STTH112-Y
Datasheet
Automotive 1 A - 1200 V ultrafast rectifier
Features
SMB Flat
SMB Flat
Wettable leads
•
•
•
•
•
•
AEC-Q101 qualified
Very low conduction losses
Negligible switching losses
Low forward and reverse recovery times
High junction temperature
ECOPACK2 or ECOPACK3 compliant component on demand
Description
The STTH112-Y, which is using ST’s new 1200 V planar technology, is especially
suited for switching mode base drive and transistor circuits.
The device is also intended for use as a free-wheeling diode in power supplies and
other power switching applications in automotive K functions.
Product status link
STTH112-Y
Product summary
IF(AV)
1A
VRRM
1200 V
Tj (max.)
175 °C
VF (typ.)
1.1 V
Trr (typ.)
53 ns
DS10171 - Rev 2 - March 2022
For further information contact your local STMicroelectronics sales office.
www.st.com
STTH112-Y
Characteristics
1
Characteristics
Table 1. Absolute ratings (limiting values at Tj= 25 °C, unless otherwise specified)
Symbol
Parameter
Value
Unit
1200
V
VRRM
Repetitive peak reverse voltage
IF(AV)
Average forward
current
TL = 135 °C δ = 0.5
1
A
IFSM
Forward surge current
tp = 8.3 ms
18
A
Tstg
Storage temperature range
-65 to + 175
°C
Tj(1)
Operating temperature range
-40 to + 175
°C
1. (dPtot/dTj) < (1/Rth(j-a)) condition to avoid thermal runaway for a diode on its own heatsink.
Table 2. Thermal resistance
Symbol
Rth(j-l)
Parameter
Junction to lead
Value
Unit
20
°C/W
Table 3. Static electrical characteristic
Symbol
Parameter
IR(1)
Reverse leakage current
VF(2)
Forward voltage drop
Test conditions
Tj = 25 °C
Tj = 125 °C
Tj = 25 °C
Tj = 150 °C
Min.
VR = VRRM
IF = 1 A
Typ.
Max.
-
5
-
1
-
µA
50
-
1.9
1.10
Unit
1.55
V
1. Pulsetest: tp = 5 ms, δ < 2%
2. Pulsetest: tp = 380 µs, δ < 2%
To evaluate the conduction losses use the following equation:
P = 1.25 x IF(AV) + 0.330 IF²(RMS)
Table 4. Dynamic electrical characteristics
Symbol
trr
Reverse recovery time
tfr
Forward recovery time
VFP
DS10171 - Rev 2
Parameter
Forward recovery voltage
Tj = 25 °C
Tj = 25 °C
Test conditions
Min.
Typ.
Max.
IF = 0.5 A; Irr = 0.25 A; IR = 1 A
-
53
75
IF = 1 A; dIF/dt = 50 A/µs; VFR = 4.50 V
-
500
20
30
Unit
ns
V
page 2/8
STTH112-Y
Electrical characteristics (curves)
1.1
Electrical characteristics (curves)
Figure 1. Average forward power dissipation versus
average forward current
2.4
Figure 2. Forward voltage drop versus forward current
(typical values)
PF(AV) (W)
IF(A)
10.00
2.0
δ = 0.05
δ = 0.1
δ = 0.2
δ = 0.5
δ =1
Tj = 150 °C
1.00
1.6
Tj = 25 °C
1.2
0.10
0.8
T
0.4
IF(AV) (A)
0.0
0.0
0.2
0.4
0.6
tp
δ =tp/T
0.8
1.0
1.2
VF(V)
0.01
0.0
1.4
Figure 3. Forward voltage drop versus forward current
(maximum values)
IF(A)
0.8
1.2
1.6
2.0
2.4
2.8
Figure 4. Relative variation of thermal impedance junction
to lead versus pulse duration
1.0
10.00
0.4
Zth(j-l)/Rth(j-l)
SMBflat
0.9
0.8
Tj = 150 °C
1.00
0.7
Tj = 25 °C
0.6
0.5
0.4
0.10
0.3
Single pulse
0.2
0.1
VF(V)
0.0
0.4
0.8
1.2
1.6
2.0
2.4
2.8
3.2
3.6
Figure 5. Junction capacitance versus reverse voltage
applied (typical values)
100
tp(s)
0.0
0.01
1. E-04
1. E-03
1. E-02
1. E-01
1. E+00
1. E+01
Figure 6. Thermal resistance junction to ambient versus
copper surface under each lead
C (pF)
Rth(j-a)(°C/W)
150
F = 1 MHz
VOSC = 30 mVRMS
Tj = 25 °C
SMB-Flat
Epoxy printed board FR4, copper thickness: 70 μm
120
90
10
60
30
SCu (cm²)
VR(V)
0
1
1
DS10171 - Rev 2
10
100
1000
10000
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
page 3/8
STTH112-Y
Package information
2
Package information
In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages,
depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product
status are available at: www.st.com. ECOPACK is an ST trademark.
2.1
SMB Flat package information
•
•
Epoxy meets UL94, V0
Lead-free package
Figure 7. SMB Flat package outline
Table 5. SMB Flat mechanical data
Dimensions
Millimeters
Ref.
Min.
Max.
Min.
Typ.
Max.
A
0.90
1.10
0.035
0.043
b
1.95
2.20
0.077
0.087
c
0.15
0.40
0.006
0.016
D
3.30
3.95
0.130
0.156
E
5.10
5.60
0.200
0.220
E1
4.05
4.60
0.159
0.181
L
0.75
1.50
0.030
0.060
L2
DS10171 - Rev 2
Typ.
Inches
0.60
0.024
page 4/8
STTH112-Y
SMB Flat package information
Figure 8. Footprint recommendations, dimensions in mm (inches)
1.20
(0.047)
3.44
(0.136)
1.20
(0.047)
2.07
(0.082)
5.84
(0.230)
millimeters
(inches)
DS10171 - Rev 2
page 5/8
STTH112-Y
Ordering information
3
DS10171 - Rev 2
Ordering information
Order code
Marking
Package
Weight
Base qty.
Delivery mode
STTH112UFY
F112Y
SMBflat
50 mg
5000
Tape and reel
page 6/8
STTH112-Y
Revision history
Table 6. Document revision history
DS10171 - Rev 2
Date
Version
Changes
04-Feb-2014
1
Initial release.
18-Mar-2022
2
Updated Section 2.1 SMB Flat package information.
page 7/8
STTH112-Y
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Information in this document supersedes and replaces information previously supplied in any prior versions of this document.
© 2022 STMicroelectronics – All rights reserved
DS10171 - Rev 2
page 8/8
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