STPS3H100
Power Schottky rectifier
Features
■
Negligible switching losses
■
High junction temperature capability
■
Low leakage current
■
Good trade-off between leakage current and
forward voltage drop
■
Avalanche capability specified
A
A
K
K
SMB
STPS3H100U
SMB flat
STPS3H100UF
Description
These Schottky rectifiers are designed for high
frequency miniature switched mode power
supplies such as adaptators and on board DC/DC
converters. They are available in SMB, and lowprofile SMB.
January 2010
Table 1.
Doc ID 16776 Rev 1
Device summary
Symbol
Value
IF(AV)
3A
VRRM
100 V
Tj (max)
175 °C
VF (max)
0.68 V
1/9
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9
Characteristics
STPS3H100
1
Characteristics
Table 2.
Absolute ratings (limiting values)
Symbol
Parameter
Value
Unit
100
V
3
A
VRRM
Repetitive peak reverse voltage
IF(AV)
Average forward current
IFSM
Surge non repetitive forward current
tp =10 ms sinusoidal
75
A
PARM
Repetitive peak avalanche power
tp = 1 µs Tj = 25 °C
2400
W
-65 to + 175
°C
175
°C
Value
Unit
Tstg
Tj
SMB
TL = 115 °C δ = 0.5
SMB flat
TL = 140 °C δ = 0.5
Storage temperature range
Operating junction temperature
(1)
1
dPtot <
condition to avoid thermal runaway for a diode on its own heatsink
Rth(j-a)
dTj
1.
Table 3.
Thermal resistance
Symbol
Rth(j-l)
Table 4.
Symbol
IR(1)
Parameter
25
SMB flat
15
°C/W
Static electrical characteristics
Parameter
Reverse leakage current
Test conditions
Tj = 25 °C
Tj = 125 °C
Tj = 25 °C
VF(2)
SMB
Junction to lead
Forward voltage drop
Tj = 125 °C
Tj = 25 °C
Tj = 125 °C
VR = VRRM
IF = 3 A
Min.
Typ.
Max.
Unit
-
-
1
µA
-
0.4
1
mA
-
-
0.84
-
0.63
0.68
-
-
0.92
-
0.71
0.76
V
IF = 6 A
1. Pulse test: tp = 5 ms, δ < 2%
2. Pulse test: tp = 380 µs, δ < 2%
To evaluate the conduction losses use the following equation:
P = 0.6 x IF(AV) + 0.027 IF2(RMS)
2/9
Doc ID 16776 Rev 1
STPS3H100
Figure 1.
Characteristics
Average forward power dissipation Figure 2.
versus average forward current
Average forward current versus
ambient temperature (δ = 0.5)
IF(AV)(A)
PF(AV)(W)
3.5
2.6
δ=0.05
2.4
δ=0.1
δ=1
δ=0.5
δ=0.2
Rth(j-a)=Rth(j-l)
3.0
2.2
SMB flat
2.0
2.5
1.8
1.6
2.0
1.4
SMB
1.2
1.5
1.0
0.8
1.0
0.6
T
T
0.4
0.5
IF(AV)(A)
0.2
δ=tp/T
δ=tp/T
tp
0.0
Tamb(°C)
tp
0.0
0.0
0.5
Figure 3.
1.0
1.5
2.0
2.5
3.0
3.5
Normalized avalanche power
derating versus pulse duration
0
25
Figure 4.
PARM(tp)
PARM(1 µs)
50
75
100
125
150
175
Normalized avalanche power
derating versus junction
temperature
PARM(Tj)
PARM(25 °C)
1
1.2
1
0.1
0.8
0.6
0.4
0.01
0.2
Tj(°C)
tp(µs)
0.001
0.01
0.1
Figure 5.
1
0
10
100
25
1000
Non repetitive surge peak forward
current versus overload duration
(maximum values) (SMB)
50
Figure 6.
75
100
125
150
Non repetitive surge peak forward
current versus overload duration
(maximum values) (SMB flat)
IM(A)
IM(A)
40
12
SMB flat
SMB
11
35
10
30
9
8
Ta=25 °C
7
6
25
20
TL=25 °C
15
TL=75 °C
Ta=75 °C
5
4
Ta=125 °C
3
2
1
0
1.E-03
10
TL=125 °C
IM
IM
5
t
t(s)
δ =0.5
1.E-02
t(s)
t
δ =0.5
1.E-01
1.E+00
0
1.E-03
Doc ID 16776 Rev 1
1.E-02
1.E-01
1.E+00
3/9
Characteristics
Figure 7.
STPS3H100
Relative variation of thermal
impedance junction to ambient
versus pulse duration (SMB)
Figure 8.
Zth(j-a)/Rth(j-a)
Zth(j-l)/Rth(j-l)
1.0
1.0
SMB flat
SMB
0.9
0.9
0.8
0.8
0.7
0.7
0.6
0.6
0.5
0.5
0.4
0.4
0.3
0.3
0.2
0.2
Single pulse
0.1
Single pulse
0.1
tp(s)
tp(s)
0.0
0.0
1.E-02
1.E-01
Figure 9.
1.E+04
Relative variation of thermal
impedance junction to lead
versus pulse duration (SMB flat)
1.E+00
1.E+01
1.E+02
1.E+03
Reverse leakage current versus
reverse voltage applied
(typical values)
1.E-04
1.E-03
1.E-02
1.E-01
1.E+00
Figure 10. Junction capacitance versus
reverse voltage applied
(typical values)
C(pF)
IR(µA)
100
1.E+03
F=1 MHz
VOSC=30 mVRMS
Tj=25 °C
Tj=150 °C
Tj=125 °C
1.E+02
Tj=100 °C
1.E+01
Tj=75 °C
Tj=50 °C
1.E+00
Tj=25 °C
1.E-01
VR(V)
VR(V)
1.E-02
10
0
4/9
20
40
60
80
100
1
Doc ID 16776 Rev 1
10
100
STPS3H100
Characteristics
Figure 11. Forward voltage drop versus
forward current
6.0
Figure 12. Thermal resistance junction to
ambient versus copper surface
under each lead (SMB)
IFM(A)
110
5.5
Rth(j-a)(°C/W)
SMB
100
5.0
90
Tj=125 °C
(Maximum values)
4.5
80
4.0
70
3.5
Tj=125 °C
(Typical values)
3.0
60
Tj=25 °C
(Maximum values)
50
2.5
2.0
40
1.5
30
20
1.0
SCU(cm²)
10
VFM(V)
0.5
0
0.0
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
0.0
1.1
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
Figure 13. Thermal resistance junction to ambient versus copper surface under each lead
(SMBflat)
Rth(j-a)(°C/W)
110
SMB flat
100
90
80
70
60
50
40
30
20
10
SCU(cm²)
0
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
Doc ID 16776 Rev 1
4.0
4.5
5.0
5/9
Package Information
2
STPS3H100
Package Information
●
Epoxy meets UL94, V0
●
Lead-free packages
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK® is an ST trademark.
Table 5.
SMB dimensions
Dimensions
Ref.
Millimeters
Inches
E1
D
Min.
Max.
Min.
Max.
A1
1.90
2.45
0.075
0.096
A2
0.05
0.20
0.002
0.008
b
1.95
2.20
0.077
0.087
c
0.15
0.40
0.006
0.016
E
5.10
5.60
0.201
0.220
E1
4.05
4.60
0.159
0.181
D
3.30
3.95
0.130
0.156
L
0.75
1.50
0.030
0.059
E
A1
A2
C
L
b
Figure 14. SMB footprint (dimensions in mm)
1.62
2.60
1.62
2.18
5.84
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Doc ID 16776 Rev 1
STPS3H100
Package Information
Table 6.
SMBflat dimensions
Dimensions
Ref.
Min.
A
0.90
1.10
0.035
0.043
b(1)
1.95
2.20
0.077
0.087
(1)
0.15
0.40
0.006
0.016
D
3.30
3.95
0.130
0.156
E
5.10
5.60
0.200
0.220
E1
4.05
4.60
0.189
0.181
L
0.75
1.50
0.029
0.059
c
D
L2
c
E E1
L
L1
Inches
Min. Typ. Max.
A
L
Millimeters
b
Typ.
L1
0.40
0.016
L2
0.60
0.024
Max.
1. Applies to plated leads
Figure 15. SMBflat footprint (dimensions in mm)
5.84
2.07
1.20
3.44
Doc ID 16776 Rev 1
1.20
7/9
Ordering information
3
Ordering information
Table 7.
4
Ordering information
Order code
Marking
Package
Weight
Base qty
Delivery mode
STPS3H100U
G31
SMB
0.107 g
2500
Tape and reel
STPS3H100UF
FG31
SMBflat
0.050 g
5000
Tape and reel
Revision history
Table 8.
8/9
STPS3H100
Document revision history
Date
Revision
15-Jan-2010
1
Changes
First issue.
Doc ID 16776 Rev 1
STPS3H100
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