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STTH10R04D

STTH10R04D

  • 厂商:

    STMICROELECTRONICS(意法半导体)

  • 封装:

    TO220-2

  • 描述:

    DIODE GEN PURP 400V 10A TO220AC

  • 数据手册
  • 价格&库存
STTH10R04D 数据手册
STTH10R04 High efficiency rectifier Features A K ■ ■ ■ ■ ■ Ultrafast recovery Low power losses High surge capability Low leakage current High junction temperature K A NC A K TO-220FPAC STTH10R04FP K D2PAK STTH10R04G Description The STTH10R04 is an ultrafast recovery power rectifier dedicated to energy recovery in PDP application. It is especially designed for clamping function in energy recovery block. The compromise between forward voltage drop and recovery time offers optimized performances. K A A K NC TO-220AC STTH10R04D DPAK STTH10R04B Table 1. Device summary IF(peak) VRRM trr (typ) Tj VF (typ) 10 A 400 V 15 ns 175 °C 1.15 V November 2007 Rev 1 1/11 www.st.com 11 Characteristics STTH10R04 1 Table 2. Symbol VRRM IF(RMS) Characteristics Absolute ratings (limiting values) Parameter Repetitive peak reverse voltage Forward current (rms) DPAK, TO-220AC, D2PAK IF(peak) Peak working forward current TO-220FPAC IFSM Tstg Tj Surge non-repetitive forward current Storage temperature range Maximum operating junction temperature Tc = 135 °C δ = 0.5 Square signal Tc = 130 °C δ = 0.5 Square signal tp = 10 ms sinusoidal 10 A Value 400 20 Unit V A 100 -65 to + 175 175 A °C °C Table 3. Symbol Rth(j-c) Thermal parameters Parameter DPAK, TO-220AC, D2PAK Junction to case TO-220FPAC 6 Value 3.5 °C/W Unit Table 4. Symbol IR (1) VF (2) Static electrical characteristics Parameter Reverse leakage current Test conditions Tj = 25 °C Tj = 125 °C Forward voltage drop Tj = 25 °C Tj = 125 °C VR = VRRM Min Typ Max 10 µA 10 1.5 IF = 10 A 1.15 100 1.7 V 1.35 Unit 1. Pulse test: tp = 5 ms, δ < 2% 2. Pulse test: tp = 380 µs, δ < 2% To evaluate the conduction losses use the following equation: P = 1.05 x IF(AV) + 0.03 IF2(RMS) Table 5. Symbol trr tfr VFP IRM Sfactor Recovery characteristics Parameter Reverse recovery time Tj = 25 °C Tj = 25 °C Tj = 25 °C Test conditions IF = 0.5 A, Irr = 0.25 A, IR = 1 A IF = 1 A, VR = 30 V, dIF/dt = -50 A/µs IF = 10 A, dIF/dt = 100 A/µs VFR = 1.1 x VFmax IF = 10 A , dIF/dt = 100 A/µs 6.2 0.3 Min Typ Max Unit 15 20 ns 40 140 3 8 ns V A Forward recovery time Peak forward voltage Reverse recovery current Softness factor I = 10 A, VCC = 200 V Tj = 125 °C F dIF/dt = 200 A/µs 2/11 STTH10R04 Characteristics Figure 1. Conduction losses versus average forward current Figure 2. Forward voltage drop versus forward current 18 16 14 12 10 8 6 4 2 0 P (W) d=0.1 d=0.05 d=0.2 d=0.5 d=1 200 180 160 140 120 100 80 60 T IFM(A) Tj=125°C (Maximum values) Tj=125°C (Typical values) Tj=25°C (Maximum values) 40 20 0 IF(av) (A) 0 2 4 6 8 10 12 VFM(V) 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 0.0 Figure 3. Relative variation of thermal Figure 4. impedance junction to case versus pulse duration Zth(j-c)/Rth(j-c) Relative variation of thermal impedance junction to case versus pulse duration Zth(j-c)/Rth(j-c) 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0.0 1.E-04 tP(s) 1.E-03 1.E-02 1.E-01 1.E+00 Single pulse D²PAK DPAK 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 tP(s) Single pulse TO-220FPAC 0.0 1.E-03 1.E-02 1.E-01 1.E+00 1.E+01 Figure 5. Peak reverse recovery current versus dIF/dt (typical values) Figure 6. trr(ns) Reverse recovery time versus dIF/dt (typical values) 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 IRM(A) IF=IF(AV) VR=200V Tj=125°C 80 70 60 50 40 30 20 IF=IF(AV) VR=200V Tj=125°C dIF/dt(A/µs) 0 50 100 150 200 250 300 350 400 450 500 10 0 0 50 100 150 dIF/dt(A/µs) 200 250 300 350 400 450 500 3/11 Characteristics STTH10R04 Figure 7. QRR(nC) Reverse recovery charges versus dIF/dt (typical values) Figure 8. S factor IF < 2 x IF(AV) VR=200V Tj=125°C Reverse recovery softness factor versus dIF/dt (typical values) 300 250 200 150 100 50 IF=IF(AV) VR=200V Tj=125°C 0.8 0.7 0.6 0.5 0.4 0.3 0.2 dIF/dt(A/µs) 0 0 50 100 150 200 250 300 350 400 450 500 0.1 0.0 0 50 100 150 dIF/dt(A/µs) 200 250 300 350 400 450 500 Figure 9. Relative variations of dynamic parameters versus junction temperature IF=IF(AV) VR=200V Reference: Tj=125°C SFACTOR Figure 10. Transient peak forward voltage versus dIF/dt (typical values) VFP(V) 12 11 10 9 8 7 6 5 4 3 2 IF=IF(AV) Tj=125°C 3.0 2.8 2.6 2.4 2.2 2.0 1.8 1.6 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0.0 25 50 IRM QRR Tj(°C) 75 100 125 1 0 0 50 100 150 200 dIF/dt(A/µs) 250 300 350 400 450 500 4/11 STTH10R04 Characteristics Figure 11. Forward recovery time versus dIF/dt (typical values) tfr(ns) IF=IF(AV) VFR=1.1 x V F max. Tj=125°C Figure 12. Junction capacitance versus reverse voltage applied (typical values) C(pF) 200 180 160 140 120 100 80 60 40 20 0 100 F=1MHz VOSC=30mVRMS Tj=25°C dIF/dt(A/µs) 10 0 50 100 150 200 250 300 350 400 450 500 VR(V) 1 10 100 1000 Figure 13. Thermal resistance, junction to ambient, versus copper surface under tab (epoxy printed board FR4, copper thickness = 35 µm) D2PAK Rth(j-a) (°C/W) Figure 14. Thermal resistance, junction to ambient, versus copper surface under tab (epoxy printed board FR4, copper thickness = 35 µm) DPAK Rth(j-a) (°C/W) 80 D²PAK 100 90 80 DPAK 70 60 70 50 40 30 20 10 SCU(cm²) 60 50 40 30 20 10 0 0 5 10 15 SCU(cm²) 0 0 5 10 15 20 25 30 35 40 20 25 30 35 40 5/11 Package information STTH10R04 2 Package information ● ● ● ● Epoxy meets UL94, V0 Cooling method: by conduction (C) Recommended torque calue: 0.8 N·m Maximum torque value: 1.0 N·m In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a lead-free second level interconnect. The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com. Table 6. TO-220AC dimensions Dimensions Ref. Millimeters Min. A H2 ØI L5 L7 L6 L2 C A Inches Min. 0.173 0.048 0.094 0.019 0.024 0.044 0.194 0.393 Max. 0.181 0.051 0.107 0.027 0.034 0.066 0.202 0.409 Max. 4.60 1.32 2.72 0.70 0.88 1.70 5.15 10.40 4.40 1.23 2.40 0.49 0.61 1.14 4.95 10.00 C D E F F1 G F1 L9 L4 F D H2 L2 L4 16.40 typ. 13.00 2.65 15.25 6.20 3.50 14.00 2.95 15.75 6.60 3.93 0.645 typ. 0.511 0.104 0.600 0.244 0.137 0.551 0.116 0.620 0.259 0.154 M E L5 L6 G L7 L9 M Diam. I 2.6 typ. 3.75 3.85 0.102 typ. 0.147 0.151 6/11 STTH10R04 Table 7. TO-220FPAC dimensions Package information Dimensions Ref. Millimeters Min. A A H B Inches Min. 0.173 0.098 0.098 0.018 0.030 0.045 0.195 0.094 0.393 Max. 0.181 0.106 0.108 0.027 0.039 0.067 0.205 0.106 0.409 Max. 4.6 2.7 2.75 0.70 1 1.70 5.20 2.7 10.4 4.4 2.5 2.5 0.45 0.75 1.15 4.95 2.4 10 B D E Dia F L6 L2 L3 L5 F1 L4 D L7 F1 G G1 H L2 L3 16 Typ. 28.6 9.8 2.9 15.9 9.00 3.00 30.6 10.6 3.6 16.4 9.30 3.20 0.63 Typ. 1.126 0.386 0.114 0.626 0.354 0.118 1.205 0.417 0.142 0.646 0.366 0.126 F G1 G E L4 L5 L6 L7 Dia. 7/11 Package information Table 8. DPAK dimensions Dimensions Ref. Millimeters Min. A E B2 C2 L2 A STTH10R04 Inches Min. 0.086 0.035 0.001 0.025 0.204 0.017 0.018 0.236 0.251 0.173 0.368 Max. 0.094 0.043 0.009 0.035 0.212 0.023 0.023 0.244 0.259 0.181 0.397 Max. 2.40 1.10 0.23 0.90 5.40 0.60 0.60 6.20 6.60 4.60 10.10 2.20 0.90 0.03 0.64 5.20 0.45 0.48 6.00 6.40 4.40 9.35 A1 A2 B B2 D H L4 B G A1 R C C2 R C D E A2 0.60 MIN. G H V2 L2 L4 V2 0.80 typ. 0.60 0° 1.00 8° 0.031 typ. 0.023 0° 0.039 8° Figure 15. DPAK footprint (dimensions in mm) 6.7 3 3 1.6 2.3 6.7 2.3 1.6 8/11 STTH10R04 Table 9. D2PAK dimensions Package information Dimensions Ref. Millimeters Min. A A E L2 C2 Inches Min. 0.173 0.098 0.001 0.027 0.045 0.017 0.048 0.352 0.393 0.192 0.590 0.050 0.055 0.094 Max. 0.181 0.106 0.009 0.037 0.067 0.024 0.054 0.368 0.409 0.208 0.624 0.055 0.069 0.126 Max. 4.60 2.69 0.23 0.93 1.70 0.60 1.36 9.35 10.40 5.28 15.85 1.40 1.75 3.20 4.40 2.49 0.03 0.70 1.14 0.45 1.23 8.95 10.00 4.88 15.00 1.27 1.40 2.40 A1 A2 B D L L3 A1 B2 B G A2 R B2 C C2 C D E G L M * V2 L2 L3 M R V2 * FLAT ZONE NO LESS THAN 2mm 0.40 typ. 0° 8° 0.016 typ. 0° 8° Figure 16. D2PAK footprint (dimensions in mm) 16.90 10.30 1.30 5.08 8.90 3.70 9/11 Ordering information STTH10R04 3 Ordering information Table 10. Ordering information Marking STTH10R04FP STTH10R04B DPAK STTH10R04B-TR STTH10R04G STTH10R04G-TR STTH10R04D STTH10R04B STTH10R04G STTH10R04G STTH10R04D TO-220AC 1.86 g D2PAK 1.48 g 1000 50 Tape and reel Tube 0.3g 2500 50 Tape and reel Tube Package TO-220FPAC Weight 1.64 g Base qty 50 75 Delivery mode Tube Tube Order code STTH10R04FP STTH10R04B 4 Revision history Table 11. Date 07-Nov-2007 Document revision history Revision 1 First issue Description of changes 10/11 STTH10R04 Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such third party products or services or any intellectual property contained therein. UNLESS OTHERWISE SET FORTH IN ST’S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. UNLESS EXPRESSLY APPROVED IN WRITING BY AN AUTHORIZED ST REPRESENTATIVE, ST PRODUCTS ARE NOT RECOMMENDED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY, DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. ST PRODUCTS WHICH ARE NOT SPECIFIED AS "AUTOMOTIVE GRADE" MAY ONLY BE USED IN AUTOMOTIVE APPLICATIONS AT USER’S OWN RISK. Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any liability of ST. ST and the ST logo are trademarks or registered trademarks of ST in various countries. Information in this document supersedes and replaces all information previously supplied. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners. © 2007 STMicroelectronics - All rights reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America www.st.com 11/11
STTH10R04D 价格&库存

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