDEC specifications, that means when a device belongs to class A it exceeds the JEDEC standard. B class strictly covers all the JEDEC criteria (international standard). DocID14952 Rev 11 77/99 93 Package information 11 STM8AF6246/48/66/68 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. 11.1 VFQFPN32 package information Figure 42. VFQFPN32 - 32-pin, 5x5 mm, 0.5 mm pitch very thin profile fine pitch quad flat package outline 6HDWLQJSODQH & GGG & $ $ $ ' H     ( ( E   3LQ,' 5  /  ' %RWWRPYLHZ 1. Drawing is not to scale. 78/99 DocID14952 Rev 11 / ?-%?!-+/2?6 STM8AF6246/48/66/68 Package information Table 46. VFQFPN32 - 32-pin, 5x5 mm, 0.5 mm pitch very thin profile fine pitch quad flat package mechanical data inches(1) millimeters Symbol Min Typ Max Min Typ Max A 0.800 0.900 1.000 0.0315 0.0354 0.0394 A1 0.000 0.020 0.050 0.0000 0.0008 0.0020 A3 - 0.200 - - 0.0079 - b 0.180 0.250 0.300 0.0071 0.0098 0.0118 D 4.850 5.000 5.150 0.1909 0.1969 0.2028 D2 3.500 3.600 3.700 0.1378 0.1417 0.1457 E 4.850 5.000 5.150 0.1909 0.1969 0.2028 E2 3.500 3.600 3.700 0.1378 0.1417 0.1457 e - 0.500 - - 0.0197 - L 0.300 0.400 0.500 0.0118 0.0157 0.0197 ddd - - 0.050 - - 0.0020 1. Values in inches are converted from mm and rounded to 4 decimal digits. DocID14952 Rev 11 79/99 93 Package information STM8AF6246/48/66/68 Figure 43. VFQFPN32 - 32-pin, 5x5 mm, 0.5 mm pitch very thin profile fine pitch quad flat package recommended footprint    9DU$ 9DU%   9DU$ 9DU%     ?&0?!-+/2?6 1. Dimensions are expressed in millimeters. 80/99 DocID14952 Rev 11 STM8AF6246/48/66/68 Package information Device marking The following figure gives an example of topside marking orientation versus pin 1 identifier location. Figure 44. VFQFPN32 marking example (package top view) 3URGXFW  LGHQWLILFDWLRQ 999999 'DWHFRGH : 6WDQGDUG67ORJR 88 5HYLVLRQFRGH 3LQLGHQWLILHU 069 DocID14952 Rev 11 81/99 93 Package information 11.2 STM8AF6246/48/66/68 LQFP48 package information Figure 45. LQFP48 - 48-pin, 7 x 7 mm low-profile quad flat package outline C ! ! ! 3%!4).' 0,!.% # MM '!5'%0,!.% CCC # + ! $ $ , , $      0). )$%.4)&)#!4)/. %    E 1. Drawing is not to scale. 82/99 % % B DocID14952 Rev 11 "?-%?6 STM8AF6246/48/66/68 Package information Table 47. LQFP48 - 48-pin, 7 x 7 mm low-profile quad flat package mechanical data inches(1) millimeters Symbol Min Typ Max Min Typ Max A - - 1.600 - - 0.0630 A1 0.050 - 0.150 0.0020 - 0.0059 A2 1.350 1.400 1.450 0.0531 0.0551 0.0571 b 0.170 0.220 0.270 0.0067 0.0087 0.0106 c 0.090 - 0.200 0.0035 - 0.0079 D 8.800 9.000 9.200 0.3465 0.3543 0.3622 D1 6.800 7.000 7.200 0.2677 0.2756 0.2835 D3 - 5.500 - - 0.2165 - E 8.800 9.000 9.200 0.3465 0.3543 0.3622 E1 6.800 7.000 7.200 0.2677 0.2756 0.2835 E3 - 5.500 - - 0.2165 - e - 0.500 - - 0.0197 - L 0.450 0.600 0.750 0.0177 0.0236 0.0295 L1 - 1.000 - - 0.0394 - k 0° 3.5° 7° 0° 3.5° 7° ccc - - 0.080 - - 0.0031 1. Values in inches are converted from mm and rounded to 4 decimal digits. DocID14952 Rev 11 83/99 93 Package information STM8AF6246/48/66/68 Figure 46. LQFP48 - 48-pin, 7 x 7 mm low-profile quad flat package recommended footprint                    AID 1. Dimensions are expressed in millimeters. Device marking The following figure gives an example of topside marking orientation versus pin 1 identifier location. Figure 47. LQFP48 marking example (package top view) 3URGXFW  LGHQWLILFDWLRQ 999999 999999 'DWHFRGH 6WDQGDUG67ORJR : 88 5HYLVLRQFRGH 3LQLGHQWLILHU 069 84/99 DocID14952 Rev 11 STM8AF6246/48/66/68 LQFP32 package information Figure 48. LQFP32 - 32-pin, 7 x 7 mm low-profile quad flat package outline C ! ! ! 3%!4).' 0,!.% # MM CCC '!5'%0,!.% # + $ ! , $ , $       0). )$%.4)&)#!4)/.  % % % B 11.3 Package information  E 7@.&@7 1. Drawing is not to scale. DocID14952 Rev 11 85/99 93 Package information STM8AF6246/48/66/68 Table 48. LQFP32 - 32-pin, 7 x 7 mm low-profile quad flat package mechanical data inches(1) millimeters Symbol Min Typ Max Min Typ Max A - - 1.600 - - 0.0630 A1 0.050 - 0.150 0.0020 - 0.0059 A2 1.350 1.400 1.450 0.0531 0.0551 0.0571 b 0.300 0.370 0.450 0.0118 0.0146 0.0177 c 0.090 - 0.200 0.0035 - 0.0079 D 8.800 9.000 9.200 0.3465 0.3543 0.3622 D1 6.800 7.000 7.200 0.2677 0.2756 0.2835 D3 - 5.600 - - 0.2205 - E 8.800 9.000 9.200 0.3465 0.3543 0.3622 E1 6.800 7.000 7.200 0.2677 0.2756 0.2835 E3 - 5.600 - - 0.2205 - e - 0.800 - - 0.0315 - L 0.450 0.600 0.750 0.0177 0.0236 0.0295 L1 - 1.000 - - 0.0394 - k 0° 3.5° 7° 0° 3.5° 7° ccc - - 0.100 - - 0.0039 1. Values in inches are converted from mm and rounded to 4 decimal digits. 86/99 DocID14952 Rev 11 STM8AF6246/48/66/68 Package information Figure 49. LQFP32 - 32-pin, 7 x 7 mm low-profile quad flat package recommended footprint                    6?&0?6 1. Dimensions are expressed in millimeters. Device marking The following figure gives an example of topside marking orientation versus pin 1 identifier location. Figure 50. LQFP32 marking example (package top view) 3URGXFW  LGHQWLILFDWLRQ 999999 999999 'DWHFRGH 6WDQGDUG67ORJR : 88 5HYLVLRQFRGH 3LQLGHQWLILHU 069 DocID14952 Rev 11 87/99 93 Package information 11.4 STM8AF6246/48/66/68 Thermal characteristics In case the maximum chip junction temperature (TJmax) specified in Table 21: General operating conditions on page 52 is exceeded, the functionality of the device cannot be guaranteed. TJmax, in degrees Celsius, may be calculated using the following equation: TJmax = TAmax + (PDmax x ΘJA) Where: – TAmax is the maximum ambient temperature in ° C – ΘJA is the package junction-to-ambient thermal resistance in ° C/W – PDmax is the sum of PINTmax and PI/Omax (PDmax = PINTmax + PI/Omax) – PINTmax is the product of IDD and VDD, expressed in Watts. This is the maximum chip internal power. – PI/Omax represents the maximum power dissipation on output pins Where: PI/Omax = Σ (VOL*IOL) + Σ((VDD-VOH)*IOH), taking into account the actual VOL/IOL and VOH/IOH of the I/Os at low and high level in the application. Table 49. Thermal characteristics(1) Symbol Parameter Value Unit ΘJA Thermal resistance junction-ambient LQFP 48 - 7 x 7 mm 57 °C/W ΘJA Thermal resistance junction-ambient LQFP 32 - 7 x 7 mm 59 °C/W ΘJA Thermal resistance junction-ambient VFQFPN32 25 °C/W 1. Thermal resistances are based on JEDEC JESD51-2 with 4-layer PCB in a natural convection environment. 11.4.1 Reference document JESD51-2 integrated circuits thermal test method environment conditions - natural convection (still air). Available from www.jedec.org. 11.4.2 Selecting the product temperature range When ordering the microcontroller, the temperature range is specified in the order code (see Section 12: Ordering information). The following example shows how to calculate the temperature range needed for a given application. 88/99 DocID14952 Rev 11 STM8AF6246/48/66/68 Package information Assuming the following application conditions: Maximum ambient temperature TAmax= 82 °C (measured according to JESD51-2), IDDmax = 14 mA, VDD = 5 V, maximum 20 I/Os used at the same time in output at low level with IOL = 8 mA, VOL= 0.4 V PINTmax = 14 mA x 5 V= 70 mW PIOmax = 20 x 8 mA x 0.4 V = 64 mW This gives: PINTmax = 70 mW and PIOmax 64 mW: PDmax = 70 mW + 64 mW Thus: PDmax = 134 mW. Using the values obtained in Table 49: Thermal characteristics TJmax is calculated as follows: For LQFP64 46 °C/W TJmax = 82 °C + (46 °C/W x 134 mW) = 82 °C + 6 °C = 88 °C This is within the range of the suffix C version parts (-40 < TJ < 125 °C). Parts must be ordered at least with the temperature range suffix C. DocID14952 Rev 11 89/99 93 Ordering information 12 STM8AF6246/48/66/68 Ordering information Figure 51. STM8AF6246/48/66/68 ordering information scheme(1) (2) Example: STM8A F 62 6 6 I T D xxx(3) Y Product class 8-bit automotive microcontroller Program memory type F = Flash + EEPROM P = FASTROM Device family 62 = Silicon rev X and rev W, LIN only Program memory size 4 = 16 Kbyte 6 = 32 Kbyte Pin count 6 = 32 pins 8 = 48 pins HSI accuracy Blank = ± 5 % I = ± 2.5 % Package type T = LQFP U = VFQFPN Temperature range A = -40 to 85 °C C = -40 to 125 °C D = -40 to 150 °C Packing Y = Tray U = Tube X = Tape and reel compliant with EIA 481-C 1. For a list of available options (e.g. memory size, package) and orderable part numbers or for further information on any aspect of this device, please go to www.st.com or contact the nearest ST Sales Office. 2. Parts marked as “ES”, “E” or accompanied by an Engineering Sample notification letter, are not yet qualified and therefore not yet ready to be used in production and any consequences deriving from such usage will not be at ST charge. In no event, ST will be liable for any customer usage of these engineering samples in production. ST Quality has to be contacted prior to any decision to use these Engineering Samples to run qualification activity. 3. Customer specific FASTROM code or custom device configuration. This field shows ‘SSS’ if the device contains a super set silicon, usually equipped with bigger memory and more I/Os. This silicon is supposed to be replaced later by the target silicon. 90/99 DocID14952 Rev 11 STM8AF6246/48/66/68 13 STM8 development tools STM8 development tools Development tools for the STM8A microcontrollers include the • STice emulation system offering tracing and code profiling • STVD high-level language debugger including assembler and visual development environment - seamless integration of third party C compilers. • STVP Flash programming software In addition, the STM8A comes with starter kits, evaluation boards and low-cost in-circuit debugging/programming tools. 13.1 Emulation and in-circuit debugging tools The STM8 tool line includes the STice emulation system offering a complete range of emulation and in-circuit debugging features on a platform that is designed for versatility and cost-effectiveness. In addition, STM8A application development is supported by a low-cost in-circuit debugger/programmer. The STice is the fourth generation of full-featured emulators from STMicroelectronics. It offers new advanced debugging capabilities including tracing, profiling and code coverage analysis to help detect execution bottlenecks and dead code. In addition, STice offers in-circuit debugging and programming of STM8A microcontrollers via the STM8 single wire interface module (SWIM), which allows non-intrusive debugging of an application while it runs on the target microcontroller. For improved cost effectiveness, STice is based on a modular design that allows users to order exactly what they need to meet their development requirements and to adapt their emulation system to support existing and future ST microcontrollers. 13.1.1 STice key features • Program and data trace recording up to 128 K records • Advanced breakpoints with up to 4 levels of conditions • Data breakpoints • Real-time read/write of all device resources during emulation • Occurrence and time profiling and code coverage analysis (new features) • In-circuit debugging/programming via SWIM protocol • 8-bit probe analyzer • 1 input and 2 output triggers • USB 2.0 high speed interface to host PC • Power supply follower managing application voltages between 1.62 to 5.5 V • Modularity that allows users to specify the components they need to meet their development requirements and adapt to future requirements. • Supported by free software tools that include integrated development environment (IDE), programming software interface and assembler for STM8. DocID14952 Rev 11 91/99 93 STM8 development tools 13.2 STM8AF6246/48/66/68 Software tools STM8 development tools are supported by a complete, free software package from STMicroelectronics that includes ST visual develop (STVD) IDE and the ST visual programmer (STVP) software interface. STVD provides seamless integration of the Cosmic and Raisonance C compilers for STM8. 13.2.1 STM8 toolset The STM8 toolset with STVD integrated development environment and STVP programming software is available for free download at www.st.com. This package includes: ST visual develop Full-featured integrated development environment from STMicroelectronics, featuring: • Seamless integration of C and ASM toolsets • Full-featured debugger • Project management • Syntax highlighting editor • Integrated programming interface • Support of advanced emulation features for STice such as code profiling and coverage ST visual programmer (STVP) Easy-to-use, unlimited graphical interface allowing read, write and verification of the STM8A microcontroller Flash memory. STVP also offers project mode for saving programming configurations and automating programming sequences. 13.2.2 C and assembly toolchains Control of C and assembly toolchains is seamlessly integrated into the STVD integrated development environment, making it possible to configure and control the building of the application directly from an easy-to-use graphical interface. Available toolchains include: C compiler for STM8 All compilers are available in free version with a limited code size depending on the compiler. For more information, refer to www.cosmic-software.com, www.raisonance.com, and www.iar.com. STM8 assembler linker Free assembly toolchain included in the STM8 toolset, which allows users to assemble and link the application source code. 92/99 DocID14952 Rev 11 STM8AF6246/48/66/68 13.3 STM8 development tools Programming tools During the development cycle, STice provides in-circuit programming of the STM8A Flash microcontroller on the user application board via the SWIM protocol. Additional tools are used to include a low-cost in-circuit programmer as well as ST socket boards, which provide dedicated programming platforms with sockets for programming the user STM8A. For production environments, programmers will include a complete range of gang and automated programming solutions from third-party tool developers already supplying programmers for the STM8 family. DocID14952 Rev 11 93/99 93 Revision history 14 STM8AF6246/48/66/68 Revision history Table 50. Document revision history Date Revision 22-Aug-2008 1 Initial release 2 Document revised as the following: Updated Features; Updated Table: Device summary; Updated Section: Product line-up; Changed Section: Product overview; Updated Section: Pinouts and pin description; Changed Section: Register map; Updated Section: Interrupt table; Updated Section: Option bytes; Updated Section: Electrical characteristics; Updated Section: Package information; Updated Section: Ordering information; Added Section: STM8 development tools. 3 Adapted Table: STM8AF61xx/62xx (32 Kbyte) microcontroller pin description. Added Section: LIN header error when automatic resynchronization is enabled. 4 Updated title on cover page. Added VFQFPN32 5x 5 mm package. Added STM8AF62xx devices, and modified cover page header to clarify the part numbers covered by the datasheets. Updated Note 1 below Table: Device summary. Updated D temperature range to -40 to 150°C. Content of Section: Product overview reorganized. Renamed Section: Memory and register map, and content merged with Register map section. Renamed BL_EN and NBL_EN, BL and NBL, respectively, in Table: Option bytes. Added Table: Operating lifetime. Added CEXT and PD (power dissipation) in Table: General operating conditions, and Section: VCAP external capacitor. Suffix D maximum junction temperature (TJ) updated in Table: General operating conditions. Update tVDD in Table: Operating conditions at power-up/power-down. Moved Table: Typical peripheral current consumption VDD = 5.0 V to Section: Current consumption for on-chip peripherals and removed IDD(CAN). Updated Section: Ordering information for the devices supported by the datasheet. Updated Section: STM8 development tools. 10-Aug-2009 22-Oct-2009 08-Jul-2010 94/99 Changes DocID14952 Rev 11 STM8AF6246/48/66/68 Revision history Table 50. Document revision history (continued) Date Revision Changes Modified references to reference manual, and Flash programming manual in the whole document. Added reference to AEC Q100 standard on cover page. Renamed timer types as follows: – Auto-reload timer to general purpose timer – Multipurpose timer to advanced control timer – System timer to basic timer Introduced concept of medium density Flash program memory. Updated timer names in Figure: STM8A block diagram. Added TMU brief description in Section: Flash program and data EEPROM, and updated TMU_MAXATT description in Table: Option byte description. 31-Jan-2011 5 Updated clock sources in clock controller features. Changed 16MHZTRIM0 to HSITRIM bit in Section: User trimming. Added Table: Peripheral clock gating bits. Updated Section: Low-power operating modes. Added calibration using TIM3 in Section: Auto-wakeup counter. Added Table: ADC naming and Table: Communication peripheral naming correspondence. Added Note 1 related AIN12 pin in Section: Analog-to-digital converter (ADC) and Table: STM8AF61xx/62xx (32 Kbyte) microcontroller pin description. Updated SPI data rate to 10 Mbit/s or fMASTER/2 in Section: Serial peripheral interface (SPI). Added reset state in Table: Legend/abbreviation. Table: STM8AF61xx/62xx (32 Kbyte) microcontroller pin description: added Note 7 related to PD1/SWIM, modified Note 6, corrected wpu input for PE1 and PE2, and renamed TIMn_CCx and TIMn_NCCx to TIMn_CHx and TIMn_CHxN, respectively. Section: Register map: Replaced tables describing register maps and reset values for nonvolatile memory, global configuration, reset status, clock controller, interrupt controller, timers, communication interfaces, and ADC, by Table: General hardware register map. Added Note 1 for Px_IDR registers in Table: I/O port hardware register map. Updated register reset values for Px_IDR registers. Added SWIM and debug module register map. DocID14952 Rev 11 95/99 98 Revision history STM8AF6246/48/66/68 Table 50. Document revision history (continued) Date 31-Jan-2011 18-Jul-2012 96/99 Revision Changes Renamed Fast Active Halt mode to Active-halt mode with regulator on, and Slow Active Halt mode to Active-halt mode with regulator off. Updated Table: Total current consumption in Halt and Active-halt modes. General conditions for VDD apply, TA = -40 to 55 °C, in particular IDD(FAH) and IDD(SAH) renamed IDD(AH); tWU(FAH) and tWU(SAH) renamed tWU(AH), and temperature condition added. Removed IDD(USART) from Table: Typical peripheral current consumption VDD = 5.0 V. Updated general conditions in Section: Memory characteristics. 5 maximum value in Table: Flash program memory and Modified T (continued) Table: DataWE memory. Update Ilkg ana maximum value for TA ranging from −40 to 150 °C in Table: I/O static characteristics. Added tIFP(NRST) and renamed VF(NRST) tIFP in Table: NRST pin characteristics. Added recommendations concerning NRST pin level above Figure: Recommended reset pin protection, and updated external capacitor value. Added Raisonance compiler in Section: Software tools. Moved know limitations to separate errata sheet. 6 Updated wildcards of document part numbers. Table: Device summary: updated the footnotes to all STM8AF61xx part numbers. Section: Introduction: small text change in first paragraph. Table: STM8AF62xx product line-up: added “P” version for all order codes; updated RAM. Table: STM8AF/H61xx product line-up: added “P” version for all order codes. Figure: STM8A block diagram: updated POR, BOR and WDG; updated LINUART input; added legend. Section: Flash program and data EEPROM: removed non relevant bullet points and added a sentence about the factory programmer. Table: Peripheral clock gating bit assignments in CLK_PCKENR1/2 registers: updated ADC features: updated ADC input range. Table: Memory model for the devices covered in this datasheet: updated 16 Kbyte and 8 Kbyte information. Table: Option bytes: updated factory default setting for NOPT17; added footnote 1. Section: Minimum and maximum values: TA = -40 °C (not 40 °C). Table: General operating conditions: updated VCAP. Table: Total current consumption in Run, Wait and Slow mode General conditions for VDD apply, TA = -40 to 150 °C: updated conditions for IDD(RUN). Table: I/O static characteristics: added new condition and new max values for rise and fall time; updated the footnote. DocID14952 Rev 11 STM8AF6246/48/66/68 Revision history Table 50. Document revision history (continued) Date 18-Jul-2012 Revision Changes Section: Reset pin characteristics: updated text below Figure: Typical NRST pull-up current Ipu vs VDD. Figure: Recommended reset pin protection: updated unit of capacitor. Table: SPI characteristics: updated SCK high and low time conditions and values. Figure: SPI timing diagram - master mode: replaced ‘SCK input’ signals with ‘SCK output’ signals. Updated Table: VFQFPN 32-lead very thin fine pitch quad flat no6 lead package mechanical data, Table: LQFP 48-pin low profile quad (continued) flat package mechanical data, and Table: LQFP 32-pin low profile quad flat package mechanical data. Replaced Figure: LQFP 48-pin low profile quad flat package (7 x 7) and Figure: LQFP 32-pin low profile quad flat package (7 x 7). Added Figure: LQFP 48-pin recommended footprint and Figure: LQFP 32-pin recommended footprint. Figure: Ordering information scheme(1): added footnote 1, added “xxx” and footnote 2, updated example and device family; added FASTROM. Section: C and assembly toolchains: added www.iar.com 04-Apr-2014 7 Updated: – Table: Device summary, – Table: STM8AF62xx product line-up, – Table: STM8AF/H61xx product line-up. – SPI description in Features. – The typical and maximum values for tTEMP reset release delay in Table: Operating conditions at power-up/power-down. – The symbol for NRST Input not filtered pulse duration in Table: NRST pin characteristics – The address and comment of Reset interrupt in Table: STM8A interrupt table. Added the three footnotes to Figure VFQFPN 32-lead very thin fine pitch quad flat no-lead package (5 x 5). 24-Jun-2014 8 Updated Table: HSI oscillator characteristics. Added HSI accuracy and removed temperature range B in Figure: Ordering information scheme(1). 12-Nov-2014 9 Updates in Table: HSI oscillator characteristics (HSI oscillator accuracy (factory calibrated) values) and Figure: Ordering information scheme(1) (changed the value for I). DocID14952 Rev 11 97/99 98 Revision history STM8AF6246/48/66/68 Table 50. Document revision history (continued) Date 98/99 Revision Changes 09-Jun-2015 10 Updated: – the product naming in the document headers and captions, – LIN version in Features and Section 5.9.3: Universal asynchronous receiver/transmitter with LIN support (LINUART). Added: – the third table footnote to Table 22: Operating conditions at powerup/power-down, – Figure 44: VFQFPN32 marking example (package top view), – Figure 47: LQFP48 marking example (package top view), – Figure 50: LQFP32 marking example (package top view), – the note about the parts marked “E” and “ES” below Figure 51: STM8AF6246/48/66/68 ordering information scheme(1) (2), – the standard for EMI characteristics in Table 43: EMI data. Removed the references to STM8AF61xx and STM8AH61xx obsolete products. Moved Section 11.4: Thermal characteristics to Section 11: Package information. 14-Jun-2016 11 Update Table 46: VFQFPN32 - 32-pin, 5x5 mm, 0.5 mm pitch very thin profile fine pitch quad flat package mechanical data DocID14952 Rev 11 STM8AF6246/48/66/68 IMPORTANT NOTICE – PLEASE READ CAREFULLY STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement. Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers’ products. No license, express or implied, to any intellectual property right is granted by ST herein. Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. ST and the ST logo are trademarks of ST. All other product or service names are the property of their respective owners. Information in this document supersedes and replaces information previously supplied in any prior versions of this document. © 2016 STMicroelectronics – All rights reserved DocID14952 Rev 11 99/99 99