STPS3L45AF

STPS3L45AF Power Schottky rectifier Datasheet - production data Description A K Schottky rectifier suited for switched mode power supplies and high frequency DC to DC converters. Packaged in a tiny SMAflat package, this device has been optimized for use in compact chargers. Figure 1. Electrical characteristics(a) SMAflat (non exposed pad) STPS3L45AF I V "Forward" I 2 x IO X IF VRRM VR VAR Features IO X V IR VTo VF(Io) VF VF(2xIo) • Negligible switching losses "Reverse" • Low thermal resistance • Low forward voltage drop IAR • Avalanche capability specified Table 1. Device summary Symbol value IF(AV) 3A VRRM 45 V Tj (max) 150 °C VF(typ) 0.462 V a. VARM and IARM must respect the reverse safe operating area defined in Figure 11. VAR and IAR are pulse measurements (tp < 10 µs). VR, IR, VRRM and VF, are static characteristics February 2014 This is information on a product in full production. DocID024949 Rev 2 1/8 www.st.com Characteristics 1 STPS3L45AF Characteristics Table 2. Absolute ratings (limiting values at 25 °C, unless otherwise specified) Symbol Parameter Test conditions Value Unit 45 V VRRM Repetitive peak reverse voltage IF(AV) Average forward current TL = 120 °C δ = 0.5 3 A IFSM Surge non repetitive forward current tp = 10 ms sinusoidal 75 A tp = 10 µs Tj = 125 °C 70 W PARM(1) Repetitive peak avalanche power VARM(2) Maximum repetitive peak avalanche voltage tp < 10 µs, Tj < 125 °C, IAR < 1.4 A 50 V VASM(2) Maximum single pulse peak avalanche voltage tp < 10 µs, Tj < 125 °C, IAR < 1.4 A 50 V Tstg Storage temperature range -65 to + 175 °C 150 °C Tj Operating junction temperature (3) 1. For pulse time duration deratings, please refer to Figure 4. More details regarding the avalanche energy measurements and diode validation in the avalanche are provided in the STMicroelectronics Application notes AN1768, “Admissible avalanche power of Schottky diodes” and AN2025, “Converter improvement using Schottky rectifier avalanche specification”. 2. Refer to Figure 11 3. dPtot --------------dTj 1 - condition to avoid thermal runaway for a diode on its own heatsink < ------------------------Rth ( j – a ) Table 3. Thermal resistance Symbol Rth(j-l) Parameter Thermal resistance junction to lead Value Unit 15 °C/W Table 4. Static electrical characteristics Symbol Parameter Test conditions IR(1) Reverse leakage current VF(1) Forward voltage drop Tj = 25 °C Tj = 125 °C Tj = 25 °C Tj = 125 °C VR = VRRM IF = 3 A 1. Pulse test: tp = 380 µs, δ < 2% To evaluate the conduction losses use the following equation: P = 0.36 x IF(AV) + 0.05 IF2(RMS) 2/8 DocID024949 Rev 2 Typ. Max. Unit 80 300 µA 66 135 mA 0.462 0.57 0.41 0.51 V STPS3L45AF Characteristics Figure 2. Average forward power dissipation versus average forward current 2.4 PF(AV)(W) 2.0 3.5 d = 0.05 d = 0.1 d = 0.2 IF(AV)(A) Rth(j-a) = Rth(j-l) 3.0 d=1 d = 0.5 2.5 1.6 2.0 1.2 1.5 0.8 1.0 T 0.4 0.0 Figure 3. Average forward current versus ambient temperature (δ = 0.5) IF(AV)(A) 0.0 0.5 1.0 1.5 d=tp/T 2.0 2.5 3.0 tp 3.5 0.0 4.0 Figure 4. Normalized avalanche power derating versus pulse duration 1 T 0.5 d=tp/T 0 Tamb(°C) tp 25 50 75 100 125 150 Figure 5. Relative variation of thermal impedance junction to lead versus pulse duration Parm(tp)/Parm(10µs) 1.0 Zth(j-l)/Rth(j-l) 0.9 0.8 0.7 0,1 0.6 0.5 0.4 0,01 0.3 0.2 0,001 tP(µs) 1 10 100 0.0 1000 Figure 6. Reverse leakage current versus reverse voltage applied (typical values) 1.E+03 Single pulse 0.1 IR(mA) tp(s) 1.E-04 1.E-03 1.E-02 1.E-01 C(pF) F = 1MHz VOSC = 30mVRMS Tj = 25°C Tj = 150°C Tj = 125°C 1.E+01 Tj = 100°C 100 Tj = 75°C 1.E+00 Tj = 50°C 1.E-01 TTjj == 25°C 25°C 1.E-02 1.E-03 1.E+01 Figure 7. Junction capacitance versus reverse voltage applied (typical values) 1000 1.E+02 1.E+00 VR(V) 0 5 10 15 20 25 30 35 40 45 10 VR(V) 1 DocID024949 Rev 2 10 100 3/8 8 Characteristics STPS3L45AF Figure 8. Forward voltage drop versus forward Figure 9. Forward voltage drop versus forward current (typical values) current (maximum values) I (A) 100.0 F 10.0 100.0 10.0 Tj = 125°C Tj = 25°C 1.0 0.0 0.2 0.4 0.6 Tj = 25°C 0.8 1.0 1.2 VF(V) 0.1 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 1.4 Figure 10. Thermal resistance junction to ambient versus copper surface under each lead (typical values) 200 Tj = 125°C 1.0 VF(V) 0.1 IF(A) Figure 11. Reverse safe operating area (tp < 10 µs and Tj < 125 °C) Rth(j-a)(°C/W) 1,6 Epoxy printed board FR4, copper thickness Cu = 35 µm 150 Iarm (V) 1,4 1,2 100 1,0 50 0,8 0 0 4/8 0,6 45 SCU(cm²) 1 2 3 4 5 DocID024949 Rev 2 Varm (V) 55 65 75 85 95 STPS3L45AF 2 Package information Package information • Epoxy meets UL94,V0 • Lead-free packages In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. Figure 12. SMAflat (non-exposed pad) dimension definitions L2 2x L 2x E E1 b L1 2x A c D Table 5. SMAflat (non-exposed pad) dimension values Dimensions Ref. Millimeters Min. Typ. Inches Max. Min. Typ. Max. A 0.90 1.10 0.035 0.043 b 1.25 1.65 0.049 0.065 c 0.15 0.40 0.006 0.016 D 2.25 2.95 0.088 0.116 E 4.80 5.60 0.189 0.220 E1 3.95 4.60 0.155 0.181 L 0.75 1.50 0.029 0.059 L1 0.50 0.020 L2 0.50 0.020 DocID024949 Rev 2 5/8 8 Package information STPS3L45AF Figure 13. SMAflat (non-exposed pad) footprint dimensions in mm (inches) 1.20 (0.047) 3.44 (0.136) 2.07 (0.082) 5.84 (0.230) 6/8 DocID024949 Rev 2 1.20 (0.047) STPS3L45AF 3 Ordering information Ordering information Table 6. Ordering information 4 Order code Marking Package Weight Base qty Delivery mode STPS3L45AF F3L45 SMAflat (non-exposed pad) 0.035 g 10000 Tape and reel Revision history Table 7. Document revision history Date Revision Description of changes 08-Jul-2013 1 First release. 03-Feb-2014 2 Updated Table 5, Figure 12 and Figure 13. DocID024949 Rev 2 7/8 8 STPS3L45AF Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. 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