STPS3H100UF

STPS3H100 Power Schottky rectifier Features ■ Negligible switching losses ■ High junction temperature capability ■ Low leakage current ■ Good trade-off between leakage current and forward voltage drop ■ Avalanche capability specified A A K K SMB STPS3H100U SMB flat STPS3H100UF Description These Schottky rectifiers are designed for high frequency miniature switched mode power supplies such as adaptators and on board DC/DC converters. They are available in SMB, and lowprofile SMB. January 2010 Table 1. Doc ID 16776 Rev 1 Device summary Symbol Value IF(AV) 3A VRRM 100 V Tj (max) 175 °C VF (max) 0.68 V 1/9 www.st.com 9 Characteristics STPS3H100 1 Characteristics Table 2. Absolute ratings (limiting values) Symbol Parameter Value Unit 100 V 3 A VRRM Repetitive peak reverse voltage IF(AV) Average forward current IFSM Surge non repetitive forward current tp =10 ms sinusoidal 75 A PARM Repetitive peak avalanche power tp = 1 µs Tj = 25 °C 2400 W -65 to + 175 °C 175 °C Value Unit Tstg Tj SMB TL = 115 °C δ = 0.5 SMB flat TL = 140 °C δ = 0.5 Storage temperature range Operating junction temperature (1) 1 dPtot < condition to avoid thermal runaway for a diode on its own heatsink Rth(j-a) dTj 1. Table 3. Thermal resistance Symbol Rth(j-l) Table 4. Symbol IR(1) Parameter 25 SMB flat 15 °C/W Static electrical characteristics Parameter Reverse leakage current Test conditions Tj = 25 °C Tj = 125 °C Tj = 25 °C VF(2) SMB Junction to lead Forward voltage drop Tj = 125 °C Tj = 25 °C Tj = 125 °C VR = VRRM IF = 3 A Min. Typ. Max. Unit - - 1 µA - 0.4 1 mA - - 0.84 - 0.63 0.68 - - 0.92 - 0.71 0.76 V IF = 6 A 1. Pulse test: tp = 5 ms, δ < 2% 2. Pulse test: tp = 380 µs, δ < 2% To evaluate the conduction losses use the following equation: P = 0.6 x IF(AV) + 0.027 IF2(RMS) 2/9 Doc ID 16776 Rev 1 STPS3H100 Figure 1. Characteristics Average forward power dissipation Figure 2. versus average forward current Average forward current versus ambient temperature (δ = 0.5) IF(AV)(A) PF(AV)(W) 3.5 2.6 δ=0.05 2.4 δ=0.1 δ=1 δ=0.5 δ=0.2 Rth(j-a)=Rth(j-l) 3.0 2.2 SMB flat 2.0 2.5 1.8 1.6 2.0 1.4 SMB 1.2 1.5 1.0 0.8 1.0 0.6 T T 0.4 0.5 IF(AV)(A) 0.2 δ=tp/T δ=tp/T tp 0.0 Tamb(°C) tp 0.0 0.0 0.5 Figure 3. 1.0 1.5 2.0 2.5 3.0 3.5 Normalized avalanche power derating versus pulse duration 0 25 Figure 4. PARM(tp) PARM(1 µs) 50 75 100 125 150 175 Normalized avalanche power derating versus junction temperature PARM(Tj) PARM(25 °C) 1 1.2 1 0.1 0.8 0.6 0.4 0.01 0.2 Tj(°C) tp(µs) 0.001 0.01 0.1 Figure 5. 1 0 10 100 25 1000 Non repetitive surge peak forward current versus overload duration (maximum values) (SMB) 50 Figure 6. 75 100 125 150 Non repetitive surge peak forward current versus overload duration (maximum values) (SMB flat) IM(A) IM(A) 40 12 SMB flat SMB 11 35 10 30 9 8 Ta=25 °C 7 6 25 20 TL=25 °C 15 TL=75 °C Ta=75 °C 5 4 Ta=125 °C 3 2 1 0 1.E-03 10 TL=125 °C IM IM 5 t t(s) δ =0.5 1.E-02 t(s) t δ =0.5 1.E-01 1.E+00 0 1.E-03 Doc ID 16776 Rev 1 1.E-02 1.E-01 1.E+00 3/9 Characteristics Figure 7. STPS3H100 Relative variation of thermal impedance junction to ambient versus pulse duration (SMB) Figure 8. Zth(j-a)/Rth(j-a) Zth(j-l)/Rth(j-l) 1.0 1.0 SMB flat SMB 0.9 0.9 0.8 0.8 0.7 0.7 0.6 0.6 0.5 0.5 0.4 0.4 0.3 0.3 0.2 0.2 Single pulse 0.1 Single pulse 0.1 tp(s) tp(s) 0.0 0.0 1.E-02 1.E-01 Figure 9. 1.E+04 Relative variation of thermal impedance junction to lead versus pulse duration (SMB flat) 1.E+00 1.E+01 1.E+02 1.E+03 Reverse leakage current versus reverse voltage applied (typical values) 1.E-04 1.E-03 1.E-02 1.E-01 1.E+00 Figure 10. Junction capacitance versus reverse voltage applied (typical values) C(pF) IR(µA) 100 1.E+03 F=1 MHz VOSC=30 mVRMS Tj=25 °C Tj=150 °C Tj=125 °C 1.E+02 Tj=100 °C 1.E+01 Tj=75 °C Tj=50 °C 1.E+00 Tj=25 °C 1.E-01 VR(V) VR(V) 1.E-02 10 0 4/9 20 40 60 80 100 1 Doc ID 16776 Rev 1 10 100 STPS3H100 Characteristics Figure 11. Forward voltage drop versus forward current 6.0 Figure 12. Thermal resistance junction to ambient versus copper surface under each lead (SMB) IFM(A) 110 5.5 Rth(j-a)(°C/W) SMB 100 5.0 90 Tj=125 °C (Maximum values) 4.5 80 4.0 70 3.5 Tj=125 °C (Typical values) 3.0 60 Tj=25 °C (Maximum values) 50 2.5 2.0 40 1.5 30 20 1.0 SCU(cm²) 10 VFM(V) 0.5 0 0.0 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 0.0 1.1 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 Figure 13. Thermal resistance junction to ambient versus copper surface under each lead (SMBflat) Rth(j-a)(°C/W) 110 SMB flat 100 90 80 70 60 50 40 30 20 10 SCU(cm²) 0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 Doc ID 16776 Rev 1 4.0 4.5 5.0 5/9 Package Information 2 STPS3H100 Package Information ● Epoxy meets UL94, V0 ● Lead-free packages In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. Table 5. SMB dimensions Dimensions Ref. Millimeters Inches E1 D Min. Max. Min. Max. A1 1.90 2.45 0.075 0.096 A2 0.05 0.20 0.002 0.008 b 1.95 2.20 0.077 0.087 c 0.15 0.40 0.006 0.016 E 5.10 5.60 0.201 0.220 E1 4.05 4.60 0.159 0.181 D 3.30 3.95 0.130 0.156 L 0.75 1.50 0.030 0.059 E A1 A2 C L b Figure 14. SMB footprint (dimensions in mm) 1.62 2.60 1.62 2.18 5.84 6/9 Doc ID 16776 Rev 1 STPS3H100 Package Information Table 6. SMBflat dimensions Dimensions Ref. Min. A 0.90 1.10 0.035 0.043 b(1) 1.95 2.20 0.077 0.087 (1) 0.15 0.40 0.006 0.016 D 3.30 3.95 0.130 0.156 E 5.10 5.60 0.200 0.220 E1 4.05 4.60 0.189 0.181 L 0.75 1.50 0.029 0.059 c D L2 c E E1 L L1 Inches Min. Typ. Max. A L Millimeters b Typ. L1 0.40 0.016 L2 0.60 0.024 Max. 1. Applies to plated leads Figure 15. SMBflat footprint (dimensions in mm) 5.84 2.07 1.20 3.44 Doc ID 16776 Rev 1 1.20 7/9 Ordering information 3 Ordering information Table 7. 4 Ordering information Order code Marking Package Weight Base qty Delivery mode STPS3H100U G31 SMB 0.107 g 2500 Tape and reel STPS3H100UF FG31 SMBflat 0.050 g 5000 Tape and reel Revision history Table 8. 8/9 STPS3H100 Document revision history Date Revision 15-Jan-2010 1 Changes First issue. Doc ID 16776 Rev 1 STPS3H100 Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. 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