Notice for TAIYO YUDEN products
Please read this notice before using the TAIYO YUDEN products.
REMINDERS
■ Product Information in this Catalog
Product information in this catalog is as of October 2019. All of the
contents specified herein and production status of the products listed
in this catalog are subject to change without notice due to technical
improvement of our products, etc. Therefore, please check for the
latest information carefully before practical application or use of our
products.
(4) Powe r g e n e r atio n c o ntro l e quip m e nt (nu c le a r p owe r,
hydroelectric power, thermal power plant control system, etc.)
(5) Undersea equipment (submarine repeating equipment,
underwater work equipment, etc.)
(6) Military equipment
(7) Any other equipment requiring extremely high levels of safety
and/or reliability equal to the equipment listed above
Please note that TAIYO YUDEN shall not be in any way responsible
for any damages and defects in products or equipment incorporating
our products, which are caused under the conditions other than those
specified in this catalog or individual product specification sheets.
*Notes:
1. There is a possibility that our products can be used only
for aviation equipment that does not directly affect the safe
operation of aircraft (e.g., in-flight entertainment, cabin
light, electric seat, cooking equipment) if such use meets
requirements specified separately by TAIYO YUDEN. Please
be sure to contact TAIYO YUDEN for further information
before using our products for such aviation equipment.
2. Implantable medical devices contain not only internal unit
which is implanted in a body, but also external unit which is
connected to the internal unit.
■ Approval of Product Specifications
Ple a se c ont ac t TA IYO Y UD EN for fur the r det a ils of p ro duc t
specifications as the individual product specification sheets are
available. When using our products, please be sure to approve our
product specifications or make a written agreement on the product
specification with TAIYO YUDEN in advance.
■ Pre-Evaluation in the Actual Equipment and Conditions
Please conduct validation and verification of our products in actual
conditions of mounting and operating environment before using our
products.
■ Limited Application
1. Equipment Intended for Use
The products listed in this catalog are intended for generalpurpose and standard use in general electronic equipment (e.g.,
AV equipment, OA equipment, home electric appliances, office
equipment, information and communication equipment including,
without limitation, mobile phone, and PC) and other equipment
specified in this catalog or the individual product specification sheets.
TAIYO YUDEN has the line-up of the products intended for
use in automotive electronic equipment, telecommunications
infrastructure and industrial equipment, or medical devices
classified as GHTF Classes A to C (Japan Classes I to III).
Therefore, when using our products for these equipment,
please check available applications specified in this catalog
or the individual product specification sheets and use the
corresponding products.
2. Equipment Requiring Inquiry
Please be sure to contact TAIYO YUDEN for further information
before using the products listed in this catalog for the following
equipment (excluding intended equipment as specified in this
catalog or the individual product specification sheets) which may
cause loss of human life, bodily injury, serious property damage
and/or serious public impact due to a failure or defect of the
products and/or malfunction attributed thereto.
(1) Transportation equipment (automotive powertrain control
system, train control system, and ship control system, etc.)
(2) Traffic signal equipment
(3) Disaster prevention equipment, crime prevention equipment
(4) Medical devices classified as GHTF Class C (Japan Class III)
(5) H i g h l y p u b l i c i n f o r m a t i o n n e t wo r k e q u i p m e n t , d a t a processing equipment (telephone exchange, and base
station, etc.)
(6) Any other equipment requiring high levels of quality and/or
reliability equal to the equipment listed above
3. Equipment Prohibited for Use
Please do not incorporate our products into the following
equipment requiring extremely high levels of safety and/or
reliability.
(1) Aerospace equipment (artificial satellite, rocket, etc.)
(2) Aviation equipment *1
(3) Medical devices classified as GHTF Class D (Japan Class IV),
implantable medical devices *2
4. Limitation of Liability
Please note that unless you obtain prior written consent of TAIYO
YUDEN, TAIYO YUDEN shall not be in any way responsible for
any damages incurred by you or third parties arising from use of
the products listed in this catalog for any equipment that is not
intended for use by TAIYO YUDEN, or any equipment requiring
inquiry to TAIYO YUDEN or prohibited for use by TAIYO YUDEN
as described above.
■ Safety Design
When using our products for high safety and/or reliability-required
equipment or circuits, please fully perform safety and/or reliability
evaluation. In addition, please install (i) systems equipped with
a protection circuit and a protection device and/or (ii) systems
equipped with a redundant circuit or other system to prevent an
unsafe status in the event of a single fault for a failsafe design to
ensure safety.
■ Intellectual Property Rights
Information contained in this catalog is intended to convey examples
of typical performances and/or applications of our products and is
not intended to make any warranty with respect to the intellectual
property rights or any other related rights of TAIYO YUDEN or any
third parties nor grant any license under such rights.
■ Limited Warranty
Please note that the scope of warranty for our products is limited to
the delivered our products themselves and TAIYO YUDEN shall not
be in any way responsible for any damages resulting from a failure
or defect in our products. Notwithstanding the foregoing, if there is
a written agreement (e.g., supply and purchase agreement, quality
assurance agreement) signed by TAIYO YUDEN and your company,
TAIYO YUDEN will warrant our products in accordance with such
agreement.
■ TAIYO YUDEN’s Official Sales Channel
The contents of this catalog are applicable to our products which are
purchased from our sales offices or authorized distributors (hereinafter
“TAIYO YUDEN’
s official sales channel”). Please note that the contents
of this catalog are not applicable to our products purchased from any
seller other than TAIYO YUDEN’
s official sales channel.
■ Caution for Export
Some of our products listed in this catalog may require specific
procedures for export according to“U.S. Export Administration
Regulations”,“Foreign Exchange and Foreign Trade Control Law”
of Japan, and other applicable regulations. Should you have any
questions on this matter, please contact our sales staff.
20
for High Quality Equipment
Automotive Application Guide
We classify automotive electronic equipment into the following four application categories and set usable
application categories for each of our products. When using our products for automotive electronic
equipment, please be sure to check such application categories and use our products accordingly. Should
you have any questions on this matter, please contact us.
POWERTRAIN
・ABS (Anti-Lock Brake System)
・ESC (Electronic Stability Control)
・Airbag
・ADAS (Equipment that directly controls running, turning and stopping), etc.
BODY & CHASSIS
・Wiper
・Automatic Door
・Power Window
・Keyless Entry System
・Electric Door Mirror
・Automobile Digital Mirror
・Interior Lighting
・Automobile Air Conditioning System
・LED Headlight
・TPMS (Tire Pressure Monitoring System)
・Anti-Theft Device (Immobilizer), etc.
INFOTAINMENT
・Car Infotainment System
・ITS/Telematics System
・Instrument Cluster
・ADAS (Sensor, Equipment that is not interlocked with safety equipment or powertrain)
・Dashcam (genuine products for automotive manufacturer), etc.
AUTOMOTIVE APPLICATION GUIDE
SAFETY
Automotive Electronic Equipment (Typical Example)
・Engine ECU (Electronically Controlled Fuel Injector)
・Cruise Control Unit
・4WS (4 Wheel Steering)
・Transmission
・Power Steering
・HEV/PHV/EV Core Control (Battery, Inverter, DC-DC)
・Automotive Locator (Car location information providing device), etc.
APPLICATION GUIDE
Category
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our product specification sheets.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our website (http://www.ty-top.com/) .
20
15
for High Quality Equipment
for High Quality Equipment
MULTILAYER
INDUCTORS
MULTILAYER CHIPCHIP
BEAD BEAD
INDUCTORS
(BK SERIES) (BK SERIES)
REFLOW
REFLOW
AEC-Q200
AEC-Q200
■PART NUMBER
B
K △
①
1
*Operating Temp. : -55～125℃
0
0
5
②
①Series name
Code
BK△
H
S
1
③
2 1
④
－ T V
⑤ ⑥ ⑦
④Nominal impedance
Code
（example）
100
330
121
102
Series name
Multilayer chip bead inductor
②Dimensions（L×W）
0603
1005
0603(0201)
1005（0402）
③Material
Code
HW
HS
HR
HM
LM
LL
TS
Dimensions
（L×W）［mm］
0.6×0.3
1.0×0.5
⑤Characteristics
Code
－
10
33
120
1000
Characteristics
Standard
Material
⑥Packaging
Code
T
Refer to impedance curves
for material differences
Packaging
Taping
⑦Internal code
Code
V
8
Internal code
MLCI for Automotive
MLCI for Telecommunications infrastructure
and Industrial equipment / Medical devices
■FEATURES
●HW：For broadband noise suppression.
●HS：For broadband noise suppression.
●HR：For upper 10MHz noise suppression.
●HM：For upper 20MHz noise suppression.
●LM：For high frequency noise suppression around 200MHz.
●LL：For high frequency noise suppression from 100MHz.
●TS：Low DC resistance HS version.
For Automotive Electronic Equipment
Type（inch）
Nominal impedance［Ω］
MULTILAYER CHIP BEAD INDUCTORS (BK SERIES)
Code
△＝Blank space
NOISE SUPPRESSION
COMPONENTS
■STANDARD EXTERNAL DIMENSIONS / STANDARD QUANTITY
W
L
T
AUTO
e
Type
BK 0603
（0201）
BK 1005
（0402）
L
W
T
e
0.60±0.03
（0.024±0.001）
1.00±0.05
（0.039±0.002）
0.30±0.03
（0.012±0.001）
0.50±0.05
（0.020±0.002）
030±0.03
（0.012±0.001）
0.50±0.05
（0.020±0.002）
0.15±0.05
（0.006±0.002）
0.25±0.10
（0.010±0.004）
Standard quantity [pcs]
Paper tape
Embossed tape
15000
10000
－
－
Unit：mm（inch）
hq_i_mlci_BK_e-E08R01
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our product specification sheets.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our website (http://www.ty-top.com/) .
20
121
for High Quality Equipment
■PART NUMBER
・ All the Multilayer Chip Bead Inductors of the catalog lineup are RoHS compliant.
Notes)
・ The exchange of individual specifications is necessary depending on your application and/or circuit condition. Please contact TAIYO YUDEN's official sales channel.
・ For Automotive (AEC-Q200 Qualified) products for BODY & CHASSIS, and INFOTAINMENT. Please check ”Automotive Application Guide” for further details before using the products.
＜ ：AEC-Q200
qualified＞
AEC-Q200
All the Multilayer Chip Bead Inductors for Automotive products are tested based on the test conditions and methods defined in AEC-Q200 by family item.
Please consult with TAIYO YUDEN's official sales channel for the details of the product specifications and AEC-Q200 test results, etc.,
and please review and approve the product specifications before ordering.
●BK 0603
Part number
For Automotive Electronic Equipment
MULTILAYER CHIP BEAD INDUCTORS (BK SERIES)
BK
BK
BK
BK
BK
BK
0603HS220-TV
0603HS330-TV
0603TS800-TV
0603TS121-TV
0603TS241-TV
0603TS601-TV
Nominal impedance
［Ω］
22
33
80
120
240
600
Impedance tolerance
±25％
±25％
±25％
±25％
±25％
±25％
NOISE SUPPRESSION
COMPONENTS
Measuring frequency
［MHz］
100
100
100
100
100
100
DC Resistance
［Ω］（max.）
0.065
0.070
0.18
0.23
0.32
0.75
Rated current
［mA］（max.）
500
500
500
450
400
270
Thickness
［mm］
0.30 ±0.03
0.30 ±0.03
0.30 ±0.03
0.30 ±0.03
0.30 ±0.03
0.30 ±0.03
Measuring frequency
［MHz］
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
DC Resistance
［Ω］（max.）
0.17
0.24
0.31
0.50
0.60
0.03
0.06
0.10
0.10
0.20
0.30
0.45
0.55
0.58
0.60
0.18
0.18
0.30
0.45
0.50
0.70
0.11
0.18
0.25
0.33
0.31
0.45
0.50
0.70
0.90
Rated current
［mA］（max.）
500
450
400
350
300
1,000
700
700
700
500
400
350
300
300
300
350
300
300
250
250
150
500
400
400
350
400
350
300
250
120
Thickness
［mm］
0.50 ±0.05
0.50 ±0.05
0.50 ±0.05
0.50 ±0.05
0.50 ±0.05
0.50 ±0.05
0.50 ±0.05
0.50 ±0.05
0.50 ±0.05
0.50 ±0.05
0.50 ±0.05
0.50 ±0.05
0.50 ±0.05
0.50 ±0.05
0.50 ±0.05
0.50 ±0.05
0.50 ±0.05
0.50 ±0.05
0.50 ±0.05
0.50 ±0.05
0.50 ±0.05
0.50 ±0.05
0.50 ±0.05
0.50 ±0.05
0.50 ±0.05
0.50 ±0.05
0.50 ±0.05
0.50 ±0.05
0.50 ±0.05
0.50 ±0.05
Note
●BK 1005
Part number
BK
BK
BK
BK
BK
BK
BK
BK
BK
BK
BK
BK
BK
BK
BK
BK
BK
BK
BK
BK
BK
BK
BK
BK
BK
BK
BK
BK
BK
BK
1005HW680-TV
1005HW121-TV
1005HW241-TV
1005HW431-TV
1005HW601-TV
1005HS100-TV
1005HS330-TV
1005HS680-TV
1005HS800-TV
1005HS121-TV
1005HS241-TV
1005HS431-TV
1005HS601-TV
1005HS102-TV
1005HR601-TV
1005HM750-TV
1005HM121-TV
1005HM241-TV
1005HM471-TV
1005HM601-TV
1005HM102-TV
1005LL100-TV
1005LL220-TV
1005LL330-TV
1005LL470-TV
1005LL680-TV
1005LL121-TV
1005LL181-TV
1005LL241-TV
1005LM182-TV
Nominal impedance
［Ω］
68
120
240
430
600
10
33
68
80
120
240
430
600
1000
600
75
120
240
470
600
1000
10
22
33
47
68
120
180
240
1800
Impedance tolerance
±25％
±25％
±25％
±25％
±25％
±25％
±25％
±25％
±25％
±25％
±25％
±25％
±25％
±25％
±25％
±25％
±25％
±25％
±25％
±25％
±25％
±25％
±25％
±25％
±25％
±25％
±25％
±25％
±25％
±25％
Note
※）The rated current is the value of current at which the temperature of the element is increased within 20℃.
AUTO
hq_i_mlci_BK_AUTO_e-E08R01
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our product specification sheets.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our website (http://www.ty-top.com/) .
122
20
for High Quality Equipment
■ELECTRICAL CHARACTERISTICS
■BK 0603
For Automotive Electronic Equipment
MULTILAYER CHIP BEAD INDUCTORS (BK SERIES)
■BK 1005
NOISE SUPPRESSION
COMPONENTS
AUTO
hq_i_mlci_BK_char_e-E08R01
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our product specification sheets.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our website (http://www.ty-top.com/) .
20
123
for High Quality Equipment
■ELECTRICAL CHARACTERISTICS
For Automotive Electronic Equipment
MULTILAYER CHIP BEAD INDUCTORS (BK SERIES)
NOISE SUPPRESSION
COMPONENTS
AUTO
hq_i_mlci_BK_char_e-E08R01
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our product specification sheets.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our website (http://www.ty-top.com/) .
124
20
for High Quality Equipment
■ELECTRICAL CHARACTERISTICS
For Automotive Electronic Equipment
MULTILAYER CHIP BEAD INDUCTORS (BK SERIES)
●BK series
Until 125 ℃ ambient temperature, BK series is available at 100% of the rated current.
Please refer to the chart shown below.
BK series
Ratio to rated current
NOISE SUPPRESSION
COMPONENTS
120%
100%
80%
60%
40%
20%
0%
-55
-35
-15
5
25
45
65
85
105
AUTO
125
Ambient Temperature(℃)
hq_i_mlci_BK_char_e-E08R01
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our product specification sheets.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our website (http://www.ty-top.com/) .
20
125
for High Quality Equipment
for High Quality Equipment
MULTILAYER
BEAD
INDUCTORS
FORFOR
POWER
LINES
(BK (BK
SERIES
P TYPE)
MULTILAYERCHIP
CHIP
BEAD
INDUCTORS
POWER
LINES
SERIES
P TYPE)
For Automotive Electronic Equipment
MULTILAYER CHIP BEAD INDUCTORS FOR POWER LINES (BK SERIES P TYPE)
REFLOW
REFLOW
AEC-Q200
AEC-Q200
■PART NUMBER
B
K P
①
①Series name
Code
BKP
*Operating Temp. :
1
0
0
5
②
H
S
1
2 1
④
③
－ T V
⑤ ⑥ ⑦
②Dimensions（L×W）
Type（inch）
0603
1005
0603（0201）
1005（0402）
③Material
Code
HS
HM
TS
TM
△＝Blank space
④Nominal impedance
Code
（example）
100
330
121
221
Series name
Multilayer chip bead inductor for power line
Code
-55～125℃（Including self-generated heat）
Dimensions
（L×W）［mm］
0.6×0.3
1.0×0.5
⑤Characteristics
Code
－
Nominal impedance［Ω］
10
33
120
220
Characteristics
Standard
Material
⑥Packaging
Code
T
Refer to impedance curves
for material differences
Packaging
Taping
⑦Internal code
Code
V
8
Internal code
MLCI for Automotive
MLCI for Telecommunications infrastructure
and Industrial equipment / Medical devices
■FEATURES
●HS：For broadband noise suppression
●HM：For upper 20MHz noise suppression
●TS：Low DC resistance HS version.
●TM：Low DC resistance HM version.
NOISE SUPPRESSION
COMPONENTS
■STANDARD EXTERNAL DIMENSIONS / STANDARD QUANTITY
W
L
T
e
AUTO
Type
L
W
T
e
BKP0603
（0201）
BKP1005
（0402）
0.6±0.03
（0.024±0.001）
1.0±0.05
（0.039±0.002）
0.3±0.03
（0.012±0.001）
0.5±0.05
（0.020±0.002）
0.3±0.03
（0.012±0.001）
0.5±0.05
（0.020±0.002）
0.15±0.05
（0.006±0.002）
0.25±0.1
（0.010±0.004）
Standard quantity [pcs]
Paper tape
Embossed tape
15000
－
10000
－
Unit：mm（inch）
hq_i_mlci_BKP_e-E08R01
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our product specification sheets.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our website (http://www.ty-top.com/) .
126
20
for High Quality Equipment
■PART NUMBER
・ All the Multilayer Chip Bead Inductors of the catalog lineup are RoHS compliant.
Part number
BKP0603HS100-TV
BKP0603HS220-TV
BKP0603HS330-TV
BKP0603HM100-TV
Nominal impedance
［Ω］
Impedance tolerance
Measuring frequency
［MHz］
DC Resistance
［mΩ］（max.）
Rated current
［A］（max.）
10
22
33
10
±5Ω
±25％
±25％
±5Ω
100
100
100
100
30
65
70
30
1.3
1.0
1.0
1.3
Nominal impedance
［Ω］
Impedance tolerance
Measuring frequency
［MHz］
DC Resistance
［mΩ］（max.）
Rated current
［A］（max.）
10
33
68
120
220
120
220
33
68
120
120
±25％
±25％
±25％
±25％
±25％
±25％
±25％
±25％
±25％
±25％
±25％
100
100
100
100
100
100
100
100
100
100
100
30
50
75
140
200
120
180
39±30％
55±30％
70±30％
100
2.0
1.7
1.5
1.0
0.80
1.1
0.90
1.7
1.5
1.3
1.3
Thickness
［mm］
0.30
0.30
0.30
0.30
Note
±0.03
±0.03
±0.03
±0.03
●BKP1005
Part number
BKP1005HS100-TV
BKP1005HS330-TV
BKP1005HS680-TV
BKP1005HS121-TV
BKP1005HS221-TV
BKP1005HM121-TV
BKP1005HM221-TV
BKP1005TS330-TV
BKP1005TS680-TV
BKP1005TS121-TV
BKP1005TM121-TV
Thickness
［mm］
0.50
0.50
0.50
0.50
0.50
0.50
0.50
0.50
0.50
0.50
0.50
Note
±0.05
±0.05
±0.05
±0.05
±0.05
±0.05
±0.05
±0.05
±0.05
±0.05
±0.05
※）The rated current is the value of current at which the temperature of the element is increased within 40℃.
For Automotive Electronic Equipment
●BKP0603
MULTILAYER CHIP BEAD INDUCTORS FOR POWER LINES (BK SERIES P TYPE)
Notes)
・ The exchange of individual specifications is necessary depending on your application and/or circuit condition. Please contact TAIYO YUDEN's official sales channel.
・ For Automotive (AEC-Q200 Qualified) products for BODY & CHASSIS, and INFOTAINMENT. Please check ”Automotive Application Guide” for further details before using the products.
＜ ：AEC-Q200
qualified＞
AEC-Q200
All the Multilayer Chip Bead Inductors for Automotive products are tested based on the test conditions and methods defined in AEC-Q200 by family item.
Please consult with TAIYO YUDEN's official sales channel for the details of the product specifications and AEC-Q200 test results, etc.,
and please review and approve the product specifications before ordering.
NOISE SUPPRESSION
COMPONENTS
AUTO
hq_i_mlci_BKP_AUTO_e-E08R01
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our product specification sheets.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our website (http://www.ty-top.com/) .
20
127
for High Quality Equipment
■ELECTRICAL CHARACTERISTICS
■BKP0603
For Automotive Electronic Equipment
MULTILAYER CHIP BEAD INDUCTORS FOR POWER LINES (BK SERIES P TYPE)
■BKP1005
NOISE SUPPRESSION
COMPONENTS
AUTO
hq_i_mlci_BKP_char_e-E08R01
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our product specification sheets.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our website (http://www.ty-top.com/) .
128
20
for High Quality Equipment
■Derating of Rated Current
For Automotive Electronic Equipment
MULTILAYER CHIP BEAD INDUCTORS FOR POWER LINES (BK SERIES P TYPE)
●BK series P type
Derating of current is necessary for BK series P type depending on ambient temperature.
Please refer to the chart shown below for appropriate derating of current.
BK series P type
Ratio to rated current
120%
100%
80%
60%
40%
20%
0%
-55
-35
-15
5
25
45
65
85
105
125
Ambient Temperature(℃)
NOISE SUPPRESSION
COMPONENTS
AUTO
hq_i_mlci_BKP_char_e-E08R01
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our product specification sheets.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our website (http://www.ty-top.com/) .
20
129
Multilayer chip inductors
Multilayer chip inductors for high frequency, Multilayer chip bead inductors
Multilayer common mode choke coils（MC series F type）
Metal Multilayer Chip Power Inductors (MCOILTM MC series)
■PACKAGING
①Minimum Quantity
●Tape & Reel Packaging
Type
CK1608（0603）
CK2125（0805）
CKS2125（0805）
CKP1608（0603）
CKP2012（0805）
CKP2016（0806）
CKP2520（1008）
LK1005（0402）
LK1608（0603）
LK2125（0805）
HK0603（0201）
HK1005（0402）
HK1608（0603）
HK2125（0805）
HKQ0603S（0201）
HKQ0603U（0201）
AQ105（0402）
BK0603（0201）
BK1005（0402）
BKH0603（0201）
BKH1005（0402）
BK1608（0603）
BK2125（0805）
BK2010（0804）
BK3216（1206）
BKP0603（0201）
BKP1005（0402）
BKP1608（0603）
BKP2125（0805）
MCF0605（0202）
MCF0806（0302）
MCF1210（0504）
MCF2010（0804）
MCEE1005（0402）
MCEK1210(0504)
MCFK1608（0603）
MCFE1608（0603）
MCHK1608(0603)
MCKK1608（0603）
MCHK2012（0806）
MCKK2012（0805）
Thickness
mm（inch）
0.8 （0.031）
0.85（0.033）
1.25（0.049）
0.85（0.033）
1.25（0.049）
0.8 （0.031）
0.9 （0.035）
0.9 （0.035）
0.7 （0.028）
0.9 （0.035）
1.1 （0.043）
0.5 （0.020）
0.8 （0.031）
0.85（0.033）
1.25（0.049）
0.3 （0.012）
0.5 （0.020）
0.8 （0.031）
0.85（0.033）
1.0 （0.039）
0.3 （0.012）
0.3 （0.012）
0.5 （0.020）
0.3 （0.012）
0.5 （0.020）
0.3 （0.012）
0.5 （0.020）
0.8 （0.031）
0.85（0.033）
1.25（0.049）
0.45（0.018）
0.8 （0.031）
0.3 （0.012）
0.5 （0.020）
0.8 （0.031）
0.85（0.033）
0.3 （0.012）
0.4 （0.016）
0.55（0.022）
0.45（0.018）
0.55（0.022）
0.5 （0.020）
0.6 （0.024）
0.65（0.026）
0.8 （0.031）
1.0 （0.039）
0.8 （0.031）
1.0 （0.039）
Standard Quantity ［pcs］
Paper Tape
Embossed Tape
4000
－
4000
－
－
2000
4000
－
－
2000
4000
－
－
3000
－
3000
－
3000
－
3000
－
2000
10000
－
4000
－
4000
－
－
2000
15000
－
10000
－
4000
－
－
4000
－
3000
15000
－
15000
－
10000
－
15000
－
10000
－
15000
－
10000
－
4000
－
4000
－
－
2000
4000
－
－
4000
15000
－
10000
－
4000
－
4000
－
15000
－
－
10000
－
5000
－
4000
10000
－
5000
－
4000
－
4000
－
4000
－
3000
4000
－
3000
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
i_mlci_pack_e-E08R01
②Taping material
●Card board carrier tape
Top tape
Base tape
Sprocket hole
Bottom tape
CK
CKP
CK
CKS
LK
LK
LK
HK
HK
HK
HKQ
AQ
1608
1608
2125
2125
1005
1608
2125
0603
1005
1608
0603
105
BK
BK
BK
BK
BK
BKP
BKP
BKP
BKP
BKH
BKH
MCF
MC
MC
MC
MC
0603
1005
1608
2125
2010
0603
1005
1608
2125
0603
1005
0605
1005
1210
1608
2012
CK
CKS
CKP
CKP
CKP
LK
HK
2125
2125
2012
2016
2520
2125
2125
BK
BK
MCF
MCF
MCF
MC
MC
2125
3216
0806
1210
2010
1608
2012
Chip cavity
Chip Filled
Chip
●Embossed Tape
Top tape
Sprocket hole
Base tape
Chip cavity
Chip Filled
Chip
③Taping Dimensions
●Paper tape (8mm wide)
B
T
8.0±0.3
(0.315±0.012)
A
F
Unit：mm（inch）
1.75±0.1
(0.069±0.004）
3.5±0.05
(0.138±0.002)
Sprocket hole
φ1.5＋0.1/－0
(φ0.059＋0.004/-0)
4.0±0.1
(0.157±0.004)
2.0±0.05
(0.079±0.002)
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
i_mlci_pack_e-E08R01
Type
Thickness
mm（inch）
CK1608（0603）
0.8 （0.031）
CK2125（0805）
0.85（0.033）
CKS2125（0805）
0.85（0.033）
CKP1608（0603）
0.8 （0.031）
LK1005（0402）
0.5 （0.020）
LK1608（0603）
0.8 （0.031）
LK2125（0805）
0.85（0.033）
HK0603（0201）
0.3 （0.012）
HK1005（0402）
0.5 （0.020）
HK1608（0603）
0.8 （0.031）
HKQ0603S（0201）
0.3 （0.012）
HKQ0603U（0201）
0.3 （0.012）
AQ105（0402）
0.5 （0.020）
BK0603（0201）
0.3 （0.012）
BK1005（0402）
0.5 （0.020）
BK1608（0603）
0.8 （0.031）
BK2125（0805）
0.85（0.033）
BK2010（0804）
0.45（0.018）
BKP0603（0201）
0.3 （0.012）
BKP1005（0402）
0.5 （0.020）
BKP1608（0603）
0.8 （0.031）
BKP2125（0805）
0.85（0.033）
BKH0603（0201）
0.3 （0.012）
BKH1005（0402）
0.5 （0.020）
MCF0605（0202）
0.3 （0.012）
MCFK1608（0603）
0.6 （0.024）
MCEE1005（0402）
0.55（0.021）
MCEK1210（0504）
0.5 （0.020）
MCFK1608（0603）
0.6 （0.024）
MCFE1608（0603）
0.65（0.026）
MCHK1608（0603）
0.8 （0.031）
MCHK2012（0805）
0.8 （0.031）
Chip cavity
Ａ
Ｂ
1.0±0.2
1.8±0.2
（0.039±0.008）
（0.071±0.008）
1.5±0.2
2.3±0.2
（0.059±0.008）
（0.091±0.008）
1.5±0.2
2.3±0.2
（0.059±0.008）
（0.091±0.008）
1.0±0.2
1.8±0.2
（0.039±0.008）
（0.071±0.008）
0.65±0.1
1.15±0.1
（0.026±0.004）
（0.045±0.004）
1.0±0.2
1.8±0.2
（0.039±0.008）
（0.071±0.008）
1.5±0.2
2.3±0.2
（0.059±0.008）
（0.091±0.008）
0.40±0.06
0.70±0.06
（0.016±0.002）
（0.028±0.002）
0.65±0.1
1.15±0.1
（0.026±0.004）
（0.045±0.004）
1.0±0.2
1.8±0.2
（0.039±0.008）
（0.071±0.008）
0.40±0.06
0.70±0.06
（0.016±0.002）
（0.028±0.002）
0.40±0.06
0.70±0.06
（0.016±0.002）
（0.028±0.002）
0.75±0.1
1.15±0.1
（0.030±0.004）
（0.045±0.004）
0.40±0.06
0.70±0.06
（0.016±0.002）
（0.028±0.002）
0.65±0.1
1.15±0.1
（0.026±0.004）
（0.045±0.004）
1.0±0.2
1.8±0.2
（0.039±0.008）
（0.071±0.008）
1.5±0.2
2.3±0.2
（0.059±0.008）
（0.091±0.008）
1.2±0.1
2.17±0.1
（0.047±0.004）
（0.085±0.004）
0.40±0.06
0.70±0.06
（0.016±0.002）
（0.028±0.002）
0.65±0.1
1.15±0.1
（0.026±0.004）
（0.045±0.004）
1.0±0.2
1.8±0.2
（0.039±0.008）
（0.071±0.008）
1.5±0.2
2.3±0.2
（0.059±0.008）
（0.091±0.008）
0.40±0.06
0.70±0.06
（0.016±0.002）
（0.028±0.002）
0.65±0.1
1.15±0.1
（0.026±0.004）
（0.045±0.004）
0.62±0.03
0.77±0.03
（0.024±0.001）
（0.030±0.001）
1.1±0.05
1.9±0.05
（0.043±0.002）
（0.075±0.002）
0.8±0.05
1.3±0.05
(0.031±0.002)
(0.051±0.002)
1.3±0.1
1.55±0.1
（0.051±0.004）
（0.061±0.004）
1.1±0.05
1.9±0.05
（0.043±0.002）
（0.075±0.002）
1.1±0.05
1.9±0.05
（0.043±0.002）
（0.075±0.002）
1.2±0.05
2.0±0.05
（0.047±0.002）
（0.079±0.002）
1.65±0.1
2.4±0.1
（0.065±0.004）
（0.094±0.004）
Insertion Pitch
Ｆ
4.0±0.1
（0.157±0.004）
4.0±0.1
（0.157±0.004）
4.0±0.1
（0.157±0.004）
4.0±0.1
（0.157±0.004）
2.0±0.05
（0.079±0.002）
4.0±0.1
（0.157±0.004）
4.0±0.1
（0.157±0.004）
2.0±0.05
（0.079±0.002）
2.0±0.05
（0.079±0.002）
4.0±0.1
（0.157±0.004）
2.0±0.05
（0.079±0.002）
2.0±0.05
（0.079±0.002）
2.0±0.05
（0.079±0.002）
2.0±0.05
（0.079±0.002）
2.0±0.05
（0.079±0.002）
4.0±0.1
（0.157±0.004）
4.0±0.1
（0.157±0.004）
4.0±0.1
（0.157±0.004）
2.0±0.05
（0.079±0.002）
2.0±0.05
（0.079±0.002）
4.0±0.1
（0.157±0.004）
4.0±0.1
（0.157±0.004）
2.0±0.05
（0.079±0.002）
2.0±0.05
（0.079±0.002）
2.0±0.05
（0.079±0.002）
4.0±0.1
（0.157±0.004）
2.0±0.05
（0.079±0.002）
4.0±0.1
（0.157±0.004）
4.0±0.1
（0.157±0.004）
4.0±0.1
（0.157±0.004）
4.0±0.1
（0.157±0.004）
4.0±0.1
（0.157±0.004）
Tape Thickness
Ｔ
1.1max
（0.043max）
1.1max
（0.043max）
1.1max
（0.043max）
1.1max
（0.043max）
0.8max
（0.031max）
1.1max
（0.043max）
1.1max
（0.043max）
0.45max
（0.018max）
0.8max
（0.031max）
1.1max
（0.043max）
0.45max
（0.018max）
0.45max
（0.018max）
0.8max
（0.031max）
0.45max
（0.018max）
0.8max
（0.031max）
1.1max
（0.043max）
1.1max
（0.043max）
0.8max
（0.031max）
0.45max
（0.018max）
0.8max
（0.031max）
1.1max
（0.043max）
1.1max
（0.043max）
0.45max
（0.018max）
0.8max
（0.031max）
0.45max
（0.018max）
0.72max
(0.028max)
0.64max
(0.025max)
0.64max
(0.025max)
0.72max
(0.028max)
0.72max
(0.028max)
0.9max
(0.035max)
0.9max
（0.035max）
Unit : mm（inch）
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
i_mlci_pack_e-E08R01
●Embossed Tape (8mm wide)
Unit：mm（inch）
3.5±0.05
(0.138±0.002)
Sprocket hole
A
B
F
8.0±0.3
(0.315±0.012)
1.75±0.1
(0.069±0.004）
φ1.5＋0.1/－0
(φ0.059＋0.004/-0)
4.0±0.1
(0.157±0.004)
2.0±0.05
(0.079±0.002)
Thickness
mm（inch）
Type
CK2125（0805）
1.25（0.049）
CKS2125（0805）
1.25（0.049）
CKP2012（0805）
0.9 （0.035）
CKP2016（0806）
0.9 （0.035）
Chip cavity
Ａ
Ｂ
1.5±0.2
2.3±0.2
（0.059±0.008）
（0.091±0.008）
1.5±0.2
2.3±0.2
（0.059±0.008）
（0.091±0.008）
1.55±0.2
2.3±0.2
（0.061±0.008）
（0.091±0.008）
1.8±0.1
2.2±0.1
（0.071±0.004）
（0.087±0.004）
Insertion Pitch
Ｆ
4.0±0.1
（0.157±0.004）
4.0±0.1
（0.157±0.004）
4.0±0.1
（0.157±0.004）
4.0±0.1
（0.157±0.004）
2.3±0.1
（0.091±0.004）
2.8±0.1
（0.110±0.004）
4.0±0.1
（0.157±0.004）
1.5±0.2
（0.059±0.008）
2.3±0.2
（0.091±0.008）
4.0±0.1
（0.157±0.004）
1.5±0.2
（0.059±0.008）
2.3±0.2
（0.091±0.008）
4.0±0.1
（0.157±0.004）
1.5±0.2
（0.059±0.008）
1.9±0.1
（0.075±0.004）
0.75±0.05
（0.030±0.002）
1.15±0.05
（0.045±0.002）
1.1±0.1
（0.043±0.004）
1.1±0.1
（0.043±0.004）
1.55±0.1
（0.061±0.004）
2.3±0.2
（0.091±0.008）
3.5±0.1
（0.138±0.004）
0.95±0.05
（0.037±0.002）
1.40±0.05
（0.055±0.002）
2.3±0.1
（0.091±0.004）
1.95±0.1
（±0.004）
2.35±0.1
（0.093±0.004）
4.0±0.1
（0.157±0.004）
4.0±0.1
（0.157±0.004）
2.0±0.05
（0.079±0.002）
4.0±0.1
（0.157±0.004）
4.0±0.1
（0.157±0.004）
4.0±0.1
（0.157±0.004）
4.0±0.1
（0.157±0.004）
0.7 （0.028）
0.9 （0.035）
CKP2520（1008）
1.1 （0.043）
1.1 （0.043）
LK2125（0805）
1.25（0.049）
0.85（0.033）
HK2125（0805）
1.0 （0.039）
BK2125（0805）
1.25（0.049）
BK3216（1206）
0.8 （0.031）
MCF0806（0302）
0.4 （0.016）
MCF1210（0504）
0.55（0.022）
MCF2010（0804）
0.45（0.018）
MCKK1608（0603）
1.0 （0.039）
MCKK2012（0805）
1.0 （0.039）
Tape Thickness
K
T
2.0
0.3
（0.079）
（0.012）
2.0
0.3
（0.079）
（0.012）
1.3
0.3
（0.051）
（0.012）
1.3
0.25
（0.051）
（0.01）
1.4
（0.055）
1.4
（0.055）
0.3
（0.012）
1.7
（0.067）
1.7
（0.067）
2.0
0.3
（0.079）
（0.012）
1.5
（0.059）
0.3
（0.012）
2.0
（0.079）
2.0
0.3
（0.079）
（0.012）
1.4
0.3
（0.055）
（0.012）
0.55
0.3
（0.022）
（0.012）
0.65
0.3
（0.026）
（0.012）
0.85
0.3
（0.033）
（0.012）
1.4
0.25
（0.055）
（0.01）
1.35
0.25
（0.053）
（0.010）
Unit : mm（inch）
④LEADER AND BLANK PORTION
Blank portion
160mm or more
(6.3inches or more)
Chip cavity
Blank portion
Leader
100mm or more
(3.94inches or more)
Direction of tape feed
400mm or more
(15.7inches or more)
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
i_mlci_pack_e-E08R01
⑤Reel Size
t
E
C
R
B
D
A
W
A
φ178±2.0
B
φ50 or more
C
φ13.0±0.2
4mm width tape
8mm width tape
t
1.5max.
2.5max.
W
5±1.0
10±1.5
D
φ21.0±0.8
E
2.0±0.5
R
1.0
(Unit : mm)
⑥Top tape strength
The top tape requires a peel-off force of 0.1～0.7N in the direction of the arrow as illustrated below.
Pull direction
0～15°
Top tape
Base tape
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
i_mlci_pack_e-E08R01
Multilayer chip inductors
Multilayer chip inductors for high frequency, Multilayer chip bead inductors
■RELIABILITY DATA
1. Operating Temperature Range
BK series
BKP series
Specified Value
LK series
HK series
－55～＋125℃
－55～＋125℃ （Including self-generated heat）
－40～＋85℃
－55～＋125℃
2. Storage Temperature Range
BK series
BKP series
Specified Value
LK series
HK series
－55～＋125℃
－55～＋125℃
－40～＋85℃
－55～＋125℃
3. Rated Current
Specified Value
BK series
BKP series
LK series
The temperature of the element is increased within 20℃.
The temperature of the element is increased within 40℃
The decreasing-rate of inductance value is within 5 %
The decreasing-rate of inductance value is within 5 %, or the temperature of the element is
increased within 20℃
HK series
4. Impedance
Specified Value
Test Methods and
Remarks
BK series
BKP series
LK series
HK series
Measuring frequency
Measuring equipment
Measuring jig
Refer to each specification.
－
: 100±1MHz
: 4291A（or its equivalent）
: 16192A（or its equivalent）, HW:16193A（or its equivalent）
5. Inductance
Specified Value
Test Methods and
Remarks
BK series
BKP series
LK series
HK series
LK Series
Measuring
Measuring
Measuring
HK Series
Measuring
Measuring
－
Refer to each specification.
frequency
equipment /jig
current
: 10～25MHz
: 4291A＋16193A（or its equivalent）
: 1mA rms
frequency
equipment /jig
: 100MHz
: 4291A＋16193A（or its equivalent）
6. Q
Specified Value
Test Methods and
Remarks
BK series
BKP series
LK series
HK series
LK Series
Measuring
Measuring
Measuring
HK Series
Measuring
Measuring
－
Refer to each specification.
frequency
equipment /jig
current
: Refer to each specification.
: 4291A＋16193A（or its equivalent）
: 1mA rms
frequency
: 100MHz
equipment /jig : 4291A＋16193A（or its equivalent）
7. DC Resistance
Specified Value
BK series
BKP series
LK series
HK series
Test Methods and
Remarks
Measuring equipment： IWATSU VOAC7512(or its equivalent）
Refer to each specification.
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
hq_i_mlci_reli_e-E08R01
8. Self Resonance Frequency（SRF）
BK series
BKP series
Specified Value
LK series
HK series
LK Series
Measuring equipment
Test Methods and
Measuring jig
Remarks
HK Series :
Measuring equipment
－
Refer to each specification.
: 4195A（or its equivalent）
: 41951＋16092A（or its equivalent）
: 8719C（or its equivalent）
9. Resistance to Flexure of Substrate
BK series
BKP series
Specified Value
No mechanical damage.
LK series
HK series
Warp
: 2mm
Testing board
: glass epoxy-resin substrate
Thickness
: 0.8mm
20
Test Methods and
Remarks
R-230
Board
Warp
Deviation±1
45
45
（Unit：mm）
10. Solderability
Specified Value
Test Methods and
Remarks
BK series
BKP series
LK series
HK series
Solder temperature
Solder temperature
Duration
11. Resistance to Soldering
BK series
BKP series
Specified Value
LK series
HK series
At least 90％ of terminal electrode is covered by new solder.
：230±5℃ (JIS Z 3282 H60A or H63A)
：245±3℃ (Sn/3.0Ag/0.5Cu)
：4±1 sec.
Appearance：No significant abnormality
Impedance change：Within ±30％
Appearance：No significant abnormality
Inductance change： Within ±15％
Appearance：No significant abnormality
Inductance change： Within ±5％
Solder temperature
：260±5℃
Duration
：10±0.5 sec.
Test Methods and Preheating temperature
：150 to 180℃
Remarks
Preheating time
：3 min.
Flux
：Immersion into methanol solution with colophony for 3 to 5 sec.
Recovery
：2 to 3 hrs of recovery under the standard condition after the test.（See Note 1）
(Note 1) When there are questions concerning measurement result；measurement shall be made after 48±2 hrs of recovery under the standard condition.
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
hq_i_mlci_reli_e-E08R01
12. Thermal Shock
BK series
BKP series
Specified Value
LK series
HK series
Test Methods and
Remarks
Appearance：No significant abnormality
Impedance change： Within ±30％
Appearance：No significant abnormality
Inductance change： Within ±10％ Q change： Within ±30％
Appearance：No significant abnormality
Inductance change： Within ±10％ Q change： Within ±20％
BK、BKP、HK Series
Conditions for 1 cycle
Step
temperature（℃）
time（min.）
1
-40℃ ＋0/－3
30±3
2
Room temperature
2～3
3
+125℃ ＋3/－0
30±3
4
Room temperature
2～3
Number of cycles：1000
Recovery：2 to 3 hrs of recovery under the standard condition after the test.（See Note 1）
LK Series
Conditions for 1 cycle
Step
temperature（℃）
time（min.）
1
-40℃ ＋0/－3
30±3
2
Room temperature
2～3
3
+85℃ ＋3/－0
30±3
4
Room temperature
2～3
Number of cycles：1000
Recovery：2 to 3 hrs of recovery under the standard condition after the test.（See Note 1）
(Note 1) When there are questions concerning measurement result；measurement shall be made after 48±2 hrs of recovery under the standard condition.
13. Damp Heat（ Steady state）
BK series
BKP series
Specified Value
LK series
HK series
Test Methods and
Remarks
Temperature
Humidity
Duration
Recovery
14. Loading under Damp Heat
BK series
BKP series
Specified Value
LK series
HK series
Appearance：No significant abnormality
Impedance change： Within ±30％
Appearance：No significant abnormality
Inductance change： Within ±10％ Q change： Within ±30％
Appearance：No significant abnormality
Inductance change： Within ±10％ Q change： Within ±20％
：85±2℃
：80 to 85％RH
：1000＋24/－0 hrs
：2 to 3 hrs of recovery under the standard condition after the removal from test chamber.（See Note 1）
Appearance：No significant abnormality
Impedance change： Within ±30％
Appearance：No significant abnormality
Inductance change： Within ±10％ Q change： Within ±30％
Appearance：No significant abnormality
Inductance change： Within ±10％ Q change： Within ±20％
Temperature
：85±2℃
Humidity
：80 to 85％RH
Test Methods and
Applied current
：Rated current
Remarks
Duration
：1000＋24/－0 hrs
Recovery
：2 to 3 hrs of recovery under the standard condition after the removal from test chamber.（See Note 1）
Note on standard condition: "standard condition" referred to herein is defined as follows:
5 to 35℃ of temperature, 45 to 85% relative humidity, and 86 to 106kPa of air pressure.
When there are questions concerning measurement results:
In order to provide correlation data, the test shall be conducted under condition of 20±2℃ of temperature, 60 to 70% relative humidity, and 86 to 106kPa of air
pressure.
Unless otherwise specified, all the tests are conducted under the "standard condition."
(Note 1) When there are questions concerning measurement result；Measurement shall be made after 48±2 hrs of recovery under the standard condition.
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
hq_i_mlci_reli_e-E08R01
15. Loading at High Temperature
BK series
BKP series
Appearance：No significant abnormality
Impedance change： Within ±30％
Appearance：No significant abnormality
Specified Value
LK series
Inductance change： Within ±10％ Q change： Within ±30％
Appearance：No significant abnormality
HK series
Inductance change： Within ±10％ Q change： Within ±20％
Temperature : BK, HK series ⇒ 125±2℃
Test Methods and
BKP, LK series ⇒ 85±2℃
Remarks
Applied current ：Rated current
Duration
：1000＋24/－0 hrs
Recovery
：2 to 3 hrs of recovery under the standard condition after the removal from test chamber.（See Note 1）
Note on standard condition: "standard condition" referred to herein is defined as follows:
5 to 35℃ of temperature, 45 to 85% relative humidity, and 86 to 106kPa of air pressure.
When there are questions concerning measurement results:
In order to provide correlation data, the test shall be conducted under condition of 20±2℃ of temperature, 60 to 70% relative humidity, and 86 to 106kPa of air
pressure. Unless otherwise specified, all the tests are conducted under the "standard condition."
(Note 1) Measurement shall be made after 48±2 hrs of recovery under the standard condition.
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
hq_i_mlci_reli_e-E08R01
Precautions on the use of Multilayer chip inductors
Multilayer chip inductors for high frequency, Multilayer chip bead inductors
■PRECAUTIONS
1. Circuit Design
Precautions
◆Verification of operating environment, electrical rating and performance
1. A malfunction in medical equipment, spacecraft, nuclear reactors, etc. may cause serious harm to human life or have severe social
ramifications.
As such, any inductors to be used in such equipment may require higher safety and/or reliability considerations and should be clearly
differentiated from components used in general purpose applications.
◆Operating Current（Verification of Rated current）
1. The operating current for inductors must always be lower than their rated values.
2. Do not apply current in excess of the rated value because the inductance may be reduced due to the magnetic saturation effect.
2. PCB Design
Precautions
◆Pattern configurations（Design of Land-patterns）
1. When inductors are mounted on a PCB, the size of land patterns and the amount of solder used（size of fillet）can directly affect inductor
performance.
Therefore, the following items must be carefully considered in the design of solder land patterns:
（1） The amount of solder applied can affect the ability of chips to withstand mechanical stresses which may lead to breaking or
cracking. Therefore, when designing land-patterns it is necessary to consider the appropriate size and configuration of the solder
pads which in turn determines the amount of solder necessary to form the fillets.
（2） When more than one part is jointly soldered onto the same land or pad, the pad must be designed so that each component's
soldering point is separated by solder-resist.
（3） The larger size of land patterns and amount of solder, the smaller Q value after mounting on PCB. It makes higher the Q value to
design land patterns smaller than terminal electrode of chips.
◆Pattern configurations（Inductor layout on panelized［ breakaway］ PC boards）
1. After inductors have been mounted on the boards, chips can be subjected to mechanical stresses in subsequent manufacturing
processes （PCB cutting, board inspection, mounting of additional parts, assembly into the chassis, wave soldering the reflow soldered
boards etc.）For this reason, planning pattern configurations and the position of SMD inductors should be carefully performed to
minimize stress.
◆Pattern configurations（Design of Land-patterns）
1. The following diagrams and tables show some examples of recommended patterns to prevent excessive solder amounts（larger fillets
which extend above the component end terminations）. Examples of improper pattern designs are also shown.
（1） Recommended land dimensions for a typical chip inductor land patterns for PCBs
Land pattern
Solder-resist
Chip inductor
Chip inductor
W
C
B
Technical
considerations
A
B
L
Recommended land dimensions for reflow-soldering （Unit：mm）
Type
0603
1005
L
0.6
1.0
Size
W
0.3
0.5
A
0.20～0.30
0.45～0.55
B
0.20～0.30
0.40～0.50
C
0.25～0.40
0.45～0.55
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
hq_i_mlci_prec_e-E08R01
（2） Examples of good and bad solder application
Item
Not recommended
Recommended
Lead wire of component
Solder-resist
Mixed mounting of SMD and
leaded components
Chassis
Solder (for grounding)
Solder-resist
Component placement close to
the chassis
Electrode pattern
Lead wire of component
Soldering iron
Hand-soldering of leaded
components near mounted
components
Solder-resist
Solder-resist
Horizontal component
placement
◆Pattern configurations（Inductor layout on panelized［ breakaway］ PC boards）
1-1. The following are examples of good and bad inductor layout; SMD inductors should be located to minimize any possible mechanical
stresses from board warp or deflection.
Item
Not recommended
Recommended
Position the component at a
right angle to the direction of
the mechanical stresses that
are anticipated.
Deflection of the board
1-2. To layout the inductors for the breakaway PC board, it should be noted that the amount of mechanical stresses given will vary
depending on inductor layout.
An example below should be counted for better design.
E
D
Perforation
C
A
B
Slit
Magnitude of stress
A＞B＝C＞D＞E
1-3. When breaking PC boards along their perforations, the amount of mechanical stress on the inductors can vary according to the
method used. The following methods are listed in order from least stressful to most stressful: push-back, slit, V-grooving, and
perforation. Thus, any ideal SMD inductor layout must also consider the PCB splitting procedure.
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
hq_i_mlci_prec_e-E08R01
3. Considerations for automatic placement
Precautions
◆Adjustment of mounting machine
1. Excessive impact load should not be imposed on the inductors when mounting onto the PC boards.
2. The maintenance and inspection of the mounter should be conducted periodically.
◆Selection of Adhesives
1. Mounting inductors with adhesives in preliminary assembly, before the soldering stage, may lead to degraded inductor characteristics
unless the following factors are appropriately checked; the size of land patterns, type of adhesive, amount applied, hardening
temperature and hardening period. Therefore, it is imperative to consult the manufacturer of the adhesives on proper usage and
amounts of adhesive to use.
◆Adjustment of mounting machine
1. If the lower limit of the pick-up nozzle is low, too much force may be imposed on the inductors, causing damage. To avoid this, the
following points should be considered before lowering the pick-up nozzle:
（1） The lower limit of the pick-up nozzle should be adjusted to the surface level of the PC board after correcting for deflection of the
board.
（2） The pick-up pressure should be adjusted between 1 and 3N static loads.
（3） To reduce the amount of deflection of the board caused by impact of the pick-up nozzle, supporting pins or back-up pins should be
used under the PC board. The following diagrams show some typical examples of good pick-up nozzle placement:
Item
Single-sided mounting
Improper method
Proper method
chipping
or cracking
supporting pins
or back-up pins
Double-sided mounting
chipping
or cracking
Technical
considerations
supporting pins
or back-up pins
2. As the alignment pin wears out, adjustment of the nozzle height can cause chipping or cracking of the inductors because of mechanical
impact on the inductors. To avoid this, the monitoring of the width between the alignment pin in the stopped position, and maintenance,
inspection and replacement of the pin should be conducted periodically.
◆Selection of Adhesives
1. Some adhesives may cause reduced insulation resistance. The difference between the shrinkage percentage of the adhesive and that of
the inductors may result in stresses on the inductors and lead to cracking. Moreover, too little or too much adhesive applied to the
board may adversely affect component placement, so the following precautions should be noted in the application of adhesives.
（1） Required adhesive characteristics
a. The adhesive should be strong enough to hold parts on the board during the mounting & solder process.
b. The adhesive should have sufficient strength at high temperatures.
c. The adhesive should have good coating and thickness consistency.
d. The adhesive should be used during its prescribed shelf life.
e. The adhesive should harden rapidly.
f. The adhesive must not be contaminated.
g. The adhesive should have excellent insulation characteristics.
h. The adhesive should not be toxic and have no emission of toxic gasses.
（2） When using adhesives to mount inductors on a PCB, inappropriate amounts of adhesive on the board may adversely affect
component placement. Too little adhesive may cause the inductors to fall off the board during the solder process. Too much
adhesive may cause defective soldering due excessive flow of adhesive on to the land or solder pad.
Amount of adhesives
After inductors are bonded
［Recommended conditions］
a
a
Figure
0805 case sizes as examples
a
0.3mm min
b
b
100～120μm
c
Area with no adhesive
c
c
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
hq_i_mlci_prec_e-E08R01
4. Soldering
Precautions
◆Selection of Flux
1. Since flux may have a significant effect on the performance of inductors, it is necessary to verify the following conditions prior to use;
（1） Flux used should be with less than or equal to 0.1 wt% （Chlorine conversion method） of halogenated content. Flux having a strong
acidity content should not be applied.
（2） When soldering inductors on the board, the amount of flux applied should be controlled at the optimum level.
（3） When using water-soluble flux, special care should be taken to properly clean the boards.
◆Soldering
1. Temperature, time, amount of solder, etc. are specified in accordance with the following recommended conditions, and please contact us
about peak temperature when you use lead-free paste.
◆Selection of Flux
1-1. When too much halogenated substance（Chlorine, etc.）content is used to activate the flux, or highly acidic flux is used, an excessive
amount of residue after soldering may lead to corrosion of the terminal electrodes or degradation of insulation resistance on the
surface of the Inductor.
1-2. Flux is used to increase solderability in flow soldering, but if too much is applied, a large amount of flux gas may be emitted and may
detrimentally affect solderability. To minimize the amount of flux applied, it is recommended to use a flux-bubbling system.
1-3. Since the residue of water-soluble flux is easily dissolved by water content in the air, the residue on the surface of Inductor in high
humidity conditions may cause a degradation of insulation resistance and therefore affect the reliability of the components. The
cleaning methods and the capability of the machines used should also be considered carefully when selecting water-soluble flux.
◆Soldering
1-1. Preheating when soldering
Preheating: Inductors shall be preheated sufficiently, and the temperature difference between the inductors and solder shall be within
130°C.
Cooling: The temperature difference between the components and cleaning process should not be greater than 100℃.
Inductors are susceptible to thermal shock when exposed to rapid or concentrated heating or rapid cooling. Therefore, the soldering
process must be conducted with a great care so as to prevent malfunction of the components due to excessive thermal shock.
［Reflow soldering］
【Recommended condition for Pb-free soldering】
Technical
considerations
Temperature（℃）
300
Peak
260℃ Max.
Within 10sec.
200
Slow
cooling
Preheating150℃ Heating above
230℃
60sec. Min.
40sec. Max.
［Hand soldering］
【Recommended condition for Pb-free soldering】
400
Peak
350℃ Max.
Within 3sec.
300
Temperature（℃）
1/2T～1/3T
Inductor
Solder
T
PC board
100
0
Caution
1. Solder (fillet) should wet up to 1/2 to 1/3 of the thickness of an inductor
ideally as shown below:
⊿T
2. Because excessive dwell time can detrimentally affect solderability,
soldering duration shall be kept as close to recommended time as possible.
3. The allowable number of reflow soldering is two (2) times.
Caution
1. It is recommended to use a 20W soldering iron with a maximum tip
diameter of 1.0 mm.
2. The soldering iron shall not directly touch inductors
3. The allowable number of hand soldering is one (1) time
Slow cooling
200
100
0
Preheating
150℃ Min.
60sec. Min.
（※⊿Ｔ≦150 ）
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
hq_i_mlci_prec_e-E08R01
5. Cleaning
Precautions
◆Cleaning conditions
1. When cleaning the PC board after the Inductors are all mounted, select the appropriate cleaning solution according to the type of flux
used and purpose of the cleaning（e.g. to remove soldering flux or other materials from the production process.）
2. Cleaning conditions should be determined after verifying, through a test run, that the cleaning process does not affect the inductor's
characteristics.
Technical
considerations
◆Cleaning conditions
1. The use of inappropriate solutions can cause foreign substances such as flux residue to adhere to the inductor, resulting in a degradation
of the inductor's electrical properties（especially insulation resistance）.
2. Inappropriate cleaning conditions（insufficient or excessive cleaning）may detrimentally affect the performance of the inductors.
In the case of ultrasonic cleaning, too much power output can cause excessive vibration of the PC board which may lead to the cracking
of the inductor or the soldered portion, or decrease the terminal electrodes' strength. Therefore, the following conditions should be
carefully checked;
Ultrasonic output
20W/ℓ or less
Ultrasonic frequency
40kHz or less
Ultrasonic washing period
5 min. or less
6. Resin coating and mold
Precautions
1. With some type of resins a decomposition gas or chemical reaction vapor may remain inside the resin during the hardening period or while
left under normal storage conditions resulting in the deterioration of the inductor's performance.
2. Thermal expansion and thermal shrinkage characteristics of resins may lead to the deterioration of inductors’ performance.
3. When a resin hardening temperature is higher than inductor operating temperature, the stresses generated by the excessive heat may
lead to damage in inductors.
7. Handling
Precautions
◆Breakaway PC boards（splitting along perforations）
1. When splitting the PC board after mounting inductors and other components, care is required so as not to give any stresses of deflection
or twisting to the board.
2. Board separation should not be done manually, but by using the appropriate devices.
◆General handling precautions
1. Always wear static control bands to protect against ESD.
2. Keep the inductors away from all magnets and magnetic objects.
3. Use non-magnetic tweezers when handling inductors.
4. Any devices used with the inductors（ soldering irons, measuring instruments） should be properly grounded.
5. Keep bare hands and metal products（i.e., metal desk）away from inductor electrodes or conductive areas that lead to chip electrodes.
6. Keep inductors away from items that generate magnetic fields such as speakers or coils.
◆Mechanical considerations
1. Be careful not to subject the inductors to excessive mechanical shocks.
（1） If inductors are dropped on the floor or a hard surface they should not be used.
（2） When handling the mounted boards, be careful that the mounted components do not come in contact with or bump against other
boards or components.
8. Storage conditions
Precautions
◆Storage
1. To maintain the solderability of terminal electrodes and to keep the packaging material in good condition, care must be taken to control
temperature and humidity in the storage area. Humidity should especially be kept as low as possible.
・Recommended conditions
Ambient temperature: 30℃or below
Humidity: 70% RH or below
The ambient temperature must be kept below 40℃. Even under ideal storage conditions, solderability of inductor is deteriorated as time
passes, so inductors should be used within 6 months from the time of delivery.
・Inductor should be kept where no chlorine or sulfur exists in the air.
Technical
considerations
◆Storage
1. If the parts are stocked in a high temperature and humidity environment, problems such as reduced solderability caused by oxidation of
terminal electrodes and deterioration of taping/packaging materials may take place. For this reason, components should be used within
6 months from the time of delivery. If exceeding the above period, please check solderability before using the inductors.
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
hq_i_mlci_prec_e-E08R01
for High Quality Equipment
for High Quality Equipment
CHIP BEAD INDUCTORS FOR POWER LINES (FB SERIES M TYPE)
CHIP BEAD INDUCTORS FOR POWER LINES (FB SERIES M TYPE)
REFLOW
REFLOW
AEC-Q200
AEC-Q200 Grade 3 (we conduct the evaluation at the test condition of Grade 3.)
*Operating environment Temp:-40～85℃
NOISE SUPPRESSION
COMPONENTS
For Automotive Electronic Equipment
CHIP BEAD INDUCTORS FOR POWER LINES (FB SERIES M TYPE)
■PART NUMBER
■FEATURES
●HS：For broadband applications
F
B
△
①
AEC-Q200
*Operating Temp. :
M
②
J
③
3
2
1
6
H
④
①Series name
Code
FB
S
8
0
⑥
⑤
0
－
⑦
Shape
Rectangular chip
③Characteristics
Code
J
H
④Dimensions（L×W）
Type（inch）
1608
2125
2012
2016
3216
3225
4516
4525
1608（0603）
2125（0805）
2012（0805）
2016（0806）
3216（1206）
3225（1210）
4516（1806）
4525（1810）
△＝Blank space
Material
Refer to impedance curves
for material differences
⑥Nominal impedance
Code
（example）
330
221
102
Characteristics
Standard
High Impedance type
Code
V
⑨
⑤Material
Code
HS
HM
HL
Series name
Ferrite bead
②Shape
Code
M
T
⑧
Nominal impedance［Ω］
33
220
1000
⑦Impedance tolerance
Code
－
N
Dimensions
（L×W）［mm］
1.6×0.8
2.0×1.25
Impedance tolerance
±25％
±30％
⑧Packaging
Code
T
2.0×1.6
3.2×1.6
3.2×2.5
4.5×1.6
4.5×2.5
Packaging
Taping
⑨Internal code
Code
V
W
●HM：For upper MHz range applications
T
C
A
B
Bead Inductor for Automotive
●HL：For GHz range applications
■STANDARD EXTERNAL DIMENSIONS / STANDARD QUANTITY
Recommended Land Patterns
Surface Mounting
W
・Mounting and soldering conditions should be
L
checked beforehand.
e
Internal code
Bead Inductor for Telecommunications infrastructure
and Industrial equipment / Medical devices
8
AUTO
-40～125℃（Including self-generated heat）
A
Type
FB MJ1608
FB MJ2125
FB MJ3216
FB MJ4516
FB MH1608
FB MH2012
FB MH2016
FB MH3216
FB MH3225
FB MH4516
FB MH4525
A
1.0
1.4
1.4
1.75
1.0
1.4
1.4
1.4
1.4
1.75
1.75
B
1.0
1.2
2.2
3.5
1.0
1.2
1.2
2.2
2.2
3.5
3.5
C
1.0
1.65
2.0
2.0
1.0
1.65
2.0
2.0
2.9
2.0
2.9
Unit：mm
Standard quantity [pcs]
Paper tape
Embossed tape
Type
L
W
T
e
FB MJ1608
（0603）
FB MJ2125
（0805）
FB MJ3216
（1206）
FB MJ4516
（1806）
FB MH1608
（0603）
FB MH2012
（0805）
FB MH2016
（0806）
FB MH3216
（1206）
FB MH3225
（1210）
FB MH4516
（1806）
FB MH4525
（1810）
1.6±0.2
（0.063±0.008）
2.0±0.2
（0.079±0.008）
3.2±0.3
（0.126±0.012）
4.5±0.3
（0.177±0.012）
1.6±0.1
（0.063±0.004）
2.0±0.2
（0.079±0.008）
2.0±0.2
（0.079±0.008）
3.2±0.3
（0.126±0.012）
3.2±0.3
（0.126±0.012）
4.5±0.3
（0.177±0.012）
4.5±0.4
（0.177±0.016）
0.8±0.2
（0.031±0.008）
1.25±0.2
（0.049±0.008）
1.6±0.2
（0.063±0.008）
1.6±0.2
（0.063±0.008）
0.8±0.1
（0.031±0.004）
1.25±0.2
（0.049±0.008）
1.6±0.2
（0.063±0.008）
1.6±0.2
（0.063±0.008）
2.5±0.3
（0.098±0.012）
1.6±0.2
（0.063±0.008）
2.5±0.3
（0.098±0.012）
0.8±0.2
（0.031±0.008）
0.85±0.2
（0.033±0.008）
1.1±0.2
（0.043±0.008）
1.1±0.2
（0.043±0.008）
0.8±0.1
（0.031±0.004）
0.85±0.2
（0.033±0.008）
1.6±0.2
（0.063±0.008）
1.6±0.2
（0.063±0.008）
2.5±0.3
（0.098±0.012）
1.6±0.2
（0.063±0.008）
2.5±0.3
（0.098±0.012）
0.3±0.2
（0.012±0.008）
0.5±0.3
（0.020±0.012）
0.5±0.3
（0.020±0.012）
0.5±0.3
（0.020±0.012）
0.3±0.15
（0.012±0.006）
0.5±0.3
（0.020±0.012）
0.5±0.3
（0.020±0.012）
0.5±0.3
（0.020±0.012）
0.5±0.3
（0.020±0.012）
0.5±0.3
（0.020±0.012）
0.9±0.6
（0.035±0.024）
4000
－
4000
－
－
2000
－
2000
4000
－
4000
－
－
2000
－
2000
－
1000
－
2000
－
1000
Unit：mm（inch）
hq_chipbeads_FBM_e-E08R01
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our product specification sheets.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our website (http://www.ty-top.com/) .
130
20
for High Quality Equipment
■PART NUMBER
・ All the Chip Bead Inductors for Power Lines of the catalog lineup are RoHS compliant.
Part number
FB MJ1608HS280NTV
FB MJ1608HM230NTV
Nominal impedance
（Ω）
28
23
Impedance tolerance
±30％
±30％
DC Resistance
［Ω］（max.）
0.007
0.007
Rated current
［A］（max.）
4.0
4.0
Thickness
［mm］
0.8 ±0.2
0.8 ±0.2
Measuring frequency
［MHz］
100
100
100
100
100
DC Resistance
［Ω］（max.）
0.004
0.008
0.004
0.008
0.008
Rated current
［A］（max.）
6.0
4.0
6.0
4.0
4.0
Thickness
［mm］
0.85 ±0.2
0.85 ±0.2
0.85 ±0.2
0.85 ±0.2
0.85 ±0.2
Measuring frequency
［MHz］
100
100
100
100
100
DC Resistance
［Ω］（max.）
0.005
0.010
0.005
0.010
0.012
Rated current
［A］（max.）
6.0
4.0
6.0
4.0
4.0
Thickness
［mm］
1.1 ±0.2
1.1 ±0.2
1.1 ±0.2
1.1 ±0.2
1.1 ±0.2
Measuring frequency
［MHz］
100
100
100
100
100
DC Resistance
［Ω］（max.）
0.007
0.014
0.007
0.014
0.014
Rated current
［A］（max.）
6.0
4.0
6.0
4.0
3.5
Thickness
［mm］
1.1 ±0.2
1.1 ±0.2
1.1 ±0.2
1.1 ±0.2
1.1 ±0.2
DC Resistance
［Ω］（max.）
Rated current
［A］（max.）
Thickness
［mm］
0.020
0.025
0.035
0.050
0.070
0.130
0.150
0.170
0.350
0.028
0.045
0.130
0.170
0.210
0.350
0.450
3.5
3.0
2.5
2.1
1.8
1.2
1.0
0.9
0.6
2.6
2.1
1.2
0.9
0.8
0.6
0.5
Note
●FB MJ2125
Part number
FB
FB
FB
FB
FB
MJ2125HS250NTV
MJ2125HS420-TV
MJ2125HM210NTV
MJ2125HM330-TV
MJ2125HL8R0NTV
Nominal impedance
（Ω）
25
42
21
33
8
Impedance tolerance
±30％
±25％
±30％
±25％
±30％
Note
●FB MJ3216
Part number
FB
FB
FB
FB
FB
MJ3216HS480NTV
MJ3216HS800-TV
MJ3216HM380NTV
MJ3216HM600-TV
MJ3216HL160NTV
Nominal impedance
（Ω）
48
80
38
60
16
Impedance tolerance
±30％
±25％
±30％
±25％
±30％
Note
●FB MJ4516
Part number
FB
FB
FB
FB
FB
MJ4516HS720NTV
MJ4516HS111-TV
MJ4516HM560NTV
MJ4516HM900-TV
MJ4516HL230NTV
Nominal impedance
（Ω）
72
110
56
90
23
Impedance tolerance
±30％
±25％
±30％
±25％
±30％
Note
High impedance type（ＧＨz Band）
●FB MH1608
Part number
FB
FB
FB
FB
FB
FB
FB
FB
FB
FB
FB
FB
FB
FB
FB
FB
MH1608HM470-TV
MH1608HM600-TV
MH1608HM101-TV
MH1608HM151-TV
MH1608HM221-TV
MH1608HM331-TV
MH1608HM471-TV
MH1608HM601-TV
MH1608HM102-TV
MH1608HL300-TV
MH1608HL600-TV
MH1608HL121-TV
MH1608HL221-TV
MH1608HL331-TV
MH1608HL471-TV
MH1608HL601-TV
Nominal impedance
Measuring frequency 100［MHz］
（Ω）
tolerance
47
±25％
60
±25％
100
±25％
150
±25％
220
±25％
330
±25％
470
±25％
600
±25％
1000
±25％
30
±25％
60
±25％
120
±25％
220
±25％
330
±25％
470
±25％
600
±25％
Nominal impedance
Measuring frequency 1［GHz］
（Ω）
tolerance
75
±40％
100
±40％
170
±40％
270
±40％
370
±40％
520
±40％
750
±40％
900
±40％
1200
±40％
120
±40％
220
±40％
540
±40％
950
±40％
1200
±40％
1500
±40％
1800
±40％
0.8
0.8
0.8
0.8
0.8
0.8
0.8
0.8
0.8
0.8
0.8
0.8
0.8
0.8
0.8
0.8
Note
±0.1
±0.1
±0.1
±0.1
±0.1
±0.1
±0.1
±0.1
±0.1
±0.1
±0.1
±0.1
±0.1
±0.1
±0.1
±0.1
NOISE SUPPRESSION
COMPONENTS
Measuring frequency
［MHz］
100
100
For Automotive Electronic Equipment
Standard type
●FB MJ1608
CHIP BEAD INDUCTORS FOR POWER LINES (FB SERIES M TYPE)
Notes)
・ The exchange of individual specifications is necessary depending on your application and/or circuit condition. Please contact TAIYO YUDEN's official sales channel.
・ For Automotive (AEC-Q200 Qualified) products for BODY & CHASSIS, and INFOTAINMENT. Please check ”Automotive Application Guide” for further details before using the products.
AEC-Q200
＜ ：AEC-Q200
qualified＞
All the Chip Bead Inductors for Power Lines for Automotive products are tested based on the test conditions and methods defined in AEC-Q200 by family item.
Please consult with TAIYO YUDEN's official sales channel for the details of the product specifications and AEC-Q200 test results, etc.,
and please review and approve the product specifications before ordering.
AUTO
※）The rated current is the value of current at which the temperature of the element is increased by 40 deg.
hq_chipbeads_FBM_AUTO_e-E08R01
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our product specification sheets.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our website (http://www.ty-top.com/) .
20
131
for High Quality Equipment
■PART NUMBER
High impedance type
●FB MH2012
Part number
FB
FB
FB
FB
MH2012HM800-TV
MH2012HM121-TV
MH2012HM221-TV
MH2012HM331-TV
Nominal impedance
（Ω）
80
120
220
330
Impedance tolerance
±25％
±25％
±25％
±25％
For Automotive Electronic Equipment
CHIP BEAD INDUCTORS FOR POWER LINES (FB SERIES M TYPE)
Measuring frequency
［MHz］
100
100
100
100
DC Resistance
［Ω］（max.）
0.025
0.032
0.060
0.080
Rated current
［A］（max.）
2.7
2.5
2.0
1.8
Thickness
［mm］
0.85 ±0.2
0.85 ±0.2
0.85 ±0.2
0.85 ±0.2
Measuring frequency
［MHz］
100
100
DC Resistance
［Ω］（max.）
0.015
0.050
Rated current
［A］（max.）
4.5
2.0
Thickness
［mm］
1.6 ±0.2
1.6 ±0.2
Measuring frequency
［MHz］
100
100
DC Resistance
［Ω］（max.）
0.020
0.070
Rated current
［A］（max.）
4.0
2.0
Thickness
［mm］
1.6 ±0.2
1.6 ±0.2
Measuring frequency
［MHz］
100
100
100
DC Resistance
［Ω］（max.）
0.042
0.100
0.130
Rated current
［A］（max.）
3.0
2.0
1.2
Thickness
［mm］
2.5 ±0.3
2.5 ±0.3
2.5 ±0.3
Measuring frequency
［MHz］
100
DC Resistance
［Ω］（max.）
0.100
Rated current
［A］（max.）
1.5
Thickness
［mm］
1.6 ±0.2
Measuring frequency
［MHz］
100
100
DC Resistance
［Ω］（max.）
0.060
0.130
Rated current
［A］（max.）
3.0
2.0
Thickness
［mm］
2.5 ±0.3
2.5 ±0.3
Measuring frequency
［MHz］
100
100
100
100
DC Resistance
［Ω］（max.）
0.004
0.006
0.004
0.006
Rated current
［A］（max.）
7.5
6.0
7.5
6.0
Thickness
［mm］
0.8 ±0.2
0.8 ±0.2
0.8 ±0.2
0.8 ±0.2
Note
●FB MH2016
Part number
FB MH2016HM121NTV
FB MH2016HM251NTV
Nominal impedance
（Ω）
120
250
Impedance tolerance
±30％
±30％
Note
●FB MH3216
Part number
FB MH3216HM221NTV
FB MH3216HM501NTV
Nominal impedance
（Ω）
220
500
Impedance tolerance
±30％
±30％
Note
●FB MH3225
Part number
FB MH3225HM601NTV
FB MH3225HM102NTV
FB MH3225HM202NTV
Nominal impedance
（Ω）
600
1000
2000
Impedance tolerance
±30％
±30％
±30％
Note
●FB MH4516
Part number
FB MH4516HM851NTV
Nominal impedance
（Ω）
850
Impedance tolerance
±30％
Note
●FB MH4525
Part number
FB MH4525HM102NTV
FB MH4525HM162NTV
Nominal impedance
（Ω）
1000
1600
Impedance tolerance
±30％
±30％
Note
●High current type
Part number
FB
FB
FB
FB
MJ1608HS220NTW
MJ1608HS280NTW
MJ1608HM180NTW
MJ1608HM230NTW
Nominal impedance
（Ω）
22
28
18
23
Impedance tolerance
±30％
±30％
±30％
±30％
Note
※）The rated current is the value of current at which the temperature of the element is increased by 40 deg.
NOISE SUPPRESSION
COMPONENTS
AUTO
hq_chipbeads_FBM_AUTO_e-E08R01
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our product specification sheets.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our website (http://www.ty-top.com/) .
132
20
for High Quality Equipment
■ELECTRICAL CHARACTERISTICS
Standard type
■FB MJ1608
■FB MJ2125
FB MJ1608HS280NTV
35
50
30
25
Impedance[Ω]
R
15
Z
30
R
20
10
X
10
X
5
1
10
100
1000
10000
10
1000
10000
1
R
1000
10000
60
Z
30
R
20
50
Z
40
R
30
20
X
10
0
X
100
1000
10000
X
10
0
10
100
FB MJ2125HM330-TV
70
Impedance[Ω]
Z
30
1
10
Frequency[MHz]
40
Impedance[Ω]
Impedance[Ω]
100
FB MJ2125HM210NTV
50
40
10
X
Frequency[MHz]
FB MJ2125HS420-TV
20
R
10
0
1
Frequency[MHz]
50
15
5
0
0
Z
20
0
1
10
Frequency[MHz]
100
1000
1
10000
10
Frequency[MHz]
100
1000
10000
Frequency[MHz]
■FB MJ3216
FB MJ2125HL8R0NTV
50
R
Z
20
X
10
80
40
Z
30
R
20
X
10
0
100
1000
10000
10
100
1000
1
10000
R
30
20
X
10
Z
60
R
40
10
100
1000
10000
AUTO
R
Z
40
X
X
0
1
60
20
20
0
10000
80
80
Impedance[Ω]
Impedance[Ω]
Z
1000
FB MJ3216HL160NTV
100
100
60
100
Frequency[MHz]
FB MJ3216HM600-TV
120
70
40
10
Frequency[MHz]
FB MJ3216HM380NTV
50
X
0
1
Frequency[MHz]
80
R
40
NOISE SUPPRESSION
COMPONENTS
10
Z
60
20
0
1
Impedance[Ω]
Impedance[Ω]
Impedance[Ω]
30
FB MJ3216HS800-TV
100
50
40
Impedance[Ω]
FB MJ3216HS480NTV
60
For Automotive Electronic Equipment
Z
20
Impedance[Ω]
40
25
FB MJ2125HS250NTV
30
CHIP BEAD INDUCTORS FOR POWER LINES (FB SERIES M TYPE)
Impedance[Ω]
FB MJ1608HM230NTV
0
1
10
Frequency[MHz]
100
1000
1
10000
10
Frequency[MHz]
100
1000
10000
Frequency[MHz]
■FB MJ4516
FB MJ4516HS720NTV
100
R
40
Z
80
R
60
40
X
20
100
100
Impedance[Ω]
Impedance[Ω]
Z
60
X
10
100
1000
Frequency[MHz]
10000
Z
60
R
40
X
0
0
1
80
20
20
0
FB MJ4516HM560NTV
120
120
80
Impedance[Ω]
FB MJ4516HS111-TV
140
1
10
100
1000
10000
Frequency[MHz]
1
10
100
1000
10000
Frequency[MHz]
hq_chipbeads_FBM_AUTO_char_e-E08R01
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our product specification sheets.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our website (http://www.ty-top.com/) .
20
133
for High Quality Equipment
■ELECTRICAL CHARACTERISTICS
FB MJ4516HM900-TV
160
120
120
Impedance[Ω]
Z
100
R
80
60
100
80
R
Z
60
X
40
40
X
20
20
0
0
1
10
100
1000
10000
1
10
Frequency[MHz]
100
1000
10000
Frequency[MHz]
High impedance type(GHz Band）
■FB MH1608
FB MH1608HM470-TV
80
50
R
40
30
20
X
10
80
Z
R
60
40
0
1
10
100
1000
10000
10
100
1000
R
100
Z
250
R
200
150
X
50
0
10
100
1000
10
Frequency[MHz]
100
1000
10000
Impedance[Ω]
Z
R
400
300
200
X
100
100
1000
Z
600
R
400
10000
10
100
1000
Z
200
R
150
10000
1000
10000
FB MH1608HL121-TV
700
500
Z
400
R
300
200
100
X
0
1000
100
600
250
100
0
100
10
Frequency[MHz]
50
Frequency[MHz]
X
1
Impedance[Ω]
Impedance[Ω]
Impedance[Ω]
R
50
10
600
10000
FB MH1608HL600-TV
350
X
1
R
800
200
300
Z
Z
1000
Frequency[MHz]
150
10000
0
1
FB MH1608HL300-TV
100
1200
400
X
Frequency[MHz]
200
1000
FB MH1608HM102-TV
1600
0
10
100
1400
200
0
1
10
Frequency[MHz]
800
500
X
1
FB MH1608HM601-TV
1000
700
600
200
Frequency[MHz]
FB MH1608HM471-TV
800
R
300
0
1
10000
10000
Z
400
100
Impedance[Ω]
NOISE SUPPRESSION
COMPONENTS
0
1000
500
300
100
X
100
FB MH1608HM331-TV
600
Impedance[Ω]
Impedance[Ω]
Z
1
10
Frequency[MHz]
350
50
X
1
10000
FB MH1608HM221-TV
400
250
150
R
100
Frequency[MHz]
FB MH1608HM151-TV
200
Z
0
1
Frequency[MHz]
300
150
50
X
20
0
Impedance[Ω]
Impedance[Ω]
Z
FB MH1608HM101-TV
200
100
60
Impedance[Ω]
Impedance[Ω]
FB MH1608HM600-TV
120
70
Impedance[Ω]
For Automotive Electronic Equipment
CHIP BEAD INDUCTORS FOR POWER LINES (FB SERIES M TYPE)
Impedance[Ω]
140
AUTO
FB MJ4516HL230NTV
140
X
0
1
10
100
1000
10000
Frequency[MHz]
1
10
100
1000
10000
Frequency[MHz]
hq_chipbeads_FBM_AUTO_char_e-E08R01
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our product specification sheets.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our website (http://www.ty-top.com/) .
134
20
for High Quality Equipment
■ELECTRICAL CHARACTERISTICS
FB MH1608HL221-TV
1200
FB MH1608HL471-TV
2000
1400
Z
R
Z
800
R
600
200
X
0
10
100
1000
X
0
1
10000
R
X
0
1
Z
1000
500
400
200
1500
10
Frequency[MHz]
100
1000
10000
1
10
Frequency[MHz]
100
1000
10000
Frequency[MHz]
FB MH1608HL601-TV
2500
Impedance[Ω]
2000
Z
1500
R
1000
500
X
0
1
10
100
1000
10000
Frequency[MHz]
High impedance type
■FB MH2012
FB MH2012HM800-TV
140
FB MH2012HM121-TV
200
350
120
100
80
R
60
40
Z
150
Impedance[Ω]
Z
Impedance[Ω]
Impedance[Ω]
FB MH2012HM221-TV
400
R
100
50
X
10
100
1000
150
50
X
0
10000
R
200
1
10
Frequency[MHz]
100
1000
X
0
10000
1
10
Frequency[MHz]
100
1000
10000
Frequency[MHz]
■FB MH2016
600
Z
Impedance[Ω]
Impedance[Ω]
500
400
300
R
200
FB MH2016HM121NTV
200
350
Z
150
R
100
50
100
X
0
1
10
100
1000
1
10
100
1000
AUTO
Z
250
R
200
150
X
50
X
Frequency[MHz]
0
1
10000
10
Frequency[MHz]
100
1000
10000
Frequency[MHz]
■FB MH3216
■FB MH3225
300
800
700
Z
Impedance[Ω]
250
200
R
150
FB MH3216HM501NTV
100
500
R
400
300
200
50
1
10
100
1000
Frequency[MHz]
R
500
Z
400
300
100
0
10000
600
200
X
100
X
0
700
Z
600
FB MH3225HM601NTV
800
Impedance[Ω]
FB MH3216HM221NTV
350
Impedance[Ω]
300
100
0
10000
FB MH2016HM251NTV
400
Impedance[Ω]
FB MH2012HM331-TV
NOISE SUPPRESSION
COMPONENTS
1
250
100
20
0
Z
300
For Automotive Electronic Equipment
400
1000
CHIP BEAD INDUCTORS FOR POWER LINES (FB SERIES M TYPE)
600
1200
Impedance[Ω]
800
Impedance[Ω]
1000
Impedance[Ω]
FB MH1608HL331-TV
1600
X
0
1
10
100
1000
10000
Frequency[MHz]
1
10
100
1000
10000
Frequency[MHz]
hq_chipbeads_FBM_AUTO_char_e-E08R01
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our product specification sheets.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our website (http://www.ty-top.com/) .
20
135
for High Quality Equipment
■ELECTRICAL CHARACTERISTICS
■FB MH4516
FB MH3225HM102NTV
2500
Impedance[Ω]
Z
600
1200
2000
R
800
400
1500
Z
R
1000
500
0
0
10
100
1000
R
600
X
0
1
10000
10
Frequency[MHz]
100
1000
10000
1
10
Frequency[MHz]
100
1000
10000
Frequency[MHz]
■FB MH4525
■High current type
FB MH4525HM102NTV
1400
FB MH4525HM162NTV
2000
R
800
Z
600
400
25
1500
R
Z
1000
500
X
X
200
0
Impedance[Ω]
Impedance[Ω]
1000
10
100
1000
10
Frequency[MHz]
100
1000
10000
Z
R
10
Z
25
20
R
15
0
1
10
100
1000
10000
10000
Z
30
R
20
X
10
X
5
0
1000
40
30
10
X
100
FB MJ1608HM230NTW
50
Impedance[Ω]
Impedance[Ω]
25
5
10
Frequency[MHz]
35
15
X
1
FB MJ1608HM180NTW
40
30
20
R
10
Frequency[MHz]
FB MJ1608HS280NTW
35
Z
15
0
1
10000
20
5
0
1
FB MJ1608HS220NTW
30
1200
Impedance[Ω]
800
200
X
1
Z
1000
400
X
200
Impedance[Ω]
For Automotive Electronic Equipment
CHIP BEAD INDUCTORS FOR POWER LINES (FB SERIES M TYPE)
Impedance[Ω]
1000
FB MH4516HM851NTV
1400
Impedance[Ω]
1200
FB MH3225HM202NTV
0
1
10
NOISE SUPPRESSION
COMPONENTS
Frequency[MHz]
100
1000
10000
Frequency[MHz]
1
10
100
1000
10000
Frequency[MHz]
AUTO
■Derating of Rated Current
●FB series M type
Derating of current is necessary for FB series M type depending on ambient temperature.
Please refer to the chart shown below for appropriate derating of current.
FB series M type
Ratio to Rated Current
120%
100%
80%
60%
40%
20%
0%
-40
-20
0
20
40
60
80
100
120
140
Ambient Temperature(℃)
hq_chipbeads_FBM_AUTO_char_e-E08R01
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our product specification sheets.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our website (http://www.ty-top.com/) .
136
20
for High Quality Equipment
for High Quality Equipment
CHIP BEAD INDUCTORS FOR POWER LINES (FB SERIES T TYPE)
CHIP BEAD INDUCTORS FOR POWER LINES (FB SERIES T TYPE)
REFLOW
REFLOW
AEC-Q200
AEC-Q200 Grade 1 (we conduct the evaluation at the test condition of Grade 1.)
*Operating environment Temp:-40～125℃
F
B
△
①
*Operating Temp. :
T H
② ③
1
6
0
8
H
④
①Series name
Code
FB
E
4
7 0
⑥
⑤
－ T
⑦ ⑧
Shape
Rectangular chip（High-Reliability）
③Characteristics
Code
H
④Dimensions（L×W）
Type（inch）
1608
1608（0603）
Material
Refer to impedance curves
for material differences
⑥Nominal impedance
Code
（example）
300
221
102
Characteristics
High Impedance type
Code
△＝Blank space
⑤Material
Code
HE
HL
Series name
Ferrite bead
②Shape
Code
T
-40～150℃（Including self-generated heat）
⑦Impedance tolerance
Code
－
Dimensions
（L×W）［mm］
1.6×0.8
Nominal impedance［Ω］
30
220
1000
Impedance tolerance
±25％
⑧Packaging
Code
T
Packaging
Taping
■FEATURES
●HE：For upper MHz range applications
●HL：For GHz range applications
CHIP BEAD INDUCTORS FOR POWER LINES (FB SERIES T TYPE)
■PART NUMBER
AEC-Q200
■STANDARD EXTERNAL DIMENSIONS / STANDARD QUANTITY
L
T
Recommended Land Patterns
Surface Mounting
・Mounting and soldering conditions should be
checked beforehand.
e
Type
FB TH1608
A
1.0
B
1.0
C
1.0
Unit：mm
C
NOISE SUPPRESSION
COMPONENTS
W
AUTO
A
B
INDL
A
Standard quantity [pcs]
Paper tape
Embossed tape
Type
L
W
T
e
FB TH1608
（0603）
1.6±0.15
（0.063±0.006）
0.8±0.15
（0.031±0.006）
0.8±0.15
（0.031±0.006）
0.4±0.2
（0.015±0.008）
4000
－
Unit：mm（inch）
hq_chipbeads_FBT_e-E08R01
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our product specification sheets.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our website (http://www.ty-top.com/) .
20
Web_1
for High Quality Equipment
■PART NUMBER
・ All the Chip Bead Inductors for Power Lines of the catalog lineup are RoHS compliant.
CHIP BEAD INDUCTORS FOR POWER LINES (FB SERIES T TYPE)
Notes)
・ The exchange of individual specifications is necessary depending on your application and/or circuit condition. Please contact TAIYO YUDEN's official sales channel.
・ For Automotive (AEC-Q200 Qualified) products for POWERTRAIN, and SAFETY. Please check ”Automotive Application Guide” for further details before using the products.
AEC-Q200
＜ ：AEC-Q200
qualified＞
All the Chip Bead Inductors for Power Lines for Automotive products are tested based on the test conditions and methods defined in AEC-Q200 by family item.
Please consult with TAIYO YUDEN's official sales channel for the details of the product specifications and AEC-Q200 test results, etc.,
and please review and approve the product specifications before ordering.
・ The products are for Telecommunications infrastructure and Industrial equipment and for Medical devices.
Please consult with TAIYO YUDEN's official sales channel for the details of the product specifications, etc.,
and please review and approve the product specifications before ordering.
Please be sure to contact us for further information in advance when the products are used for automotive electronic equipment.
●FB TH1608HE
Part number
FB
FB
FB
FB
FB
FB
FB
FB
FB
TH1608HE470-T
TH1608HE600-T
TH1608HE101-T
TH1608HE151-T
TH1608HE221-T
TH1608HE331-T
TH1608HE471-T
TH1608HE601-T
TH1608HE102-T
Nominal impedance
（Ω）
47
60
100
150
220
330
470
600
1000
Impedance tolerance
±25％
±25％
±25％
±25％
±25％
±25％
±25％
±25％
±25％
Measuring frequency
［MHz］
100
100
100
100
100
100
100
100
100
DC Resistance
［Ω］（max.）
0.020
0.025
0.035
0.050
0.070
0.130
0.150
0.170
0.350
Rated current
［A］（max.）
2.5
2.3
1.9
1.5
1.3
0.9
0.7
0.6
0.5
Thickness
［mm］
0.8 ±0.15
0.8 ±0.15
0.8 ±0.15
0.8 ±0.15
0.8 ±0.15
0.8 ±0.15
0.8 ±0.15
0.8 ±0.15
0.8 ±0.15
Measuring frequency
［MHz］
100
100
100
100
100
100
100
DC Resistance
［Ω］（max.）
0.028
0.045
0.130
0.170
0.210
0.350
0.450
Rated current
［A］（max.）
2.00
1.60
0.95
0.65
0.60
0.50
0.42
Thickness
［mm］
0.8 ±0.15
0.8 ±0.15
0.8 ±0.15
0.8 ±0.15
0.8 ±0.15
0.8 ±0.15
0.8 ±0.15
Note
●FB TH1608HL
Part number
FB
FB
FB
FB
FB
FB
FB
TH1608HL300-T
TH1608HL600-T
TH1608HL121-T
TH1608HL221-T
TH1608HL331-T
TH1608HL471-T
TH1608HL601-T
Nominal impedance
（Ω）
30
60
120
220
330
470
600
Impedance tolerance
±25％
±25％
±25％
±25％
±25％
±25％
±25％
Note
※）The rated current is the value of current at which the temperature of the element is increased by 40 deg.
NOISE SUPPRESSION
COMPONENTS
AUTO
INDL
hq_chipbeads_FBT_AUTO_e-E08R01
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our product specification sheets.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our website (http://www.ty-top.com/) .
Web_2
20
for High Quality Equipment
■ELECTRICAL CHARACTERISTICS
■FB TH1608HE
CHIP BEAD INDUCTORS FOR POWER LINES (FB SERIES T TYPE)
NOISE SUPPRESSION
COMPONENTS
■FB TH1608HL
AUTO
INDL
hq_chipbeads_FBT_char_e-E08R01
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our product specification sheets.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our website (http://www.ty-top.com/) .
20
Web_3
for High Quality Equipment
■ELECTRICAL CHARACTERISTICS
●FB series T type
Derating of current is necessary for FB series T type depending on ambient temperature.
Please refer to the chart shown below for appropriate derating of current.
FB series T type
Ratio to rated current (A)
CHIP BEAD INDUCTORS FOR POWER LINES (FB SERIES T TYPE)
■Derating of Rated Current
Rated current at 150℃ is 10mA
Ambient Temperature (℃)
125
150
NOISE SUPPRESSION
COMPONENTS
AUTO
INDL
hq_chipbeads_FBT_char_e-E08R01
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our product specification sheets.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our website (http://www.ty-top.com/) .
Web_4
20
CHIP BEAD INDUCTORS FOR POWER LINES (FB SERIES M TYPE / T TYPE)
■PACKAGING
①Minimum Quantity
Standard Quantity［pcs］
Paper Tape
Embossed Tape
4000
－
4000
－
4000
－
－
2000
－
2000
－
1000
－
2000
－
1000
－
2000
Type
1608（0603）
2125（0805）
2012（0805）
2016（0806）
3216（1206）
3225（1210）
4516（1806）
4525（1810）
4532（1812）
②Tape Material
●Card board carrier tape
Top tape
Base tape
Chip Filled
Sprocket hole
Bottom tape
Chip cavity
Chip
●Embossed tape
Top tape
Chip Filled
Sprocket hole
Base tape
Chip cavity
Chip
③Taping Dimensions
●Paper tape (0.315 inches wide)
A
B
F
1.75±0.1
(0.069±0.004）
T
8.0±0.3
(0.315±0.012)
φ1.5＋0.1/－0
(φ0.059＋0.004/-0)
3.5±0.05
(0.138±0.002)
Sprocket hole
4.0±0.1
(0.157±0.004)
2.0±0.05
(0.079±0.002)
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
chipbeads_pack_e-E08R01
A
Chip Cavity
B
Insertion Pitch
F
Tape Thickness
T
1.0±0.2
（0.039±0.008）
1.8±0.2
（0.071±0.008）
4.0±0.2
（0.157±0.008）
1.1max
（0.043max）
1.5±0.2
（0.059±0.008）
2.3±0.2
（0.091±0.008）
4.0±0.2
（0.157±0.008）
1.1max
（0.043max）
Type
FB MJ1608
FB MH1608
FB TH1608
（0603）
FB MJ2125
FB MH2012
（0805）
Unit : mm（inch）
●Embossed tape (0.315 inches wide)
3.5±0.05
(0.138±0.002)
A
B
F
8.0±0.3
(0.315±0.012)
1.75±0.1
(0.069±0.004）
φ1.5＋0.1/－0
(φ0.059＋0.004/-0)
Sprocket hole
4.0±0.1
(0.157±0.004)
2.0±0.05
(0.079±0.002)
Chip Cavity
A
B
1.8±0.2
2.2±0.2
（0.071±0.008）
（0.087±0.008）
1.9±0.2
3.5±0.2
（0.075±0.008）
（0.138±0.008）
1.9±0.2
3.5±0.2
（0.075±0.008）
（0.138±0.008）
2.8±0.2
3.5±0.2
（0.110±0.008）
（0.138±0.008）
Type
FB MH2016
（0806）
FB MJ3216
（1206）
FB MH3216
（1206）
FB MH3225
（1210）
Insertion Pitch
F
4.0±0.2
（0.157±0.008）
4.0±0.2
（0.157±0.008）
4.0±0.2
（0.157±0.008）
4.0±0.2
（0.157±0.008）
Tape Thickness
K
T
2.6max
0.6max
（0.102max）
（0.024max）
1.5max
0.3max
（0.059max）
（0.012max）
2.6max
0.6max
（0.102max）
（0.024max）
4.0max
0.6max
（0.157max）
（0.024max）
Unit : mm（inch）
Insertion Pitch
F
4.0±0.2
（0.157±0.008）
4.0±0.2
（0.157±0.008）
4.0±0.2
（0.157±0.008）
8.0±0.2
（0.315±0.008）
Tape Thickness
K
T
1.5max
0.3max
（0.059max）
（0.012max）
2.6max
0.6max
（0.102max）
（0.024max）
4.0max
0.6max
（0.157max）
（0.024max）
4.0max
0.6max
（0.157max）
（0.024max）
Unit : mm（inch）
●Embossed tape (0.472 inches wide)
5.5±0.05
(0.217±0.002)
1.75±0.1
(0.069±0.004）
A
B
T
12.0±0.3
(0.472±0.012)
φ1.5＋0.1/－0
(φ0.059＋0.004/-0)
Sprocket hole
K
F
2.0±0.05
(0.079±0.002)
Type
FB MJ4516
（1806）
FB MH4516
（1806）
FB MH4525
（1810）
FB MH4532
（1812）
4.0±0.1
(0.157±0.004)
Chip Cavity
A
B
1.9±0.2
4.9±0.2
（0.075±0.008）
（0.193±0.008）
1.9±0.2
4.9±0.2
（0.075±0.008）
（0.193±0.008）
2.9±0.2
4.9±0.2
（0.114±0.008）
（0.193±0.008）
3.6±0.2
4.9±0.2
（0.142±0.008）
（0.193±0.008）
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
chipbeads_pack_e-E08R01
④Leader and Blank portion
⑤Reel size
2.0±0.5
（0.079±0.020）
t
φ13.0±0.5
（φ0.512±0.020）
R1.0
φd
φ21.0±0.8
（φ0.827±0.031）
φD
W
Type
FB MJ1608
FB MJ2125
FB MJ3216
φD
φd
MH1608
MH2012
MH2016
MH3216
MH3225
MH4516
MH4525
FB MH4532
FB TH1608
t
10.0±1.5
（0.394±0.059）
14.0±1.5
（0.551±0.059）
FB MJ4516
FB
FB
FB
FB
FB
FB
FB
W
180＋0/－3
（7.09＋0/－0.118 ）
330±2.0
（12.99±0.080）
180＋0/－3
（7.09＋0/－0.118 ）
60＋1/－0
（2.36＋0.039/－0 ）
100±1.0
（3.94±0.039）
60＋1/－0
（2.36＋0.039/－0 ）
10.0±1.5
（0.394±0.059）
14.0±1.5
（0.551±0.059）
14.0±2.0
（0.551±0.080）
10.0±1.5
（0.394±0.059）
2.5max
(0.098max)
3.0max
(1.181max)
2.5max
(0.098max)
Unit : mm（inch）
⑥Top tape strength
The top tape requires a peel-off force of 0.1 to 0.7N in the direction of the arrow as illustrated below.
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
chipbeads_pack_e-E08R01
CHIP BEAD INDUCTORS FOR POWER LINE (FB SERIES M TYPE / T TYPE)
■RELIABILITY DATA
1. Operating Temperature Range
Specified Value
－40℃～＋125℃ （Including self-generated heat）
Test Methods and
Remarks
Including self-generated heat
2. Storage Temperature Range
Specified Value
－40℃～＋85℃
Test Methods and
Remarks
*Note: －5 to ＋40℃ in taped packaging
3. Impedance
Specified Value
Within the specified tolerance
Test Methods and
Remarks
Measuring equipment
Measuring frequency
: Impedance analyzer (HP4291A) or its equivalent
: 100±1 MHz
4. DC Resistance
Specified Value
Within the specified range
Test Methods and
Remarks
Four-terminal method
Measuring equipment : Milliohm High-Tester 3226 (Hioki Denki) or its equivalent
5. Rated Current
Specified Value
Within the specified range
6. Vibration
Specified Value
Appearance
Impedance change
: No significant abnormality
: Within ±30% of the initial value
Test Methods and
Remarks
According to JIS C 0040.
Vibration type
:A
Time
: 2 hrs each in X,Y, and Z directions Total: 6 hrs
Frequency range
: 10 to 55 to 10Hz (/min.)
Amplitude
: 1.5 mm (shall not exceed acceleration 196m/s2)
Mounting method
: Soldering onto PC board
7. Solderability
Specified Value
90% or more of immersed surface of terminal electrode shall be covered with fresh solder.
Test Methods and
Remarks
Solder temperature
Immersion time
Preconditioning
Immersion and Removal speed
:
:
:
:
230±5℃
4±1 sec.
Immersion into flux.
25mm/sec.
8. Resistance to Soldering Heat
Specified Value
Appearance
Impedance change
: No significant abnormality
: Within ±30% of the initial value
Test Methods and
Remarks
Preheating
Resistance to Soldering Heat
Duration
Preconditioning
Immersion and Removal speed
Recovery
:
:
:
:
:
:
150℃ for 3 min.
260±5℃
10±0.5 sec.
Immersion into flux.
25mm/sec.
2 to 3 hrs of recovery under the standard condition after the test.
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
hq_chipbeads_reli_e-E08R01
9. Thermal Shock
Specified Value
Test Methods and
Remarks
Appearance
Impedance change
: No significant abnormality
: Within＋50/－10% of the initial value
According to JIS C 0025.
Conditions for 1 cycle
Step
Temperature (℃)
1
－40±3℃
2
Room Temperature
3
85±2℃
4
Room Temperature
Number of cycles
Mounting method
Recovery
Duration (min.)
30±3
Within 3
30±3
Within 3
: 100
: Soldering onto PC board
: 2 to 3 hrs of recovery under the standard condition after the removal from test chamber.
10. Resistance to Humidity (steady state)
Specified Value
Appearances
Impedance change
: No significant abnormality
: Within ±30% of the initial value
Test Methods and
Remarks
Temperature
Humidity
Duration
Mounting method
Recovery
:
:
:
:
:
40±2℃
90 to 95% RH
500＋24/－0
Soldering onto PC board
2 to 3 hrs of recovery under the standard condition after the removal from test chamber.
11. Loading under Damp Heat
Specified Value
Appearance
Impedance change
Test Methods and
Remarks
Temperature
Humidity
Applied current
Duration
Mounting method
Recovery
No ignificant abnormality
Within ±30% of the initial value
: 40±2℃
: 90 to 95%RH
: Rated current
: 500＋24/－0 hrs
: Soldering onto PC board
: 2 to 3hrs of recovery under the standard condition after the removal from test chamber.
12. High Temperature Loading Test
Specified Value
Appearance
Impedance change
: No significant abnormality
: Within ±30% of the initial value
Test Methods and
Remarks
Temperature
Duration
Applied current
Mounting method
Recovery
:
:
:
:
:
85±2℃
500＋24/－0 hrs
Rated current
Soldering onto PC board
2 to 3 hrs of recovery under the standard condition after the removal from test chamber.
13. Bending Strength
Specified Value
Appearance
: No mechanical damage.
Warp
Testing board
Thickness
: 2mm
: Glass epoxy-resin substrate
: 0.8mm
Test Methods and
Remarks
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
hq_chipbeads_reli_e-E08R01
14. Adhesion of Electrode
Specified Value
No separation or indication of separation of electrode.
Applied force
Duration
: 5N
: 10 sec.
Test Methods and
Remarks
Note on standard condition: "standard condition" referred to herein is defined as follows:
5 to 35℃ of temperature, 45 to 85% relative humidity and 86 to 106kPa of air pressure.
When there are questions concerning measurement results:
In order to provide correlation data, the test shall be conducted under condition of 20±2℃ of temperature, 60 to 70% relative humidity and 86 to 106kPa of air
pressure. Unless otherwise specified, all the tests are conducted under the "standard condition."
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
hq_chipbeads_reli_e-E08R01
CHIP BEAD INDUCTORS FOR POWER LINE （FB SERIES M TYPE / T TYPE）
■PRECAUTIONS
1. Circuit Design
Precautions
◆Operating environment
1. The products listed in this catalogue are intended for use in general electronic equipment (e.g., AV equipment, OA equipment, home electric
appliances, office equipment, information and communication equipment), general medical equipment, industrial equipment, and automotive
interior applications, etc.
Please be sure to contact TAIYO YUDEN for further information before using the products for any equipment which may directly cause
loss of human life or bodily injury (e.g., specially controlled medical equipment, transportation equipment including, without limitation,
automotive powertrain control system, train control system, and ship control system, traffic signal equipment).
Please do not incorporate our products into any equipment requiring high levels of safety and/or reliability (e.g., aerospace equipment,
aviation equipment, nuclear control equipment, undersea equipment, military equipment, etc.).
◆Rated current
1. Rated current of this product is shown in this catalogue, but please be sure to have the base board designed with adequate inspection in
case of the generation of heat becomes high within the rated current range when the base board is in high resistance or in bad heating
conditions.
2. PCB Design
Precautions
◆Land pattern design
1. Please refer to a recommended land pattern.
3. Considerations for automatic placement
Precautions
Technical
considerations
◆Adjustment of mounting machine
1. Excessive impact load should not be imposed on the products when mounting onto the PC boards.
2. Mounting and soldering conditions should be checked beforehand.
◆Adjustment of mounting machine
1. When installing products, care should be taken not to apply distortion stress as it may deform the products.
4. Soldering
Precautions
◆Wave soldering
1. Please refer to the specifications in the catalog for a wave soldering.
◆Reflow soldering
1. Please contact any of our offices for a reflow soldering, and refer to the recommended condition specified.
◆Lead free soldering
1. When using products with lead free soldering, we request to use them after confirming adhesion, temperature of resistance to soldering
heat, etc. sufficiently.
◆Preheating when soldering
Heating : The temperature difference between soldering and remaining heat should not be greater than 150℃.
Cooling : The temperature difference between the components and cleaning process should not be greater than 100℃.
◆Recommended conditions for using a soldering iron
Put the soldering iron on the land-pattern.
Soldering iron's temperature - Below 350℃
Duration - 3 seconds or less
The soldering iron should not directly touch the inductor.
◆Wave, Reflow, Lead free soldering
1. If products are used beyond the range of the recommended conditions, heat stresses may deform the products, and consequently
degrade the reliability of the products.
【Recommended reflow condition】
Technical
considerations
◆Preheating when soldering
1. There is a case that products get damaged by a heat shock.
◆Recommended conditions for using a soldering iron
1. If products are used beyond the range of the recommended conditions, heat stresses may deform the products, and consequently
degrade the reliability of the products.
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
hq_chipbeads_prec_e-E08R01
5. Handling
Precautions
Technical
considerations
◆Handling
1. Keep the inductors away from all magnets and magnetic objects.
◆Setting PC boards
1. When setting a chip mounted base board, please make sure that there is no residual stress to the chip by distortion in the board or at
screw part.
◆Breakaway PC boards (splitting along perforations)
1. When splitting the PC board after mounting inductors, care should be taken not to give any stresses of deflection or twisting to the
board.
2. Board separation should not be done manually, but by using the appropriate devices.
◆Mechanical considerations
1. Please do not give the inductors any excessive mechanical shocks.
◆Handling
1. There is a case that a characteristic varies with magnetic influence.
◆Setting PC boards
1. There is a case that a characteristic varies with residual stress.
◆Breakaway PC boards (splitting along perforations)
1. Planning pattern configurations and the position of products should be carefully performed to minimize stress.
◆Mechanical considerations
1. There is a case to be damaged by a mechanical shock.
6. Storage conditions
Precautions
◆Storage
1. To maintain the solderability of terminal electrodes and to keep the packing material in good condition, temperature and humidity in the
storage area should be controlled.
・Recommended conditions
Ambient temperature -5～40℃
Humidity Below 70% RH
The ambient temperature must be kept below 30℃. Even under ideal storage conditions, solderability of products electrodes may
decrease as time passes.
For this reason, inductors should be used within 6 months from the time of delivery.
Technical
considerations
◆Storage
1. Under a high temperature and humidity environment, problems such as reduced solderability caused by oxidation of terminal electrodes
and deterioration of taping/packaging materials may take place.
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
hq_chipbeads_prec_e-E08R01
工商网监
湘ICP备2023018690号
