BK1005LL241-TV

Notice for TAIYO YUDEN Products [ For High Quality and/or Reliability Equipment (Automotive Electronic Equipment / Industrial Equipment) ] Please read this notice before using the TAIYO YUDEN products. REMINDERS ■ Product information in this catalog is as of October 2018. All of the contents specified herein are subject to change without notice due to technical improvements, etc. Therefore, please check for the latest information carefully before practical application or use of our products. Please note that TAIYO YUDEN shall not be in any way responsible for any damages and defects in products or equipment incorporating our products, which are caused under the conditions other than those specified in this catalog or individual product specification sheets. ■ Please contact TAIYO YUDEN for further details of product specifications as the individual product specification sheets are available. ■ Please conduct validation and verification of our products in actual condition of mounting and operating environment before using our products. ■ The products listed in this catalog are intended for use in general electronic equipment (e.g., AV equipment, OA equipment, home electric appliances, office equipment, information and communication equipment), medical equipment classified as Class I or II by IMDRF, industrial equipment, and automotive interior applications, etc. Please be sure to contact TAIYO YUDEN for further information before using the products for any equipment which may directly cause loss of human life or bodily injury (e.g., transportation equipment including, without limitation, automotive powertrain control system, train control system, and ship control system, traffic signal equipment, medical equipment classified as Class III by IMDRF). Please do not incorporate our products into any equipment requiring high levels of safety and/or reliability (e.g., aerospace equipment, aviation equipment*, medical equipment classified as Class IV by IMDRF, nuclear control equipment, undersea equipment, military equipment). *Note: There is a possibility that our products can be used only for aviation equipment that does not directly affect the safe operation of aircraft (e.g., in-flight entertainment, cabin light, electric seat, cooking equipment) if such use meets requirements specified separately by TAIYO YUDEN. Please be sure to contact TAIYO YUDEN for further information before using our products for such aviation equipment. When our products are used even for high safety and/or reliability-required devices or circuits of general electronic equipment, it is strongly recommended to perform a thorough safety evaluation prior to use of our products and to install a protection circuit as necessary. Please note that unless you obtain prior written consent of TAIYO YUDEN, TAIYO YUDEN shall not be in any way responsible for any damages incurred by you or third parties arising from use of the products listed in this catalog for any equipment requiring inquiry to TAIYO YUDEN or prohibited for use by TAIYO YUDEN as described above. ■ Information contained in this catalog is intended to convey examples of typical performances and/or applications of our products and is not intended to make any warranty with respect to the intellectual property rights or any other related rights of TAIYO YUDEN or any third parties nor grant any license under such rights. ■ Please note that the scope of warranty for our products is limited to the delivered our products themselves and TAIYO YUDEN shall not be in any way responsible for any damages resulting from a fault or defect in our products. Notwithstanding the foregoing, if there is a written agreement (e.g., supply and purchase agreement, quality assurance agreement) signed by TAIYO YUDEN and your company, TAIYO YUDEN will warrant our products in accordance with such agreement. ■ The contents of this catalog are applicable to our products which are purchased from our sales offices or authorized distributors (hereinafter“TAIYO YUDEN’ s official sales channel”). Please note that the contents of this catalog are not applicable to our products purchased from any seller other than TAIYO YUDEN’ s official sales channel. ■ Caution for Export Some of our products listed in this catalog may require specific procedures for export according to“U.S. Export Administration Regulations” ,“Foreign Exchange and Foreign Trade Control Law”of Japan, and other applicable regulations. Should you have any questions on this matter, please contact our sales staff. 19 Automotive Application Guide We classify automotive electronic equipment into the following four application categories and set usable application categories for each of our products. When using our products for automotive electronic equipment, please be sure to check such application categories and use our products accordingly. Should you have any questions on this matter, please contact us. Category SAFETY ・ABS (Anti-Lock Brake System) ・ESC (Electronic Stability Control) ・Airbag ・ADAS (Equipment that directly controls running, turning and stopping), etc. BODY & CHASSIS ・Wiper ・Automatic Door ・Power Window ・Keyless Entry System ・Electric Door Mirror ・Interior Lighting ・LED Headlight ・TPMS (Tire Pressure Monitoring System) ・Anti-Theft Device (Immobilizer), etc. INFOTAINMENT ・Car Infotainment System ・ITS/Telematics System ・Instrument Cluster ・ADAS (Sensor, Equipment that is not interlocked with safety equipment or powertrain), etc. Automotive Application Guide POWERTRAIN Automotive Electronic Equipment (Typical Example) ・Engine ECU (Electronically Controlled Fuel Injector) ・Cruise Control Unit ・4WS (4 Wheel Steering) ・Automatic Transmission ・Power Steering ・HEV/PHV/EV Core Control (Battery, Inverter, DC-DC) ・Automotive Locator (Car location information providing device), etc. ▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our product specification sheets. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our website (http://www.ty-top.com/) . 19 15 MULTILAYER INDUCTORS(BK SERIES) MULTILAYER CHIPCHIP BEAD BEAD INDUCTORS (BK SERIES) REFLOW REFLOW AEC-Q200 AEC-Q200 ■PART NUMBER B K △ ① 1 *Operating Temp. : -55～125℃ 0 0 5 ② ①Series name Code BK△ H S 1 ③ 2 1 ④ － T V ⑤ ⑥ ⑦ ④Nominal impedance Code （example） 100 330 121 102 Series name Multilayer chip bead inductor ②Dimensions（L×W） Code Type（inch） 1005 1005（0402） ／ FERRITE BEAD INDUCTORS NOISE SUPPRESSION COMPONENTS ③Material Code HW HS HR HM LM LL △＝Blank space Dimensions （L×W）［mm］ 1.0×0.5 ⑤Characteristics Code － Material ⑥Packaging Code T Refer to impedance curves for material differences Nominal impedance［Ω］ 10 33 120 1000 Characteristics Standard Packaging Taping ⑦Internal code Code V Internal code MLCI for Industrial and Automotive ■FEATURES ●HW：For broadband noise suppression. ●HS：For broadband noise suppression. ●HR：For upper 10MHz noise suppression. ●HM：For upper 20MHz noise suppression. ●LM：For high frequency noise suppression around 200MHz. ●LL：For high frequency noise suppression from 100MHz. ■STANDARD EXTERNAL DIMENSIONS / STANDARD QUANTITY W L T e Type BK 1005 （0402） L W T e 1.00±0.05 （0.039±0.002） 0.50±0.05 （0.020±0.002） 0.50±0.05 （0.020±0.002） 0.25±0.10 （0.010±0.004） Standard quantity [pcs] Paper tape Embossed tape 10000 － Unit：mm（inch） hq_i_mlci_BK_e-E07R01 ▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our product specification sheets. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our website (http://www.ty-top.com/) . 78 19 ■PART NUMBER ・ All the Multilayer Chip Bead Inductors of the catalog lineup are RoHS compliant. Note) ・ The exchange of individual specifications is necessary depending on the application and circuit condition. Please contact Taiyo Yuden sales channels. ・ *1: Automotive (AEC-Q200 Qualified) products for BODY & CHASSIS, and INFOTAINMENT. Please check ”Automotive Application Guide” for further details before using the products. 　　＜　　　　　　　　　：AEC-Q200 qualified＞ AEC-Q200 　　　　　All the Multilayer Chip Bead Inductors of　*1 marks are tested based on the test conditions and methods defined in AEC-Q200 by family item. 　　　　　Please consult with TAIYO YUDEN’s official sales channel for the details of the product specification and AEC-Q200 test results, etc., 　　　　　and please review and　approve TAIYO YUDEN's product specification before ordering. ・ *2: Industrial　products and Medical products ●BK 1005 Part number 1005HW680-TV 1005HW121-TV 1005HW241-TV 1005HW431-TV 1005HW601-TV 1005HS100-TV 1005HS330-TV 1005HS680-TV 1005HS800-TV 1005HS121-TV 1005HS241-TV 1005HS431-TV 1005HS601-TV 1005HS102-TV 1005HR601-TV 1005HM750-TV 1005HM121-TV 1005HM241-TV 1005HM471-TV 1005HM601-TV 1005HM102-TV 1005LL100-TV 1005LL220-TV 1005LL330-TV 1005LL470-TV 1005LL680-TV 1005LL121-TV 1005LL181-TV 1005LL241-TV 1005LM182-TV Nominal impedance ［Ω］ 68 120 240 430 600 10 33 68 80 120 240 430 600 1000 600 75 120 240 470 600 1000 10 22 33 47 68 120 180 240 1800 Impedance tolerance ±25％ ±25％ ±25％ ±25％ ±25％ ±25％ ±25％ ±25％ ±25％ ±25％ ±25％ ±25％ ±25％ ±25％ ±25％ ±25％ ±25％ ±25％ ±25％ ±25％ ±25％ ±25％ ±25％ ±25％ ±25％ ±25％ ±25％ ±25％ ±25％ ±25％ Measuring frequency ［MHz］ 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 DC Resistance ［Ω］（max.） 0.17 0.24 0.31 0.50 0.60 0.03 0.06 0.10 0.10 0.20 0.30 0.45 0.55 0.58 0.60 0.18 0.18 0.30 0.45 0.50 0.70 0.11 0.18 0.25 0.33 0.31 0.45 0.50 0.70 0.90 Rated current ［mA］（max.） 500 450 400 350 300 1,000 700 700 700 500 400 350 300 300 300 350 300 300 250 250 150 500 400 400 350 400 350 300 250 120 Thickness ［mm］ 0.50 ±0.05 0.50 ±0.05 0.50 ±0.05 0.50 ±0.05 0.50 ±0.05 0.50 ±0.05 0.50 ±0.05 0.50 ±0.05 0.50 ±0.05 0.50 ±0.05 0.50 ±0.05 0.50 ±0.05 0.50 ±0.05 0.50 ±0.05 0.50 ±0.05 0.50 ±0.05 0.50 ±0.05 0.50 ±0.05 0.50 ±0.05 0.50 ±0.05 0.50 ±0.05 0.50 ±0.05 0.50 ±0.05 0.50 ±0.05 0.50 ±0.05 0.50 ±0.05 0.50 ±0.05 0.50 ±0.05 0.50 ±0.05 0.50 ±0.05 Note *1 *1 *1 *1 *1 *1 *1 *1 *1 *1 *1 *1 *1 *1 *1 *1 *1 *1 *1 *1 *1 *1 *1 *1 *1 *1 *1 *1 *1 *1 ,*2 ,*2 ,*2 ,*2 ,*2 ,*2 ,*2 ,*2 ,*2 ,*2 ,*2 ,*2 ,*2 ,*2 ,*2 ,*2 ,*2 ,*2 ,*2 ,*2 ,*2 ,*2 ,*2 ,*2 ,*2 ,*2 ,*2 ,*2 ,*2 ,*2 ※）The rated current is the value of current at which the temperature of the element is increased within 20℃. ／ FERRITE BEAD INDUCTORS NOISE SUPPRESSION COMPONENTS BK BK BK BK BK BK BK BK BK BK BK BK BK BK BK BK BK BK BK BK BK BK BK BK BK BK BK BK BK BK hq_i_mlci_BK_e-E07R01 ▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our product specification sheets. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our website (http://www.ty-top.com/) . 19 79 ■ ELECTRICAL CHARACTERISTICS ■ BK1005 Z 50 100 0 10000 BK1005 HW601 BK1005 HS100 400 R 40 20 1 400 Z X 10 100 1000 Frequency［MHz］ 0 10000 1 200 40 R Z 150 100 0 1 10 100 0 10000 200 800 150 150 100 100 R 50 Z 0 Impedance ［Ω］ 1 R X 10 100 1000 Frequency［MHz］ BK1005 HR601 BK1005 HS102 10000 BK1005 HM750 1000 200 800 150 600 100 1000 400 Z 50 200 0 BK1005 HM121 BK1005 HS431 400 10000 2000 250 10000 600 0 10 100 1000 Frequency［MHz］ 10 100 1000 Frequency［MHz］ 200 X 1 1 Frequency［MHz］ 200 0 Ｒ X 1000 1000 Z Z 50 X 10000 10000 BK1005 HS680 250 250 50 10 100 1000 Frequency［MHz］ BK1005 HS330 60 X 10 100 1000 Frequency［MHz］ R 200 Impedance ［Ω］ Impedance ［Ω］ 0 10000 BK1005 HS800 250 1 R X 10 100 1000 Frequency［MHz］ 10000 10 10000 0 0 500 400 200 Impedance ［Ω］ ／ FERRITE BEAD INDUCTORS NOISE SUPPRESSION COMPONENTS 10 100 1000 Frequency［MHz］ 1 20 Z R X 1 R 80 60 200 Z 100 Impedance ［Ω］ Impedance ［Ω］ Z 0 0 10000 80 600 200 600 X 10 100 1000 Frequency［MHz］ 100 800 Impedance ［Ω］ 1 300 100 Ｘ X 10 100 1000 Frequency［MHz］ 1000 Ｒ 50 R 1 Ｚ 800 Impedance ［Ω］ 100 150 BK1005 HW431 1000 400 Impedance ［Ω］ Impedance ［Ω］ Impedance ［Ω］ 150 BK1005 HW241 500 200 200 0 BK1005 HW121 250 Impedance ［Ω］ BK1005 HW680 250 Z 150 300 R 200 100 100 50 0 X 10 100 1000 Frequency［MHz］ 1 0 10000 1 BK1005 HM102 100 1000 BK1005 LL220 BK1005 LL100 2000 250 200 150 BK1005 LL330 250 500 200 400 150 300 100 200 50 100 1000 100 50 0 1 10 100 1000 10000 0 0 1 10 100 1000 10000 1 10 100 1000 10000 0 1 10 100 1000 10000 ▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our product specification sheets. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our website (http://www.ty-top.com/) . 80 19 ■ ELECTRICAL CHARACTERISTICS BK1005 LL470 500 BK1005 LL680 500 400 400 300 300 200 200 100 100 0 0 1 10 100 1000 1 10000 10 100 1000 10000 BK1005 LM182 2500 2000 1500 Z 1000 R 500 1 10 100 1000 ／ FERRITE BEAD INDUCTORS NOISE SUPPRESSION COMPONENTS X 0 10000 ■ Derating of Rated Current ●BK series Until 125 ℃ ambient temperature, BK series is available at 100% of the rated current. Please refer to the chart shown below. Ratio to rated current (%) 120 BK series 100 80 60 40 20 0 -55 -35 -15 5 25 45 65 85 105 125 Ambient Temperature (℃) ▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our product specification sheets. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our website (http://www.ty-top.com/) . 19 81 Multilayer chip inductors Multilayer chip inductors for high frequency, Multilayer chip bead inductors Multilayer common mode choke coils（MC series F type） Metal Multilayer Chip Power Inductors (MCOILTM MC series) ■PACKAGING ①Minimum Quantity ●Tape & Reel Packaging Type CK1608（0603） CK2125（0805） CKS2125（0805） CKP1608（0603） CKP2012（0805） CKP2016（0806） CKP2520（1008） LK1005（0402） LK1608（0603） LK2125（0805） HK0603（0201） HK1005（0402） HK1608（0603） HK2125（0805） HKQ0603W（0201） HKQ0603S（0201） HKQ0603U（0201） AQ105（0402） BK0603（0201） BK1005（0402） BKH0603（0201） BKH1005（0402） BK1608（0603） BK2125（0805） BK2010（0804） BK3216（1206） BKP0603（0201） BKP1005（0402） BKP1608（0603） BKP2125（0805） MCF0605（0202） MCF0806（0302） MCF1210（0504） MCF2010（0804） MCEE1005（0402） MCFK1608（0603） MCFE1608（0603） MCKK1608（0603） MCHK2012（0806） MCKK2012（0805） Thickness mm（inch） 0.8 （0.031） 0.85（0.033） 1.25（0.049） 0.85（0.033） 1.25（0.049） 0.8 （0.031） 0.9 （0.035） 0.9 （0.035） 0.7 （0.028） 0.9 （0.035） 1.1 （0.043） 0.5 （0.020） 0.8 （0.031） 0.85（0.033） 1.25（0.049） 0.3 （0.012） 0.5 （0.020） 0.8 （0.031） 0.85（0.033） 1.0 （0.039） 0.3 （0.012） 0.3 （0.012） 0.3 （0.012） 0.5 （0.020） 0.3 （0.012） 0.5 （0.020） 0.3 （0.012） 0.5 （0.020） 0.8 （0.031） 0.85（0.033） 1.25（0.049） 0.45（0.018） 0.8 （0.031） 0.3 （0.012） 0.5 （0.020） 0.8 （0.031） 0.85（0.033） 0.3 （0.012） 0.4 （0.016） 0.55（0.022） 0.45（0.018） 0.55（0.022） 0.6 （0.024） 0.65（0.026） 1.0 （0.039） 0.8 （0.031） 1.0 （0.039） Standard Quantity ［pcs］ Paper Tape Embossed Tape 4000 － 4000 － － 2000 4000 － － 2000 4000 － － 3000 － 3000 － 3000 － 3000 － 2000 10000 － 4000 － 4000 － － 2000 15000 － 10000 － 4000 － － 4000 － 3000 15000 － 15000 － 15000 － 10000 － 15000 － 10000 － 15000 － 10000 － 4000 － 4000 － － 2000 4000 － － 4000 15000 － 10000 － 4000 － 4000 － 15000 － － 10000 － 5000 － 4000 10000 － 4000 － 4000 － 3000 4000 － 3000 ▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . i_mlci_pack_e-E07R01 ②Taping material ●Card board carrier tape Top tape Base tape Sprocket hole Bottom tape CK CKP CK CKS LK LK LK HK HK HK HKQ AQ 1608 1608 2125 2125 1005 1608 2125 0603 1005 1608 0603 105 BK BK BK BK BK BKP BKP BKP BKP BKH BKH MCF MC MC MC 0603 1005 1608 2125 2010 0603 1005 1608 2125 0603 1005 0605 1005 1608 2012 CK CKS CKP CKP CKP LK HK 2125 2125 2012 2016 2520 2125 2125 BK BK MCF MCF MCF MC MC 2125 3216 0806 1210 2010 1608 2012 Chip cavity Chip Filled Chip ●Embossed Tape Top tape Sprocket hole Base tape Chip cavity Chip Filled Chip ③Taping Dimensions ●Paper tape (8mm wide) B T 8.0±0.3 (0.315±0.012) A F Unit：mm（inch） 1.75±0.1 (0.069±0.004） 3.5±0.05 (0.138±0.002) Sprocket hole φ1.5＋0.1/－0 (φ0.059＋0.004/-0) 4.0±0.1 (0.157±0.004) 2.0±0.05 (0.079±0.002) ▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . i_mlci_pack_e-E07R01 Type Thickness mm（inch） CK1608（0603） 0.8 （0.031） CK2125（0805） 0.85（0.033） CKS2125（0805） 0.85（0.033） CKP1608（0603） 0.8 （0.031） LK1005（0402） 0.5 （0.020） LK1608（0603） 0.8 （0.031） LK2125（0805） 0.85（0.033） HK0603（0201） 0.3 （0.012） HK1005（0402） 0.5 （0.020） HK1608（0603） 0.8 （0.031） HKQ0603W（0201） 0.3 （0.012） HKQ0603S（0201） 0.3 （0.012） HKQ0603U（0201） 0.3 （0.012） AQ105（0402） 0.5 （0.020） BK0603（0201） 0.3 （0.012） BK1005（0402） 0.5 （0.020） BK1608（0603） 0.8 （0.031） BK2125（0805） 0.85（0.033） BK2010（0804） 0.45（0.018） BKP0603（0201） 0.3 （0.012） BKP1005（0402） 0.5 （0.020） BKP1608（0603） 0.8 （0.031） BKP2125（0805） 0.85（0.033） BKH0603（0201） 0.3 （0.012） BKH1005（0402） 0.5 （0.020） MCF0605（0202） 0.3 （0.012） MCFK1608（0603） 0.6 （0.024） MCEE1005（0402） 0.55（0.021） MCFE1608（0603） 0.65（0.026） MCHK2012（0805） 0.8 （0.031） Chip cavity Ａ Ｂ 1.0±0.2 1.8±0.2 （0.039±0.008） （0.071±0.008） 1.5±0.2 2.3±0.2 （0.059±0.008） （0.091±0.008） 1.5±0.2 2.3±0.2 （0.059±0.008） （0.091±0.008） 1.0±0.2 1.8±0.2 （0.039±0.008） （0.071±0.008） 0.65±0.1 1.15±0.1 （0.026±0.004） （0.045±0.004） 1.0±0.2 1.8±0.2 （0.039±0.008） （0.071±0.008） 1.5±0.2 2.3±0.2 （0.059±0.008） （0.091±0.008） 0.40±0.06 0.70±0.06 （0.016±0.002） （0.028±0.002） 0.65±0.1 1.15±0.1 （0.026±0.004） （0.045±0.004） 1.0±0.2 1.8±0.2 （0.039±0.008） （0.071±0.008） 0.40±0.06 0.70±0.06 （0.016±0.002） （0.028±0.002） 0.40±0.06 0.70±0.06 （0.016±0.002） （0.028±0.002） 0.40±0.06 0.70±0.06 （0.016±0.002） （0.028±0.002） 0.75±0.1 1.15±0.1 （0.030±0.004） （0.045±0.004） 0.40±0.06 0.70±0.06 （0.016±0.002） （0.028±0.002） 0.65±0.1 1.15±0.1 （0.026±0.004） （0.045±0.004） 1.0±0.2 1.8±0.2 （0.039±0.008） （0.071±0.008） 1.5±0.2 2.3±0.2 （0.059±0.008） （0.091±0.008） 1.2±0.1 2.17±0.1 （0.047±0.004） （0.085±0.004） 0.40±0.06 0.70±0.06 （0.016±0.002） （0.028±0.002） 0.65±0.1 1.15±0.1 （0.026±0.004） （0.045±0.004） 1.0±0.2 1.8±0.2 （0.039±0.008） （0.071±0.008） 1.5±0.2 2.3±0.2 （0.059±0.008） （0.091±0.008） 0.40±0.06 0.70±0.06 （0.016±0.002） （0.028±0.002） 0.65±0.1 1.15±0.1 （0.026±0.004） （0.045±0.004） 0.62±0.03 0.77±0.03 （0.024±0.001） （0.030±0.001） 1.1±0.05 1.9±0.05 （0.043±0.002） （0.075±0.002） 0.8±0.05 1.3±0.05 (0.031±0.002) (0.051±0.002) 1.1±0.05 1.9±0.05 （0.043±0.002） （0.075±0.002） 1.55±0.2 2.3±0.2 （0.061±0.008） （0.091±0.008） Insertion Pitch Ｆ 4.0±0.1 （0.157±0.004） 4.0±0.1 （0.157±0.004） 4.0±0.1 （0.157±0.004） 4.0±0.1 （0.157±0.004） 2.0±0.05 （0.079±0.002） 4.0±0.1 （0.157±0.004） 4.0±0.1 （0.157±0.004） 2.0±0.05 （0.079±0.002） 2.0±0.05 （0.079±0.002） 4.0±0.1 （0.157±0.004） 2.0±0.05 （0.079±0.002） 2.0±0.05 （0.079±0.002） 2.0±0.05 （0.079±0.002） 2.0±0.05 （0.079±0.002） 2.0±0.05 （0.079±0.002） 2.0±0.05 （0.079±0.002） 4.0±0.1 （0.157±0.004） 4.0±0.1 （0.157±0.004） 4.0±0.1 （0.157±0.004） 2.0±0.05 （0.079±0.002） 2.0±0.05 （0.079±0.002） 4.0±0.1 （0.157±0.004） 4.0±0.1 （0.157±0.004） 2.0±0.05 （0.079±0.002） 2.0±0.05 （0.079±0.002） 2.0±0.05 （0.079±0.002） 4.0±0.1 （0.157±0.004） 2.0±0.05 （0.079±0.002） 4.0±0.1 （0.157±0.004） 4.0±0.1 （0.157±0.004） Tape Thickness Ｔ 1.1max （0.043max） 1.1max （0.043max） 1.1max （0.043max） 1.1max （0.043max） 0.8max （0.031max） 1.1max （0.043max） 1.1max （0.043max） 0.45max （0.018max） 0.8max （0.031max） 1.1max （0.043max） 0.45max （0.018max） 0.45max （0.018max） 0.45max （0.018max） 0.8max （0.031max） 0.45max （0.018max） 0.8max （0.031max） 1.1max （0.043max） 1.1max （0.043max） 0.8max （0.031max） 0.45max （0.018max） 0.8max （0.031max） 1.1max （0.043max） 1.1max （0.043max） 0.45max （0.018max） 0.8max （0.031max） 0.45max （0.018max） 0.72max (0.028max) 0.6max (0.016max) 0.9max （0.035max） 0.9max （0.035max） Unit : mm（inch） ▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . i_mlci_pack_e-E07R01 ●Embossed Tape (8mm wide) Unit：mm（inch） A B 8.0±0.3 (0.315±0.012) 3.5±0.05 (0.138±0.002) Sprocket hole F 1.75±0.1 (0.069±0.004） φ1.5＋0.1/－0 (φ0.059＋0.004/-0) 4.0±0.1 (0.157±0.004) 2.0±0.05 (0.079±0.002) Type Thickness mm（inch） CK2125（0805） 1.25（0.049） CKS2125（0805） 1.25（0.049） CKP2012（0805） 0.9 （0.035） CKP2016（0806） 0.9 （0.035） Chip cavity Ａ Ｂ 1.5±0.2 2.3±0.2 （0.059±0.008） （0.091±0.008） 1.5±0.2 2.3±0.2 （0.059±0.008） （0.091±0.008） 1.55±0.2 2.3±0.2 （0.061±0.008） （0.091±0.008） 1.8±0.1 2.2±0.1 （0.071±0.004） （0.087±0.004） Insertion Pitch Ｆ 4.0±0.1 （0.157±0.004） 4.0±0.1 （0.157±0.004） 4.0±0.1 （0.157±0.004） 4.0±0.1 （0.157±0.004） 2.3±0.1 （0.091±0.004） 2.8±0.1 （0.110±0.004） 4.0±0.1 （0.157±0.004） 1.5±0.2 （0.059±0.008） 2.3±0.2 （0.091±0.008） 4.0±0.1 （0.157±0.004） 1.5±0.2 （0.059±0.008） 2.3±0.2 （0.091±0.008） 4.0±0.1 （0.157±0.004） 1.5±0.2 （0.059±0.008） 1.9±0.1 （0.075±0.004） 0.75±0.05 （0.030±0.002） 1.15±0.05 （0.045±0.002） 1.1±0.1 （0.043±0.004） 1.1±0.1 （0.043±0.004） 1.55±0.2 （0.061±0.008） 2.3±0.2 （0.091±0.008） 3.5±0.1 （0.138±0.004） 0.95±0.05 （0.037±0.002） 1.40±0.05 （0.055±0.002） 2.3±0.1 （0.091±0.004） 1.95±0.1 （±0.004） 2.3±0.2 （0.091±0.008） 4.0±0.1 （0.157±0.004） 4.0±0.1 （0.157±0.004） 2.0±0.05 （0.079±0.002） 4.0±0.1 （0.157±0.004） 4.0±0.1 （0.157±0.004） 4.0±0.1 （0.157±0.004） 4.0±0.1 （0.157±0.004） 0.7 （0.028） 0.9 （0.035） CKP2520（1008） 1.1 （0.043） 1.1 （0.043） LK2125（0805） 1.25（0.049） 0.85（0.033） HK2125（0805） 1.0 （0.039） BK2125（0805） 1.25（0.049） BK3216（1206） 0.8 （0.031） MCF0806（0302） 0.4 （0.016） MCF1210（0504） 0.55（0.022） MCF2010（0804） 0.45（0.018） MCKK1608（0603） 1.0 （0.039） MCKK2012（0805） 1.0 （0.039） Tape Thickness K T 2.0 0.3 （0.079） （0.012） 2.0 0.3 （0.079） （0.012） 1.3 0.3 （0.051） （0.012） 1.3 0.25 （0.051） （0.01） 1.4 （0.055） 1.4 （0.055） 0.3 （0.012） 1.7 （0.067） 1.7 （0.067） 2.0 0.3 （0.079） （0.012） 1.5 （0.059） 0.3 （0.012） 2.0 （0.079） 2.0 0.3 （0.079） （0.012） 1.4 0.3 （0.055） （0.012） 0.55 0.3 （0.022） （0.012） 0.65 0.3 （0.026） （0.012） 0.85 0.3 （0.033） （0.012） 1.4 0.25 （0.055） （0.01） 1.35 0.25 （0.053） （0.010） Unit : mm（inch） ▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . i_mlci_pack_e-E07R01 ④LEADER AND BLANK PORTION Blank portion Chip cavity Blank portion Leader 100mm or more (3.94inches or more) 160mm or more (6.3inches or more) Direction of tape feed 400mm or more (15.7inches or more) ⑤Reel Size t E C R B D A W A φ178±2.0 B φ50 or more C φ13.0±0.2 4mm width tape 8mm width tape t 1.5max. 2.5max. W 5±1.0 10±1.5 D φ21.0±0.8 E 2.0±0.5 R 1.0 (Unit : mm) ⑥Top tape strength The top tape requires a peel-off force of 0.1～0.7N in the direction of the arrow as illustrated below. Pull direction 0～15° Top tape Base tape ▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . i_mlci_pack_e-E07R01 Multilayer chip inductors Multilayer chip inductors for high frequency, Multilayer chip bead inductors ■RELIABILITY DATA 1. Operating Temperature Range BK series BKP series Specified Value LK series HK series －55～＋125℃ －55～＋125℃ （Including self-generated heat） －40～＋85℃ －55～＋125℃ 2. Storage Temperature Range BK series BKP series Specified Value LK series HK series －55～＋125℃ －55～＋125℃ －40～＋85℃ －55～＋125℃ 3. Rated Current Specified Value BK series BKP series LK series The temperature of the element is increased within 20℃. The temperature of the element is increased within 40℃ The decreasing-rate of inductance value is within 5 % The decreasing-rate of inductance value is within 5 %, or the temperature of the element is increased within 20℃ HK series 4. Impedance Specified Value Test Methods and Remarks BK series BKP series LK series HK series Measuring frequency Measuring equipment Measuring jig Refer to each specification. － : 100±1MHz : 4291A（or its equivalent） : 16192A（or its equivalent）, HW:16193A（or its equivalent） 5. Inductance Specified Value Test Methods and Remarks BK series BKP series LK series HK series LK Series Measuring Measuring Measuring HK Series Measuring Measuring － Refer to each specification. frequency equipment /jig current : 10～25MHz : 4291A＋16193A（or its equivalent） : 1mA rms frequency equipment /jig : 100MHz : 4291A＋16193A（or its equivalent） 6. Q Specified Value Test Methods and Remarks BK series BKP series LK series HK series LK Series Measuring Measuring Measuring HK Series Measuring Measuring － Refer to each specification. frequency equipment /jig current : Refer to each specification. : 4291A＋16193A（or its equivalent） : 1mA rms frequency : 100MHz equipment /jig : 4291A＋16193A（or its equivalent） 7. DC Resistance Specified Value BK series BKP series LK series HK series Test Methods and Remarks Measuring equipment：VOAC-7412, VOAC-7512, VOAC-7521（made by Iwasaki Tsushinki） Refer to each specification. ▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . hq_i_mlci_reli_e-E07R01 8. Self Resonance Frequency（SRF） BK series BKP series Specified Value LK series HK series LK Series Measuring equipment Test Methods and Measuring jig Remarks HK Series : Measuring equipment 9. Temperature Characteristic BK series BKP series Specified Value LK series HK series Test Methods and Temperature range Remarks Reference temperature － Refer to each specification. : 4195A（or its equivalent） : 41951＋16092A（or its equivalent） : 8719C（or its equivalent） － Inductance change：Within ±10％ : －30～＋85℃ : ＋20℃ 10. Resistance to Flexure of Substrate BK series BKP series Specified Value No mechanical damage. LK series HK series Warp : 2mm Testing board : glass epoxy-resin substrate Thickness : 0.8mm 20 Test Methods and Remarks R-230 Board Warp Deviation±1 45 45 （Unit：mm） 11. Solderability Specified Value Test Methods and Remarks BK series BKP series LK series HK series Solder temperature Solder temperature Duration 12. Resistance to Soldering BK series BKP series Specified Value LK series HK series Test Methods and Remarks Solder temperature Duration Preheating temperature Preheating time Flux Recovery At least 90％ of terminal electrode is covered by new solder. ：230±5℃ (JIS Z 3282 H60A or H63A) ：245±3℃ (Sn/3.0Ag/0.5Cu) ：4±1 sec. Appearance：No significant abnormality Impedance change：Within ±30％ Appearance：No significant abnormality Inductance change： Within ±15％ Appearance：No significant abnormality Inductance change： Within ±5％ ：260±5℃ ：10±0.5 sec. ：150 to 180℃ ：3 min. ：Immersion into methanol solution with colophony for 3 to 5 sec. ：2 to 3 hrs of recovery under the standard condition after the test.（See Note 1） ▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . hq_i_mlci_reli_e-E07R01 13. Thermal Shock BK series BKP series Specified Value LK series HK series Test Methods and Remarks Appearance：No significant abnormality Impedance change： Within ±30％ Appearance：No significant abnormality Inductance change： Within ±10％ Q change： Within ±30％ Appearance：No significant abnormality Inductance change： Within ±10％ Q change： Within ±20％ BK、BKP、HK Series Conditions for 1 cycle Step temperature（℃） time（min.） 1 -40℃ ＋0/－3 30±3 2 Room temperature 2～3 3 +125℃ ＋3/－0 30±3 4 Room temperature 2～3 Number of cycles：1000 Recovery：2 to 3 hrs of recovery under the standard condition after the test.（See Note 1） LK Series Conditions for 1 cycle Step temperature（℃） time（min.） 1 -40℃ ＋0/－3 30±3 2 Room temperature 2～3 3 +85℃ ＋3/－0 30±3 4 Room temperature 2～3 Number of cycles：1000 Recovery：2 to 3 hrs of recovery under the standard condition after the test.（See Note 1） (Note 1) When there are questions concerning measurement result；measurement shall be made after 48±2 hrs of recovery under the standard condition. 14. Damp Heat（ Steady state） BK series BKP series Specified Value LK series HK series Test Methods and Remarks Temperature Humidity Duration Recovery 15. Loading under Damp Heat BK series BKP series Specified Value LK series HK series Appearance：No significant abnormality Impedance change： Within ±30％ Appearance：No significant abnormality Inductance change： Within ±10％ Q change： Within ±30％ Appearance：No significant abnormality Inductance change： Within ±10％ Q change： Within ±20％ ：85±2℃ ：80 to 85％RH ：1000＋24/－0 hrs ：2 to 3 hrs of recovery under the standard condition after the removal from test chamber.（See Note 1） Appearance：No significant abnormality Impedance change： Within ±30％ Appearance：No significant abnormality Inductance change： Within ±10％ Q change： Within ±30％ Appearance：No significant abnormality Inductance change： Within ±10％ Q change： Within ±20％ Temperature ：85±2℃ Humidity ：80 to 85％RH Test Methods and Applied current ：Rated current Remarks Duration ：1000＋24/－0 hrs Recovery ：2 to 3 hrs of recovery under the standard condition after the removal from test chamber.（See Note 1） Note on standard condition: "standard condition" referred to herein is defined as follows: 5 to 35℃ of temperature, 45 to 85% relative humidity, and 86 to 106kPa of air pressure. When there are questions concerning measurement results: In order to provide correlation data, the test shall be conducted under condition of 20±2℃ of temperature, 60 to 70% relative humidity, and 86 to 106kPa of air pressure. Unless otherwise specified, all the tests are conducted under the "standard condition." (Note 1) Measurement shall be made after 48±2 hrs of recovery under the standard condition. ▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . hq_i_mlci_reli_e-E07R01 16. Loading at High Temperature BK series BKP series Appearance：No significant abnormality Impedance change： Within ±30％ Appearance：No significant abnormality Specified Value LK series Inductance change： Within ±10％ Q change： Within ±30％ Appearance：No significant abnormality HK series Inductance change： Within ±10％ Q change： Within ±20％ Temperature : Maximum operating Temperature Test Methods and Applied current ：Rated current Remarks Duration ：1000＋24/－0 hrs Recovery ：2 to 3 hrs of recovery under the standard condition after the removal from test chamber.（See Note 1） Note on standard condition: "standard condition" referred to herein is defined as follows: 5 to 35℃ of temperature, 45 to 85% relative humidity, and 86 to 106kPa of air pressure. When there are questions concerning measurement results: In order to provide correlation data, the test shall be conducted under condition of 20±2℃ of temperature, 60 to 70% relative humidity, and 86 to 106kPa of air pressure. Unless otherwise specified, all the tests are conducted under the "standard condition." (Note 1) Measurement shall be made after 48±2 hrs of recovery under the standard condition. ▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . hq_i_mlci_reli_e-E07R01 Precautions on the use of Multilayer chip inductors Multilayer chip inductors for high frequency, Multilayer chip bead inductors ■PRECAUTIONS 1. Circuit Design Precautions ◆Verification of operating environment, electrical rating and performance 1. A malfunction in medical equipment, spacecraft, nuclear reactors, etc. may cause serious harm to human life or have severe social ramifications. As such, any inductors to be used in such equipment may require higher safety and/or reliability considerations and should be clearly differentiated from components used in general purpose applications. ◆Operating Current（Verification of Rated current） 1. The operating current for inductors must always be lower than their rated values. 2. Do not apply current in excess of the rated value because the inductance may be reduced due to the magnetic saturation effect. 2. PCB Design Precautions ◆Pattern configurations（Design of Land-patterns） 1. When inductors are mounted on a PCB, the size of land patterns and the amount of solder used（size of fillet）can directly affect inductor performance. Therefore, the following items must be carefully considered in the design of solder land patterns: （1） The amount of solder applied can affect the ability of chips to withstand mechanical stresses which may lead to breaking or cracking. Therefore, when designing land-patterns it is necessary to consider the appropriate size and configuration of the solder pads which in turn determines the amount of solder necessary to form the fillets. （2） When more than one part is jointly soldered onto the same land or pad, the pad must be designed so that each component's soldering point is separated by solder-resist. （3） The larger size of land patterns and amount of solder, the smaller Q value after mounting on PCB. It makes higher the Q value to design land patterns smaller than terminal electrode of chips. ◆Pattern configurations（Inductor layout on panelized［ breakaway］ PC boards） 1. After inductors have been mounted on the boards, chips can be subjected to mechanical stresses in subsequent manufacturing processes （PCB cutting, board inspection, mounting of additional parts, assembly into the chassis, wave soldering the reflow soldered boards etc.）For this reason, planning pattern configurations and the position of SMD inductors should be carefully performed to minimize stress. ◆Pattern configurations（Design of Land-patterns） 1. The following diagrams and tables show some examples of recommended patterns to prevent excessive solder amounts（larger fillets which extend above the component end terminations）. Examples of improper pattern designs are also shown. （1） Recommended land dimensions for a typical chip inductor land patterns for PCBs Land pattern Solder-resist Chip inductor Chip inductor W C B Technical considerations A B L Recommended land dimensions for wave-soldering （Unit：mm） Type 1608 2125 L 1.6 2.0 Size W 0.8 1.25 A 0.8～1.0 1.0～1.4 B 0.5～0.8 0.8～1.5 C 0.6～0.8 0.9～1.2 Recommended land dimensions for reflow-soldering （Unit：mm） Type 1005 1608 2125 L 1.0 2.0 1.6 Size W 0.5 1.25 0.8 A 0.45～0.55 0.8～1.0 0.8～1.2 B 0.40～0.50 0.6～0.8 0.8～1.2 C 0.45～0.55 0.6～0.8 0.9～1.6 Excess solder can affect the ability of chips to withstand mechanical stresses. Therefore, please take proper precautions when designing land-patterns. ▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . hq_i_mlci_prec_e-E06R01 （2） Examples of good and bad solder application Item Not recommended Recommended Lead wire of component Solder-resist Mixed mounting of SMD and leaded components Chassis Solder (for grounding) Solder-resist Component placement close to the chassis Electrode pattern Lead wire of component Soldering iron Hand-soldering of leaded components near mounted components Solder-resist Solder-resist Horizontal component placement ◆Pattern configurations（Inductor layout on panelized［ breakaway］ PC boards） 1-1. The following are examples of good and bad inductor layout; SMD inductors should be located to minimize any possible mechanical stresses from board warp or deflection. Item Not recommended Recommended Position the component at a right angle to the direction of the mechanical stresses that are anticipated. Deflection of the board 1-2. To layout the inductors for the breakaway PC board, it should be noted that the amount of mechanical stresses given will vary depending on inductor layout. An example below should be counted for better design. E D Perforation C A B Slit Magnitude of stress A＞B＝C＞D＞E 1-3. When breaking PC boards along their perforations, the amount of mechanical stress on the inductors can vary according to the method used. The following methods are listed in order from least stressful to most stressful: push-back, slit, V-grooving, and perforation. Thus, any ideal SMD inductor layout must also consider the PCB splitting procedure. ▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . hq_i_mlci_prec_e-E06R01 3. Considerations for automatic placement Precautions ◆Adjustment of mounting machine 1. Excessive impact load should not be imposed on the inductors when mounting onto the PC boards. 2. The maintenance and inspection of the mounter should be conducted periodically. ◆Selection of Adhesives 1. Mounting inductors with adhesives in preliminary assembly, before the soldering stage, may lead to degraded inductor characteristics unless the following factors are appropriately checked; the size of land patterns, type of adhesive, amount applied, hardening temperature and hardening period. Therefore, it is imperative to consult the manufacturer of the adhesives on proper usage and amounts of adhesive to use. ◆Adjustment of mounting machine 1. If the lower limit of the pick-up nozzle is low, too much force may be imposed on the inductors, causing damage. To avoid this, the following points should be considered before lowering the pick-up nozzle: （1） The lower limit of the pick-up nozzle should be adjusted to the surface level of the PC board after correcting for deflection of the board. （2） The pick-up pressure should be adjusted between 1 and 3N static loads. （3） To reduce the amount of deflection of the board caused by impact of the pick-up nozzle, supporting pins or back-up pins should be used under the PC board. The following diagrams show some typical examples of good pick-up nozzle placement: Item Single-sided mounting Improper method Proper method chipping or cracking supporting pins or back-up pins Double-sided mounting chipping or cracking Technical considerations supporting pins or back-up pins 2. As the alignment pin wears out, adjustment of the nozzle height can cause chipping or cracking of the inductors because of mechanical impact on the inductors. To avoid this, the monitoring of the width between the alignment pin in the stopped position, and maintenance, inspection and replacement of the pin should be conducted periodically. ◆Selection of Adhesives 1. Some adhesives may cause reduced insulation resistance. The difference between the shrinkage percentage of the adhesive and that of the inductors may result in stresses on the inductors and lead to cracking. Moreover, too little or too much adhesive applied to the board may adversely affect component placement, so the following precautions should be noted in the application of adhesives. （1） Required adhesive characteristics a. The adhesive should be strong enough to hold parts on the board during the mounting & solder process. b. The adhesive should have sufficient strength at high temperatures. c. The adhesive should have good coating and thickness consistency. d. The adhesive should be used during its prescribed shelf life. e. The adhesive should harden rapidly. f. The adhesive must not be contaminated. g. The adhesive should have excellent insulation characteristics. h. The adhesive should not be toxic and have no emission of toxic gasses. （2） When using adhesives to mount inductors on a PCB, inappropriate amounts of adhesive on the board may adversely affect component placement. Too little adhesive may cause the inductors to fall off the board during the solder process. Too much adhesive may cause defective soldering due excessive flow of adhesive on to the land or solder pad. Amount of adhesives After inductors are bonded ［Recommended conditions］ a a Figure 0805 case sizes as examples a 0.3mm min b b 100～120μm c Area with no adhesive c c 4. Soldering Precautions ◆Selection of Flux 1. Since flux may have a significant effect on the performance of inductors, it is necessary to verify the following conditions prior to use; （1） Flux used should be with less than or equal to 0.1 wt% （Chlorine conversion method） of halogenated content. Flux having a strong acidity content should not be applied. （2） When soldering inductors on the board, the amount of flux applied should be controlled at the optimum level. （3） When using water-soluble flux, special care should be taken to properly clean the boards. ◆Soldering 1. Temperature, time, amount of solder, etc. are specified in accordance with the following recommended conditions, and please contact us about peak temperature when you use lead-free paste. ▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . hq_i_mlci_prec_e-E06R01 ◆Selection of Flux 1-1. When too much halogenated substance（Chlorine, etc.）content is used to activate the flux, or highly acidic flux is used, an excessive amount of residue after soldering may lead to corrosion of the terminal electrodes or degradation of insulation resistance on the surface of the Inductor. 1-2. Flux is used to increase solderability in flow soldering, but if too much is applied, a large amount of flux gas may be emitted and may detrimentally affect solderability. To minimize the amount of flux applied, it is recommended to use a flux-bubbling system. 1-3. Since the residue of water-soluble flux is easily dissolved by water content in the air, the residue on the surface of Inductor in high humidity conditions may cause a degradation of insulation resistance and therefore affect the reliability of the components. The cleaning methods and the capability of the machines used should also be considered carefully when selecting water-soluble flux. ◆Soldering 1-1. Preheating when soldering Heating: Chip inductor components should be preheated to within 100 to 130℃ of the soldering. Cooling: The temperature difference between the components and cleaning process should not be greater than 100℃. Chip inductors are susceptible to thermal shock when exposed to rapid or concentrated heating or rapid cooling. Therefore, the soldering process must be conducted with a great care so as to prevent malfunction of the components due to excessive thermal shock. ［Reflow soldering］ 【Recommended conditions for eutectic soldering】 【Recommended condition for Pb-free soldering】 300 300 Peak 260℃ Max. Within 10sec. 230℃ Within 10sec. 60sec. 60sec Min. 200 Min. Temperature（℃） Temperature（℃） Preheating Slow cooling 100 0 200 Slow cooling 100 0 Preheating150℃ Heating above 230℃ 60sec. Min. 40sec. Max. ※Ceramic chip components should be preheated to within 100 to 130℃ of the soldering. ※Assured to be reflow soldering for 2 times. Caution 1. The ideal condition is to have solder mass（fillet）controlled to 1/2 to 1/3 of the thickness of the inductor, as shown below: 1/2T～1/3T Inductor Solder Technical considerations T PC board 2. Because excessive dwell times can detrimentally affect solderability, soldering duration should be kept as close to recommended times as possible. ［Wave soldering］ 【Recommended conditions for eutectic soldering】 【Recommended condition for Pb-free soldering】 300 Preheating 120sec. Min. Peak 260℃ Max. Within 10sec. 230～250℃ Within 3sec. 200 Slow cooling 100 Temperature（℃） Temperature（℃） 300 0 200 120sec. Min. Preheating 150℃ 100 Slow cooling 0 ※Ceramic chip components should be preheated to within 100 to 130℃ of the soldering. ※Assured to be wave soldering for 1 time. ※Except for reflow soldering type. Caution 1. Make sure the inductors are preheated sufficiently. 2. The temperature difference between the inductor and melted solder should not be greater than 100 to 130℃. 3. Cooling after soldering should be as gradual as possible. 4. Wave soldering must not be applied to the inductors designated as for reflow soldering only. ［Hand soldering］ 【Recommended conditions for eutectic soldering】 【Recommended condition for Pb-free soldering】 400 400 Peak 350℃ Max. Within 3sec. 230～280℃ Within 3sec. 300 200 Slow cooling 100 0 Preheating 60sec. Min. Temperature（℃） Temperature（℃） 300 ⊿T Slow cooling 200 100 0 Preheating 150℃ Min. 60sec. Min. （※⊿ＴT190℃） ※It is recommended to use 20W soldering iron and the tip is 1φor less. ※The soldering iron should not directly touch the components. ※Assured to be soldering iron for 1 time. Note: The above profiles are the maximum allowable soldering condition, therefore these profiles are not always recommended. ▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . hq_i_mlci_prec_e-E06R01 Caution 1. Use a 20W soldering iron with a maximum tip diameter of 1.0 mm. 2. The soldering iron should not directly touch the inductor. 5. Cleaning Precautions ◆Cleaning conditions 1. When cleaning the PC board after the Inductors are all mounted, select the appropriate cleaning solution according to the type of flux used and purpose of the cleaning（e.g. to remove soldering flux or other materials from the production process.） 2. Cleaning conditions should be determined after verifying, through a test run, that the cleaning process does not affect the inductor's characteristics. Technical considerations ◆Cleaning conditions 1. The use of inappropriate solutions can cause foreign substances such as flux residue to adhere to the inductor, resulting in a degradation of the inductor's electrical properties（especially insulation resistance）. 2. Inappropriate cleaning conditions（insufficient or excessive cleaning）may detrimentally affect the performance of the inductors. （1） Excessive cleaning a. In the case of ultrasonic cleaning, too much power output can cause excessive vibration of the PC board which may lead to the cracking of the inductor or the soldered portion, or decrease the terminal electrodes' strength. Thus the following conditions should be carefully checked; Ultrasonic output Below 20W/ℓ Ultrasonic frequency Below 40kHz Ultrasonic washing period 5 min. or less 6. Post cleaning processes Precautions ◆Application of resin coatings, moldings, etc. to the PCB and components. 1. With some type of resins a decomposition gas or chemical reaction vapor may remain inside the resin during the hardening period or while left under normal storage conditions resulting in the deterioration of the inductor's performance. 2. When a resin's hardening temperature is higher than the inductor's operating temperature, the stresses generated by the excess heat may lead to inductor damage or destruction. 3. Stress caused by a resin's temperature generated expansion and contraction may damage inductors. The use of such resins, molding materials etc. is not recommended. When inductors are coated/molded with resin, please check effects on the inductors by analyzing them in actual applications prior to use. 7. Handling Precautions ◆Breakaway PC boards（splitting along perforations） 1. When splitting the PC board after mounting inductors and other components, care is required so as not to give any stresses of deflection or twisting to the board. 2. Board separation should not be done manually, but by using the appropriate devices. ◆General handling precautions 1. Always wear static control bands to protect against ESD. 2. Keep the inductors away from all magnets and magnetic objects. 3. Use non-magnetic tweezers when handling inductors. 4. Any devices used with the inductors（ soldering irons, measuring instruments） should be properly grounded. 5. Keep bare hands and metal products（i.e., metal desk）away from chip electrodes or conductive areas that lead to chip electrodes. 6. Keep inductors away from items that generate magnetic fields such as speakers or coils. ◆Mechanical considerations 1. Be careful not to subject the inductors to excessive mechanical shocks. （1） If inductors are dropped on the floor or a hard surface they should not be used. （2） When handling the mounted boards, be careful that the mounted components do not come in contact with or bump against other boards or components. 8. Storage conditions Precautions ◆Storage 1. To maintain the solderability of terminal electrodes and to keep the packaging material in good condition, care must be taken to control temperature and humidity in the storage area. Humidity should especially be kept as low as possible. ・Recommended conditions Ambient temperature: Below 30℃ Humidity: Below 70% RH The ambient temperature must be kept below 40℃. Even under ideal storage conditions, solderability of inductor is deteriorated as time passes, so inductors should be used within 6 months from the time of delivery. ・Inductor should be kept where no chlorine or sulfur exists in the air. Technical considerations ◆Storage 1. If the parts are stocked in a high temperature and humidity environment, problems such as reduced solderability caused by oxidation of terminal electrodes and deterioration of taping/packaging materials may take place. For this reason, components should be used within 6 months from the time of delivery. If exceeding the above period, please check solderability before using the inductors. ▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . hq_i_mlci_prec_e-E06R01