有关敝公司产品的注意事项
【一般电子设备】
请务必在使用敝公司产品之前阅读。
注意
■ 本产品目录中所记载的内容为2018 年10月之内容。因改良等原因，可能会不经预告而变更记载内容，所以请务必在
使用前先确认最新的产品信息。未按照本产品目录中所记载的内容或交货规格说明书使用敝公司产品的，即便其致
使使用设备发生损害、瑕疵等时，敝公司也不承担任何责任，敬请悉知。
■ 就规格相关的详细内容，敝公司备有交货规格说明书，详情请向敝公司咨询。
■ 使用敝公司产品时，请务必事先安装到设备之后，在实际使用的环境下进行评估和确认。
■ 本产品目录中所记载的产品可使用于一般电子设备［音像设备、办公自动化设备、家电产品、办公设备、信息 /通讯设
备（手机、电脑等）］以及医疗设备（国际（IMDRF）第一类，第二类）。因此，若考虑将本产品目录中所记载的产品使
用于可能会直接危及生命或身体的设备［运输用设备（汽车驱动控制设备、火车控制设备、船舶控制设备等）、交通
信号设备、防灾设备、医疗设备（国际（IMDRF ）第三类）、高公共性信息通信设备（电话交换机以及电话、无线、广
播电视等基站）］等时，请务必事先向敝公司咨询。
另外，请勿将敝公司产品使用于对安全性和可靠性要求较高的设备（航天设备、航空设备※、医疗设备（国际（IMDRF）
第四类）、原子能控制设备、海底设备、军事设备等）。
※ 注释 ：仅限于对航空设备的安全运行不产生直接干扰的设备
［机内娱乐设备、机内照明设备、电动座椅、餐饮设备等］，在满足敝公司另行指定的相关
条件时，亦可将敝公司产品用于以上用途。在贵公司考虑将敝公司的产品用于以上用途时，请务必事先向敝公司咨询相关的信息。
且即便属于一般电子设备，使用于对安全性和可靠性要求较高的设备、电路上时，敝公司建议进行充分的安全评估，
并根据需要，在设计时追加保护电路等。
未经敝公司的事先书面同意，把本产品目录中所记载的产品使用于前述需要向敝公司咨询的设备或敝公司禁止使用
的设备，从而给客户或第三方造成损害的，敝公司不承担任何责任，敬请悉知。
■ 本产品目录中所记载的信息是用于说明相关产品的典型操作以及相关应用。此类信息的使用不代表对于敝公司以及
第三方的知识产权以及其他权利的使用许可或是不侵权保证。
■ 敝公司产品的保证范围仅限于交付的敝公司产品单品，就敝公司产品的故障或瑕疵所誘発的损害，敝公司不承担任
何责任，敬请悉知。但是，以书面形式另行签署了交易基本合同书，品质保证协定书等时，敝公司将根据该合同等的
条件提供保证。
■ 本产品目录中所记载的内容适用于从敝公司营业所、销售子公司、销售代理店（即“正规销售渠道”）购买的敝公司产
品，并不适用于从上述以外的渠道购买的敝公司产品，敬请悉知。
■ 出口相关注意事项
本产品目录中所记载的部分产品在出口时须事先确认《外汇和对外贸易法》以及美国出口管理的相关法规，并办理
相关手续。如有不明之处，请向敝公司咨询。
19
信号用绕线型片状电感器
（LB 系列 M 型）
WIRE-WOUND CHIP INDUCTORS FOR SIGNAL LINES（LB SERIES M TYPE）
回流焊
REFLOW
※使用温度范围：
-40 ～+105℃（包含产品本身发热）
* Operating Temp.：-40～+105℃（Including
self-generated heat）
■PARTS
NUMBER
型号标示法
L
B
M △
①
2
0
1
②
①类型 name
①Series
Code
代码
LBM△
6
T
③
1
0 0
④
J △
⑤ ⑥
空格
△＝Blank space
④标称电感值
④Nominal
inductance
Code
代码
（example）
（例）
R12
1R0
100
101
小数点 point
※R＝Decimal
Series
name
类型
Wound信号用绕线型片状电感器
chip inductor for signal line
Dimensions（L×W）［mm］
尺寸（L×W ）
［mm］
2.0×1.6
③包装
③Packaging
代码
Code
T
0.12
1.0
10
100
⑤Inductance tolerance
⑤电感量公差
代码
Code
J
包装
Packaging
卷盘带装
Taping
电感器／标准电感器
②尺寸（L
× W）
②Dimensions（L×W）
代码
Code
2016
Nominal
inductance［μH］
标称电感值
［μH］
电感量公差
Inductance
tolerance
±5％
⑥Internal code
⑥本公司管理记号
标准外型尺寸／标准数量
■STANDARD
EXTERNAL DIMENSIONS / STANDARD QUANTITY
Recommended Land Patterns
推荐焊盘图案
实装上的注意
Surface Mounting
・请确认实装状态后使用。
・Mounting and soldering conditions should be checked beforehand.
・
本产品焊法限定为回流焊法。
・Applicable
soldering process to these products is reflow soldering only.
W
L
T
Type
LBM 2016
e
A
0.6
B
1.0
C
1.8
单位：
mm
Unit：mm
C
A
B
A
Standard
quantity
［pcs］
标准数量
[pcs]
Paper
tape
Embossed
纸带
压纹带tape
Type
L
W
T
e
LBM 2016
2.0±0.2
（0.08±0.008）
1.6±0.2
（0.063±0.008）
1.6±0.2
（0.063±0.008）
0.5±0.2
（0.02±0.008）
－
2000
Unit：mm（inch）
单位：
mm（inch）
i_wound_LBM_e-E07R01
▶ 由于篇幅有限，本产品目录中只记载了有代表性的产品规格，若考虑使用弊司产品时，请确认交货规格说明书中的详细规格。
另外，有关各产品的详细信息
（特性图、可靠性信息、使用时的注意事项等），请参阅弊司网站
（http://www.ty-top.com/ ）。
19
93
■PARTS
NUMBER
型号一览
●LBM2016 型
type
Parts
number
型号
电感器／标准电感器
LBM 2016TR12J
LBM 2016TR15J
LBM 2016TR18J
LBM 2016TR22J
LBM 2016TR27J
LBM 2016TR33J
LBM 2016TR39J
LBM 2016TR47J
LBM 2016TR56J
LBM 2016TR68J
LBM 2016TR82J
LBM 2016T1R0J
LBM 2016T1R2J
LBM 2016T1R5J
LBM 2016T1R8J
LBM 2016T2R2J
LBM 2016T2R7J
LBM 2016T3R3J
LBM 2016T3R9J
LBM 2016T4R7J
LBM 2016T5R6J
LBM 2016T6R8J
LBM 2016T8R2J
LBM 2016T100J
LBM 2016T120J
LBM 2016T150J
LBM 2016T180J
LBM 2016T220J
LBM 2016T270J
LBM 2016T330J
LBM 2016T390J
LBM 2016T470J
LBM 2016T560J
LBM 2016T680J
LBM 2016T820J
LBM 2016T101J
LBM 2016T151J
LBM 2016T181J
LBM 2016T221J
Self-resonant
EHS
Nominal
inductance
标称电感值
［μH］
［μ
H］
Inductance
tolerance
电感量公差
QQ值
（（min.）
min.）
自共振频率
frequency
（min.）
［［MHｚ］（min.）
MHｚ］
DC直流电阻
Resistance
［Ω］（±30％）
［Ω］
（±30％）
Rated
current
额定电流
［mA］（max.）
］
（max.）
［mA
Measuring
测试频率
frequency
［［MHz］
MHz］
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
0.12
0.15
0.18
0.22
0.27
0.33
0.39
0.47
0.56
0.68
0.82
1.0
1.2
1.5
1.8
2.2
2.7
3.3
3.9
4.7
5.6
6.8
8.2
10
12
15
18
22
27
33
39
47
56
68
82
100
150
180
220
±5％
±5％
±5％
±5％
±5％
±5％
±5％
±5％
±5％
±5％
±5％
±5％
±5％
±5％
±5％
±5％
±5％
±5％
±5％
±5％
±5％
±5％
±5％
±5％
±5％
±5％
±5％
±5％
±5％
±5％
±5％
±5％
±5％
±5％
±5％
±5％
±5％
±5％
±5％
30
30
30
30
30
30
30
30
30
30
30
30
30
30
30
30
30
30
30
30
25
25
25
25
25
25
25
25
25
25
20
20
20
20
20
15
15
15
15
600
550
500
450
425
400
375
350
300
270
250
220
180
135
100
75
55
48
43
40
36
33
30
27
23
20
18
17
16
15
14
13
12
11
10
9.0
6.5
6.0
5.5
0.13
0.15
0.15
0.20
0.21
0.21
0.26
0.26
0.29
0.32
0.34
0.38
0.41
0.47
0.48
0.54
0.59
0.68
0.74
0.78
0.88
0.97
1.1
1.2
1.4
1.5
2.5
2.8
3.2
3.6
3.9
4.1
5.9
7.0
7.7
8.0
13.5
15
18
610
570
560
520
510
490
440
430
410
400
390
385
370
350
345
340
310
290
275
270
255
240
225
215
200
190
150
140
130
125
120
115
95
90
85
80
69
67
65
25.2
25.2
25.2
25.2
25.2
25.2
25.2
25.2
25.2
25.2
25.2
7.96
7.96
7.96
7.96
7.96
7.96
7.96
7.96
7.96
7.96
7.96
7.96
2.52
2.52
2.52
2.52
2.52
2.52
2.52
2.52
2.52
2.52
2.52
2.52
0.796
0.796
0.796
0.796
※）
额定电流：
直流叠加导致的电感降低在
以内、以及温度上升
※）Rated
Current
: The maximum DC value having
inductance
decrease within
10 % and temperature increase within 20 degC by the application of DC bias.
10%
20℃以内都满足的最大直流电流值。
i_wound_LBM_e-E07R01
▶ 由于篇幅有限，本产品目录中只记载了有代表性的产品规格，若考虑使用弊司产品时，请确认交货规格说明书中的详细规格。
另外，有关各产品的详细信息
（特性图、可靠性信息、使用时的注意事项等），请参阅弊司网站
（http://www.ty-top.com/ ）。
94
19
WIRE-WOUND CHIP INDUCTORS (LB SERIES)，
WIRE-WOUND CHIP POWER INDUCTORS (CB SERIES)，
WIRE-WOUND CHIP INDUCTORS FOR SIGNAL LINES (LB SERIES M TYPE)
■PACKAGING
①Minimum Quantity
Standard Quantity ［pcs］
Paper Tape
Embossed Tape
Type
LB C3225
CB C3225
LB 3218
LB R2518
LB C2518
LB 2518
CB 2518
CB C2518
LBM2016
LB C2016
LB 2016
CB 2016
CB C2016
LB 2012
LB C2012
LB R2012
CB 2012
CB C2012
CB L2012
LB 1608
LBMF1608
CBMF1608
－
1000
－
2000
－
2000
－
2000
－
3000
4000
4000
－
－
－
3000
②Tape material
●Embossed tape
Top tape
Chip Filled
Sprocket hole
Base tape
Chip cavity
Chip
●Card board carrier tape
Top tape
Base tape
Chip Filled
Sprocket hole
Bottom tape
Chip cavity
Chip
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
i_wound_CB_LB_pack_e-E05R01
③Taping Dimensions
●Embossed Tape （0.315 inches wide）
A
B
F
Type
LBM2016
LB C3225
CB C3225
LB
3218
LB 2518
CB 2518
LB C2518
CB C2518
LB R2518
LB 2016
CB 2016
LB C2016
CB C2016
LB 2012
CB 2012
LB C2012
CB C2012
LB R2012
LBMF1608
CBMF1608
1.75±0.1
(0.069±0.004）
8.0±0.3
(0.315±0.012)
φ1.5＋0.1/－0
(φ0.059＋0.004/-0)
3.5±0.05
(0.138±0.002)
Sprocket hole
4.0±0.1
(0.157±0.004)
2.0±0.1
(0.079±0.004)
Chip cavity
A
B
1.75±0.1
2.1±0.1
（0.069±0.004）
（0.083±0.004）
2.8±0.1
3.5±0.1
（0.110±0.004）
（0.138±0.004）
2.1±0.1
3.5±0.1
（0.083±0.004）
（0.138±0.004）
Insertion pitch
F
4.0±0.1
（0.157±0.004）
4.0±0.1
（0.157±0.004）
4.0±0.1
（0.157±0.004）
Tape thickness
T
K
0.3±0.05
1.9max.
（0.012±0.002）
（0.075max.）
0.3±0.05
4.0max.
（0.012±0.002）
（0.157max.）
0.3±0.05
2.2max.
（0.012±0.002）
（0.087max.）
2.15±0.1
（0.085±0.004）
2.7±0.1
（0.106±0.004）
4.0±0.1
（0.157±0.004）
0.3±0.05
（0.012±0.002）
2.2max.
（0.087max.）
1.75±0.1
（0.069±0.004）
2.1±0.1
（0.083±0.004）
4.0±0.1
（0.157±0.004）
0.3±0.05
（0.012±0.002）
1.9max.
（0.075max.）
1.45±0.1
（0.057±0.004）
2.25±0.1
（0.089±0.004）
4.0±0.1
（0.157±0.004）
0.25±0.05
（0.010±0.002）
1.45max.
（0.057max.）
1.1±0.1
（0.043±0.004）
1.9±0.1
（0.075±0.004）
4.0±0.1
（0.157±0.004）
0.25±0.05
（0.010±0.002）
1.2max.
（0.047max.）
Unit：mm（inch）
Insertion pitch
F
4.0±0.1
（0.157±0.004）
4.0±0.1
（0.157±0.004）
Tape thickness
T
1.1max.
（0.043max.）
1.1max.
（0.043max.）
Unit：mm（inch）
●Card board carrier tape（0.315 inches wide）
A
B
F
Type
CB L2012
LB
1608
1.75±0.1
(0.069±0.004）
T
8.0±0.3
(0.315±0.012)
φ1.5＋0.1/－0
(φ0.059＋0.004/-0)
3.5±0.05
(0.138±0.002)
Sprocket hole
4.0±0.1
(0.157±0.004)
2.0±0.1
(0.079±0.004)
Chip cavity
A
B
1.55±0.1
2.3±0.1
（0.061±0.004）
（0.091±0.004）
1.0±0.1
1.8±0.1
（0.039±0.004）
（0.071±0.004）
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
i_wound_CB_LB_pack_e-E05R01
④Leader and Blank Portion
⑤Reel Size
⑥Top Tape Strength
The top tape requires a peel-off force 0.2 to 0.7N in the direction of the arrow as illustrated below.
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
i_wound_CB_LB_pack_e-E05R01
WIRE-WOUND CHIP INDUCTORS (LB SERIES),
WIRE-WOUND CHIP POWER INDUCTORS (CB SERIES),
WIRE-WOUND CHIP INDUCTORS FOR SIGNAL LINES (LB SERIES M TYPE)
■RELIABILITY DATA
1.Operating temperature Range
LB, LBC, LBR, LBMF Series
Specified Value
CB, CBC, CBL, CBMF Series
－40～＋105℃（Including self-generated heat）
LBM Series
2. Storage Temperature Range（after soldering）
LB, LBC, LBR, LBMF Series
Specified Value
CB, CBC, CBL, CBMF Series
－40～＋85℃
LBM Series
Test Methods and
Remarks
LB, CB Series：
Please refer the term of "7. storage conditions" in precautions.
3.Rated Current
LB, LBC, LBR, LBMF Series
Specified Value
CB, CBC, CBL, CBMF Series
Within the specified tolerance
LBM Series
4.Inductance
LB, LBC, LBR, LBMF Series
Specified Value
CB, CBC, CBL, CBMF Series
Within the specified tolerance
LBM Series
Test Methods and
Remarks
LB・LBC・LBR・CB・CBC・CBL・LBMF・CBMF・LBM Series
Measuring equipment
：LCR Mater（HP4285A or its equivalent）
Measuring frequency
: Specified frequency
5.Q
LB, LBC, LBR, LBMF Series
Specified Value
CB, CBC, CBL, CBMF Series
LBM Series
Test Methods and
Remarks
LBM Series
Measuring equipment
Measuring frequency
－
Within the specified tolerance
: LCR Mater（HP4285A or its equivalent）
: Specified frequency
6.DC Resisitance
LB, LBC, LBR, LBMF Series
Specified Value
CB, CBC, CBL, CBMF Series
Within the specified tolerance
LBM Series
Test Methods and
Remarks
Measuring equipment : DC Ohmmeter （HIOKI 3227 or its equivalent）
7.Self-Resonant Frequency
LB, LBC, LBR, LBMF Series
Specified Value
CB, CBC, CBL, CBMF Series
Within the specified tolerance
LBM Series
Test Methods and
Remarks
Measuring equipment : Impedance analyzer （HP4291A or its equivalent）
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
i_wound_CB_LB_reli_e-E05R01
8.Temperature Characteristic
LBM2016
Specified Value
Test Methods and
Remarks
Inductance change : Within±5％
LB1608
LB2012
LBR2012
CB2012
CBL2012
LB2016
CB2016
LB2518
LBR2518
CB2518
LBC3225
CBC3225
LBMF1608
CBMF1608
LBC2016
CBC2016
LBC2518
CBC2518
LB3218
LBC2012
CBC2012
Inductance change : Within±20％
Inductance change : Within±25％
Inductance change : Within±35％
Based on the inductance at 20℃ and Measured at the ambient of －40℃～＋85℃.
9.Rasistance to Flexure of Substrate
LB, LBC, LBR, LBMF Series
Specified Value
CB, CBC, CBL, CBMF Series
No damage.
LBM Series
Warp
: 2mm（LB・LBC・LBR・CB・CBC・CBL・LBM・LBMF・CBMF Series）
Test substrate : Glass epoxy-resin substrate
Thickness
: 0.8mm（LB1608・LBMF1608・CBMF1608）
: 1.0mm（Others）
Test Methods and
Remarks
10.Body Strength
LB, LBC, LBR, LBMF Series
Specified Value
CB, CBC, CBL, CBMF Series
No damage.
LBM Series
Test Methods and
Remarks
LB・LBC・LBR・CB・CBC・CBL・LBM
Applied force : 10N
Duration
: 10sec.
LB1608・LBMF1608・CBMF1608
Applied force : 5N
Duration
: 10sec.
11.Adhesion of terminal electrode
LB, LBC, LBR, LBMF Series
Specified Value
CB, CBC, CBL, CBMF Series
No abnormality.
LBM Series
Test Methods and
Remarks
LB・LBC・LBR・CB・CBC・CBL・LBM・LBMF・CBMF
Applied force
: 10N to X and Y directions
Duration
: 5 sec.
Test substrate
: Printed board
LB1608・CBMF1608・LBMF1608
Applied force
: 5N to X and Y directions
Duration
: 5 sec.
Test substrate
: Printed board
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
i_wound_CB_LB_reli_e-E05R01
12.Resistance to vibration
LB, LBC, LBR, LBMF Series
Specified Value
CB, CBC, CBL, CBMF Series
Inductance change : Within±5％
No significant abnormality in appearance.
LBM Series
Test Methods and
Remarks
Inductance change : Within±10％
No significant abnormality in appearance.
LB・LBR・LBC・CB・CBC・CBL・LBM・LBMF・CBMF：
The given sample is soldered to the board and then it is tested depending on the conditions of the following table.
Vibration Frequency
10～55Hz
Total Amplitude
1.5mm (May not exceed acceleration 196m/s2)
Sweeping Method
10Hz to 55Hz to 10Hz for 1min.
X
Time
Y
For 2 hours on each X, Y, and Z axis.
Z
Recovery : At least 2 hrs of recovery under the standard condition after the test, followed by the measurement within 48 hrs.
13.Drop test
LB, LBC, LBR, LBMF Series
Specified Value
CB, CBC, CBL, CBMF Series
－
LBM Series
14.Solderability
LB, LBC, LBR, LBMF Series
Specified Value
CB, CBC, CBL, CBMF Series
At least 90％ of surface of terminal electrode is covered by new
LBM Series
Test Methods and
Remarks
LB・LBC・LBR・CB・CBC・CBL・LBM・LBMF・CBMF：
Solder temperature
: 245±5℃
Duration
: 5±0.5sec
Flux
: Methanol solution with 25％ of colophony
15.Resistance to soldering
LB, LBC, LBR, LBMF Series
Specified Value
CB, CBC, CBL, CBMF Series
LBM Series
Test Methods and
Remarks
Inductance change : Within±10％
Inductance change : Within±5％
LB・LBC・LBR・CB・CBC・CBL・LBM・LBMF・CBMF：
3 times of reflow oven at 230℃ MIN for 40sec. with peak temperature at 260 ℃ for 5sec.
Recovery : At least 2 hrs of recovery under the standard condition after the test, followed by the measurement within 48 hrs.
16.Resisitance to solvent
LB, LBC, LBR, LBMF Series
Specified Value
CB, CBC, CBL, CBMF Series
－
LBM Series
Test Methods and
Remarks
Solvent temperature
Type of solvent
Cleaning conditions
: Room temperature
: Isopropyl alcohol
: 90s. Immersion and cleaning.
17.Thermal shock
LB, LBC, LBR, LBMF Series
Specified Value
CB, CBC, CBL, CBMF Series
Inductance change : Within±10％
No significant abnormality in appearance.
LBM Series
Test Methods and
Remarks
LB・LBC・LBR・CB・CBC・CBL・LBM・LBMF・CBMF：
The given sample is soldered to the board and then its Inductance is measured after 100cycles of the following conditions.
Conditions of 1 cycle
Step
Temperature (℃)
Duration (min)
1
－40±3
30±3
2
Room temperature
Within 3
3
＋85±2
30±3
4
Room temperature
Within 3
Recovery
: At least 2 hrs of recovery under the standard condition after the test, followed by the measurement within 48 hrs.
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
i_wound_CB_LB_reli_e-E05R01
18.Damp heat life test
LB, LBC, LBR, LBMF Series
Specified Value
CB, CBC, CBL, CBMF Series
Inductance change : Within±10％
No significant abnormality in appearance.
LBM Series
Test Methods and
Remarks
Temperature
Humidity
Duration
Recovery
: 60±2℃
: 90～95％RH
: 1000 hrs
: At least 2 hrs of recovery under the standard condition after the test, followed by the measurement within 48 hrs.
19.Loading under damp heat life test
LB, LBC, LBR, LBMF Series
CB, CBC, CBL, CBMF Series
Specified Value
Test Methods and
Remarks
Inductance change : Within±10％
No significant abnormality in appearance.
LBM Series
Temperature
Humidity
Duration
Applied current
Recovery
: 60±2℃
: 90～95％RH
: 1000 hrs
: Rated current
: At least 2 hrs of recovery under the standard condition after the test, followed by the measurement within 48 hrs.
20.High temperature life test
Specified Value
LB, LBC, LBR, LBMF Series
－
CB, CBC, CBL, CBMF Series
Inductance change : Within±10％
No significant abnormality in appearance.
LBM Series
Test Methods and
Remarks
Temperature
Duration
Recovery
: 85±2℃
: 1000 hrs
: At least 2 hrs of recovery under the standard condition after the test, followed by the measurement within 48 hrs.
21.Loading at high temperature life test
LB, LBC, LBR, LBMF Series
Specified Value
CB, CBC, CBL, CBMF Series
LBM Series
Test Methods and
Remarks
Temperature
Duration
Applied current
Recovery
Inductance change : Within±10％
（LBC3225 Series : Within±20％）
No significant abnormality in appearance.
－
: 85±2℃
: 1000 hrs
: Rated current
: At least 2 hrs of recovery under the standard condition after the test, followed by the measurement within 48 hrs.
22.Low temperature life test
LB, LBC, LBR, LBMF Series
Specified Value
CB, CBC, CBL, CBMF Series
Inductance change : Within±10％
No significant abnormality in appearance.
LBM Series
Test Methods and
Remarks
Temperature
Duration
Recovery
: －40±2℃
: 1000 hrs
: At least 2 hrs of recovery under the standard condition after the test, followed by the measurement within 48 hrs.
23.Standard condition
LB, LBC, LBR, LBMF Series
Specified Value
CB, CBC, CBL, CBMF Series
LBM Series
Standard test conditions
Unless specified, Ambient temperature is 20±15℃ and the Relative
humidity is 65±20％. If there is any doubt about the test results, further
measurement shall be had within the following limits:
Ambient Temperature: 20±2℃
Relative humidity: 65±5％
Inductance value is based on our standard measurement systems.
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
i_wound_CB_LB_reli_e-E05R01
WIRE-WOUND CHIP INDUCTORS (LB SERIES)，
WIRE-WOUND CHIP POWER INDUCTORS (CB SERIES)，
WIRE-WOUND CHIP INDUCTORS FOR SIGNAL LINES (LB SERIES M TYPE)
■PRECAUTIONS
1．Circuit Design
Precautions
◆Operating environment
1. The products described in this specification are intended for use in general electronic equipment, (office supply equipment,
telecommunications systems, measuring equipment, and household equipment). They are not intended for use in mission-critical
equipment or systems requiring special quality and high reliability (traffic systems, safety equipment, aerospace systems, nuclear
control systems and medical equipment including life-support systems,) where product failure might result in loss of life, injury or
damage. For such uses, contact TAIYO YUDEN Sales Department in advance.
2．PCB Design
Precautions
Technical
considerations
◆Land pattern design
1. Please contact any of our offices for a land pattern, and refer to a recommended land pattern of a right figure or specifications.
PRECAUTIONS
【Recommended Land Patterns】
Surface Mounting
・ Mounting and soldering conditions should be checked beforehand.
・ Applicable soldering process to those products is reflow soldering only.
3．Considerations for automatic placement
Precautions
Technical
considerations
◆Adjustment of mounting machine
1. Excessive impact load should not be imposed on the products when mounting onto the PC boards.
2. Mounting and soldering conditions should be checked beforehand.
1. When installing products, care should be taken not to apply distortion stress as it may deform the products.
4．Soldering
Precautions
◆Reflow soldering（ LB and CB Types）
1. For reflow soldering with either leaded or lead-free solder, the profile specified in "point for controlling" is recommended.
◆Recommended conditions for using a soldering iron
1. Put the soldering iron on the land-pattern. Soldering iron's temperature - Below 350℃ Duration-3 seconds or less. The soldering iron
should not come in contact with inductor directly.
◆Reflow soldering（ LB and CB Types）
1. Reflow profile
Technical
considerations
◆Recommended conditions for using a soldering iron
1. Components can be damaged by excessive heat where soldering conditions exceed the specified range.
5．Cleaning
Precautions
Technical
considerations
◆Cleaning conditions
Washing by supersonic waves shall be avoided.
◆Cleaning conditions
If washed by supersonic waves, the products might be broken.
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
i_wound_CB_LB_prec_e-E06R01
6．Handling
Precautions
Technical
considerations
◆Handling
1. Keep the inductors away from all magnets and magnetic objects.
◆Breakaway PC boards（ splitting along perforations）
1. When splitting the PC board after mounting inductors, care should be taken not to give any stresses of deflection or twisting to the
board.
2. Board separation should not be done manually, but by using the appropriate devices.
◆Mechanical considerations
1. Please do not give the inductors any excessive mechanical shocks.
◆Handling
1. There is a case that a characteristic varies with magnetic influence.
◆Breakaway PC boards（ splitting along perforations）
1. Planning pattern configurations and the position of products should be carefully performed to minimize stress.
◆Mechanical considerations
1. There is a case to be damaged by a mechanical shock.
7．Storage conditions
Precautions
◆Storage
1. To maintain the solderability of terminal electrodes and to keep the packing material in good condition, temperature and humidity in the
storage area should be controlled.
・ Recommended conditions
Ambient temperature : 0～40℃
Humidity : Below 70% RH
・ The ambient temperature must be kept below 30℃. Even under ideal storage conditions, solderability of products electrodes may
decrease as time passes.
For this reason, product should be used within 6 months from the time of delivery.
In case of storage over 6 months, solderability shall be checked before actual usage.
Technical
considerations
◆Storage
1. Under a high temperature and humidity environment, problems such as reduced solderability caused by oxidation of terminal electrodes
and deterioration of taping/packaging materials may take place.
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
i_wound_CB_LB_prec_e-E06R01
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