X00619MA2AL2

X00619 Datasheet 0.8 A - 600 V sensitive gate SCR Features A G K K TO-92 (preform) G A TO-92 (straight) K G A A G A K SOT-223 • On-state rms current, IT(RMS) 0.8 A • • • Repetitive peak off-state voltage 600 V Triggering gate current from 30 to 200 μA ECOPACK2 compliant Applications • • • • • • Limited gate current topologies Ground fault circuit interrupters Overvoltage crowbar protection in power supplies Protection in electronic ballasts Capacitive discharge ignitions Ignitors (lighting, oven...) Description The X00619 SCR can be used as on/off function in applications where topology does not offer high current for gate triggering. This device is optimized in forward voltage drop and inrush current capabilities for reduced power losses and high reliability in harsh environments. Product status link TO92 straight leads (bulk packing) TO92 leads preform X00619 (tape and reel or ammopack packing) SOT-223 (tape and reel packing) Product summary IT(RMS) up to 0.8 A VDRM/VRRM 600 V IGT From 30 to 200 µA Tjmax. 125 °C DS6289 - Rev 4 - December 2021 For further information contact your local STMicroelectronics sales office. www.st.com X00619 Characteristics 1 Characteristics Table 1. Absolute maximum ratings (limiting values, Tj = 25 °C unless otherwise specified) Symbol IT(RMS) IT(AV) ITSM I2t dl/dt IGM PG(AV) Tstg Tj Parameters On-state RMS current (180° conduction angle) Average on-state current (180° conduction angle) 0.8 A 0.5 A Tamb = 107 °C TL = 83 °C TO-92 SOT-223 Unit TL = 83 °C TO-92 SOT-223 Value Tamb = 107 °C Non repetitive surge peak on-state current, tp = 8.3 ms Tj initial = 25 °C tp = 10 ms I2t value for fusing tp = 10 ms Tj = 25 °C 0.4 A2s F = 60 Hz Tj = 125 °C 50 A/µs tp = 20 µs Tj = 125 °C 1 A Tj = 125 °C 0.1 W Storage junction temperature range -40 to +150 °C Operating junction temperature range -40 to +125 °C Critical rate of rise of on-state current IG = 2 x IGT , tr ≤ 100 ns Peak gate current Average gate power dissipation 10 Tj = 25 °C A 9 Table 2. Electrical characteristics (Tj = 25 °C, unless otherwise specified) Symbol IGT Parameters Value VD = 12 V, RL = 140 Ω VGT Unit Min. 30 Max. 200 Max. 0.8 V V µA VGD VD = VDRM, RL = 3.3 kΩ, RGK = 1 kΩ, Tj = 125 °C Min. 0.2 VRG IRG = 10 µA Min. 5 IH IT = 50 mA, RGK = 1 kΩ Max. 5 mA IL IG = 1 mA, RGK = 1 kΩ Max. 6 mA VD = 67 % VDRM, RGK = 1 kΩ, Tj = 125 °C Min. 40 V/µs Value Unit dV/dt Table 3. Static electrical characteristics Symbol DS6289 - Rev 4 Test conditions VTM ITM = 1 A, tp = 380 µs 25 °C Max. 1.35 V VTO Threshold on-state voltage 125 °C Max. 0.85 V Rd Dynamic resistance 125 °C Max. 245 mΩ IDRM VDRM = VRRM, RGK = 1 kΩ 25 °C IRRM VDRM = VRRM, RGK = 1 kΩ 125 °C Max. 1 100 µA page 2/13 X00619 Characteristics Table 4. Thermal resistance Symbol Max. value Parameters Rth(j-l) Junction to leads (DC) TO-92 70 Rth(j-c) Junction to case (DC) SOT-223 30 Junction to ambient (DC) TO-92 150 SOT-223 60 Rth(j-a) Junction to ambient (DC) S(1) = 5 cm2 Unit °C/W 1. S = Copper surface under tab. DS6289 - Rev 4 page 3/13 X00619 Characteristics (curves) 1.1 Characteristics (curves) Figure 1. Maximum average power dissipation versus average on-state current P(W) 0.6 Figure 2. Average and DC on-state current versus case temperature (SOT-223) IT(AV) (A) 1.0 SOT-223 α = 30°, 60°, 90°, 120°, 180°, DC α = 30°, 60°, 90°, 120°, 180°, DC 0.8 0.4 0.6 0.4 0.2 360° IT(AV) (A) 0.2 Tc (°C) α 0.0 0.0 0.0 0.1 0.2 0.3 0.4 0.5 Figure 3. Average and DC on-state current versus lead temperature (TO-92) IT(AV) (A) 1.0 0 0.6 50 75 125 IT(AV) (A) α = 30°, 60°, 90°, 120°, 180°, DC DC 0.8 0.8 0.6 0.6 0.4 0.4 0.2 100 Figure 4. Average and DC on-state current versus ambient temperature (free air convection) 1.0 TO-92 25 SOT-223 SCU= 5 cm² 0.2 α = 180° Tl (°C) TO-92 Tamb (°C) 0.0 0.0 0 25 50 75 100 125 Figure 5. Relative variation of thermal impedance junction to ambient versus pulse duration 1.00 0 25 50 75 100 125 Figure 6. Relative variation of gate trigger, holding and latching current versus junction temperature IGT,IH,IL [T j ] / IGT,IH,IL [T j =25°C] Zth(j-a) /Rth(j-a) 1.6 Typical values 1.4 TO-92 1.2 SCU= 0.5 cm² 1.0 0.10 0.8 SOT-223 IH and IL 0.6 0.4 0.2 t p (s) 0.01 1.0E-02 DS6289 - Rev 4 1.0E-01 1.0E+00 1.0E+01 IGT 1.0E+02 1.0E+03 Tj (°C) 0.0 -40 -20 0 20 40 60 80 100 120 page 4/13 X00619 Characteristics (curves) Figure 7. Relative variation of holding current versus gate-cathode resistance (typical values) IH[R GK ] / IH[ RGK =1kΩ] 3.5 Figure 8. Relative variation of static dV/dt immunity versus gate-cathode resistance (typical values) dV/dt[R GK ] / dV/dt[R GK =1kΩ] 100.0 VD = 0.67xVDRM 3.0 2.5 10.0 2.0 1.5 1.0 1.0 0.5 RGK (kΩ) RGK (kΩ) 0.0 1.E-02 1.E-01 0.1 1.E+00 1.E+01 Figure 9. Relative variation of static dV/dt immunity versus gate-cathode capacitance (typical values) dV/dt[C GK ] / dV/dt[R GK =1kΩ] 100 1.0E-01 1.E+02 RGK = 1 kΩ 1.0E+01 Figure 10. Surge peak on-state current versus number of cycles 10 VD = 0.67xVDRM 1.0E+00 ITSM(A) 9 Non repetitive 8 Tj initial=25 °C tp=10ms One cycle 7 6 5 10 Repetitive 4 TC = 83°C 3 2 0 1 1 10 Figure 11. Non-repetitive surge peak on-state current for sinusoidal pulse (tp< 10 ms) 100 Number of cycles 1 CGK (nF) 1 100 1000 Figure 12. On-state characteristics (maximum values) 10.0 ITSM(A) 10 ITM(A) Tj initial=25 °C ITSM 10 1.0 TJ=125 C 1 TJ=25 C t p(ms) 0 0.01 DS6289 - Rev 4 VTM(V) 0.10 T j max Vto =0.85 V Rd =245 mΩ 0.1 1.00 10.00 0.5 1.0 1.5 2.0 2.5 3.0 page 5/13 X00619 Characteristics (curves) Figure 13. Thermal resistance junction to ambient versus copper surface under tab Rth(j-a) (°C/W) 130 120 110 100 90 80 70 60 50 40 30 20 10 0 0.0 DS6289 - Rev 4 Epoxy printed circuit board FR4, copper thickness = 35 µm S(cm²) 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 page 6/13 X00619 Package information 2 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: www.st.com. ECOPACK is an ST trademark. 2.1 TO-92 package information • • Lead free plating + halogen-free molding resin Epoxy meets UL94, V0 Figure 14. TO-92 with straight leads (plastic) package outline c A a B C b D F E Table 5. TO-92 with straight leads (plastic) package mechanical data Dimensions Inches(1) Millimeters Ref. Min. A Typ. Max. Min. 1.35 B Typ. 0.048 4.70 C Max. 0.190 2.54 0.100 D 4.40 0.172 E 12.70 0.554 F 3.70 0.152 a 0.50 0.022 b 1.27 c 0.050 0.48 0.019 1. Inches dimensions given for information DS6289 - Rev 4 page 7/13 X00619 TO-92 with leads preform (plastic) package information 2.2 TO-92 with leads preform (plastic) package information • • Lead free plating + halogen-free molding resin Epoxy meets UL94, V0 Figure 15. TO-92 with leads preform (plastic) package outline Table 6. TO-92 with leads preform (plastic) package mechanical data Dimensions Inches(1) Millimeters Ref. Min. Typ. Max. Min. Typ. Max. G 1.30 1.70 2.00 0.051 0.067 0.079 H 7.69 9.69 0.303 0.381 d 2.40 2.90 0.094 0.114 θ 30° 50° 30° 40° 40° 50° 1. Inches dimensions given for information DS6289 - Rev 4 page 8/13 X00619 SOT-223 package information 2.3 SOT-223 package information • • Epoxy meets UL94, V0 Lead free plating + halogen-free molding resin Figure 16. SOT-223 package outline V A A1 c B e1 D B1 4 H E 1 2 3 e DS6289 - Rev 4 page 9/13 X00619 SOT-223 package information Table 7. SOT-223 package mechanical data Dimensions Inches(1) Millimeters Ref. Min. Typ. A Max. Min. Typ. 1.80 A1 0.02 0.10 Max. 0.0709 0.0008 0.0039 B 0.60 0.70 0.85 0.024 0.0276 0.0335 B1 2.90 3.00 3.15 0.114 0.1181 0.1240 c 0.24 0.26 0.35 0.009 0.0102 0.0138 D 6.30 6.50 6.70 0.248 0.2559 0.2638 e 2.3 0.0906 e1 4.6 0.1811 E 3.30 3.50 3.70 H 6.70 7.00 7.30 V 0.130 0.1378 0.1457 0.264 0.2756 0.2874 10° max. 1. Inches only for reference Figure 17. SOT-223 footprint (dimensions in mm) 3.25 1.32 5.16 7.80 1.32 2.30 DS6289 - Rev 4 0.95 page 10/13 X00619 Ordering information 3 Ordering information Figure 18. Ordering information scheme X 006 19 M A 1AA2 Sensitive SCR series Current 006 = 0.8 A Sensitivity 19 = 30 µA to 200 µA Voltag e M = 600 V Package A = TO-92 N = SOT-223 Packing mode 1AA2 = Bulk (TO-92 with straight leads) 2AL2 = Ammopack (TO-92 with leads preform) 5AL2 = Tape and reel (TO-92 with leads preform and SOT-223) Table 8. Ordering information Order code Marking X00619MA1AA2 X00619MA2AL2 X0619 MA X00619MA5AL2 X00619MN5AL2 DS6289 - Rev 4 X0 619 MN Package Weight Base qty. Delivery mode TO-92 straight leads 0.2 g 2500 Bulk 0.2 g 2000 Ammopack 0.2 g 2000 0.12 g 1000 TO-92 leads preform SOT-223 Tape and reel page 11/13 X00619 Revision history Table 9. Document revision history DS6289 - Rev 4 Date Revision Changes 26-May-2009 1 First issue. 03-May-2012 2 Added SOT-223 package. 03-Sep-2021 3 Inserted TO-92 with leads preform package. 20-Dec-2021 4 Updated Figure 10 and Figure 11. page 12/13 X00619 IMPORTANT NOTICE – PLEASE READ CAREFULLY STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement. Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers’ products. No license, express or implied, to any intellectual property right is granted by ST herein. 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