VNQ600-E

VNQ600 Quad channel high side solid state relay Features Max supply voltage VCC 36V Max On-state resistance RON 35mΩ(1) Current limitation (typ.) ILIM 25A ) s ( ct 1. Per each channel. u d o SO-28 (double island) ■ DC short circuit current: 25A ■ CMOS compatible inputs ■ Proportional load current sense. ■ Undervoltage & overvoltage shutdown ■ Overvoltage clamp ■ Thermal shutdown ■ Current limitation ■ Very low standby power dissipation ■ Protection against: – Loss of ground & loss of VCC ■ u d o ) s ( ct Reverse battery protection (a) r P e t e l o r P Description e t e l o s b -O The VNQ600 is a quad HSD formed by assembling two VND600 chips in the same SO-28 package. The VNQ600 is a monolithic device designed in| STMicroelectronics VIPower M0-3 Technology. The VNQ600 is intended for driving any type of multiple loads with one side connected to ground. This device has four independent channels and four analog sense outputs which deliver currents proportional to the outputs currents. Active current limitation combined with thermal shutdown and automatic restart protect the device against overload. Device automatically turns off in case of ground pin disconnection. s b O a. See Application schematic on page 17 Table 1. Device summary Order codes Package SO-28 (double island) November 2008 Tube Tape and reel VNQ600 VNQ60013TR Rev 10 1/26 www.st.com 26 Contents VNQ600 Contents 1 Block diagram and pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 2 Electrical specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 3 2.1 Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 2.2 Thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 2.3 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 2.4 Electrical characteristics curves . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Application information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 3.1 4 Solution 1: a resistor in the ground line (RGND only) . . . . . . . . . . . . . . 17 3.1.2 Solution 2: a diode (DGND) in the ground line . . . . . . . . . . . . . . . . . . . . 18 t e l o Load dump protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 3.3 MCU I/O protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 3.4 Maximum demagnetization energy (VCC = 13.5V) . . . . . . . . . . . . . . . . . 19 ) (s s b O t c u SO-28 thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 d o r Package and packing information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 P e 5.1 ECOPACK® packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 let SO-28 packing information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 5.2 o s b 2/26 r P e 3.1.1 Package and PCB thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 5 O u d o GND protection network against reverse battery . . . . . . . . . . . . . . . . . . . 17 3.2 4.1 6 ) s ( ct Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 VNQ600 List of tables List of tables Table 1. Table 2. Table 3. Table 4. Table 5. Table 6. Table 7. Table 8. Table 9. Table 10. Table 11. Table 12. Table 13. Table 14. Table 15. Table 16. Device summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Suggested connections for unused and not connected pins . . . . . . . . . . . . . . . . . . . . . . . . 6 Absolute maximum rating . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Thermal data (per island) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Power . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Protections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Switching (VCC=13V; Tj = 25°C) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Current sense (9V< VCC< 16V) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Logic inputs. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 VCC - output diode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Truth table. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Electrical transient requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Thermal calculation according to the PCB heatsink area . . . . . . . . . . . . . . . . . . . . . . . . . . 20 Thermal parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 SO-28 mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 Document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 ) s ( ct u d o r P e t e l o ) (s s b O t c u d o r P e t e l o s b O 3/26 List of figures VNQ600 List of figures Figure 1. Figure 2. Figure 3. Figure 4. Figure 5. Figure 6. Figure 7. Figure 8. Figure 9. Figure 10. Figure 11. Figure 12. Figure 13. Figure 14. Figure 15. Figure 16. Figure 17. Figure 18. Figure 19. Figure 20. Figure 21. Figure 22. Figure 23. Figure 24. Figure 25. Figure 26. Figure 27. Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Configuration diagram (top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Current and voltage conventions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 IOUT/ISENSE versus IOUT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Switching characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Off state output current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 High level input current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Input clamp voltage. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Turn-on voltage slope . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Overvoltage shutdown . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Turn-off voltage slope . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 ILIM vs Tcase. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 On state resistance vs VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Input high level . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Input hysteresis voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 On state resistance vs Tcase . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Input low level . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Application schematic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 Maximum turn-off current versus load inductance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 SO-28 PC board . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 Rthj-amb Vs PCB copper area in open box free air condition . . . . . . . . . . . . . . . . . . . . . . 21 Thermal impedance junction ambient single pulse . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 Thermal fitting model of a quad channel HSD in SO-28 . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 SO-28 package dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 SO-28 tube shipment (no suffix) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 SO-28 tape and reel shipment (suffix “TR”) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 ) s ( ct u d o r P e t e l o ) (s t c u d o r P e t e l o s b O 4/26 s b O VNQ600 1 Block diagram and pin description Block diagram and pin description Figure 1. Block diagram VCC 1,2 OVERVOLTAGE UNDERVOLTAGE DEMAG 1 ) s ( ct DRIVER 1 OUTPUT 1 INPUT 1 ILIM1 LOGIC IOUT1 INPUT 2 o r P DEMAG 2 DRIVER 2 GND 1,2 e t e ol IOUT2 OVERTEMP. 2 u d o INPUT 3 Pr INPUT 4 e t e l s ( t c b O K s b O OVERVOLTAGE OUTPUT 2 CURRENT SENSE 2 VCC 3,4 UNDERVOLTAGE DEMAG 3 DRIVER 3 OUTPUT 3 ILIM3 LOGIC IOUT3 K CURRENT SENSE 3 DEMAG 4 DRIVER 4 GND 3,4 so CURRENT SENSE 1 ILIM2 OVERTEMP. 1 )- du K OUTPUT 4 ILIM4 OVERTEMP. 3 OVERTEMP. 4 IOUT4 K CURRENT SENSE 4 5/26 Block diagram and pin description Figure 2. VNQ600 Configuration diagram (top view) VCC1,2 1 28 VCC1,2 GND 1,2 OUTPUT 2 INPUT2 OUTPUT 2 INPUT1 OUTPUT 2 CURRENT SENSE 1 OUTPUT 1 CURRENT SENSE 2 OUTPUT 1 VCC1,2 OUTPUT 1 VCC3,4 OUTPUT 4 GND 3,4 OUTPUT 4 INPUT4 OUTPUT 4 INPUT3 OUTPUT 3 u d o r P e CURRENT SENSE 3 OUTPUT 3 CURRENT SENSE 4 VCC3,4 let 14 15 o s b Table 2. t(s Current sense uc Floating od To ground r P e s b O 6/26 O ) OUTPUT 3 VCC3,4 Suggested connections for unused and not connected pins Connection / pin t e l o ) s ( ct Through 1KΩ resistor N.C. Output Input X X X X Through 10KΩ resistor VNQ600 Electrical specifications 2 Electrical specifications 2.1 Absolute maximum ratings Stressing the device above the rating listed in the “Absolute maximum ratings” table may cause permanent damage to the device. These are stress ratings only and operation of the device at these or any other conditions above those indicated in the Operating sections of this specification is not implied. Exposure to Absolute Maximum Rating conditions for extended periods may affect device reliability. Refer also to the STMicroelectronics SURE Program and other relevant quality document. Table 3. Absolute maximum rating Symbol Parameter VCC Supply voltage (continuous) 41 -VCC Reverse supply voltage (continuous) IOUT Output current (continuous), for each channel Reverse output current (continuous), for each channel IIN Input current s b O V V 15 A -15 A +/- 10 mA -3 +15 V V Ground current at Tpins < 25 °C (continuous) -200 mA VESD Electrostatic discharge (Human Body Model: R=1.5KΩ; C=100pF) - INPUT - CURRENT SENSE - OUTPUT - VCC 4000 2000 5000 5000 V V V V Maximum switching energy (L=0.11mH; RL=0Ω; Vbat=13.5V; Tjstart=150ºC; IL=40A) 126 mJ Power dissipation (per island) at Tlead=25°C 6.25 W Internally limited °C -55 to 150 °C ) (s ct u d o r P e t e l o O e t e ol Pr Unit IGND EMAX bs u d o -0.3 IR VCSENSE Current sense maximum voltage ) s ( ct Value Ptot Tj Tstg Junction operating temperature Storage temperature 7/26 Electrical specifications 2.2 VNQ600 Thermal data Table 4. Thermal data (per island) Symbol Parameter Value Unit 20 °C/W Rthj-lead Thermal resistance junction-lead Rthj-amb Thermal resistance junction-ambient (one chip ON) 60(1) 45(2) °C/W Rthj-amb Thermal Resistance junction-ambient (two chips ON) 46(1) 31(2) °C/W 1. When mounted on a standard single-sided FR-4 board with 0.5cm2 of Cu (at least 35 µm thick) connected to all VCC pins. Horizontal mounting and no artificial air flow. ) s ( ct 2. When mounted on a standard single-sided FR-4 board with 6cm2 of Cu (at least 35 µm thick) connected to all VCC pins. Horizontal mounting and no artificial air flow. 2.3 u d o Electrical characteristics r P e Values specified in this section are for 8V