A4K300-RE-10

FERRITE CHIP BEADS 4 LINE ARRAY (NORMAL USAGE) A4K SERIES 1. PART NO. EXPRESSION : A4K300-RE-10 (a)(b)(c) (d) (e) (f) (g) (a) Series code (b) Dimension code (c) Material code (d) Impedance code : 300 = 30 (e) R : Reel (f) Current code : E = 500mA (g) 10 : Lead Free 2. CONFIGURATION & DIMENSIONS : A J D2 G I L C H PCB Pattern D1 P B Unit:m/m D2 P G 0.80 Ref. H 0.40 Ref. I 0.80 Ref. J 2.80 Ref. L 2.20~2.60 A B C D1 3.20±0.20 1.60±0.20 0.90±0.20 0.40±0.15 0.20±0.10 0.80±0.10 3. SCHEMATIC : 4. MATERIALS : b a Ag(100%) Ni(100%)-1.5um(min.) Sn(100%)-3.0um(min.) (a) Body : Ferrite (b) Termination : Ag/Ni/Sn 5. GENERAL SPECIFICATION : a) Temp. rise : 30°C Max. b) Rated current : Base on temp. rise c) Storage temp. : -55°C to +125°C d) Operating temp. : -55°C to +125°C e) Resistance to solder heat : 260°C.10secs NOTE : Specifications subject to change without notice. Please check our website for latest information. 18.06.2008 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 1 FERRITE CHIP BEADS 4 LINE ARRAY (NORMAL USAGE) A4K SERIES 6. ELECTRICAL CHARACTERISTICS : Part Number A4K300-RE-10 A4K600-RD-10 A4K121-RD-10 A4K301-RC-10 A4K601-RB-10 A4K102-RB-10 Impedance () 30 ±25% 60 ±25% 120 ±25% 300 ±25% 600 ±25% 1000 ±25% Test Frequency ( MHz ) 100 100 100 100 100 100 DC Resistance () Max. 0.20 0.25 0.30 0.40 0.50 0.75 Rated Current ( mA ) Max. 500 400 350 250 200 150 NOTE : Specifications subject to change without notice. Please check our website for latest information. 18.06.2008 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 2 FERRITE CHIP BEADS 4 LINE ARRAY (NORMAL USAGE) A4K SERIES 7. IMPEDANCE VS. FREQUENCY CURVES : A4K300-RE-10 A4K600-RD-10 A4K121-RD-10 A4K301-RC-10 A4K601-RB-10 A4K102-RB-10 NOTE : Specifications subject to change without notice. Please check our website for latest information. 18.06.2008 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 3 FERRITE CHIP BEADS 4 LINE ARRAY (NORMAL USAGE) A4K SERIES 8. RELIABILITY & TEST CONDITION : ITEM Electrical Characteristics Test Impedance DC Resistance Rated Current Temperature Rise Test Solder Heat Resistance PERFORMANCE TEST CONDITION HP4291A, HP4287A+16192A HP4338B 1. Applied the allowed DC current. 2. Temperature measured by digital surface thermometer. Preheat : 150°C, 60sec. Solder : Sn-Ag3.0-Cu0.5 Solder Temperature : 260±5°C Flux for lead free : rosin Dip Time : 10±0.5sec. 260°C 150°C Refer to standard electrical characteristics list 30°C max. ( t) Appearance : No significant abnormality Impedance change : Within ±30% No mechanical damage Remaining terminal electrode : 70% Min. Preheating Dipping Natural cooling 60 seconds 10±0.5 seconds Solderability More than 90% of the terminal electrode should be covered with solder. Preheat : 150°C, 60sec. Solder : Sn-Ag3.0-Cu0.5 Solder Temperature : 230±5°C Flux for lead free : rosin Dip Time : 4±1sec. 230°C 150°C Preheating Dipping Natural cooling 60 seconds 4±1.0 seconds Terminal Strength The terminal electrode & the dielectric must not be damaged by the forces applied on the right conditions. For A Series : Size 4 Force (Kfg) 0.5 Time (sec) > 25 W W Flexture Strength The terminal electrode & the dielectric must not be damaged by the forces applied on the right conditions. 20(.787) Bending 45(1.772) 45(1.772) 40(1.575) Solder a chip on a test substrate, bend the substrate by 2mm (0.079in) and return. 100(3.937) NOTE : Specifications subject to change without notice. Please check our website for latest information. 18.06.2008 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 4 FERRITE CHIP BEADS 4 LINE ARRAY (NORMAL USAGE) A4K SERIES 8. RELIABILITY & TEST CONDITION : ITEM Loading at High Temperature PERFORMANCE Appearance : No damage. Impedance : Within ±30% of initial value. TEST CONDITION Temperature : 125±5°C Applied Current : rated current Duration : 500±12hrs Measured at room temperature after placing for 2 to 3hrs. Humidity : 90~95% RH. Temperature : 40±2°C Duration : 500±12hrs Measured at room temperature after placing for 2 to 3hrs. Humidity Thermal Shock Appearance : No damage. Impedance : Within ±30% of initial value. Phase 1 2 Temperature (°C) -55±2°C +125±5°C Times (min.) 30±3 30±3 For A Series : Condition for 1 cycle Step1 : -55±2°C 30±3 min. Step2 : +125±5°C 30±3 min. Number of cycles : 5 Measured at room temperature after placing for 2 to 3hrs. Temperature : -55±2°C Duration : 500±12hrs Measured at room temperature after placing for 2 to 3hrs. Measured : 5 times Low temperature storage test NOTE : Specifications subject to change without notice. Please check our website for latest information. 18.06.2008 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 5 FERRITE CHIP BEADS 4 LINE ARRAY (NORMAL USAGE) A4K SERIES 9. SOLDERING AND MOUNTING : 9-1. Recommended PC Board Pattern 2.8 PC board should be designed so that products are not sufficient under mechanical stress as warping the board. Products shall be positioned in the sideway direction against the mechanical stress to prevent failure. 2.2 - 2.6 0.8 0.8 0.4 9-2. Soldering Mildly activated rosin fluxes are preferred. The minimum amount of solder can lead to damage from the stresses caused by the difference in coefficients of expansion between solder, chip and substrate. The terminations are suitable for all wave and re-flow soldering systems. If hand soldering cannot be avoided, the preferred technique is the utilization of hot air soldering tools. 9-2.1 Lead Free Solder Re-flow : Recommended temperature profiles for re-flow soldering in Figure 1. 9-2.2 Solder Wave : Wave soldering is perhaps the most rigorous of surface mount soldering processes due to the steep rise in temperature seen by the circuit when immersed in the molten solder wave, typical at 230°C. Due to the risk of thermal damage to products, wave soldering of large size products is discouraged. Recommended temperature profile for wave soldering is shown in Fig. 2 9-2.3 Soldering Iron (Figure 3) : Products attachment with soldering iron is discouraged due to the inherent process control limitations. In the event that a soldering iron must be employed the following precautions are recommended. Note : d) 1.0mm tip diameter (max) a) Preheat circuit and products to 150°C. e) Use a 20 watt soldering iron with tip diameter of 1.0mm b) 350°C tip temperature (max) f) Limit soldering time to 3 secs. c) Never contact the ceramic with the iron tip Preheating Soldering Natural cooling Preheating Soldering Natural cooling TEMPERATURE °C 10s max. 250 ~ 260 230 180 150 TEMPERATURE °C 260 245 150 60~120s 30~60s Time(sec.) Figure 1. Re-flow Soldering Preheating Soldering 3s (max.) 10s (max.) Over 2min. Gradual Cooling Within 3s TEMPERATURE °C Natural cooling Figure 2. Wave Soldering 350 330 150 Over 1min. Gradual Cooling Figure 3. Hand Soldering NOTE : Specifications subject to change without notice. Please check our website for latest information. 18.06.2008 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 6 FERRITE CHIP BEADS 4 LINE ARRAY (NORMAL USAGE) A4K SERIES 9-3. Solder Volume Accordingly increasing the solder volume, the mechanical stress to product is also increased. Exceeding solder volume may cause the failure of mechanical or electrical performance. Solder shall be used not to be exceed as shown in Fig. 4. Upper limit Recommendable t Figure 4 NOTE : Specifications subject to change without notice. Please check our website for latest information. 18.06.2008 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 7 FERRITE CHIP BEADS 4 LINE ARRAY (NORMAL USAGE) A4K SERIES 10. PACKAGING INFORMATION : 10-1. Reel Dimension A Type 7" x 8mm D B C A(mm) 9.0±0.5 B(mm) 60.0±2.0 60.0±2.0 C(mm) D(mm) 13.5±0.5 178.0±2.0 13.5±0.5 178.0±2.0 7" x 12mm 13.5±0.5 2±0.5 13.5±0.5 R10.5 7" x 8mm 7" x 12mm R1.9 R0.5 120° 10-2 Tape Dimension / 8mm P2:2±0.05 E:1.75±0.1 Po:4±0.1 D:1.5+0.1 A W:8.0±0.1 t Series Size 1 Bo(mm) Ao(mm) Ko(mm) P(mm) 2.0±0.1 4.0±0.1 4.0±0.1 4.0±0.1 4.0±0.1 4.0±0.1 4.0±0.1 t(mm) 0.23±0.05 0.22±0.05 0.22±0.05 0.22±0.05 0.22±0.05 0.22±0.05 0.22±0.05 D1(mm) none none 1.0±0.1 1.0±0.1 1.0±0.1 1.0±0.1 1.0±0.1 1.12±0.05 0.67±0.05 0.54±0.05 1.80±0.10 1.01±0.10 1.02±0.10 2.25±0.10 1.42±0.10 1.04±0.10 2.35±0.10 1.50±0.10 1.45±0.10 3.50±0.10 1.88±0.10 1.27±0.10 3.42±0.10 2.77±0.10 1.55±0.10 3.40±0.10 1.77±0.10 1.04±0.10 F:3.5±0.05 2 Bo Z 3 (09) 3 (12) P A D1:1±0.1 Ao Ko Section A-A A 4 5 4 10-2.1 Tape Dimension / 12mm D:1.5+0.1 E:1.75±0.1 A W:12.0±0.1 Po:4±0.1 P2:2±0.05 t Series Size 6 Bo(mm) 4.95±0.1 4.95±0.1 6.10±0.1 Ao(mm) 1.93±0.1 3.66±0.1 5.40±0.1 Ko(mm) 1.93±0.1 1.85±0.1 2.00±0.1 P(mm) 4.0±0.1 8.0±0.1 8.0±0.1 t(mm) 0.24±0.05 0.24±0.05 0.30±0.05 D1(mm) 1.5±0.1 1.5±0.1 1.5±0.1 F:5.5±0.05 Bo Z 7 8 A D1:1.5±0.1 P Ao Ko Section A-A 10-3. Packaging Quantity Chip Size Chip / Reel Inner Box Middle Box Carton Bulk (Bags) 8 1000 4000 20000 40000 7000 7 1000 4000 20000 40000 12000 6 2000 8000 40000 80000 20000 5 2500 12500 62500 125000 30000 4 3000 15000 75000 150000 50000 3 (12) 2000 10000 50000 100000 100000 3 (09) 4000 20000 100000 200000 150000 2 4000 20000 100000 200000 200000 1 10000 50000 250000 500000 300000 NOTE : Specifications subject to change without notice. Please check our website for latest information. 18.06.2008 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 8 FERRITE CHIP BEADS 4 LINE ARRAY (NORMAL USAGE) A4K SERIES 10-4. Tearing Off Force F 165° to 180° Top cover tape The force for tearing off cover tape is 15 to 60 grams in the arrow direction under the following conditions. Room Temp. (°C) 5~35 Room Humidity (%) 45~85 Room atm (hPa) 860~1060 Tearing Speed (mm/min) 300 Base tape Application Notice 1. Storage Conditions : To maintain the solderabililty of terminal electrodes : a) Temperature and humidity conditions : -10 ~ 40°C and 30 ~ 70% RH. b) Recommended products should be used within 6 months from the time of delivery. c) The packaging material should be kept where no chlorine or sulfur exists in the air. 2. Transportation : a) Products should be handled with care to avoid damage or contamination from perspiration and skin oils. b) The use of tweezers or vacuum pick up is strongly recommended for individual components. c) Bulk handling should ensure that abrasion and mechanical shock are minimized. NOTE : Specifications subject to change without notice. Please check our website for latest information. 18.06.2008 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 9