X0202DA5BL2

X02 1.25 A sensitive gate SCR Features A ■ on-state rms current: 1.25 A ■ repetitive peak off-state voltage: 600 V and 800 V ■ G K gate triggering current: 50 and 200 µA A Applications ground fault circuit interrupters ■ overvoltage crowbar protection in power supplies ■ A G ■ A K K TO-92 X02xxA SOT-223 X02xxN capacitive ignition circuits Description A The X02 SCR can be used as the on/off function in applications where topology does not offer high current for gate triggering. K G This device is optimized in forward voltage drop and inrush current capabilities for reduced power losses and high reliability in harsh environments. Table 1. G SMBflat-3L X0202NUF Device summary Voltage Order code 600 V Sensitivity µA Package 800 V X0202MA Y 200 TO-92 X0202MN Y 200 SOT-223 X0202NA Y 200 TO-92 X0202NN Y 200 SOT-223 50 TO-92 X0205MA Y X0205NA Y 50 TO-92 X0202NUF Y 200 SMBflat-3L January 2011 Doc ID 7480 Rev 4 1/11 www.st.com 11 Characteristics X02 1 Characteristics Table 2. Absolute ratings (limiting values, TJ = 25 °C unless otherwise specified) Symbol IT(RMS) Parameter On-state rms current (180 °Conduction angle) TO-92 TL = 63 °C SOT-223 Ttab = 99 °C Value Unit 1.25 A 0.8 A SMBflat-3L Ttab = 111 °C IT(AV) Average on-state current (180 °Conduction angle) TO-92 TL = 63 °C SOT-223 Ttab = 99 °C SMBflat-3L Ttab = 111 °C ITSM I²t tp = 8.3 ms Non repetitive surge peak on-state current tp = 10 ms 25 Tj = 25 °C A 22.5 I²t Value for fusing tp = 10 ms Tj = 25 °C 2.5 A2s di/dt Critical rate of rise of on-state current IG = 2 x IGT , tr ≤ 100 ns F = 60 Hz Tj = 125 °C 50 A/µs IGM Peak gate current tp = 20 µs Tj = 125 °C 1.2 A Tj = 125 °C 0.2 W - 40 to + 150 - 40 to + 125 °C PG(AV) Tstg Tj Average gate power dissipation Storage junction temperature range Operating junction temperature range Table 3. Electrical characteristics (TJ = 25 °C unless otherwise specified) Symbol Test conditions X0202 X0205 Min. IGT Unit 20 µA VD = 12 V, RL = 140 Ω Max. VGT 50 Max. 0.8 V Min. 0.1 V VGD VD = VDRM, RL = 3.3 kΩ , RGK = 1 kΩ VRG IRG = 10 µA Min. 8 V IH IT = 50 mA, RGK = 1 kΩ Max. 5 mA IL IG = 1 mA, RGK = 1 kΩ Max. 6 mA dV/dt Table 4. VD = 67% VDRM, RGK = 1 kΩ 2/11 Tj = 110 °C Min. 10 15 V/µs X0202 X0205 Unit Static electrical characteristics Symbol Test conditions VTM ITM = 2.5 A, tp = 380 µs VTO Threshold voltage Rd Dynamic resistance IDRM IRRM Tj = 125 °C 200 VDRM = VRRM, RGK = 1 kΩ Tj = 25 °C 1.45 V 0.9 V 200 mΩ Tj = 25 °C 5 µA Tj = 125 °C 500 µA Tj = 125 °C Doc ID 7480 Rev 4 Max. X02 Characteristics Table 5. Thermal resistances Symbol Parameter Value Rth(j-l) Junction to leads (DC) TO-92 60 Rth(j-t) Junction to tab (DC) SOT-223 25 Rth(j-t) Junction to tab (DC) SMBflat-3L Junction to ambient (DC) Figure 1. 1.2 14 Max. Rth(j-a) S = 5 cm2 Maximum average power dissipation versus average on-state current (full cycle) Figure 2. P(W) 1.4 °C/W TO-92 150 SOT-223 60 SMBflat-3L 75 Average and DC on-state current versus tab (SOT-223, SMBflat-3L) or lead (TO-92) temperature IT(AV)(A) D.C. (SMBflat-3L) 360° α = 180° 1.2 D.C. (TO-92) 1.0 D.C. (SOT-223) 1.0 α 0.8 Unit 0.8 α = 180° (TO-92) 0.6 0.6 0.4 IT(AV)(A) 0.0 0.2 α = 180° (SMBflat-3L) Tlead or Ttab (°C) 0.0 0 0.1 Figure 3. 1.4 α = 180° (SOT-223) 0.4 0.2 0.2 0.3 0.4 0.5 0.6 0.7 0.8 Average and DC on-state current versus ambient temperature 0 Figure 4. 25 50 75 100 125 Relative variation of thermal impedance junction to ambient versus pulse duration K=[Zth(j-a)/Rth(j-a)] IT(AV)(A) 1.00 1.2 TO-92 D.C. (SOT-223) SMBflat-3L D.C. (SMBflat-3L) 1.0 0.8 D.C. (TO-92) 0.10 0.6 SOT-223 α = 180° (TO-92) 0.4 α = 180° (SOT-223) 0.2 α = 180° (SMBflat-3L) Tamb(°C) tp(s) 0.0 0 25 50 75 100 125 0.01 1.E-02 1.E-01 1.E+00 1.E+01 1.E+02 1.E+03 1.E+04 1.E+05 Doc ID 7480 Rev 4 3/11 Characteristics Figure 5. X02 Relative variation of triggering, Figure 6. holding and latching current versus junction temperature Relative variation of holding current versus gate-cathode resistance (typical values) IGT,IH,IL[Tj] / IGT,IH,IL[Tj=25°C] 1.50 IH[RGK] / IH[RGK=1kΩ] Typical values 4.0 1.25 Tj=25 3.5 3.0 1.00 2.5 0.75 IH & IL RGK = 1kΩ 2.0 1.5 0.50 1.0 IGT 0.5 0.25 0.00 -40 -20 Figure 7. 0 20 40 RGK(kΩ) 0.0 1.E-02 Tj(°C) 60 80 100 120 1.E-01 1.E+00 1.E+01 140 Relative variation of dV/dt immunity Figure 8. versus gate-cathode resistance (typical values) Relative variation of dV/dt immunity versus gate-cathode capacitance (typical values) dV/dt[CGK] / dV/dt[RGK=1kΩ] dV/dt[RGK] / dV/dt[RGK=1kΩ] 20 10.0 VD = 0.67 x VDRM Tj = 125°C RGK = 1kΩ 18 Tj = 125°C VD = 0.67 x VDRM 16 14 12 10 1.0 8 6 4 2 RGK(kΩ) CGK(nF) 0 0.1 0.0 0.2 Figure 9. 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 Surge peak on-state current versus number of cycles 0 2 4 6 8 10 12 14 16 18 20 22 Figure 10. Non repetitive surge peak on state current for a sinusoidal pulse and corresponding value of I2T ITSM(A), I2t (A2s) ITSM(A) 25 300 20 100 Tj initial = 25°C tp=10ms dI/dt limitation ITSM One cycle 15 Non repetitive Tj initial=25°C 10 10 Repetitive Tamb=25°C 5 I2t Number of cycles 1 4/11 tp(ms) 1 0 10 100 1000 0.01 Doc ID 7480 Rev 4 0.10 1.00 10.00 X02 Ordering information scheme Figure 11. On-state characteristics (maximum Figure 12. Thermal resistance junction to values) ambient versus copper surface under tab (SOT-223, SMBflat-3L) ITM(A) 170 160 150 140 130 120 110 100 90 80 70 60 50 3E+1 Tj max.: Vt0=0.9V Rd=200mΩ 1E+1 Tj=max 1E+0 Tj=25°C VTM(V) 1E-1 0.5 2 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 Rth(j-a)(°C/W) Epoxy printed circuit board FR4, copper thickness 35 µm SMBF3L (typical) SOT-223 (maximum) S(cm²) 0 1 2 3 4 5 Ordering information scheme Figure 13. Ordering information scheme X 02 02 M ZBlank 1BA2 Sensitive SCR series Current 02 = 1.25 A Sensitivity 02 = 200 µA 05 = 50 µA Voltage M = 600 V N = 800 V Package A = TO-92 (A"Blank") N = SOT-223 (N"No Blank”) UF = SMBF3L Packing mode 1BA2 = Bulk 2BL2 = Ammopack 5BA4 = Tape and reel 7” (SOT-223) Blank = Tape and reel 13” (SMBflat-3L) Doc ID 7480 Rev 4 5/11 Package information 3 X02 Package information ● Epoxy meets UL94, V0 ● Lead-free packages In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. Table 6. TO-92 dimensions Dimensions Ref Millimeters Min. Typ. Max. Inches Min. Typ. Max. A a B A 1.35 B C 4.70 C F 6/11 D E Doc ID 7480 Rev 4 0.053 0.185 2.54 0.100 D 4.40 0.173 E 12.70 0.500 F 3.70 0.146 a 0.50 0.019 X02 Package information Table 7. SOT-223 dimensions Dimensions Ref. V A A1 Millimeters Min. c Typ. A B A1 e1 Inches Max. Min. Typ. Max. 1.80 0.071 0.02 0.10 0.001 0.004 B 0.60 0.70 0.85 0.024 0.027 0.033 B1 2.90 3.00 3.15 0.114 0.118 0.124 c 0.24 0.26 0.35 0.009 0.010 0.014 (1) 6.30 6.50 6.70 0.248 0.256 0.264 D B1 D 4 H E 1 2 e 3 2.3 e1 0.090 4.6 0.181 E(1) 3.30 3.50 3.70 0.130 0.138 0.146 H 6.70 7.00 7.30 0.264 0.276 0.287 e V 10° max 1. Do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15mm (0.006inches) Figure 14. SOT-223 footprint 3.25 1.32 5.16 7.80 1.32 2.30 Doc ID 7480 Rev 4 0.95 7/11 Package information Table 8. X02 SMBflat-3L dimensions Dimensions Ref. A c e D b 2x L2 2x L 2x L1 E E1 Millimeters Inches Min. Typ. Max. Min. Typ. Max. A 0.90 1.10 0.035 0.043 b 0.35 0.65 0.014 0.026 b4 1.95 2.20 0.07 0.087 c 0.15 0.40 0.006 0.016 D 3.30 3.95 0.130 0.156 E 5.10 5.60 0.201 0.220 E1 4.05 4.60 0.156 0.181 L 0.75 1.50 0.030 0.059 L1 L L2 b4 L1 0.40 0.016 L2 0.60 0.024 e 1.60 0.063 Figure 15. SMBflat-3L footprint dimensions 5.84 (0.230) 0.51 (0.020) 2.07 (0.082) 2.07 (0.082) 0.51 (0.020) 1.20 (0.047) 3.44 (0.136) millimeters (inches) 8/11 Doc ID 7480 Rev 4 1.20 (0.047) X02 Package information Figure 16. Footprint and connectors for SOT-223 or SMBflat-3L (dimensions in mm) 5.84 3.42 3.25 1.19 1.32 1.50 2.92 SOT-223 Solder resist 1.35 1.20 1.08 Solder lands SMBF3L 7.80 2.07 2.22 SMBF3L 1.95 SMBF3L 2.07 0.61 0.51 0.46 1.30 1.20 1.08 Solder paste 1.47 1.32 1.19 Connector line SOT-223 SOT-223 SOT-223 0.85 0.95 1.10 2.30 Doc ID 7480 Rev 4 9/11 Ordering information 4 Ordering information Table 9. 5 Ordering information Order code Marking Package Weight Base qty Delivery mode X0202MA 1BA2 X0202 MA TO-92 0.2 g 2500 Bulk X0202MA 2BL2 X0202 MA TO-92 0.2 g 2000 Ammopack X0202MN5BA4 X2M SOT-223 0.12 g 1000 Tape and reel X0202NA 1BA2 X0202 NA TO-92 0.2 g 2500 Bulk X0202NA 2BL2 X0202 NA TO-92 0.2 g 2000 Ammopack X0202NN5BA4 X2N SOT-223 0.12 g 1000 Tape and reel X0205MA 1BA2 X0205 MA TO-92 0.2 g 2500 Bulk X0205MA 2BL2 X0205 MA TO-92 0.2 g 2000 Ammopack X0205NA 1BA2 X0205 NA TO-92 0.2 g 2500 Bulk X0202NUF X2N SMBflat-3L 46.914 mg 5000 Tape and reel Revision history Table 10. 10/11 X02 Document revision history Date Revision Changes Sep-2000 3 Previous issue 14-Jan-2011 4 Added SMBflat-3L package and ECOPACK statement. 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