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TS972ID

TS972ID

  • 厂商:

    STMICROELECTRONICS(意法半导体)

  • 封装:

    SOIC-8

  • 描述:

    IC OPAMP GP 2 CIRCUIT 8SO

  • 数据手册
  • 价格&库存
TS972ID 数据手册
® TS971 TS972 TS974 OUTPUT RAIL TO RAIL VERY LOW NOISE OPERATIONAL AMPLIFIERS PIN CONNECTIONS (top view) TS971ILT . . . . . . . . RAIL TO RAIL OUTPUT VOLTAGE SWING (±2.4V @ VCC = ±2.5V) VERY LOW NOISE LEVEL : 4nV/√   Hz ULTRA LOW DISTORTION : 0.003% HIGH DYNAMIC FEATURES (12MHz, 4V/µs) OPERATING RANGE : 2.7V to 12V ESD PROTECTION (2kV) LATCH-UP IMMUNITY AVAILABLE IN SOT23-5 MICROPACKAGE Output 1 5 V CC VDD 2 Non-inverting input 3 4 Inve rting input DESCRIPTION The TS97x family operational amplifiers is able to operate with voltages as low as ±1.35V and featuring output Rail to Rail signal swing. The TS97x boasts characteristics that make them particularly well suited for portable and battery-supplied equipment. Very low noise and low distortion charact e r is t ic s ma k e t h em id e a l f o r a ud io pre-amplification. The TS971 is housed in the space-saving 5 pins SOT23 package which simplifies the board design because of the ability to be placed everywhere (outside dimensions are 2.8mm x 2.9mm) APPLICATIONS Portable equipments (CD players, PDA) Portable communications (cell phones, pagers) Instrumentation & sensoring Professional audio circuits Ou tpu t 1 Inve rting Inp u t 1 Non -inve rting Inp u t 1 TS971ID N.C . 1 + 8 N.C. 7 VCC 6 Output 2 5 N.C. Inve rting Inpu t 1 2 Non-inve rting Inpu t 1 3 V DD 4 TS972IN-TS972ID-TS972IPT . . . . 1 2 3 + + 8 VCC 7 Output 2 6 Inve rting Input 2 5 Non-inve rting Inp ut 2 VDD 4 ORDER CODES Package Part Temperature Number Range NDPL TS971I TS972I TS974I -40, +125 C -40, +125 C -40, +125 C o o o SOT23 Marking K120 TS974IN-TS974ID-TS974IPT Output 1 1 Inve rting Inp ut 1 2 Non-inv ert ing Inp ut 1 3 + + 14 Output 4 13 In verting Inp ut 4 12 Non-in verting Inp ut 4 11 VDD + + 10 Non-in verting Inp ut 3 9 8 In verting Inp ut 3 Output 3 • • • • • • • • N = Dual in Line Package (DIP) D = Small Outline Package (SO) - also available in Tape & Reel P = Thin Shrink Small Outline Package (TSSOP) - only available in Tape & Reel (PT) L = Tiny Package (SOT23-5) - only available in Tape & Reel (LT) VCC 4 Non-inve rting In put 2 5 In verting Inp ut 2 6 Output 2 7 August 1999 1/12 TS971-TS972-TS974 ABSOLUTE MAXIMUM RATINGS Symbol VCC Vid Vin Toper Tstg Tj R thjc Supply Voltage - note 1 Differential Input Voltage - note 2 Input Voltage Range - note 3 Operating Free Air Temperature Range Storage Temperature Range Maximum Junction Temperation Thermal Resistance Junction to Case - note 4 SOT23-5 SO8 SO14 TSSOP8 TSSOP14 Thermal Resistance Junction to Ambient Human Body Model Lead Temperature (soldering, 10sec) Notes: 1. 2. 3. 4. All voltages values, except differential voltage are with respect to network ground terminal. Differential voltages are non-inverting input terminal with respect to the inverting input terminal. The magniture of input and output voltages must never exceed VCC +0.3V. Short-circuits can cause excessive heating and destructive dissipation. Parameter Value 12 ± VCC -0.3 to 12.3 -40 to +125 -65 to +150 150 Unit V V V o o o o C C C C/W 81 28 22 26 21 256 2 260 o Rthja ESD C/W kV o C OPERATING CONDITIONS Symbol VCC Vicm Parameter Supply Voltage Range Common Mode Input Voltage Range Value 2.7 to 12 VDD + 1.15 to VCC - 1.15 Unit V V 2/12 TS971-TS972-TS974 ELECTRICAL CHARACTERISTICS VCC = 2.5V, VDD = -2.5V, Tamb = 25oC (unless otherwise specified) Symbol Vio DVio Iio Iib Input Offset Voltage Tmin. < Tamb < Tmax. Input Offset Voltage Drift Vicm = 0V, Vo = 0V Input Offset Current Vicm = 0V, Vo = 0V Input Bias Current Vicm = 0V, Vo = 0V Tmin. < Tamb < Tmax. Common Mode Input Voltage Range Common Mode Rejection Ratio Vicm = ±1.35V Supply Voltage Rejection Ratio VCC = ±2V to ±3V Large Signal Voltage Gain High Level Output Voltage Low Level Output Voltage Output Source Current Output Sink Current Supply Current Unity gain - no load Gain Bandwidth Product f = 100kHz Slew Rate AV = 1, Vin = ±1V Phase Margin at Unity Gain Gain Margin Equivalent Input Noise Voltage f = 100kHz Total Harmonic Distortion f = 1kHz, A V = -1 R L = 10kΩ R L = 2kΩ, CL = 100pF R L = 2kΩ, CL = 100pF R L = 2kΩ, CL = 100pF 8.5 2.8 R L = 2kΩ R L = 2kΩ RL = 2kΩ -1.35 60 60 70 2 Parameter Min. Typ. 1 Max. 5 7 Unit mV µV/ C nA 10 200 200 ±1.5 85 dB 70 80 2.4 -2.4 1.5 100 2 12 V/µs 4 60 10 4 0.003 Degrees dB nV  Hz √ % 2.8 MHz -2 dB V V mA mA mA 150 nA 750 1000 1.35 V dB o 5 Vicm CMR SVR Avd VOH VOL Isource Isink ICC GBP SR ∅m Gm en THD 3/12 TS971-TS972-TS974 INPUT OFFSET VOLTAGE DISTRIBUTION VOLTAGE GAIN & PHASE vs FREQUENCY VOLTAGE GAIN & PHASE vs FREQUENCY THD vs Vout THD vs Vout THD vs FREQUENCY 4/12 TS971-TS972-TS974 NOISE VOLTAGE vs FREQUENCY GAIN BANDWIDTH PRODUCT vs Iout PHASE MARGIN vs Iout PHASE MARGIN vs VCC PHASE MARGIN vs VCC GAIN MARGIN vs VCC 5/12 TS971-TS972-TS974 TS972IN PACKAGE MECHANICAL DATA 8 PINS - PLASTIC DIP Dimensions A a1 B b b1 D E e e3 Min. 0.51 1.15 0.356 0.204 7.95 Millimeters Typ. 3.32 Max. Min. 0.020 0.045 0.014 0.008 0.313 Inches Typ. 0.131 Max. 1.65 0.55 0.304 10.92 9.75 2.54 7.62 0.065 0.022 0.012 0.430 0.384 0.100 0.300 6/12 TS971-TS972-TS974 TS971ID - TS972ID PACKAGE MECHANICAL DATA 8 PINS - PLASTIC MICROPACKAGE (SO) Dimensions A a1* a2 a3 b b1 C c1 D E e e3 F L M S Min. 0.1 0.65 0.35 0.19 0.25 4.8 5.8 Millimeters Typ. Max. 1.75 0.25 1.65 0.85 0.48 0.25 0.5 45 (typ.) 5.0 6.2 o Min. 0.004 0.026 0.014 0.007 0.010 0.189 0.228 Inches Typ. Max. 0.069 0.010 0.065 0.033 0.019 0.010 0.020 0.197 0.244 1.27 3.81 3.8 0.4 4.0 1.27 0.6 8 (max.) o 0.050 0.150 0.150 0.016 0.157 0.050 0.024 * coplanarity between all the leads : 0.1mm 7/12 TS971-TS972-TS974 TS972IPT PACKAGE MECHANICAL DATA 8 PINS - THIN SHRINK SMALL OUTLINE PACKAGE (TSSOP) Dim. A A1 A2 b c D E E1 e k l Millimeters Min. 0.05 0.80 0.19 0.09 2.90 4.30 0o 0.50 0.60 3.00 6.40 4.40 0.65 8o 0.75 0o 0.09 4.50 0.169 1.00 Typ. Max. 1.20 0.15 1.05 0.30 0.20 3.10 0.01 0.031 0.007 0.003 0.114 Min. Inches Typ. Max. 0.05 0.006 0.039 0.041 0.15 0.012 0.118 0.252 0.173 0.025 8o 0.0236 0.030 0.177 0.122 8/12 TS971-TS972-TS974 TS974IN PACKAGE MECHANICAL DATA 14 PINS - PLASTIC DIP Dim. a1 B b b1 D E e e3 Millimeters Min. 0.51 1.39 0.5 0.25 20 8.5 2.54 15.24 1.65 Typ. Max. Min. 0.020 0.055 Inches Typ. Max. 0.065 0.020 0.010 0.787 0.335 0.100 0.600 9/12 TS971-TS972-TS974 TS974ID PACKAGE MECHANICAL DATA 14 PINS - PLASTIC MICROPACKAGE (SO) Dim. A a1 a2 b b1 C c1 D E e e3 F G L M S Min. 0.1 0.35 0.19 Millimeters Typ. Max. 1.75 0.2 1.6 0.46 0.25 45o (typ.) Min. 0.004 0.014 0.007 Inches Typ. Max. 0.069 0.008 0.063 0.018 0.010 0.5 8.55 5.8 1.27 7.62 3.8 4.6 0.5 4.0 5.3 1.27 0.68 8 (max.) o 0.020 8.75 6.2 0.336 0.228 0.050 0.300 0.150 0.181 0.020 0.157 0.208 0.050 0.027 0.334 0.244 10/12 TS971-TS972-TS974 TS974IPT PACKAGE MECHANICAL DATA 14 PINS - THIN SHRINK SMALL OUTLINE PACKAGE (TSSOP) Dim. A A1 A2 b c D E E1 e k l Millimeters Min. 0.05 0.80 0.19 0.09 4.90 4.30 0o 0.50 0.60 5.00 6.40 4.40 0.65 8o 0.75 0o 0.09 4.50 0.169 1.00 Typ. Max. 1.20 0.15 1.05 0.30 0.20 5.10 0.01 0.031 0.007 0.003 0.192 Min. Inches Typ. Max. 0.05 0.006 0.039 0.041 0.15 0.012 0.196 0.252 0.173 0.025 8o 0.0236 0.030 0.177 0.20 11/12 TS971-TS972-TS974 TS971ILT PACKAGE MECHANICAL DATA 5 PINS -TINY PACKAGE (SOT23) A E A2 D b A1 E1 C L Dim. A A1 A2 b C D E E1 L Millimeters Min. 0.90 0 0.90 0.35 0.09 2.80 2.60 1.50 0.10 Max. 1.45 0.15 1.30 0.50 0.20 3.00 3.00 1.75 0.60 Min. 0.034 0.034 0.013 0.003 0.110 0.102 0.059 0.003 Inches Max. 0.057 0.006 0.051 0.020 0.008 0.118 0.118 0.069 0.024 Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infri ngement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publ ication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for useas critical components inlife support devices or systems without express written approval of STMicroelectronics. © The ST logo is a trademark of STMicroelectronics © 1999 STMicroelectronics – Printed in Italy – All Rights Reserved STMicroelectronics GROUP OF COMPANIES Australia - Brazil - China - Finland - France - Germany - Hong Kong - India - Italy - Japan - Malaysia - Malta - Morocco Singapore - Spain - Sweden - Switzerland - United Kingdom - U.S.A. © http://www.st.com 12/12
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