STPS1045B-TR

STPS1045B Power Schottky rectifier Datasheet  production data Description High voltage Schottky rectifier suited for switch mode power supply and other power converters. $ Packaged in DPAK, this device is intended for use in high frequency circuitries where low switching losses is required. . $ . . Table 1. Device summary Symbol Value IF(AV) 10 A VRRM 45 V Tj 175 °C VF(typ) 0.50 V $ $ $ $ '3$. Features  Very small conduction losses  Extremely fast switching  Low thermal resistance  Negligible switching losses  Low forward voltage drop  Low capacitance  Avalanche specification  ECOPACK®2 compliant component for DPAK on demand October 2016 This is information on a product in full production. DocID6085 Rev 9 1/8 www.st.com 8 Characteristics 1 STPS1045B Characteristics Table 2. Absolute ratings (limiting values, at 25 °C unless otherwise stated) Symbol Parameter Value Unit 45 V 7 A Repetitive peak reverse voltage VRRM IF(RMS) / pin Forward rms current IF(AV) Average forward current, δ 0.5, square wave Tc = 150 °C 10 A IFSM Surge non repetitive forward current tp = 10 ms sinusoidal 75 A PARM Repetitive peak avalanche power tp = 10 s, Tj = 125 °C 285 W -65 to +175 °C 175 °C Storage temperature range Tstg Tj 1. Maximum operating junction 1 dPtot < Rth(j-a) dTj temperature(1) condition to avoid thermal runaway for a diode on its own heatsink Table 3. Thermal resistance Symbol Rth(j-c) Parameter Max. value Unit 3 °C/W Junction to case Table 4. Static electrical characteristics Symbol Parameter Test conditions IR (1) Reverse leakage current Tj = 25 °C Tj = 125 °C Tj = 25 °C VF(2) Forward voltage drop Tj = 125 °C Tj = 25 °C Tj = 125 °C Min. - VR = VRRM - - Unit 100 A 15 mA 0.50 0.57 V IF = 20 A - To evaluate the conduction losses, use the following equation: DocID6085 Rev 9 Max. 0.63 - 2. Pulse test: tp = 380 µs,  < 2% 2/8 7 IF = 10 A 1. Pulse test: tp = 5 ms,  < 2% P = 0.42 x IF(AV) + 0.015 x IF2(RMS) Typ. 0.84 0.65 0.72 STPS1045B Characteristics Figure 1. Average forward power dissipation versus average forward current Figure 2. Average forward current versus ambient temperature (δ= 0.5) ,)$9 $ 3)$9 :  į  į   į   į  5WKMD 5WKMF     į   5WKMD ƒ&:    7  5WKMD ƒ&:   į WS7             WS       Figure 3. Normalized avalanche power derating versus pulse duration at Tj = 125 °C       7DPEƒ& , )$9 $ 3$50 W S  3$50 —V Figure 4. Relative variation of thermal impedance junction to case versus pulse duration = WKMF 5WKMF     į   į   7  į    (     W S —V į W 37 6LQJOHSXOVH (   (  (  W3 (  WSV Figure 5. Reverse leakage current versus reverse voltage applied (typical values) Figure 6. Junction capacitance versus reverse voltage applied (typical values) ,5—$ &S) (  ) 0+] 926& P9506 7M ƒ& 7M ƒ& ( 7M ƒ&  7M ƒ& ( 7M ƒ& ( 7M ƒ& (  7M ƒ& ( (             959 959 DocID6085 Rev 9 3/8 Characteristics STPS1045B Figure 7. Forward voltage drop versus forward current Figure 8. Thermal resistance junction to ambient versus copper surface under tab , ) $ 5WKMDƒ&:   7M ƒ& PD[LPXPYDOXHV  (SR[\SULQWHGERDUG)5FRSSHUWKLFNQHVV —P  7M ƒ& W\SLFDOYDOXHV '3$.     7M ƒ& PD[LPXPYDOXHV          4/8     6FXFPð 9 ) 9 DocID6085 Rev 9     STPS1045B 2 Package Information Package Information  Epoxy meets UL94,V0  Cooling method: by conduction (C) In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. 2.1 DPAK package information Figure 9. DPAK package outline ( $ E F 7KHUPDOSDG ( / ' ' 5 + / $ E H H 5 F $ / /  Note: 9 *DXJH SODQH This package drawing may slightly differ from the physical package. However, all the specified dimensions are guaranteed. DocID6085 Rev 9 5/8 Package Information STPS1045B Table 5. DPAK package mechanical data Dimensions Ref. Millimeters Min. Typ. Inches Max. Min. Typ. Max. A 2.18 2.40 0.085 0.094 A1 0.90 1.10 0.035 0.043 A2 0.03 0.23 0.001 0.009 b 0.64 0.90 0.025 0.035 b4 4.95 5.46 0.194 0.214 c 0.46 0.61 0.018 0.024 c2 0.46 0.60 0.018 0.023 D 5.97 6.22 0.235 0.244 D1 4.95 5.60 0.194 0.220 E 6.35 6.73 0.250 0.264 E1 4.32 5.50 0.170 0.216 e 2.28 0.090 e1 4.40 4.70 0.173 0.185 H 9.35 10.40 0.368 0.409 L 1.00 1.78 0.039 0.070 L2 1.27 0.050 L4 0.60 1.02 0.023 0.040 V2 -8° +8° -8° 8° Figure 10. DPAK footprint dimensions (in mm)      % 7KHGHYLFHPXVWEHSRVLWLRQHGZLWKLQ 6/8 DocID6085 Rev 9   $ % $ STPS1045B 3 Ordering information Ordering information Table 6. Ordering information Order code Marking STPS1045B S10 45 STPS1045B-TR 4 Package Weight DPAK 0.30 g S10 45 Base qty Delivery mode 75 Tube 2500 Tape and reel Revision history Table 7. Document revision history Date Revision Changes Jul-2003 3B 21-Apr-2005 4 IPAK package removed 03-Nov-2005 5 DPAK foot print dimensions updated. 01-Jul-2010 6 Updated Figure 10 Updated ECOPACK statement. 04-Nov-2014 7 Updated DPAK package information, Table 2 and Figure 5. Removed PARM (Tj = 25 °C). 07-Apr-2015 8 Updated Table 2. Format update to current standard. 05-Oct-2016 9 Updated DPAK package information. Last issue DocID6085 Rev 9 7/8 STPS1045B IMPORTANT NOTICE – PLEASE READ CAREFULLY STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement. Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers’ products. No license, express or implied, to any intellectual property right is granted by ST herein. Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. ST and the ST logo are trademarks of ST. All other product or service names are the property of their respective owners. Information in this document supersedes and replaces information previously supplied in any prior versions of this document. © 2016 STMicroelectronics – All rights reserved 8/8 DocID6085 Rev 9