STPS1150AY

STPS1150-Y Datasheet Automotive power Schottky rectifier Features K A A K SMA • • • • • • AEC-Q101 qualified Negligible switching losses Low forward voltage drop for higher efficiency and extended battery life Low thermal resistance Surface mount miniature package Avalanche capability specified • • ECOPACK®2 compliant component PPAP capable Description This 150 V power Schottky rectifier is ideal for switch mode power supplies on up to 24 V rails and high frequency converters. Packaged in SMA, the STPS1150-Y is intended for use in ECU (Engine Control Unit) and fly-back converters in automotive applications where low drop forward voltage is required to reduce power dissipation. Product status STPS1150-Y Product summary Symbol Values IF(AV) 1A VRRM 150 V Tj (max) 175 °C VF(max) 0.67 V DS7258 - Rev 3 - April 2018 For further information contact your local STMicroelectronics sales office. www.st.com STPS1150-Y Characteristics 1 Characteristics Table 1. Absolute ratings (limiting values, at 25 °C unless otherwise specified) Symbol Parameter Value Unit VRRM Repetitive peak reverse voltage, Tj = -40 °C to +175 °C 150 V IF(RMS) Forward rms current 15 A IF(AV) Average forward current TL = 150 °C, δ = 0.5 square wave 1 A IFSM Surge non repetitive forward current tp = 10 ms sinusoidal 50 A PARM Repetitive peak avalanche power tp = 10 µs, Tj = 125 °C 108 W Storage temperature range -65 to +175 °C Operating junction temperature range(1) -40 to +175 °C Tstg Tj 1. (dPtot/dTj) < (1/Rth(j-a)) condition to avoid thermal runaway for a diode on its own heatsink. Table 2. Thermal resistance parameters Symbol Rth(j-l) Parameter Max. value Unit 30 °C/W Junction to lead Table 3. Static electrical characteristics Symbol IR(1) Parameter Reverse leakage current Test conditions Tj = 25 °C Tj = 125 °C Tj = 25 °C VF(2) Forward voltage drop Tj = 125 °C Tj = 25 °C Tj = 125 °C VR = VRRM IF = 1 A IF = 2 A Min. Typ. Max. Unit - 0.2 1.0 µA - 0.2 1.0 mA - 0.78 0.82 - 0.62 0.67 - 0.85 0.89 - 0.69 0.75 V 1. tp = 5 ms, δ < 2% 2. tp = 380 μs, δ < 2% To evaluate the conduction losses, use the following equation: P = 0.59 x IF(AV) + 0.08 x IF2(RMS) DS7258 - Rev 3 page 2/9 STPS1150-Y Characteristics (curves) 1.1 Characteristics (curves) Figure 1. Average forward power dissipation versus average forward current PF(AV)( W) Figure 2. Average forward current versus ambient temperature (δ = 0.5) 1.2 0.9 δ = 0.1 0.8 δ = 0.2 IF(AV)( A) δ = 0.5 Rth(j-a) = Rth(j-l) 1.0 δ = 0.05 0.7 0.8 δ =1 0.6 0.5 0.6 0.4 0.4 0.3 T 0.2 T 0.2 0.1 IF(AV)(A) δ =tp/T tp δ 0.0 0.2 0.4 0.6 0.8 1.0 0 1.2 Figure 3. Normalized avalanche power derating versus pulse duration (Tj = 125 °C) 1 = tp/ T PARM (t p ) PARM (10 µs) Tamb (°C) tp 0.0 0.0 2 5 50 75 100 125 150 175 Figure 4. Relative variation of thermal impedance junction to ambient versus pulse duration 1.0 Zth(j-a)/ Rth(j-a) SMA 0.9 0.8 0.7 0.1 0.6 0.5 0.4 0.01 0.3 Single pulse 0.2 t p(µs) 0.1 0.001 1 10 100 0.0 1.E-02 1000 Figure 5. Reverse leakage current versus reverse voltage applied (typical values) t p( s) 1.E-01 1.E+00 1.E+01 1.E+02 1.E+03 Figure 6. Junction capacitance versus reverse voltage applied (typical values) IR(µA) C(pF) 1.E+ 04 100 1.E+ 03 F = 1 MHz VOSC = 30mVRMS Tj = 25 °C Tj =150°C Tj =125°C 1.E+ 02 Tj =100°C 1.E+ 01 Tj =75°C 1.E+ 00 10 Tj =50°C 1.E- 01 Tj =25°C 1.E- 02 VR(V) VR ( V) 1 1.E- 03 0 DS7258 - Rev 3 25 50 75 100 125 150 1 10 100 1000 page 3/9 STPS1150-Y Characteristics (curves) Figure 7. Forward voltage drop versus forward current Figure 8. Thermal resistance junction to ambient versus copper surface under each lead (SMA) IFM(A) 3.0 200 2.5 Rth(j-a) (°C/W) Epoxy printed circuit copper thickness = 35 µm Tj =125°C (maximum values) 150 2.0 1.5 Tj =125°C (typical values) 100 1.0 Tj =25°C (maximum values) 0.5 50 VFM ( V) 0.0 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 SCu (cm²) 0 0.0 DS7258 - Rev 3 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 page 4/9 STPS1150-Y Package information 2 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. 2.1 SMA package information • • Band shows cathode Epoxy meets UL94, V0 Figure 9. SMA package outline E1 D E A1 C L A2 b Table 4. SMA package mechanical data Dimensions Ref. DS7258 - Rev 3 Millimeters Inches Min. Max. Min. Max. A1 1.90 2.45 0.075 0.097 A2 0.05 0.20 0.002 0.008 b 1.25 1.65 0.049 0.065 c 0.15 0.40 0.006 0.016 D 2.25 2.90 0.089 0.114 E 4.80 5.35 0.189 0.211 E1 3.95 4.60 0.156 0.181 L 0.75 1.50 0.030 0.059 page 5/9 STPS1150-Y SMA package information Figure 10. SMA recommended footprint in mm (inches) 1.4 2.63 1.4 (0.055) (0.104) (0.055) 1.64 (0.065) 5.43 (0.214) DS7258 - Rev 3 page 6/9 STPS1150-Y Ordering Information 3 Ordering Information Table 5. Ordering information DS7258 - Rev 3 Order code Marking Package Weight Base qty. Delivery mode STPS1150AY 1150Y SMA 0.068 g 5000 Tape and reel page 7/9 STPS1150-Y Revision history Table 6. Document revision history Date Version 02-Nov-2011 1 Initial release. 02-May-2012 2 Updated Table 3. 3 Updated Figure 3. Normalized avalanche power derating versus pulse duration (Tj = 125 °C), Table 2. Thermal resistance parameters and Table 1. Absolute ratings (limiting values, at 25 °C unless otherwise specified). 16-Apr-2018 Changes Removed figure 4 and figure 5. DS7258 - Rev 3 page 8/9 STPS1150-Y IMPORTANT NOTICE – PLEASE READ CAREFULLY STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement. Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers’ products. No license, express or implied, to any intellectual property right is granted by ST herein. Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. ST and the ST logo are trademarks of ST. All other product or service names are the property of their respective owners. Information in this document supersedes and replaces information previously supplied in any prior versions of this document. © 2018 STMicroelectronics – All rights reserved DS7258 - Rev 3 page 9/9