STPS2H100
Datasheet
100 V, 2 A power Schottky rectifier
Features
•
•
•
•
•
•
Negligible switching losses
High junction temperature capability
Low leakage current
Good trade-off between leakage current and forward voltage drop
Avalanche capability specified
ECOPACK2 component
Applications
•
•
•
•
•
•
Switching diode
Battery charger
SMPS
DC / DC converter
Telecom power
LED lighting
Description
This Schottky rectifier is designed for high frequency miniature switched mode power
supplies such as adaptors and on board DC/DC converters.
Product status link
Packaged in SMA, SMA Flat, SMB, SMB Flat and SMA Flat Notch, the STPS2H100
is ideal for use in lighting and telecom power applications.
STPS2H100
Product summary
Symbol
Value
IF(AV)
2A
VRRM
100 V
Tj (max.)
175 °C
VF (max.)
0.65 V
DS1452 - Rev 10 - October 2019
For further information contact your local STMicroelectronics sales office.
www.st.com
STPS2H100
Characteristics
1
Characteristics
Table 1. Absolute ratings (limiting values at 25 °C, unless otherwise specified)
Symbol
VRRM
IF(AV)
Parameter
Value
Unit
100
V
2
A
Repetitive peak reverse voltage
Average forward current
SMA
Tl = 130 °C, δ = 0.5
SMB
Tl = 135 °C, δ = 0.5
SMA Flat, SMA Flat Notch
Tl = 145 °C, δ = 0.5
SMB Flat
Tl = 150 °C, δ = 0.5
IFSM
Surge non repetitive forward current
tp = 10 ms sinusoidal
75
A
PARM
Repetitive peak avalanche power
tp = 10 µs, Tj = 125 °C
173
W
-65 to +175
°C
175
°C
Tstg
Tj
Storage temperature range
Maximum operating junction temperature(1)
1. (dPtot/dTj) < (1/Rth(j-a)) condition to avoid thermal runaway for a diode on its own heatsink.
Table 2. Thermal resistance parameters
Symbol
Rth(j-l)
Parameter
Junction to lead
Max. value
SMA
30
SMA Flat, SMA Flat Notch
20
SMB
25
SMB Flat
15
Unit
°C/W
For more information, please refer to the following application note :
•
AN5088 : Rectifiers thermal management, handling and mounting recommendations
Table 3. Static electrical characteristics
Symbol
IR(1)
Parameter
Reverse leakage current
Test conditions
Tj = 25 °C
Tj = 125 °C
Tj = 25 °C
VF(2)
Forward voltage drop
Tj = 125 °C
Tj = 25 °C
Tj = 125 °C
VR = VRRM
IF = 2 A
IF = 4 A
Min.
Typ.
-
0.40
-
Unit
1.00
µA
1.00
mA
0.79
0.60
-
Max.
0.65
0.88
0.69
V
0.74
1. Pulse test: tp = 5 ms, δ < 2%
2. Pulse test: tp = 380 µs, δ < 2%
To evaluate the conduction losses, use the following equation:
P = 0.56 x IF(AV) + 0.045 x IF2(RMS)
DS1452 - Rev 10
page 2/19
STPS2H100
Characteristics (curves)
For more information, please refer to the following application notes related to the power losses :
•
AN604: Calculation of conduction losses in a power rectifier
•
AN4021: Calculation of reverse losses on a power diode
1.1
Characteristics (curves)
Figure 1. Average forward power dissipation versus
average forward current
1.7
1.6
1.5
1.4
1.3
1.2
1.1
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.0
Figure 2. Average forward current versus ambient
temperature (δ = 0.5, SMA / SMB)
IF(AV)(A)
PF(AV)( W)
δ = 0.1
δ = 0.05
δ = 0.2
2.2
δ = 0.5
Rth(j-a) =Rt h(j-I)
2.0
SMB
1.8
SMA
1.6
δ= 1
SMA
Rth(j-a) = 100°C/W
S(CU) = 1.5cm2
1.4
1.2
SMB
Rth(j-a) = 80°C/W
S(CU) = 1.5cm2
1.0
0.8
0.6
T
IF(AV) (A)
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
0.2
tp
δ=tp/T
2.0
0
2.2
IF(AV)(A)
2.0
2.0
1.8
1.8
1.6
1.6
1.4
1.4
1.2
25
50
75
)
100
125
150
175
Figure 4. Average forward current versus ambient
temperature (δ = 0.5, SMA Flat, SMA Flat Notch)
2.2
Rth(j-a)= Rth(j-l)
Tamb (°C
tp
δ =tp/T
0.0
Figure 3. Average forward current versus ambient
temperature (δ = 0.5, SMB Flat)
2.2
T
0.4
IF(AV)(A)
Rth(j-a)=Rth(j-l)
SMA Flat
SMA Flat Notch
1.2
SMBflat
1.0
1.0
0.8
0.8
Rth(j-a)= 40 °C/W
S CU= 2.5 cm 2
0.6
0.6
T
0.4
0.2
δ=tp/T
0.0
0
DS1452 - Rev 10
25
T
0.4
0.2
Tamb (°C)
tp
δ=tp/T
0.0
50
75
100
125
150
175
0
25
Tamb (°C)
tp
50
75
100
125
150
175
page 3/19
STPS2H100
Characteristics (curves)
Figure 5. Normalized avalanche power derating versus
junction temperature (Tj = 125 °C)
PARM (t p )
PARM (10 µs)
1
Figure 6. Relative variation of thermal impedance junction
to ambient versus pulse duration (SMA)
1.0
Zth(j-a) / Rth(j-a)
SMA
0.9
0.8
0.7
0.1
0.6
0.5
0.4
0.01
0.3
0.2
0.1
t p(µs)
0.001
1
10
100
1000
Single pulse
0.0
1.E-02
t p (s)
1.E-01
1.E+00
1.E+01
1.E+02
1.E+03
Figure 7. Relative variation of thermal impedance junction Figure 8. Relative variation of thermal impedance junction
to lead versus pulse duration (SMA Flat, SMA Flat Notch)
to ambient versus pulse duration (SMB)
1.0
0.9
Zth(j-l) / Rth(j-l)
1.0
0.9
0.8
0.8
0.7
0.7
0.6
0.6
0.5
0.5
0.4
0.4
0.3
0.3
0.2
0.2
Single pulse
0.1
0.1
t p (s)
0.0
1.E-04
1.E-03
1.E-02
1.E-01
1.E+00
1.E+01
Figure 9. Relative variation of thermal impedance junction
to lead versus pulse duration (SMB Flat)
1.0
0.9
Zth(j-a) /Rth(j-a)
SMB
SMA Flat
SMA Flat Notch
Zth(j-l) /Rth(j-l)
Single pulse
0.0
1.E-02
t p (s)
1.E-01
1.E+00
1.E+02
1.E+03
Figure 10. Reverse leakage current versus reverse
voltage applied (typical values)
1.E+04
IR(µA)
SMBflat
1.E+03
0.8
Tj = 150 °C
Tj = 125 °C
0.7
1.E+02
Tj = 100 °C
0.6
1.E+01
0.5
Tj = 75 °C
0.4
Tj = 50 °C
1.E+00
0.3
Tj = 25 °C
0.2
0.1
1.E+01
1.E-01
Single pulse
0.0
1.E-04
DS1452 - Rev 10
t p (s)
1.E-03
1.E-02
VR (V)
1.E-02
1.E-01
1.E+00
1.E+01
0
20
40
60
80
100
page 4/19
STPS2H100
Characteristics (curves)
Figure 11. Junction capacitance versus reverse voltage
applied (typical values)
C(pF)
Figure 12. Forward voltage drop versus forward current
(low level)
IF (A)
2.0
100
F= 1MHz
VOSC= 30mVRMS
Tj = 25°C
1.8
Tj=125°C
(Maximum values)
1.6
1.4
1.2
Tj=125°C
(Typical values)
1.0
0.8
Tj=25°C
(Maximum values)
0.6
0.4
0.2
VR ( V)
1
10
0.0
100
Figure 13. Forward voltage drop versus forward current
(high level)
100
VF (V)
0.0
10
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
1.1
1.2
Figure 14. Thermal resistance junction to ambient versus
copper surface under each lead (SMA)
Rth(j-a) (°C/W)
IF(A)
200
Epoxy printed circuit board FR4, copper thickness: 35 µm
Tj=125°C
(Maximum values)
SMA
150
Tj=125°C
(Typical values)
10
100
50
Tj=25°C
(Maximum values)
S(Cu)(cm²)
VF (V)
1
0.4
0.5
0.6
0.7
0.8
0.9
1.0
1.1
1.2
1.3
1.4
1.5
1.6
1.7
1.8
Figure 15. Thermal resistance junction to ambient versus
copper surface under each lead (SMA Flat, SMA Flat
Notch)
Rth(j-a) (°C/W)
200
0
0.0
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
Figure 16. Thermal resistance junction to ambient versus
copper surface under each lead (SMB)
200
Epoxy printed circuit board FR4, copper thickness: 35 µm
0.5
Rth(j-a) (°C/W)
Epoxy p ri nted ci rcui t board FR4, coppe r t hi ckness: 35 µm
SMA Flat
SMA Flat Notch
SMB
150
150
100
100
50
50
S(Cu)(cm²)
S(Cu)(cm²)
0
0
0.0
0.5
DS1452 - Rev 10
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
page 5/19
STPS2H100
Characteristics (curves)
Figure 17. Thermal resistance junction to ambient versus copper surface under each lead (SMB Flat)
200
Rth(j-a) (°C/W)
SMB-Flat
Epoxy printed circuit board FR4, eCu= 35 µm
150
100
50
SCu (cm²)
0
0.0
DS1452 - Rev 10
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
page 6/19
STPS2H100
Package information
2
Package information
In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages,
depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product
status are available at: www.st.com. ECOPACK is an ST trademark.
2.1
SMA Flat package information
•
•
Epoxy meets UL94, V0
Lead-free package
Figure 18. SMA Flat package outline
A
c
D
L 2x
L1 2 x
E
E1
L
L2 2 x
b
2x
Table 4. SMA Flat package mechanical data
Dimensions
Ref.
Millimeters
Min.
DS1452 - Rev 10
Typ.
Inches (for reference only)
Max.
Min.
Typ.
Max.
A
0.90
1.10
0.035
0.044
b
1.25
1.65
0.049
0.065
c
0.15
0.40
0.005
0.016
D
2.25
2.95
0.088
0.117
E
4.80
5.60
0.188
0.221
E1
3.95
4.60
0.155
0.182
L
0.75
1.50
0.029
0.060
L1
0.50
0.020
L2
0.50
0.020
page 7/19
STPS2H100
SMA Flat package information
Figure 19. SMA Flat recommended footprint in mm (inches)
5.52
(0.217)
1.52
(0.060)
1.20
(0.047)
3.12
(0.123)
1.20
(0.047)
millimeter s
(inches)
DS1452 - Rev 10
page 8/19
STPS2H100
SMA Flat Notch package information
2.2
SMA Flat Notch package information
•
•
•
Epoxy meets UL94, V0
Cooling method: by conduction (C)
Band indicates cathode
Figure 20. SMA Flat Notch package outline
Table 5. SMA Flat Notch package mechanical data
Dimensions
Ref.
Millimeters
Min.
A1
0.90
A1
Max.
Min.
1.10
0.035
0.05
Typ.
Max.
0.044
0.002
b
1.25
1.65
0.049
0.065
C
0.15
0.40
0.005
0.016
D
2.25
2.90
0.088
0.115
E
5.00
5.35
0.196
0.211
E1
3.95
4.60
0.155
0.182
G
2.00
0.079
G1
0.85
0.033
L
DS1452 - Rev 10
Typ.
Inches (for reference only)
0.75
1.20
0.029
L1
0.45
0.018
L2
0.45
0.018
L3
0.05
0.002
V
8°
8°
V1
8°
8°
page 9/19
STPS2H100
SMA Flat Notch package information
Figure 21. SMA Flat Notch recommended footprint in mm (inches)
1.20
(0.047)
3.12
1.20
(0.123)
(0.047)
1.52
(0.060)
5.52
(0.217)
DS1452 - Rev 10
page 10/19
STPS2H100
SMA package information
2.3
SMA package information
•
•
Epoxy meets UL94, V0
Lead-free package
Figure 22. SMA package outline
E1
D
E
A1
C
L
A2
b
Table 6. SMA package mechanical data
Dimensions
Millimeters
Ref.
DS1452 - Rev 10
Inches
Min.
Max.
Min.
Max.
A1
1.90
2.45
0.075
0.097
A2
0.05
0.20
0.002
0.008
b
1.25
1.65
0.049
0.065
c
0.15
0.40
0.006
0.016
D
2.25
2.90
0.089
0.114
E
4.80
5.35
0.189
0.211
E1
3.95
4.60
0.156
0.181
L
0.75
1.50
0.030
0.059
page 11/19
STPS2H100
SMA package information
Figure 23. SMA recommended footprint in mm (inches)
1.4
2.63
1.4
(0.055)
(0.103)
(0.055)
1.64
(0.064)
5.43
(0.214)
DS1452 - Rev 10
page 12/19
STPS2H100
SMB package information
2.4
SMB package information
•
•
Epoxy meets UL94, V0
Lead-free package
Figure 24. SMB package outline
E1
D
E
A1
C
A2
L
b
Table 7. SMB package mechanical data
Dimensions
Ref.
DS1452 - Rev 10
Millimeters
Inches (for reference only)
Min.
Max.
Min.
Max.
A1
1.90
2.45
0.0748
0.0965
A2
0.05
0.20
0.0020
0.0079
b
1.95
2.20
0.0768
0.0867
c
0.15
0.40
0.0059
0.0157
D
3.30
3.95
0.1299
0.1556
E
5.10
5.60
0.2008
0.2205
E1
4.05
4.60
0.1594
0.1811
L
0.75
1.50
0.0295
0.0591
page 13/19
STPS2H100
SMB package information
Figure 25. SMB recommended footprint
1.62
2.60
1.62
(0.064)
(0.102)
(0.064)
2.18
(0.086)
5.84
(0.230)
DS1452 - Rev 10
page 14/19
STPS2H100
SMB Flat package information
2.5
SMB Flat package information
•
•
Epoxy meets UL94, V0
Lead-free package
Figure 26. SMB Flat package outline
A
c
D
L 2x
L1 2 x
E
E1
L2 2 x
b
Table 8. SMB Flat mechanical data
Dimensions
Ref.
Millimeters
Min.
DS1452 - Rev 10
Typ.
Inches (for reference only)
Max.
Min.
Typ.
Max.
A
0.90
1.10
0.035
0.043
b
1.95
2.20
0.077
0.087
c
0.15
0.40
0.006
0.016
D
3.30
3.95
0.130
0.156
E
5.10
5.60
0.201
0.220
E1
4.05
4.60
0.159
0.181
L
0.75
1.50
0.030
0.059
L1
0.40
0.016
L2
0.60
0.024
page 15/19
STPS2H100
SMB Flat package information
Figure 27. Footprint recommendations, dimensions in mm (inches)
1.20
(0.047)
3.44
(0.136)
1.20
(0.047)
2.07
(0.082)
5.84
(0.230)
millimeters
(inches)
DS1452 - Rev 10
page 16/19
STPS2H100
Ordering Information
3
Ordering Information
Table 9. Ordering information
DS1452 - Rev 10
Order code
Marking
Package
Weight
Base qty.
Delivery mode
STPS2H100A
S21
SMA
0.068 g
5000
Tape and reel
STPS2H100AF
F21
SMA Flat
0.035 g
10 000
Tape and reel
STPS2H100AFN
A21
SMA Flat Notch
0.039 g
10 000
Tape and reel
STPS2H100U
G21
SMB
0.107 g
2500
Tape and reel
STPS2H100UF
FG21
SMB Flat
0.050 g
5000
Tape and reel
page 17/19
STPS2H100
Revision history
Table 10. Document revision history
Date
Version
Changes
Jul-2003
4A
Aug-2004
5
SMA package dimensions update. Reference A1 max. changed from 2.70
(0.106 inches) to 2.03 mm (0.080 inches).
08-Feb-2007
6
Reformatted to current standards. Added ECOPACK statement. Added
SMBflat package.
15-Feb-2010
7
Updated weight for SMBflat in Table 9.
24-Jun-2013
8
Added SMAflat package
Last update.
Removed figure 6.
17-May-2018
9
Updated Table 1. Absolute ratings (limiting values at 25 °C, unless otherwise
specified) and Section Description.
Minor text changes to improve readability.
08-Oct-2019
DS1452 - Rev 10
10
Added Section 2.2 SMA Flat Notch package information.
page 18/19
STPS2H100
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DS1452 - Rev 10
page 19/19