STTH112_07

STTH112 High voltage ultrafast rectifier Main product characteristics IF(AV) VRRM Tj (max) VF (max) 1A 1200 V 175° C 1.65 V Features and benefits ■ ■ ■ ■ ■ Low forwarded voltage drop High reliability High surge current capability Soft switching for reduced EMI disturbances Planar technology DO-41 STTH112 Description The STTH112, which is using ST ultrafast high voltage planar technology, is specially suited for free-wheeling, clamping, snubbering, demagnetization in power supplies and other power switching applications Table 1. Symbol VRRM V(RMS) Repetitive peak reverse voltage RMS voltage Tl = 85° C IF(AV) Average forward current Tl = 115° C Tl = 125° C δ = 0.5 DO-41 1 A SMA STTH112A SMB STTH112U Absolute ratings (limiting values) Parameter Value 1200 850 Unit V V δ = 0.5 SMA δ =0 .5 SMB DO-41 20 A 18 IFSM Forward surge current t = 8.3 ms SMA SMB Tstg Tj Storage temperature range Maximum operating junction temperature - 50 + 175 + 175 °C °C March 2007 Rev 4 1/7 www.st.com 7 Electrical characteristics STTH112 1 Table 2. Symbol Electrical characteristics Thermal parameters Parameter L = 10 mm Rth (j-l) Junction to lead DO-41 SMA SMB Rth (j-a) Junction to ambient L = 10 mm DO-41 Value 45 30 °C/W 25 110 Unit Table 3. Symbol IR Static electrical characteristics Parameter Reverse leakage current Tests conditions VR = 1200V Tj = 25° C Tj = 125° C Tj = 25° C Min. Typ. Max. 5 µA 50 1.9 1.17 1.10 1.65 1.55 V Unit VF Forward voltage drop IF = 1 A Tj = 125° C Tj = 150° C Table 4. Symbol trr tfr VFP Dynamic electrical characteristics Parameter Reverse recovery time Forward recovery time Forward recovery voltage Tests conditions IF = 0.5 A Irr = 0.25 A IR = 1A IF = 1 A dIF/dt = 50 A/µs VFR = 1.1 x VFmax Tj = 25° C Min. Typ. Max. 75 500 Tj = 25° C 30 Unit ns ns V Figure 1. Conduction losses versus average Figure 2. current IFM(A) δ = 0.05 δ = 0.1 δ = 0.2 100.0 Forward voltage drop versus forward current. P(W) 2.2 2.0 1.8 1.6 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0.0 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 1.0 δ = 0.5 Tj=125°C (maximum values) δ=1 10.0 Tj=125°C (typical values) Tj=25°C (maximum values) T IF(AV)(A) δ=tp/T 0.9 1.0 tp 0.1 1.1 1.2 0.0 0.5 1.0 1.5 2.0 VFM(V) 2.5 3.0 3.5 4.0 4.5 5.0 2/7 STTH112 Electrical characteristics Figure 3. Figure 4. Relative variation of thermal impedance junction ambient versus pulse duration (epoxy FR4, Lleads = 10mm) (DO-41). 1.0 0.9 0.8 0.7 Relative variation of thermal impedance junction ambient versus pulse duration (epoxy FR4) (SMA). Zth(j-c)/Rth(j-c) 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0.0 1.E-01 1.E+00 1.E+01 δ = 0.2 δ = 0.1 Single pulse δ = 0.5 Zth(j-c)/Rth(j-c) 0.6 0.5 0.4 0.3 δ = 0.5 T 0.2 0.1 0.0 1.E+02 1.E+03 δ = 0.2 δ = 0.1 Single pulse T tp(s) δ=tp/T tp tp(s) 1.E+00 1.E+01 δ=tp/T 1.E+02 tp 1.E+03 1.E-01 Figure 5. Relative variation of thermal Figure 6. impedance junction ambient versus pulse duration (epoxy FR4)(SMB). Thermal resistance junction to ambient versus copper surface under each lead (epoxy printed circuit board FR4, copper thickness: 35 µm) (DO-41, SMB). Zth(j-c)/Rth(j-c) 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 δ = 0.2 δ = 0.5 Rth(j-a)(°C/W) 110 100 90 80 70 60 50 40 SMB DO-41 Lleads=10mm 0.2 δ = 0.1 T 30 20 0.1 Single pulse tp(s) 1.E+00 1.E+01 0.0 1.E-01 δ=tp/T 1.E+02 tp 1.E+03 10 0 0 1 2 3 4 S(cm²) 5 6 7 8 9 10 Figure 7. Thermal resistance junction to ambient versus copper surface under each lead (epoxy printed circuit board FR4, copper thickness: 35 µm) (SMA). Rth(j-a)(°C/W) 140 130 120 110 100 90 80 70 60 50 40 30 20 10 0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 SMA S(cm²) 3/7 Package mechanical data STTH112 2 Package mechanical data ● Epoxy meets UL 94, V0 SMA dimensions Dimensions Ref. E1 Table 5. Millimeters Min. Max. 2.45 0.20 1.65 0.40 2.90 5.35 4.60 1.50 Inches Min. 0.075 0.002 0.049 0.006 0.089 0.189 0.156 0.030 Max. 0.094 0.008 0.065 0.016 0.114 0.211 0.181 0.059 D A1 A2 b 1.90 0.05 1.25 0.15 2.25 4.80 3.95 0.75 E c A1 D E b C L A2 E1 L Figure 8. Footprint (dimensions in mm) 1.4 2.63 1.4 1.64 5.43 4/7 STTH112 Table 6. SMB dimensions Package mechanical data Dimensions Ref. E1 Millimeters Min. Max. 2.45 0.20 2.20 0.40 3.95 5.60 4.60 1.50 Inches Min. 0.075 0.002 0.077 0.006 0.130 0.201 0.159 0.030 Max. 0.096 0.008 0.087 0.016 0.156 0.220 0.181 0.059 D A1 A2 b 1.90 0.05 1.95 0.15 3.30 5.10 4.05 0.75 E c A1 D E b C L A2 E1 L Figure 9. Footprint (dimensions in mm) 1.62 2.60 1.62 2.18 5.84 Table 7. DO-41 dimensions DIMENSIONS REF. ØB ØD ØD Millimeters Min. Max. 5.20 2.71 Inches Min. 0.160 0.080 1.102 Max. 0.205 0.107 A C A C 4.07 2.04 28 0.712 B C D 0.863 0.028 0.034 In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a lead-free second level interconnect. The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com. 5/7 Ordering information STTH112 3 Ordering information Ordering code STTH112 STTH112A STTH112U STTH112RL Marking STTH112 H12 U12 STTH112 Package DO-41 SMA SMB DO-41 Weight 0.34 g 0.068 g 0.11 g 0.34 g Base qty 2000 5000 2500 5000 Delivery Mode Ammopack Tape and reel Tape and reel Tape and reel 4 Revision history Date Jan-2003 Revision 2 Initial release. New value of Tj = 150°C added to table 2. Dimensions A1 E and D updated in Table 4. Data sheet reformatted. No other technical changes Reformatted to current standards. Updated dimensions and footprints for SMA and SMB packages. Changes 22-Jun-2005 3 20-Mar-2007 4 6/7 STTH112 Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. 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