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STPS2545CTY

STPS2545CTY

  • 厂商:

    STMICROELECTRONICS(意法半导体)

  • 封装:

    TO-220-3

  • 描述:

    Diode Array 1 Pair Common Cathode Schottky 45V 12.5A Through Hole TO-220-3

  • 数据手册
  • 价格&库存
STPS2545CTY 数据手册
STPS2545CT-Y Automotive power Schottky rectifier Datasheet − production data Features A1 ■ Very small conduction losses ■ Negligible switching losses ■ Extremely fast switching ■ Low thermal resistance ■ Avalanche capability specified ■ AEC-Q101 qualified K A2 A2 A1 Description TO-220AB Dual center tab Schottky rectifier suited for switch mode power supplies and high frequency DC to DC converters. Table 1. This device is especially intended for use in low voltage, high frequency inverters, free-wheeling and polarity protection in automotive applications. June 2012 This is information on a product in full production. K Doc ID 18183 Rev 2 Device summary Symbol Value IF(AV) 2 x 12.5 A VRRM 45 V Tj (max) 175 °C VF(max) 0.57 V 1/7 www.st.com 7 Characteristics 1 STPS2545CT-Y Characteristics Table 2. Absolute ratings (limiting values, per diode) Symbol Value Unit VRRM Repetitive peak reverse voltage 45 V IF(RMS) Forward rms current 30 A 12.5 A IF(AV) Average forward current δ = 0.5 Tc = 160 °C IFSM Surge non repetitive forward current tp = 10 ms sinusoidal 200 A PARM Repetitive peak avalanche power tp = 1 µs, Tj = 25 °C 4800 W -65 to + 175 °C -40 to + 175 °C 10000 V/µs Value Unit 1.6 °C/W 0.6 °C/W Tstg Tj dV/dt 1. Parameter Per diode Storage temperature range Operating junction temperature range(1) Critical rate of rise reverse voltage 1 dPtot < condition to avoid thermal runaway for a diode on its own heatsink. Rth(j-a) dTj Table 3. Thermal resistances parameters Symbol Parameter Rth (j-c) Junction to case Rth (c) Coupling Per diode When the diodes 1 and 2 are used simultaneously: ΔTj(diode 1) = P(diode 1) x Rth(j-c)(per diode) + P(diode 2) x Rth(c) Table 4. Symbol IR (1) VF (1) Static electrical characteristics (per diode) Parameter Reverse leakage current Forward voltage drop Tests conditions Tj = 25 °C Tj = 125 °C Min. VR = VRRM Tj = 125 °C IF = 12.5 A Tj = 25 °C IF = 25 A Tj = 125 °C IF = 25 A 1. Pulse test: tp = 380 µs, δ < 2% To evaluate the conduction losses use the following equation: P = 0.42 x IF(AV) + 0.012 x IF2(RMS) 2/7 Doc ID 18183 Rev 2 Typ. Max. Unit 125 µA 9 25 mA 0.50 0.57 0.84 0.65 0.72 V STPS2545CT-Y Figure 1. Characteristics Conduction losses versus average Figure 2. current Average forward current versus ambient temperature (δ = 0.5) IF(AV)(A) PF(AV)(W) 14 10 δ = 0.05 δ = 0.1 9 δ = 0.2 δ = 0.5 Rth(j-a)=Rth(j-c) 12 8 10 δ=1 7 6 8 5 6 4 Rth(j-a)=50°C/W 3 4 T 2 T 2 1 IF(AV)(A) δ=tp/T 0 0.0 2.5 Figure 3. 5.0 7.5 10.0 δ=tp/T tp 0 12.5 15.0 Normalized avalanche power derating versus pulse duration 0 Tamb(°C) tp 25 Figure 4. 50 75 100 125 150 175 Normalized avalanche power derating versus junction temperature PARM(Tj) PARM(25 °C) PARM(tp) PARM(1 µs) 1.2 1 1 0.8 0.1 0.6 0.4 0.01 0.2 Tj(°C) tp(µs) 0.001 0.01 0.1 Figure 5. 1 0 10 100 1000 Non repetitive surge peak forward current versus overload duration (maximum values) 25 50 Figure 6. IM(A) 75 100 125 150 Relative variation of thermal impedance junction to case versus pulse duration Zth(j-c) / Rth(j-c) 200 1.0 180 0.9 160 0.8 140 0.7 120 TC=25°C 100 TC=75°C 80 0.6 δ = 0.5 0.5 0.4 δ = 0.2 60 0.3 δ = 0.1 40 0.2 TC=125°C IM 20 0 1.E-03 T Single pulse 0.1 t(s) t δ=0.5 1.E-02 1.E-01 1.E+00 0.0 1.E-03 Doc ID 18183 Rev 2 tP(s) 1.E-02 δ=tp/T 1.E-01 tp 1.E+00 3/7 Characteristics Figure 7. STPS2545CT-Y Reverse leakage current versus reverse voltage applied (typical values) Figure 8. IR(mA) Junction capacitance versus reverse voltage applied (typical values) C(nF) 1.E+02 10.0 F=1MHz Vosc=30mV Tj=25°C Tj=150°C 1.E+01 Tj=125°C Tj=100°C 1.E+00 1.0 Tj=75°C 1.E-01 Tj=50°C 1.E-02 Tj=25°C VR(V) VR(V) 0.1 1.E-03 0 5 Figure 9. 10 15 20 25 30 35 40 1 45 Forward voltage drop versus forward current 10 100 Figure 10. Thermal resistance junction to ambient versus copper surface under tab Rth(j-a)(°C/W) IFM(A) 80 100 Epoxy printed circuit board FR4, copper thickness = 35 µm 70 Tj=125°C (Maximum values) 60 Tj=125°C (Typical values) 50 Tj=25°C (Maximum values) 10 40 30 20 10 S(cm²) VFM(V) 1 0 0.0 4/7 0.2 0.4 0.6 0.8 1.0 1.2 1.4 0 Doc ID 18183 Rev 2 5 10 15 20 25 30 35 40 STPS2545CT-Y 2 Package information Package information ● Epoxy meets UL94, V0 ● Lead-free package In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. Table 5. TO-220AB dimensions Dimensions Ref. Dia Min. Max. Min. Max. A 4.40 4.60 0.173 0.181 C 1.23 1.32 0.048 0.051 D 2.40 2.72 0.094 0.107 E 0.49 0.70 0.019 0.027 F 0.61 0.88 0.024 0.034 F1 1.14 1.70 0.044 0.066 F2 1.14 1.70 0.044 0.066 G 4.95 5.15 0.194 0.202 G1 2.40 2.70 0.094 0.106 H2 10 10.40 0.393 0.409 C L5 L7 L6 L2 F2 D L9 L4 L2 F M G1 Inches A H2 F1 Millimeters 16.4 typ. 0.645 typ. L4 13 14 0.511 0.551 L5 2.65 2.95 0.104 0.116 L6 15.25 15.75 0.600 0.620 L7 6.20 6.60 0.244 0.259 L9 3.50 3.93 0.137 0.154 E G M Diam. Note: 2.6 typ. 3.75 3.85 0.102 typ. 0.147 0.151 Leads are raw copper on all exposed areas before plating finishing. Doc ID 18183 Rev 2 5/7 Ordering information 3 Ordering information Table 6. 4 Ordering information Order code Marking Package Weight Base qty Delivery mode STPS2545CTY STPS2545CTY TO-220AB 1.9 g 50 Tube Revision history Table 7. 6/7 STPS2545CT-Y Document revision history Date Revision Changes 19-Sep-2011 1 First issue. 28-Jun-2012 2 Corrected typographical error in Table 3. Doc ID 18183 Rev 2 STPS2545CT-Y Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such third party products or services or any intellectual property contained therein. UNLESS OTHERWISE SET FORTH IN ST’S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. UNLESS EXPRESSLY APPROVED IN WRITING BY TWO AUTHORIZED ST REPRESENTATIVES, ST PRODUCTS ARE NOT RECOMMENDED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY, DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. ST PRODUCTS WHICH ARE NOT SPECIFIED AS "AUTOMOTIVE GRADE" MAY ONLY BE USED IN AUTOMOTIVE APPLICATIONS AT USER’S OWN RISK. Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any liability of ST. ST and the ST logo are trademarks or registered trademarks of ST in various countries. Information in this document supersedes and replaces all information previously supplied. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners. © 2012 STMicroelectronics - All rights reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Philippines - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America www.st.com Doc ID 18183 Rev 2 7/7
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