SDL1108-R47MF

HIGH CURRENT POWER INDUCTORS 1. PART NO. EXPRESSION : SDL1108 SERIES SDL1108-R47MF (a) (b) (c) (d)(e) (a) Series code (b) Dimension code (c) Inductance code : R47 = 0.47uH (d) Tolerance code : M = ±20% (e) F : Lead Free 2. CONFIGURATION & DIMENSIONS : A F H B I R47 D C G PCB Pattern E Part No. SDL1108-R47MF SDL1108-R60MF SDL1108-1R0MF SDL1108-1R2MF SDL1108-1R5MF SDL1108-2R0MF mm A 12.0 Max. 12.0 Max. 12.0 Max. 12.5 Max. 12.0 Max. 12.0 Max. mm B 12.0 Max. 12.0 Max. 12.0 Max. 12.0 Max. 12.0 Max. 12.0 Max. mm C 8.5 Max. 8.5 Max. 8.5 Max. 8.5 Max. 8.5 Max. 8.5 Max. mm D 3.4±0.5 3.4±0.5 3.4±0.5 3.4±0.5 3.4±0.5 3.4±0.5 mm E 5.6±0.5 5.6±0.5 6.6±0.5 6.6±0.5 7.2±0.5 6.5±0.5 mm F 6.7±0.5 6.7±0.5 6.2±0.5 6.2±0.5 6.2±0.5 6.4±0.5 mm G 5.6±0.5 5.6±0.5 6.6±0.5 6.6±0.5 7.2±0.5 6.5±0.5 mm H 6.7±0.5 6.7±0.5 6.2±0.5 6.2±0.5 6.2±0.5 6.4±0.5 mm I 1.8 +0.2 1.8 +0.2 1.5 +0.2 1.5 +0.2 1.4 +0.2 1.2 +0.2 -0 -0 -0 -0 -0 -0 3. SCHEMATIC : 4. MATERIALS : (a) Core : Ferrite Core b (b) Wire : Enamelled Copper Wire a NOTE : Specifications subject to change without notice. Please check our website for latest information. 05.05.2008 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 1 HIGH CURRENT POWER INDUCTORS 5. GENERAL SPECIFICATION : a) Operating temp. : -55°C to +125°C b) Storage temp. : -55°C to +125°C c) Ambient temp. : 20°C d) Irms (A) : Will cause the coil temperature rise approximately T=40°C without core loss e) Isat (A) : Will cause L0 to drop approximately 20% typical SDL1108 SERIES f) Part temperature (ambient + temp. rise) : Should not exceed 125°C under worst case operating conditions 6. ELECTRICAL CHARACTERISTICS : Inductance L 0 ( µH ) 0.47±20% 0.60±20% 1.00±20% 1.20±20% 1.50±20% 2.00±20% Test Frequency ( Hz ) 0.25V / 100K 0.25V / 100K 0.25V / 100K 0.25V / 100K 0.25V / 100K 0.25V / 100K DCR (m ) ±8% 0.8 0.8 1.7 2.0 2.4 3.5 Irms (A) Max. 40 38 30 27 25 20 Isat (A) Max. 50 45 40 34 30 25 Part No. SDL1108-R47MF SDL1108-R60MF SDL1108-1R0MF SDL1108-1R2MF SDL1108-1R5MF SDL1108-2R0MF NOTE : Specifications subject to change without notice. Please check our website for latest information. 05.05.2008 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 2 HIGH CURRENT POWER INDUCTORS 7. CHARACTERISTICS CURVES : SDL1108-R47MF SW DL1108-R47MF SDL1108 SERIES SW DL1108-R60MF SDL1108-R60MF SDL1108-1R0MF SWDL1108-1R0MF SDL1108-1R2MF SWDL1108-1R2MF SDL1108-1R5MF SWDL1108-1R5MF SDL1108-2R0MF SWDL1108-2R0MF NOTE : Specifications subject to change without notice. Please check our website for latest information. 05.05.2008 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 3 HIGH CURRENT POWER INDUCTORS 8. RELIABILITY AND TEST CONDITION : SDL1108 SERIES ITEM Electrical Characteristics Test Inductance DCR Heat Rated Current (Irms) Saturation Current (Isat) Mechanical Performance Test Solderability Test PERFORMANCE Refer to standard electrical characteristics list TEST CONDITION HP4284A, CH11025, CH3302, CH1320, CH1320S LCR meter. CH16502, Agilent33420A Micro-Ohm Meter. Irms(A) will cause the coil temperature rise approximately T=40°C without core loss Isat(A) will cause Lo to drop approximately 20%. More than 90% of the terminal electrode should be covered with solder. 230°C Preheating Dipping Natural cooling 150°C 60 seconds 4±1 seconds After fluxing components shall be dipped in a melted solder bath at 230±5°C for 4 seconds. Solder Heat Resistance 1. Components should have no evidence of electrical & mechanical damage. 2. Inductance : Within ±20% of initial value. Preheat : 150°C, 60sec. Solder : Sn-Ag3.0-Cu0.5 Solder Temperature : 260±5°C Flux for lead free : rosin Dip Time : 10±0.5sec. Preheating 260°C Dipping Natural cooling 150°C 60 seconds 10±0.5 seconds Reliability Test High Temperature Life Test Temperature : 125±5°C Time : 500±12 hours Measure at room temperature after placing for 2 to 3 hrs. 1. Appearance : No damage 2. Inductance : Within ±20% of initial value. No disconnection or short circuit. Temperature : -40±5°C Time : 500±12 hours Measure at room temperature after placing for 2 to 3 hrs. Conditions of 1 cycle. Step 1 2 3 4 Temperature (°C) -55±3 Room Temperature 125±3 Room Temperature Times (min.) 30±3 Within 3 30±3 Within 3 Low Temperature Life Test Thermal Shock Total : 5 cycles Measure at room temperature after placing for 2 to 3 hrs. Humidity Resistance 1. Appearance : No damage 2. Inductance : Within ±20% of initial value. No disconnection or short circuit. Temperature : 40±5°C Humidity : 90% to 95% Applied Current : Rated Curent Time : 500±12 hours Measure at room temperature after placing for 2 to 3 hrs. NOTE : Specifications subject to change without notice. Please check our website for latest information. 05.05.2008 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 4 HIGH CURRENT POWER INDUCTORS 9. SOLDERIND AND MOUNTING : Part No. SDL1108-R47MF SDL1108-R60MF G SDL1108-1R0MF SDL1108-1R2MF I SDL1108-1R5MF SDL1108-2R0MF SDL1108 SERIES H mm G 5.6±0.5 5.6±0.5 6.6±0.5 6.6±0.5 7.2±0.5 6.5±0.5 mm H 6.7±0.5 6.7±0.5 6.2±0.5 6.2±0.5 6.2±0.5 6.4±0.5 mm I 1.8 +0.2 1.8 +0.2 1.5 +0.2 1.5 +0.2 1.4 +0.2 1.2 +0.2 -0 -0 -0 -0 -0 -0 9-2. Soldering Mildly activated rosin fluxes are preferred. The minimum amount of solder can lead to damage from the stresses caused by the difference in coefficients of expansion between solder, chip and substrate. Our terminations are suitable for all wave and re-flow soldering systems. If hand soldering cannot be avoided, the preferred technique is the utilization of hot air soldering tools. 9-2.1 Solder Re-flow : Recommended temperature profiles for re-flow soldering in Figure 1. 9-2.2 Soldering Iron (Figure 2) : Products attachment with soldering iron is discouraged due to the inherent process control limitations. In the event that a soldering iron must be employed the following precautions are recommended. Note : a) Preheat circuit and products to 150°C. d) 1.0mm tip diameter (max) e) Use a 20 watt soldering iron with tip diameter of 1.0mm b) 280°C tip temperature (max) c) Never contact the ceramic with the iron tip f) Limit soldering time to 3 secs. Preheating TEMPERATURE °C 250~260 230 180 150 60~120s Soldering TEMPERATURE °C 10s max. Natural cooling Preheating 280 260 150 Soldering Natural cooling 30~60s Over 1min. Within 3secs. Gradual Cooling Figure 1. Re-flow Soldering 10. PACKING AND QUANTITY : Size Styrofoam Inner box Carton SDL1108 210 420 2100 Figure 2. Iron Soldering NOTE : Specifications subject to change without notice. Please check our website for latest information. 05.05.2008 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 5