STTH1R04
Datasheet
1 A - 400 V ultrafast recovery diode
Features
A
K
A
A
K
K
SMA
SMB
•
•
•
•
Applications
•
•
A
Negligible switching losses
Low forward voltage drop
High junction temperature
ECOPACK compliant
Switching diode
Telecom power
Description
K
The STTH1R04 series uses ST's new 400 V planar Pt doping technology. The
STTH1R04 is specially suited for switching mode base drive and transistor circuits.
Packaged in SMA, SMB and DO-15, the STTH1R04 is ideal for use low voltage, high
frequency inverters, free wheeling and polarity protection
DO-15
Product status
STTH1R04
Product summary
Symbol
Value
IF(AV)
1A
VRRM
400 V
T j(max.)
175 °C
VF(typ.)
0.9 V
trr(typ.)
14 ns
DS5848 - Rev 4 - March 2019
For further information contact your local STMicroelectronics sales office.
www.st.com
STTH1R04
Characteristics
1
Characteristics
Table 1. Absolute ratings (limiting values at 25 °C, unless otherwise specified)
Symbol
VRRM
IF(AV)
Parameter
Unit
400
V
1
A
30
A
-65 to +175
°C
+175
°C
Max. value
Unit
Repetitive peak reverse voltage
Average forward current δ = 0.5, square wave
IFSM
Surge non repetitive forward current
Tstg
Storage temperature range
Tj
Value
SMA
TL = 125 °C
SMB
TL = 140 °C
DO-15
TL = 105 °C
tp = 10 ms sinusoidal
Operating junction temperature
Table 2. Thermal resistance parameter
Symbol
Rth(j-l)
Parameter
Junction to lead
Junction to lead
Lead length = 10 mm on infinite heatsink
SMA
35
SMB
25
DO-15
50
°C/W
For more information, please refer to the following application note :
•
AN5088 : Rectifiers thermal management, handling and mounting recommendations
Table 3. Static electrical characteristics
Symbol
IR(1)
Parameter
Reverse leakage current
Test conditions
Tj = 25 °C
Tj = 125 °C
Min.
VR = VRRM
Tj = 25 °C
(2)
VF
Forward voltage drop
Tj = 100 °C
Tj = 150 °C
Typ.
-
5
IF = 1 A
Max.
Unit
5
µA
50
µA
1.50
-
1.0
1.25
-
0.9
1.15
V
1. Pulse test: tp = 5 ms, δ < 2%
2. Pulse test: tp = 380 µs, δ < 2%
To evaluate the conduction losses, use the following equation:
P = 0.9 x IF(AV) + 0.250 x IF2(RMS)
For more information, please refer to the following application notes related to the power losses :
•
AN604: Calculation of conduction losses in a power rectifier
•
AN4021: Calculation of reverse losses on a power diode
DS5848 - Rev 4
page 2/14
STTH1R04
Characteristics
Table 4. Dynamic characteristics (Tj = 25 °C unless otherwise stated)
Symbol
trr
IRM
tfr
VFP
DS5848 - Rev 4
Parameters
Test conditions
Min.
Typ.
Max.
Unit
IF = 1 A, dIF/dt = -50 A/μs, VR = 30 V
-
IF = 1 A, dIF/dt = -100 A/μs, VR = 30 V
-
14
20
Reverse recovery current
IF = 1 A, dIF/dt = -200 A/μs, VR = 320 V, Tj = 125 °C
-
2.5
3.5
A
Forward recovery time
IF = 1 A, dIF/dt = 100 A/μs, VFR = 1.1 x VF(max.)
-
50
ns
Forward recovery voltage
IF = 1 A, dIF/dt = 100 A/μs
-
Reverse recovery time
30
3.5
ns
V
page 3/14
STTH1R04
Characteristics (curves)
1.1
Characteristics (curves)
Figure 1. Average forward power dissipation versus
average forward current
IFM(A)
50
P(W)
1.6
Figure 2. Forward voltage drop versus forward current
δ=0.05
1.4
δ=0.1
45
δ=0.5
δ=0.2
δ=1
40
1.2
35
1.0
30
TJ=150°C
(Maximum values)
25
0.8
TJ=150°C
(Typical values)
20
0.6
15
0.4
T
TJ=25°C
=25°C
(Maximum values)
10
5
0.2
I F(AV) (A)
δ=tp/T
tp
0.0
0.2
0.4
0.6
0.8
1.0
VFM(V)
0
0.0
1.2
0.0
0.4
0.8
1.2
1.6
2.0
2.4
2.8
3.2
3.6
4.0
Figure 3. Relative variation of thermal impedance junction Figure 4. Relative variation of thermal impedance junction
to lead versus pulse duration (SMA)
to lead versus pulse duration (SMB)
1.0
Zth(j-a)/Rth(j-a)
1.0
SMA
Scu=1cm²
0.9
SMB
Scu=1cm²
0.9
0.8
0.8
0.7
0.7
0.6
0.6
0.5
0.5
0.4
0.4
0.3
0.3
0.2
0.2
0.1
Zth(j-a)/Rth(j-a)
Single pulse
0.1
t P(s)
0.0
1.E-02
DS5848 - Rev 4
1.E-01
1.E+00
Single pulse
t P(s)
0.0
1.E+01
1.E+02
1.E+03
1.E-03
1.E-02
1.E-01
1.E+00
1.E+01
1.E+02
1.E+03
page 4/14
STTH1R04
Characteristics (curves)
Figure 5. Relative variation of thermal impedance junction
to lead versus pulse duration (DO-15)
1.0
Figure 6. Reverse recovery charges versus dIF/dt (typical
values)
Zth(j-a)/Rth(j-a)
40
DO-15
Lleads=10mm
0.9
QRR(nC)
IF= 1 A
VR=320 V
36
0.8
32
0.7
28
0.6
24
0.5
20
0.4
16
0.3
12
0.2
Tj=125 °C
8
Single pulse
0.1
0.0
Tj=25 °C
4
t P(s)
dIF/dt(A/µs)
0
1.E-01
1.E+00
1.E+01
1.E+02
1.E+03
Figure 7. Junction capacitance versus reverse voltage
applied (typical values)
100
C(pF)
10
10
t RR(ns)
IF= 1 A
VR=320 V
Tj=125 °C
30
25
20
15
10
1
10
100
1000
Figure 9. Peak reverse recovery current versus dIF/dt
(typical values)
5.0
IRM(A)
dIF/dt(A/µs)
10
IF= 1 A
VR=320 V
1.0
3.5
3.0
IRM
0.8
Tj=125 °C
2.5
1000
QRR
[Tj ]j ]// Q
QRR
[Tj =125°C]
Q
RR;;IIRM
RM [T
RR;;IIRM
RM [T
j =125°C]
1.2
4.0
100
Figure 10. Relative variations of dynamic parameters
versus junction temperature
1.4
IF= 1 A
VR=320 V
4.5
Tj=25 °C
5
0
VR(V)
1
1000
Figure 8. Reverse recovery time versus dIF/dt (typical
values)
70
65
60
55
50
45
40
35
F=1MHz
VOSC=30mVRMS
Tj=25°C
100
2.0
0.6
1.5
0.4
QRR
1.0
Tj=25 °C
0.5
0.2
dIF/dt(A/µs)
T j (°C)
0.0
0.0
10
DS5848 - Rev 4
100
1000
25
50
75
100
125
150
page 5/14
STTH1R04
Characteristics (curves)
Figure 11. Transient peak forward voltage versus dIF/dt
(typical values)
30
Figure 12. Forward recovery time versus dIF/dt (typical
values)
VFp (V)
t FR(ns)
55
IF=1 A
Tj=125 °C
IF=1 A
Tj=125 °C
50
25
45
40
20
35
30
15
25
20
10
15
10
5
5
dIF/dt(A/µs)
0
50
100
150
200
250
300
350
400
450
0
500
Figure 13. Thermal resistance junction to ambient versus
copper surface under each lead (typical values)
200
dIF/dt(A/µs)
0
0
50
100
150
200
250
300
350
400
500
Figure 14. Thermal resistance junction to ambient versus
copper surface under each lead (typical values)
Rth(j-a)(°C/W)
200
Rth(j-a)(°C/W)
SMA
SMB
150
150
100
100
Epoxy printed board FR4, eCu = 35 µm
Epoxy printed board FR4, eCu = 35 µm
50
450
50
SCu (cm²)
SCu (cm²)
0
0
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
Figure 15. Thermal resistance junction to ambient versus lead length, DO-15
Rth(j-a) (°C/W)
120
DO-15
100
80
60
40
20
L leads (mm)
0
0.0
DS5848 - Rev 4
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
page 6/14
STTH1R04
Package information
2
Package information
In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages,
depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product
status are available at: www.st.com. ECOPACK is an ST trademark.
2.1
SMB package information
•
•
Epoxy meets UL94, V0
Lead-free package
Figure 16. SMB package outline
E1
D
E
A1
C
A2
L
DS5848 - Rev 4
b
page 7/14
STTH1R04
SMB package information
Table 5. SMB package mechanical data
Dimensions
Ref.
Millimeters
Inches (for reference only)
Min.
Max.
Min.
Max.
A1
1.90
2.45
0.074
0.097
A2
0.05
0.20
0.001
0.008
b
1.95
2.20
0.076
0.087
c
0.15
0.40
0.005
0.016
D
3.30
3.95
0.129
0.156
E
5.10
5.60
0.200
0.221
E1
4.05
4.60
0.159
0.182
L
0.75
1.50
0.029
0.060
Figure 17. SMB recommended footprint
1.62
2.60
1.62
(0.064)
(0.102)
(0.064)
2.18
(0.086)
5.84
(0.230)
DS5848 - Rev 4
page 8/14
STTH1R04
SMA package information
2.2
SMA package information
•
•
Epoxy meets UL94, V0
Cooling method : by conduction (C)
Figure 18. SMA package outline
E1
D
E
A1
C
A2
L
b
Table 6. SMA package mechanical data
Dimensions
Millimeters
Ref.
DS5848 - Rev 4
Inches (for reference only)
Min.
Max.
Min.
Max.
A1
1.90
2.45
0.074
0.097
A2
0.05
0.20
0.001
0.008
b
1.25
1.65
0.049
0.065
c
0.15
0.40
0.005
0.016
D
2.25
2.90
0.088
0.115
E
4.80
5.35
0.188
0.211
E1
3.95
4.60
0.155
0.182
L
0.75
1.50
0.029
0.060
page 9/14
STTH1R04
SMA package information
Figure 19. SMA recommended footprint in mm (inches)
1.4
2.63
1.4
(0.055)
(0.104)
(0.055)
1.64
(0.065)
5.43
(0.214)
DS5848 - Rev 4
page 10/14
STTH1R04
DO-15 package information
2.3
DO-15 package information
•
Epoxy meets UL 94, V0
Figure 20. DO-15 package outline
C
C
A
ØD
ØB
Table 7. DO-15 package mechanical data
Dimensions
Ref.
DS5848 - Rev 4
Millimeters
Inches (for reference only)
Min.
Typ.
Max.
Min.
Typ.
Max.
A
6.05
-
6.75
0.238
-
0.266
B
2.95
-
3.53
0.116
-
0.139
C
26.00
-
31.00
1.024
-
1.220
D
0.71
-
0.88
0.028
-
0.0035
page 11/14
STTH1R04
Ordering information
3
Ordering information
Table 8. Ordering information
DS5848 - Rev 4
Order code
Marking
Package
Weight
Base qty.
Delivery mode
STTH1R04A
HR4
SMA
0.068 g
5000
Tape and reel
STTH1R04U
BR4
SMB
0.107 g
2500
Tape and reel
STTH1R04QRL
STTH1R04Q
DO-15
0.400 g
6000
Tape and reel
page 12/14
STTH1R04
Revision history
Table 9. Document revision history
DS5848 - Rev 4
Date
Revision
Changes
30-May-2008
1
First issue.
12-Nov-2015
2
Updated Figure 3, Figure 4, Figure 5 and Figure 6. Minor text changes.
13-Nov-2018
3
Removed DO-41 package information.
15-Mar-2019
4
Updated Table 3. Static electrical characteristics.
page 13/14
STTH1R04
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© 2019 STMicroelectronics – All rights reserved
DS5848 - Rev 4
page 14/14
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