STPS2L40UF

STPS2L40 Low drop power Schottky rectifier Main product characteristics A IF(AV) VRRM Tj (max) VF(max) 2A 40 V 150° C 0.34 V K SMB STPS2L40U Features and Benefits ■ ■ ■ ■ ■ Very small conduction losses Negligible switching losses Low forward voltage drop Surface mount miniature package Avalanche capability specified K A SMB flat STPS2L40UF Description Single chip Schottky rectifiers suited to Switched Mode Power Supplies and high frequency DC to DC converters. Packaged in SMB, and low profile SMB, this device is especially intended for surface mounting and used in low voltage, high frequency inverters, free wheeling and polarity protection applications. Table 1. Symbol VRRM IF(AV) IFSM PARM Tstg Tj 1. d Ptot --------------dTj Order codes Part number STPS2L40U STPS2L40UF marking GD4 FGD4 Absolute Ratings (limiting values) Parameter Repetitive peak reverse voltage Average forward current SMB SMB flat TL = 130° C δ = 0.5 TL = 140° C δ = 0.5 tp = 10 ms sinusoidal tp = 1 µs Tj = 25° C Value 40 2 75 2200 -65 to + 150 (1) Unit V A A W °C °C Surge non repetitive forward current Repetitive peak avalanche power Storage temperature range Operating junction temperature 1 ------------------------Rth ( j – a ) 150 < condition to avoid thermal runaway for a diode on its own heatsink February 2007 Rev 3 1/8 www.st.com 8 Characteristics STPS2L40 1 Characteristics Table 2. Symbol Thermal resistances Parameter SMB Junction to lead SMB flat 10 Value 20 ° C/W Unit Rth (j-l) Table 3. Symb ol Static electrical characteristics Tests Conditions Tests Conditions Tj = 25° C Min. Typ. Max. 220 Unit µA mA mA IR (1) Reverse leakage current Tj = 100° C Tj = 125° C Tj = 25° C Tj = 125° C V R = 40 V 38 20 80 0.39 0.25 0.28 IF = 1 A IF = 2 A IF = 4 A V 0.43 0.31 0.34 0.5 V 0.39 0.45 VF(1) Forward voltage drop Tj = 25° C Tj = 125° C Tj = 25° C Tj = 125° C 1. Pulse test: tp = 380 µs, δ < 2 To evaluate the conduction losses use the following equation: P = 0.22 x IF(AV) + 0.06 IF2(RMS) Figure 1. PF(AV)(W) 1.2 2.2 Average forward power dissipation Figure 2. versus average forward current IF(AV)(A) δ = 0.1 δ = 0.2 δ = 0.5 Average forward current versus ambient temperature (δ = 0.5) SMB Rth(j-a)=Rth(j-l) SMB 2.0 1.8 Rth(j-a)=100°C/W 1.0 δ = 0.05 1.6 0.8 δ=1 1.4 1.2 0.6 1.0 0.4 0.8 0.6 T 0.2 0.4 T IF(AV)(A) 0.0 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 δ=tp/T 2.2 2.4 0.2 tp 0.0 2.6 2.8 0 δ=tp/T 25 tp 50 Tamb(°C) 75 100 125 150 2/8 STPS2L40 Characteristics Figure 3. Average forward current versus ambient temperature (δ = 0.5) SMB flat Rth(j-a)=Rth(j-l) Figure 4. Non repetitive surge peak forward current versus overload duration (maximum values) SMB SMB IF(AV)(A) 2.2 2.0 1.8 Rth(j-a)=100°C/W SMB flat IM(A) 12 11 10 9 8 7 6 Ta=25°C 1.6 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0.0 0 Ta=75°C 5 4 T 3 2 IM t Ta=125°C δ=tp/T 25 tp 50 Tamb(°C) 75 100 125 150 1 0 1.E-03 δ=0.5 t(s) 1.E-02 1.E-01 1.E+00 Figure 5. Non repetitive surge peak forward current versus overload duration (maximum values) SMB flat SMB flat (non exposed pad) Figure 6. Normalized avalanche power derating versus pulse duration IM(A) 30 PARM(tp) PARM(1µs) 1 25 20 0.1 15 TL=25°C TL=75°C 10 TL=125°C 0.01 IM t 5 δ=0.5 t(s) 1.E-02 1.E-01 1.E+00 0.001 0.01 0.1 1 tp(µs) 10 100 1000 0 1.E-03 Figure 7. Normalized avalanche power derating versus junction temperature Figure 8. Relative variation of thermal impedance junction to ambient versus pulse duration - SMB PARM(tp) PARM(25°C) 1.2 1 Zth(j-a)/Rth(j-a) 1.0 0.9 0.8 0.7 SMB 0.8 0.6 0.4 0.2 0.6 0.5 0.4 0.3 0.2 T Single pulse Tj(°C) 0 25 50 75 100 125 150 0.1 0.0 1.E-02 1.E-01 1.E+00 tp(s) 1.E+01 δ=tp/T 1.E+02 tp 1.E+03 3/8 Characteristics STPS2L40 Figure 9. Relative variation of thermal impedance junction to lead versus pulse duration - SMB flat Figure 10. Reverse leakage current versus reverse voltage applied (typical values) IR(mA) 1.E+02 Tj=125°C Zth(j-l)/Rth(j-l) 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 Single pulse SMB flat 1.E+01 1.E+00 1.E-01 Tj=25°C T 1.E-02 tp 0.1 0.0 1.E-04 1.E-03 1.E-02 tp(s) 1.E-01 δ=tp/T 1.E+00 VR(V) 1.E-03 0 5 10 15 20 25 30 35 40 1.E+01 Figure 11. Junction capacitance versus reverse voltage applied (typical values) C(pF) 1000 F=1MHz VOSC=30mVRMS Tj=25°C Figure 12. Forward voltage drop versus forward current (high level) IFM(A) 10.0 Tj=125°C (typical values) Tj=125°C (maxmimum values) Tj=25°C (maximum values) 100 1.0 VR(V) 10 1 10 100 0.1 0.0 0.1 0.2 0.3 VFM(V) 0.4 0.5 0.6 0.7 Figure 13. Forward voltage drop versus forward current (low level) Figure 14. Thermal resistance junction to ambient versus copper surface under each lead (epoxy printed board FR4, eCU=35µm) Rth(j-a)(°C/W) 110 100 IFM(A) 3.0 2.5 Tj=125°C (typical values) 90 80 SMB 2.0 Tj=25°C (maximum values) 70 60 50 40 30 SMB flat 1.5 Tj=125°C (maxmimum values) 1.0 0.5 20 VFM(V) 0.0 0.0 0.1 0.2 0.3 0.4 0.5 0.6 10 0 0.0 0.5 1.0 1.5 2.0 SCU(cm²) 2.5 3.0 3.5 4.0 4.5 5.0 4/8 STPS2L40 Package Information 2 Package Information ● Epoxy meets UL94,V0 SMB dimensions Dimensions Ref. E1 Table 4. Millimeters Min. Max. 2.45 0.20 2.20 0.40 5.60 4.60 3.95 1.50 Inches Min. 0.075 0.002 0.077 0.006 0.201 0.159 0.130 0.030 Max. 0.096 0.008 0.087 0.016 0.220 0.181 0.156 0.059 D A1 A2 b 1.90 0.05 1.95 0.15 5.10 4.05 3.30 0.75 E c A1 E E1 b C L A2 D L Figure 15. SMB footprint (dimensions in mm) 1.62 2.60 1.62 2.18 5.84 5/8 Package Information Table 5. SMB Flat dimensions Dimensions Ref. A c D L L2 E E1 L L1 b STPS2L40 Millimeters Min. Typ. Max. Min. 0.035 0.077 0.006 0.130 0.200 0.189 0.029 Inches Typ. Max. 0.043 0.087 0.016 0.156 0.220 0.181 0.059 0.016 0.024 A b(1) c (1) 0.90 1.95 0.15 3.30 5.10 4.05 0.75 0.40 0.60 1.10 2.20 0.40 3.95 5.60 4.60 1.50 D E E1 L L1 L2 1. Applies to plated leads Figure 16. SMB Flat footprint (dimensions in mm) 5.84 2.07 1.20 3.44 1.20 In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a lead-free second level interconnect. The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com. 6/8 STPS2L40 Ordering Information 3 Ordering Information Ordering type STPS2L40U STPS2L40UF Marking GD4 FGD4 Package SMB SMB flat Weight 0.107 g 0.50 g Base qty 2500 5000 Delivery mode Tape and reel Tape and reel 4 Revision history Date Jul-2003 31-Jan-2007 Revision 2A 3 Last update. Reformatted to current standard. Added ECOPACK statement. Added SMB flat package. Description of Changes 7/8 STPS2L40 Please Read Carefully: Information in this document is provided solely in connection with ST products. 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