一般積層セラミックコンデンサ
（温度補償用・Class 1）
STANDARD MULTILAYER
CERAMIC CAPACITORS
(CLASS1 : TEMPERATURE COMPENSATING
DIELECTRIC TYPE)
OPERATING TEMP.
K55VJ125C
＊042TYPE, 063TYPE, 105TYPEは除く
＊Except for 042TYPE, 063TYPE, 105TYPE
特長 FEATURES
YImprove Higher Mounting Densities.
YMultilayer block structure provides higher reliability
YA wide range of capacitance values available in standard case sizes.
Y実装密度の向上が図れます
Yモノリシックの構造のため、信頼性が高い
Y同一形状、静電容量範囲が広い
用途 APPLICATIONS
YGeneral electronic equipment
YCommunication equipment (portable telephones, PHS, other wireless applications, etc.)
Y一般電子機器用
Y通信機器用（携帯電話、PHS、コードレス電話 etc.）
形名表記法 ORDERING CODE
1
4
6
7
定格電圧 hVDCi
形状寸法fEIAgLPWhmmi
公称静電容量 hpFi
容量許容差
E
T
U
042(01005)
063(0201)
105(0402)
107(0603)
16
25
50
2
C
D
F
J
K
0.5
1
10
FRW 小数点
温度特性 hppm/Ci
積層コンデンサ
CG
PG
RG
SG
TG
UG
SL
3
端子電極
メッキ品
K
例
0R5
010
100
5
シリーズ名
M
0.4P0.2
0.6P0.3
1.0P0.5
1.6P0.8
9
個別仕様
M
M
M
M
M
0.25
0.5
1
5
10
pF
pF
pF
%
%
10
包装
F
T
8
K150DCG、CH、CJ、CK
K150DPH、PJ、PK
K220DRH、RJ、RK
K330DSH、SJ、SK G M 30
K470DTH、TJ、TK H M 60
K750DUJ、UK
J M120
J350VK1000
K M250
標準
K
テーピングf2mmピッチY178Bg
テーピングf4mmピッチY178Bg
製品厚み hmmi
C
P
V
W
Z
0.2
0.3
0.5
0.5
0.8
11
当社管理記号
標準品
Q
QWスペース
GW 許容差
U M K 1 0 5 C H 1 0 1 J W _ F Z
1
2
3
4
7
8
1
4
6
7
Rated voltagehVDCi
Dimensions fcase sizegfEIAgLPWhmmi
Nominal CapacitancehpFi
Capacitance Tolerance
E
T
U
Multilayer ceramic capacitor
3
PG
End termination
RG
Plated
SG
TG
UG
SL
example
0R5
010
100
0.5
1
10
K150DCG、CH、CJ、CK
(C0G、C0H、C0J、C0K)
K150DPH、PJ、PK
(P2H、P2J、P2K)
K220DRH、RJ、RK
(R2H、R2J、R2K)
K330DSH、SJ、SK
(S2H、S2J、S2K) 2 M 30
K470DTH、TJ、TK
(T2H、T2J、T2K) H M 60
K750DUJ、UK
2J M120
(U2J、U2K)
J350VK1000
K M250
GWTolerance
9
10
11
9
C
D
F
J
K
*R=decimal point
Temperature characteristicshppm/Ci
CG
K
0.4P0.2
0.6P0.3
1.0P0.5
1.6P0.8
5
Series name
M
042(01005)
063(0201)
105(0402)
107(0603)
16
25
50
2
46
6
5
M
M
M
M
M
0.25
0.5
1
5
10
pF
pF
pF
%
%
Special
code
K
10
Packaging
F
T
8
Standard Products
Tapef2mm pitchY178Bg
Tapef4mm pitchY178Bg
Thickness[mm]
C
P
V
W
Z
0.2
0.3
0.5
0.5
0.8
11
Internal code
Q
Standard Products
QWBlank space
外形寸法 EXTERNAL DIMENSIONS
TypefEIAg
GMK042
f01005g
GMK063
f0201g
GMK105
f0402g
GMK107
f0603g
L
0.4M0.02
f0.016M0.001g
0.6M0.03
f0.024M0.001g
1.0M0.05
f0.039M0.002g
1.6M0.10
f0.063M0.004g
W
0.2M0.02
f0.008M0.001g
0.3M0.03
f0.012M0.001g
0.5M0.05
f0.020M0.002g
0.8M0.10
f0.031M0.004g
T
0.2M0.02
f0.008M0.001g
0.3M0.03
f0.012M0.001g
0.5M0.05
f0.020M0.002g
50.8M0.10
f0.031M0.004g
e
0.1M0.03
f0.004M0.001g
0.15M0.05
f0.006M0.002g
0.25M0.10
f0.010M0.004g
0.35M0.25
f0.014M0.010g
Unit：mm(inch)
C
P
W, V
Z
Type
042 063
105
CG UG RG SG TG UG CG SL CG
Temp.char.
WV
[pF] [pF 3digits]
0.5
0R5
1
010
1.5
1R5
2
020
3
030
4
040
5
050
6
060
7
070
8
080
9
090
10
100
12
120
15
150
18
180
22
220
27
270
33
330
39
390
47
470
56
560
68
680
82
820
100
101
120
121
150
151
180
181
220
221
270
271
330
331
390
391
470
471
560
561
680
681
820
821
1000
102
16V
25V
16V
P
C
P
W
50V
W
W
107
UG SL
PG、TG、
RG SG、
50V
温度特性 Temperature Characteristics
温度特性
温度係数範囲
使用温度範囲
Temperature
hppm/Ci F1
Operating Temp. range
char.(EIA)
Temperature coefficient range
W
W
Z
Z
V
Z
Z
V
V
C K(C0K)
C J(C0J)
0±250
C H(C0H)
C G(C0G)
0±60
CAPACITORS
概略バリエーション AVAILABLE CAPACITANCE RANGE
4
0±120
0±30
P K(P2K)
−150±250
P J(P2J)
−150±120
P H(P2H)
R K(R2K)
−220±250
−150±60
R J(R2J)
−220±120
R H(R2H)
−220±60
S K(S2K)
−330±250
S J(S2J)
−330±120
S H(S2H)
T K(T2K)
−330±60
T J(T2J)
T H(T2H)
−470±120
K55VJ125C
−470±250
−470±60
U K(U2K)
−750±250
U J(U2J)
−750±120
−1000∼＋350
SL
注Dグラフの記号は製品の厚み記号です。
F1D20Cにおける静電容量を基準。
Based on the capacitance at 20C
Note: Letter code in shaded areas are thickness codes.
静電容量許容差 Capacitance Tolerance Symbol
記号
Symbol
許容差
Tolerance
区分
Item
C
M0.25pF
V5pF
D
M0.5 pF
V10pF
F
M1pF
6V10 pF
J
M5 %
11pFV
K
M10 %
11pFV
Q
区分
Item
QF2
Symbol
U400J20YCF1
V27pF
U1000
30pFV
F1DCW公称静電容量 Nominal capacitancehpFi
F2D測定周波数 Measurement Frequency= 1M0.1MHzfCT1000pFg
1M0.1kHz fCX1000pFg
測定電圧
Measurement voltage
= 0.5V5VrmsfCT1000pFg
1M0.2VrmsfCX1000pFg
セレクションガイド
Selection Guide
P.10
アイテム一覧
Part Numbers
P.48
特性図
Electrical Characteristics
AAAAAA
梱包
Packaging
P.78
信頼性
Reliability Data
P.80
使用上の注意
Precautions
P.86
etc
47
アイテム一覧 PART NUMBERS
042TYPE
Class 1
定格電圧
Rated
形 名
Voltage
Ordering code
(DC)
16V
EMK04 2
EMK04 2
EMK04 2
EMK04 2
EMK04 2
EMK04 2
EMK04 2
EMK04 2
EMK04 2
EMK04 2
EMK04 2
EMK04 2
EMK04 2
EMK04 2
Q 0R5GC
Q 0 1 0GC
Q 1R5GC
Q 0 2 0GC
Q 0 3 0GC
Q 0 4 0GC
Q 0 5 0GC
Q 0 6 0GC
Q 0 7 0GC
Q 0 8 0GC
Q 0 9 0GC
Q 1 0 0GC
Q 1 2 0GC
Q 1 5 0GC
温度特性
公称静電 静電容量
EHS
厚み
許容 差
Temperature characteristics (EIA)
容 量
(Environmental
Capacitance Thicknees
Hazardous CK CJ CH CG PK PJ PH RK RJ RH SK SJ SH TK TJ TH UK UJ
Capacitance tolerance
[mm]
SL
Substances) (C0K) (C0J) (C0H) (C0G) (P2K) (P2J) (P2H) (R2K) (R2J) (R2H) (S2K) (S2J) (S2H) (T2K) (T2J) (T2H) (U2K) (U2J)
(inch)
[pF]
[%]
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
●
●
●
●
●
●
●
●
●
●
●
●
●
●
0.5
1
1.5
2
3
4
5
6
7
8
9
10
12
15
●
●
●
●
●
●
●
●
●
●
●
●
●
●
±0.25pF
±0.5pF
0.2M0.02
(0.008M0.001)
±0.5pF
±1pF
±5%
±10%
注D形名のQには温度特性、Gには静電容量許容差記号が入ります。
Q Please specify the temperature characteristics code and G the capacitance tolerance code.
063TYPE
Class 1
定格電圧
Rated
形 名
Voltage
Ordering code
(DC)
25V
TMK06 3
TMK06 3
TMK06 3
TMK06 3
TMK06 3
TMK06 3
TMK06 3
TMK06 3
TMK06 3
TMK06 3
TMK06 3
TMK06 3
TMK06 3
TMK06 3
TMK06 3
TMK06 3
TMK06 3
TMK06 3
TMK06 3
TMK06 3
TMK06 3
TMK06 3
TMK06 3
TMK06 3
Q0R5GP
Q0 1 0GP
Q1R5GP
Q0 2 0GP
Q0 3 0GP
Q0 4 0GP
Q0 5 0GP
Q0 6 0GP
Q0 7 0GP
Q0 8 0GP
Q0 9 0GP
Q1 0 0GP
Q1 2 0GP
Q 1 5 0GP
CH1 8 0GP
CH2 2 0GP
CH2 7 0GP
CH3 3 0GP
CH3 9 0GP
CH4 7 0GP
CH5 6 0GP
CH6 8 0GP
CH8 2 0GP
CH1 0 1GP
温度特性
公称静電 静電容量
EHS
厚み
許容 差
Temperature characteristics (EIA)
容 量
(Environmental
Capacitance Thicknees
Hazardous CK CJ CH CG PK PJ PH RK RJ RH SK SJ SH TK TJ TH UK UJ
Capacitance tolerance
[mm]
SL
Substances) (C0K) (C0J) (C0H) (C0G) (P2K) (P2J) (P2H) (R2K) (R2J) (R2H) (S2K) (S2J) (S2H) (T2K) (T2J) (T2H) (U2K) (U2J)
(inch)
[pF]
[%]
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
注D形名のQには温度特性、Gには静電容量許容差記号が入ります。
Q Please specify the temperature characteristics code and G the capacitance tolerance code.
48
●
●
●
●
●
●
●
●
●
●
●
●
●
●
0.5
1
1.5
2
3
4
5
6
7
8
9
10
12
15
18
22
27
33
39
47
56
68
82
100
±0.25pF
±0.5pF
±0.5pF
±1pF
0.3M0.03
(0.012M0.001)
±5%
±10%
アイテム一覧 PART NUMBERS
105TYPE
Class 1
定格電圧
Rated
形 名
Voltage
Ordering code
(DC)
Q 0R5 GW
Q 0 1 0 GW
Q1R5 GW
Q 0 2 0 GW
Q 0 3 0 GW
Q 0 4 0 GW
Q 0 5 0 GW
Q 0 6 0 GW
Q 0 7 0 GW
Q 0 8 0 GW
Q0 9 0 GW
Q 1 0 0 GW
Q1 2 0 GW
Q 1 5 0 GW
Q 1 8 0 GW
Q 220G V
Q 270G V
Q 3 3 0 GV
Q 390G V
Q 4 7 0 GV
Q 5 6 0 GV
Q 680G V
Q 820G V
Q1 0 1 GV
Q 1 2 1 GV
Q 1 5 1 GV
Q 181G V
Q2 2 1 G V
Q 2 7 1 GV
Q 3 3 1 GV
SL 1 2 1 GV
SL 1 5 1 GV
SL 1 8 1 GV
SL 2 2 1 GV
SL 2 7 1 G V
SL 3 3 1 G V
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
0.5
1
1.5
2
3
4
5
6
7
8
9
10
12
15
18
22
27
33
39
47
56
68
82
100
120
150
180
220
270
330
120
150
180
220
270
330
4
±0.25pF
±0.5pF
CAPACITORS
50V
UMK10 5
UMK10 5
UMK10 5
UMK10 5
UMK10 5
UMK10 5
UMK10 5
UMK10 5
UMK10 5
UMK10 5
UMK10 5
UMK10 5
UMK10 5
UMK10 5
UMK10 5
UMK10 5
UMK10 5
UMK10 5
UMK10 5
UMK10 5
UMK10 5
UMK10 5
UMK10 5
UMK10 5
UMK10 5
UMK10 5
UMK10 5
UMK10 5
UMK10 5
UMK10 5
UMK10 5
UMK10 5
UMK10 5
UMK10 5
UMK10 5
UMK10 5
温度特性
公称静電 静電容量
EHS
厚み
許容 差
容 量
Temperature characteristics (EIA)
(Environmental
Capacitance Thicknees
Hazardous CK CJ CH CG PK PJ PH RK RJ RH SK SJ SH TK TJ TH UK UJ
Capacitance tolerance
[mm]
SL
Substances) (C0K) (C0J) (C0H) (C0G) (P2K) (P2J) (P2H) (R2K) (R2J) (R2H) (S2K) (S2J) (S2H) (T2K) (T2J) (T2H) (U2K) (U2J)
(inch)
[pF]
[%]
±0.5pF
±1pF
0.5M0.05
(0.020M0.002)
±5%
±10%
注D形名のQには温度特性、Gには静電容量許容差記号が入ります。
Q Please specify the temperature characteristics code and G the capacitance tolerance code.
105TYPE
Class 1
定格電圧
Rated
形 名
Voltage
Ordering code
(DC)
16V
EMK10 5
EMK10 5
EMK10 5
EMK10 5
EMK10 5
EMK10 5
EMK10 5
EMK10 5
EMK10 5
EMK10 5
EMK10 5
EMK10 5
EMK10 5
EMK10 5
EMK10 5
EMK10 5
EMK10 5
EMK10 5
Q 0R5 BW
Q 0 1 0 BW
Q 1R2 BW
Q 1R5 BW
Q 1R8 BW
Q 2R2 JW
Q 2R7 JW
Q 3R3 JW
Q 3R9 JW
Q 4R7 JW
Q 5R6 JW
Q 6R8 JW
Q 8R2 JW
Q 1 0 0 JW
Q 1 2 0 JW
Q 1 5 0 JW
Q 1 8 0 JW
Q 2 0 0 JW
温度特性
公称静電 静電容量
EHS
厚み
許容 差
容 量
Temperature characteristics (EIA)
(Environmental
Capacitance Thicknees
Hazardous CK CJ CH CG PK PJ PH RK RJ RH SK SJ SH TK TJ TH UK UJ
Capacitance tolerance
[mm]
SL
Substances) (C0K) (C0J) (C0H) (C0G) (P2K) (P2J) (P2H) (R2K) (R2J) (R2H) (S2K) (S2J) (S2H) (T2K) (T2J) (T2H) (U2K) (U2J)
(inch)
[pF]
[%]
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
0.5
1
1.2
1.5
1.8
2.2
2.7
3.3
3.9
4.7
5.6
6.8
8.2
10
12
15
18
20
±0.1pF
0.5M0.05
(0.020M0.002)
±5%
注D形名のQには温度特性、Gには静電容量許容差記号が入ります。
Q Please specify the temperature characteristics code and G the capacitance tolerance code.
49
アイテム一覧 PART NUMBERS
107TYPE
Class 1
定格電圧
Rated
Voltage
(DC)
形 名
Ordering code
UMK107
UMK107
UMK107
UMK107
UMK107
UMK107
UMK107
UMK107
UMK107
UMK107
UMK107
UMK107
UMK107
UMK107
UMK107
UMK107
UMK107
50V UMK107
UMK107
UMK107
UMK107
UMK107
UMK107
UMK107
UMK107
UMK107
UMK107
UMK107
UMK107
UMK107
UMK107
UMK107
UMK107
UMK107
UMK107
UMK107
Q 0R5GZ
Q 010GZ
Q 1R5GZ
Q 020GZ
Q 030GZ
Q 040GZ
Q 050GZ
Q 060GZ
Q 070GZ
Q 080GZ
Q 090GZ
Q 100GZ
Q 120GZ
Q 150GZ
Q 180GZ
Q 220GZ
Q 270GZ
Q 330GZ
Q 390GZ
Q 470GZ
Q 560GZ
Q 680GZ
Q 820GZ
Q 101GZ
Q 121GZ
Q 151GZ
Q 181GZ
Q 221GZ
Q 271GZ
Q 331GZ
Q 391GZ
Q 471GZ
Q 561GZ
Q 681GZ
Q 821GZ
Q 102GZ
温度特性
公称静電 静電容量
EHS
許容 差
Temperature characteristics (EIA)
容 量
(Environmental
tance
Hazardous CK CJ CH CG PK PJ PH RK RJ RH SK SJ SH TK TJ TH UK UJ Capacitance Capaci
tol
e
rance
Substances) (C0K) (C0J) (C0H) (C0G) (P2K) (P2J) (P2H) (R2K) (R2J) (R2H) (S2K) (S2J) (S2H) (T2K) (T2J) (T2H) (U2K) (U2J) [pF]
[%]
0.5
RoHS ●
1
RoHS ●
1.5 ±0.25pF
RoHS ●
2
RoHS ●
±0.5pF
3
●
RoHS
4
●
RoHS
5
●
RoHS
6
●
RoHS
7
●
RoHS
±0.5pF
8
●
RoHS
±1pF
9
●
RoHS
10
● ●
RoHS
12
● ●
RoHS
15
● ●
RoHS
18
● ●
RoHS
22
● ●
RoHS
27
● ●
RoHS
33
● ●
RoHS
39
● ●
RoHS
47
● ●
RoHS
56
● ●
RoHS
68
● ●
RoHS
82
● ●
RoHS
100 ±5%
● ●
RoHS
120 ±10%
● ●
RoHS
150
● ●
RoHS
180
● ●
RoHS
220
● ●
RoHS
270
● ●
RoHS
330
● ●
RoHS
390
● ●
RoHS
470
● ●
RoHS
560
● ●
RoHS
680
● ●
RoHS
820
● ●
RoHS
1000
● ●
RoHS
注D形名のQには温度特性、Gには静電容量許容差記号が入ります。
Q Please specify the temperature characteristics code and G the capacitance tolerance code.
50
厚み
Thicknees
[mm]
(inch)
0.8M0.10
(0.031M0.004)
梱包 PACKAGING
1最小受注単位数 Minimum Quantity
F袋づめ梱包
2テーピング材質 Taping material
Bulk packaging
形式fEIAg
製品厚み
標準数量
Thickness
Standard
Type
f
g
mm inch
code
GMK105f0402g
標準数量
quantity
[pcs
pcs]
]
[
V, W
f
0.5 0.020
g
GVK105f0402g
W
A
GMK107f0603g
f
g
f
g
f
g
f
g
D
f
g
G
f
g
D
f
g
D
f
g
D
0.8 0.031
Z
0.8 0.031
A
G2K110 f0504g
0.6 0.024
0.85 0.033
B
GMK212f0805g
1.25 0.049
G4K212f0805g
0.85 0.033
G2K212f0805g
0.85 0.033
1000
0.85 0.033
f
g
F
f
g
G
f
g
f
g
1.15 0.045
GMK316f1206g
1.25 0.049
1.6 0.063
0.85 0.033
f
g
f
g
1.15 0.045
1.5 0.059
L
D
F
H
GMK325f1210g
f
1.9 0.075
g
f
2.0max 0.079
f
2.5 0.098
Fテーピング梱包 Taped
packaging
N
g
g
形式fEIAg
製品厚み
Type
Thickness
f
Y
M
標準数量
Standard quantity
[pcs]
紙テープ エンボステープ
g
code
paper
Embossed tape
f
g
C
15000
E
f
g
P
15000
E
f
g
P
10000
f
g
E
f
g
10000
E
4000
E
4000
E
E
mm inch
GMK042f01005g
0.2 0.008
GMK063f0201g
0.3 0.012
0.3 0.012
G2K096f0302g
0.45 0.018
K
GMK105f0402g
V, W
0.5 0.020
G VK105f0402g
W
f
0.45 0.018
g
K
GMK107f0603g
A
f
0.8 0.031
g
Z
f
g
A
4000
f
g
B
4000
E
f
g
K
4000
E
f
g
D
4000
E
f
g
G
E
3000
f
g
D
4000
E
f
g
D
4000
E
f
g
D
4000
E
f
g
F
g
E
3000
f
G
f
g
E
2000
f
g
E
2000
2000
0.8 0.031
G2K110 f0504g
0.6 0.024
0.45 0.018
GMK212f0805g
0.85 0.033
1.25 0.049
G4K212f0805g
0.85 0.033
G2K212f0805g
0.85 0.033
0.85 0.033
1.15 0.045
GMK316f1206g
1.25 0.049
1.6 0.063
0.85 0.033
f
g
f
g
1.15 0.045
1.5 0.059
L
3バルクカセット Bulk Cassette
D
F
H
GMK325f1210g
f
1.9 0.075
g
Y
E
g
M
E
500
f
g
Y
E
1000
f
g
M
g
E
500
f
U
2.5 0.098
1.9 0.075
GMK432f1812g
N
f
f
2.0max 0.079
2.5 0.098
3.2 0.125
g
UnitDmm finchg
105, 107, 212形状で個別対応致しますのでお問い合せ下さい。
Please contact any of our offices for accepting your requirement according
to dimensions 0402, 0603, 0805.(inch)
78
梱包 PACKAGING
エンボステープ Embossed tape（12mm幅）f0.472inches wideg
3テーピング寸法 Taping dimensions
紙テープ Paper Tape（8mm幅）f0.315inches wideg
4
CAPACITORS
Type
チップ挿入部
挿入ピッチ
fEIAg
Chip Cavity
Insertion Pitch Tape Thickness
GMK042f01005g
A
0.25M0.04
B
0.45M0.04
テープ厚み
F
2.0M0.04
GMK063f0201g
G2K096f0302g
0.67M0.06
52.0M0.05
0.45max.
0.72M0.1
1.02M0.1
0.65M0.15
1.0M0.2
1.15M0.15
1.8M0.2
52.0M0.05
4.0M0.1
1.1max.
f0.039M0.008g f0.071M0.008g f0.157M0.004g
1.15M0.2
1.55M0.2
1.65M0.25
2.0M0.2
4.0M0.1
4.0max. 0.6max.
f0.315M0.004g f0.157max.g f0.024max.g
UnitDmmfinchg
チップ挿入部
Chip cavity
4.0M0.1
1.1max.
f0.157M0.004g
f0.043max.g
160mm以上
f6.3inches or moreg
100mm以上
f3.94inches or moreg
引き出し方向
Direction of tape feed
挿入ピッチ
400mm以上
f15.7inches or moreg
5リール寸法 Reel size
テープ厚み
Insertion Pitch Tape Thickness
A
B
1.65M0.25
2.4M0.2
F
K
T
f0.065M0.008g f0.094M0.008g
2.0M0.2
4リーダー部／空部 Leader and Blank portion
1.0max.
f0.079M0.008g f0.142M0.008g
Type
3.6M0.2
4.0M0.1
2.5max. 0.6max
6トップテープ強度 Top Tape Strength
トップテープのはがし力は下図矢印方向にて0.1∼0.7Nとなります。
The top tape requires a peel-off force of 0.1V0.7N in the direction of the
arrow as illustrated below.
f0.079M0.008g f0.142M0.008g f0.157M0.004g f0.098max.g f0.024max.g
2.8M0.2
GMK325f1210g
T
f0.039max.g
3.6M0.2
fEIAg
GMK316f1206g
8.0M0.1
K
f0.043max.g
UnitDmmfinchg
エンボステープ Embossed tape（8mm幅）f0.315inches wideg
GMK212f0805g
4.9M0.2
f0.193M0.008g
F
2.4M0.2
f0.065M0.008g f0.094M0.008g
G2K212f0805g
GMK316f1206g
3.7M0.2
f0.146M0.008g
GMK432f1812g
テープ厚み
0.8max.
f0.045M0.008g f0.061M0.008g f0.157M0.004g
G4K212f0805g
B
52.0M0.05 0.6max.(0.024max)
f0.026M0.004g f0.045M0.004g f0.079M0.002g f0.031max.g
GMK212f0805g
A
挿入ピッチ
Insertion Pitch Tape Thickness
f0.028M0.004g f0.040M0.004g f0.079M0.002g 0.45max.(0.018max)
GVK105f0402g
G2K110f0504g
Chip cavity
f0.016M0.002g f0.027M0.002g f0.079M0.002g f0.018max.g
GMK105f0402g
GMK107f0603g
チップ挿入部
T
0.45max.
f0.010M0.002g f0.018M0.002g f0.079M0.002g f0.018max.g
0.37M0.06
Type
fEIAg
3.6M0.2
f0.110M0.008g f0.142M0.008g
3.4max.
f0.134max.g
UnitDmmfinchg
79
1/3
RELIABILITY DATA
Multilayer Ceramic Capacitor Chips
Specified Value
Item
Temperature Compensating (Class 1)
Standard
1.Operating Temperature
High Permitivity (Class 2)
High Frequency Type
K55 to J125C
Standard Note1
BDK55 to J125C
Range
Test Methods and Remarks
High Value
K25 to J85C
High Capacitance Type BJfX7RgDK55∼J125C, BJfX5RgDK55∼J85C
K25 to J85C
High Capacitance Type BJfX7RgDK55∼J125C, BJfX5RgDK55∼J85C
FDK25 to J85C
2.Storage Temperature
K55 to J125C
BDK55 to J125C
Range
EfY5UgDK30∼J85C,
FDK25 to J85C
50VDC,25VDC,
16VDC
16VDC
50VDC
No breakdown or dam-
No abnormality
50VDC,25VDC
EfY5UgDK30∼J85C,
FfY5VgDK30∼J85C
50VDC,35VDC,25VDC
16VDC,10VDC,6.3VDC
4DVC
4.Withstanding Voltage
Between terminals
No breakdown or damage
Applied voltage: Rated voltageP3 (Class 1)
age
Rated voltageP2.5 (Class 2)
Duration: 1 to 5 sec.
Charge/discharge current: 50mA max. (Class 1,2)
5.Insulation Resistance
500 ME A F. or 10000 ME ., whichever is the Applied voltage: Rated voltage
10000 ME min.
smaller.
Duration: 60M5 sec.
Note 5
6.Capacitance (Tolerance)
Charge/discharge current: 50mA max.
0.5 to 5 pF: M0.25 pF
0.5 to 2 pF : M0.1 pF
B: M10%, M20%
1 to 10pF: M0.5 pF
2.2 to 5.1 pF : M5%
FDK20 %
J80
BDM10L、M20L
FDK20LNJ80L
5 to 10 pF: M1 pF
11 pF or over: M 5%
M10%
105TYPERQ, SQ, TQ, UQ only
0.5∼2pF: M0.1pF
2.2∼20pF: M5%
7.Q or Tangent of Loss Angle
(tan d)
4
CAPACITORS
3.Rated Voltage
FfY5VgDK30∼J85C
Under 30 pF
Refer to detailed speci- B: 2.5% max.(50V, 25V) BD2.5L max.
: QU400 + 20C
fication
F: 5.0% max. (50V, 25V) FD7L max.
30 pF or over : QU1000
Note 4
C= Nominal capacitance
Measuring frequencyD
Class1D 1ＭHzM10%fCT1000pFg
1ｋHzM10%fCX1000pFg
Class2D 1ｋHzM10%fCT10AFg
120HzM10HzfCX10AFg
Measuring voltageD
Note 4
Class1D0.5V5VrmsfCT1000pFg
1M0.2VrmsfCX1000pFg
Class2D 1M0.2VrmsfCT10AFg
0.5M0.1VrmsfCX10AFg
Bias application: None
Multilayer:
Measuring frequencyD
Class1D 1ＭHzM10%fCT1000pFg
1ｋHzM10%fCX1000pFg
Class2D 1ｋHzM10%fCT10AFg
120HzM10HzfCX10AFg
Measuring voltageD
Note 4 Class1D0.5V5VrmsfCT1000pFg
1M0.2VrmsfCX1000pFg
Class2D 1M0.2VrmsfCT10AFg
0.5M0.1VrmsfCX10AFg
Bias application: None
High-Frequency-Multilayer:
Measuring frequency: 1GHz
Measuring equipment: HP4291A
Measuring jig: HP16192A
8.Temperature
(Without
CKD0M250
CHD0M60
BDM10LfK25V85Cg
BDM10L
According to JIS C 5102 clause 7.12.
Characteristic
voltage
CJD0M120
RHDK220M60
FD K80 LfK25V85Cg
fK25VJ85Cg
Temperature compensating:
of Capacitance
application)
CHD0M60
BfX7RgDM15L
FDJ30LNK80L
Measurement of capacitance at 20C and 85C shall be made
fK25VJ85Cg
to calculate temperature characteristic by the following
PKDK150M250
BfX7R、X5Rg：
equation.
PJDK150M120
M15L
20
(C
85 - C )
PHDK150M60
FfY5Vg：
P 10 (ppm/C)
C
20 P QT
RKDK220M250
J22LNK82L
High permitivity:
fppm/Cg
J30
J22
CGD0M30
FfY5VgD L
K82
6
RJDK220M120
Change of maximum capacitance deviation in step 1 to 5
RHDK220M60
Temperature at step 1: +20C
SKDK330M250
Temperature at step 2: minimum operating temperature
SJDK330M120
Temperature at step 3: +20C (Reference temperature)
SHDK330M60
Temperature at step 4: maximum operating temperature
TKDK470M250
Temperature at step 5: +20C
TJDK470M120
Reference temperature for X7R, X5R, Y5U and Y5V shall be +25C
THDK470M60
UKDK750M250
UJDK750M120
SLD +350 to -1000 (ppm/C)
9.Resistance to Flexure of
Substrate
Appearance:
Appearance:
Appearance:
No abnormality
No abnormality
No abnormality
Capacitance change:
Capacitance change: Capacitance change:
Within M5% or M0.5 pF,
WithinM0.5 pF
whichever is larger.
Warp: 1mm
Testing board: glass epoxy-resin substrate
Thickness: 1.6mm (063 TYPE : 0.8mm)
The measurement shall be made with board in the bent position.
B, BJDWithin M12.5%
FDWithin M30%
81
2/3
RELIABILITY DATA
Multilayer Ceramic Capacitor Chips
Specified Value
Item
Temperature Compensating (Class 1)
Standard
10.Body Strength
High Frequency Type
High Permittivity (Class 2)
Standard Note1
Test Methods and Remarks
High Value
No mechanical dam-
High Frequency Multilayer:
age.
Applied force: 5N
4
Duration: 10 sec.
No separation or indication of separation of electrode.
Applied force: 5N
（01005, 0201, 0302 TYPE 2N）
Duration: 30M5 sec.
12.Solderability
At least 95% of terminal electrode is covered by new solder.
13.Resistance to soldering
Appearance: No abnor-
Appearance: No abnor-
Appearance: No abnormality
mality
mality
Capacitance change: Within M7.5% (B, BJ)
Capacitance change:
Capacitance change:
CAPACITORS
11.Adhesion of Electrode
Solder temperature: 230M5C
Duration: 4M1 sec.
Preconditioning: Thermal treatment (at 150C for 1 hr)
Within M20% (F)
W i t h i n M 2 . 5 % o r Within M2.5%
tan d: Initial value
M0.25pF, whichever is Q: Initial value
Insulation resistance: Initial value
(Applicable to Class 2.)
Solder temperature: 270M5C
Note 4
Duration: 3M0.5 sec.
Preheating conditions: 80 to 100C, 2 to 5 min. or 5 to 10 min.
larger.
Insulation resistance: Withstanding voltage (between terminals): No
Q: Initial value
Initial value
Insulation resistance:
Withstanding voltage
Initial value
(between terminals): No
24M2 hrs (Class 1)
Withstanding voltage
abnormality
48M4 hrs (Class 2)
abnormality
150 to 200C, 2 to 5 min. or 5 to 10 min.
Recovery: Recovery for the following period under the standard condition after the test.
(between terminals): No
abnormality
14.Thermal shock
Appearance: No abnor-
Appearance: No abnor-
Appearance: No abnormality
mality
mality
Capacitance change: Within M7.5% (B, BJ)
Capacitance change:
Capacitance change:
Preconditioning: Thermal treatment (at 150C for 1 hr)
Within M20% (F)
W i t h i n M 2 . 5 % o r Within M0.25pF
tan d: Initial value
M0.25pF, whichever is Q: Initial value
Insulation resistance: Initial value
(Applicable to Class 2.)
Conditions for 1 cycle:
Note 4
larger.
Insulation resistance: Withstanding voltage (between terminals): No
abnormality
J0
Step 1: Minimum operating temperature K3 C 30M3 min.
Step 2: Room temperature
2 to 3 min.
K0
Step 3: Maximum operating temperature J3 C 30M3 min.
Q: Initial value
Initial value
Insulation resistance:
Withstanding voltage
Number of cycles: 5 times
Initial value
(between terminals): No
Recovery after the test: 24M2 hrs (Class 1)
Withstanding voltage
abnormality
Step 4: Room temperature
2 to 3 min.
48M4 hrs (Class 2)
(between terminals): No
abnormality
15.Damp Heat (steady state)
Appearance: No abnor-
Appearance: No abnor-
Appearance: No abnor-
Appearance: No abnor-
MultilayerD
mality
mality
mality
mality
Preconditioning: Thermal treatment (at 150C for 1 hr)
Capacitance change:
Capacitance change: Capacitance change:
Within M5% or M0.5pF,
Within M0.5pF,
whichever is larger.
Q:
CU30 pF
: QU350
Capacitance change:
(Applicable to Class 2.)
B: Within M12.5%
BJ:Within M12.5%
Temperature: 40M2C
Insulation resistance:
F: Within M30%
Note 4
Humidity: 90 to 95% RH
1000 ME min.
tan d: B: 5.0% max.
tan d:
Duration: 500 K0 hrs
BJ: 5.0% max.
Recovery: Recovery for the following period under the standard condition after the removal from test chamber.
F: 7.5% max.
+24
10TC＜30 pF: QU275
Note 4
F: 11.0% max.
+ 2.5C
Insulation resistance: 50
Insulation resistance:
ME A F or 1000 ME
50 MEAF or 1000 ME
10C
whichever is smaller.
whichever is smaller.
High-Frequency Multilayer:
C: Nominal capacitance
Note 5
Note 5
Temperature: 60M2C
C＜10 pF
: QU200 +
24M2 hrs (Class 1)
48M4 hrs (Class 2)
Insulation resistance:
Humidity: 90 to 95% RH
1000 ME min.
+24
Duration: 500 K
0 hrs
Recovery: Recovery for the following period under the standard condition after the removal from test chamber.
24M2 hrs (Class 1)
83
3/3
RELIABILITY DATA
Multilayer Ceramic Capacitor Chips
Specified Value
Item
16.Loading under Damp Heat
High Permittivity (Class 2)
Test Methods and Remarks
Standard
High Frequency Type
Standard Note1
High Value
Appearance: No abnormality
Capacitance change:
Within M 7.5% or
M0.75pF, whichever is
larger.
Q: CU30 pF: QU200
C＜30 pF: QU 100 +
10C/3
CD Nominal capacitance
Insulation resistance:
500 ME min.
Appearance: No abnormality
Capacitance change:
CT2 pF: Within M0.4 pF
CX2 pF: Within M0.75
pF
CD Nominal capacitance
Insulation resistance:
500 ME min.
Appearance: No abnormality
Capacitance change:
B: Within M12.5%
F: Within M30%
tan d: B: 5.0% max.
F: 7.5% max.
Note 4
Insulation resistance:
25 MEAF or 500 ME,
whichever is the smaller.
Note 5
Appearance: No abnormality
Capacitance change:
BJDWithinM12.5L
FDWithinM30L
Note 4
tandD
BJD5.0Lmax.
FD11Lmax.
Insulation resistance:
25 MEAF or 500 ME,
whichever is the smaller.
Note 5
According to JIS C 5102 Clause 9. 9.
Multilayer:
Preconditioning: Voltage treatment (Class 2)
Temperature: 40M2C
Humidity: 90 to 95% RH
+24
Duration: 500 K0 hrs
Applied voltage: Rated voltage
Charge and discharge current: 50mA max. (Class 1,2)
Recovery: Recovery for the following period under the standard
condition after the removal from test chamber.
24M2 hrs (Class 1)
48M4 hrs (Class 2)
High-Frequency Multilayer:
Temperature: 60M2C
Humidity: 90 to 95% RH
+24
Duration: 500 K0 hrs
Applied voltage: Rated voltage
Charge and discharge current: 50mA max.
Recovery: 24M2 hrs of recovery under the standard condition after the removal from test chamber.
Appearance: No abnormality
Capacitance change:
Within M3% or
M0.3pF, whichever is
larger.
Q: CU30 pF : QU350
10TC＜30 pF: QU275
+ 2.5C
C＜10 pF: QU200 +
10C
CD Nominal
capacitance
Insulation resistance:
1000 ME min.
Appearance: No abnormality
Capacitance change:
Within M3% or
M0.3pF, whichever is
larger.
Insulation resistance:
1000 ME min.
Appearance: No abnormality
Capacitance change:
B: Within M12.5%
F: Within M30%
Note 4
tan d:
B: 4.0% max.
F: 7.5% max.
Insulation resistance:
50 MEAF or 1000 ME,
whichever is smaller.
Note 5
Appearance: No abnormality
Capacitance change:
BJDWithinM12.5L
WithinM20LFF
WithinM25LFF
FDWithinM30L
Note 4
tandD
BJD5.0Lmax.
FD11Lmax.
Insulation resistance:
50 MEAF or 1000 ME,
whichever is smaller.
Note 5
According to JIS C 5102 clause 9.10.
Multilayer:
Preconditioning: Voltage treatment (Class 2)
Temperature:125M3CfClass 1, Class 2: B, BJfX7Rgg
85M2C (Class 2: BJ,F)
+48
Duration: 1000 K0 hrs
Applied voltage: Rated voltageP2 Note 6
Recovery: Recovery for the following period under the standard condition after the removal from test chamber.
As for Ni product, thermal treatment shall be performed
prior to the recovery.
24M2 hrs (Class 1)
48M4 hrs (Class 2)
High-Frequency Multilayer:
Temperature: 125M3C (Class 1)
+48
Duration: 1000 K
0 hrs
Applied voltage: Rated voltageP2
Recovery: 24M2 hrs of recovery under the standard condition after the removal from test chamber.
4
CAPACITORS
17.Loading at High Temperature
Temperature Compensating (Class 1)
Note 1
:For 105 type, specified in "High value".
Note 2
:Thermal treatment (Multilayer): 1 hr of thermal treatment at 150 J0 /K10 C followed by 48M4 hrs of recovery under the standard condition shall be performed before the measurement.
Note 3
:Voltage treatment (Multilayer): 1 hr of voltage treatment under the specified temperature and voltage for testing followed by 48M4 hrs of recovery under the standard condition shall be performed before the measurement.
Note 4, 5 :The figure indicates typical inspection. Please refer to individual specifications.
Note 6
:Some of the parts are applicable in rated voltageP1.5. Please refer to individual specifications.
Note on standard condition: "standard condition" referred to herein is defined as follows: 5 to 35C of temperature, 45 to 85% relative humidity, and 86 to 106kPa of air pressure.
When there are questions concerning measurement results: In order to provide correlation data, the test shall be conducted under condition of 20M2C of temperature, 60 to 70% relative humidity,
and 86 to 106kPa of air pressure. Unless otherwise specified, all the tests are conducted under the "standard condition."
85
1/6
PRECAUTIONS
Precautions on the use of Multilayer Ceramic Capacitors
Stages
1.Circuit Design
Precautions
Technical considerations
Verification of operating environment, electrical rating and performance
1. A malfunction in medical equipment, spacecraft, nuclear re-
4
actors, etc. may cause serious harm to human life or have
severe social ramifications. As such, any capacitors to be
CAPACITORS
used in such equipment may require higher safety and/or reliability considerations and should be clearly differentiated from
components used in general purpose applications.
Operating Voltage (Verification of Rated voltage)
1. The operating voltage for capacitors must always be lower
than their rated values.
If an AC voltage is loaded on a DC voltage, the sum of the two
peak voltages should be lower than the rated value of the capacitor chosen. For a circuit where both an AC and a pulse
voltage may be present, the sum of their peak voltages should
also be lower than the capacitor's rated voltage.
2. Even if the applied voltage is lower than the rated value, the
reliability of capacitors might be reduced if either a high frequency AC voltage or a pulse voltage having rapid rise time is
present in the circuit.
Pattern configurations
1.The following diagrams and tables show some examples of recommended patterns to
(Design of Land-patterns)
prevent excessive solder amourts.flarger fillets which extend above the component end
1. When capacitors are mounted on a PCB, the amount of sol-
terminationsg
der used (size of fillet) can directly affect capacitor performance.
Examples of improper pattern designs are also shown.
Therefore, the following items must be carefully considered in
the design of solder land patterns:
(1) Recommended land dimensions for a typical chip capacitor land patterns for PCBs
(1) The amount of solder applied can affect the ability of chips
to withstand mechanical stresses which may lead to breaking or cracking. Therefore, when designing land-patterns
it is necessary to consider the appropriate size and configuration of the solder pads which in turn determines the
amount of solder necessary to form the fillets.
(2) When more than one part is jointly soldered onto the same
Recommended land dimensions for wave-soldering (unit: mm)
land or pad, the pad must be designed so that each
Type
107
212
316
component's soldering point is separated by solder-re-
L
1.6
2.0
3.2
3.2
W
0.8
51.25
1.6
2.5
A
0.8V1.0
1.0V1.4
1.8V2.5
1.8V2.5
B
0.5V0.8
0.8V1.5
0.8V1.7
0.8V1.7
C
0.6V0.8
0.9V1.2
1.2V1.6
1.8V2.5
Size
325
Recommended land dimensions for reflow-soldering (unit: mm)
Type
042
063
105
107
212
316
325
L
0.4
0.6
1.0
1.6
2.0
3.2
3.2
4.5
W
0.2
0.3
0.5
0.8
51.25
1.6
2.5
3.2
Size
432
A
0.15V0.25 0.20V0.30 0.45V0.55 0.6V0.8 0.8V1.2 1.8V2.5 1.8V2.5 2.5V3.5
B
0.10V0.20 0.20V0.30 0.40V0.50 0.6V0.8 0.8V1.2 1.0V1.5 1.0V1.5 1.5V1.8
C
0.15V0.30 0.25V0.40 0.45V0.55 0.6V0.8 0.9V1.6 1.2V2.0 1.8V3.2 2.3V3.5
Excess solder can affect the ability of chips to withstand mechanical stresses. Therefore,
please take proper precautions when designing land-patterns.
Type 212（4 circuits）
Size
sist.
L
2.0
W
1.25
a
0.5V0.6
b
0.5V0.6
c
0.2V0.3
d
0.5
Type
212（2 circuits） 110（2 circuits） 096（2 circuits）
L
2.0
1.37
W
1.25
1.0
0.6
0.5V0.6
0.35V0.45
0.25V0.35
b
0.5V0.6
0.55V0.65
0.15V0.25
c
0.5V0.6
0.3V0.4
0.15V0.25
d
1.0
0.64
0.45
Size
2.PCB Design
a
0.9
87
2/6
PRECAUTIONS
Precautions on the use of Multilayer Ceramic Capacitors
Stages
Precautions
2.PCB Design
Technical considerations
(2) Examples of good and bad solder application
Items
Not recommended
Recommended
Mixed mounting
of SMD and
leaded
components
4
CAPACITORS
Component
placement close
to the chassis
Hand-soldering
of leaded
components
near mounted
components
Horizontal
component
placement
Pattern configurations
(Capacitor layout on panelized [breakaway] PC boards)
1-1. The following are examples of good and bad capacitor layout; SMD capacitors should be
located to minimize any possible mechanical stresses from board warp or deflection.
1. After capacitors have been mounted on the boards, chips can
be subjected to mechanical stresses in subsequent manufac-
Not recommended
Recommended
turing processes (PCB cutting, board inspection, mounting of
additional parts, assembly into the chassis, wave soldering
the reflow soldered boards etc.) For this reason, planning
pattern configurations and the position of SMD capacitors
Deflection of
the board
should be carefully performed to minimize stress.
1-2. To layout the capacitors for the breakaway PC board, it should be noted that the amount
of mechanical stresses given will vary depending on capacitor layout. The example
below shows recommendations for better design.
1-3. When breaking PC boards along their perforations, the amount of mechanical stress on
the capacitors can vary according to the method used. The following methods are
listed in order from least stressful to most stressful: push-back, slit, V-grooving, and
perforation. Thus, any ideal SMD capacitor layout must also consider the PCB splitting
procedure.
89
3/6
PRECAUTIONS
Precautions on the use of Multilayer Ceramic Capacitors
Stages
3.Considerations for automatic placement
Precautions
Adjustment of mounting machine
1. Excessive impact load should not be imposed on the capacitors when mounting onto the PC boards.
2. The maintenance and inspection of the mounters should be
conducted periodically.
Technical considerations
1. If the lower limit of the pick-up nozzle is low, too much force may be imposed on the
capacitors, causing damage. To avoid this, the following points should be considered
before lowering the pick-up nozzle:
(1)The lower limit of the pick-up nozzle should be adjusted to the surface level of the PC
board after correcting for deflection of the board.
(2)The pick-up pressure should be adjusted between 1 and 3 N static loads.
supporting pins or back-up pins should be used under the PC board. The following diagrams show some typical examples of good pick-up nozzle placement:
Not recommended
Recommended
Single-sided
CAPACITORS
(3)To reduce the amount of deflection of the board caused by impact of the pick-up nozzle,
4
mounting
Double-sided
mounting
2. As the alignment pin wears out, adjustment of the nozzle height can cause chipping or
cracking of the capacitors because of mechanical impact on the capacitors. To avoid
this, the monitoring of the width between the alignment pin in the stopped position, and
maintenance, inspection and replacement of the pin should be conducted periodically.
Selection of Adhesives
1. Some adhesives may cause reduced insulation resistance. The difference between the
1. Mounting capacitors with adhesives in preliminary assembly,
shrinkage percentage of the adhesive and that of the capacitors may result in stresses
before the soldering stage, may lead to degraded capacitor
on the capacitors and lead to cracking. Moreover, too little or too much adhesive applied
characteristics unless the following factors are appropriately
to the board may adversely affect component placement, so the following precautions
checked; the size of land patterns, type of adhesive, amount
should be noted in the application of adhesives.
applied, hardening temperature and hardening period. Therefore, it is imperative to consult the manufacturer of the adhe-
(1)Required adhesive characteristics
sives on proper usage and amounts of adhesive to use.
a. The adhesive should be strong enough to hold parts on the board during the mounting &
solder process.
b. The adhesive should have sufficient strength at high temperatures.
c. The adhesive should have good coating and thickness consistency.
d. The adhesive should be used during its prescribed shelf life.
e. The adhesive should harden rapidly
f. The adhesive must not be contaminated.
g. The adhesive should have excellent insulation characteristics.
h. The adhesive should not be toxic and have no emission of toxic gasses.
(2)The recommended amount of adhesives is as follows;
Figure
212/316 case sizes as examples
a
0.3mm min
b
100 V120 Am
c
Adhesives should not contact the pad
91
4/6
PRECAUTIONS
Precautions on the use of Multilayer Ceramic Capacitors
Stages
4. Soldering
Precautions
Selection of Flux
Technical considerations
1-1. When too much halogenated substance (Chlorine, etc.) content is used to activate the
1. Since flux may have a significant effect on the performance of
flux, or highly acidic flux is used, an excessive amount of residue after soldering may
capacitors, it is necessary to verify the following conditions
lead to corrosion of the terminal electrodes or degradation of insulation resistance on
prior to use;
the surface of the capacitors.
(1)Flux used should be with less than or equal to 0.1 wt%
1-2. Flux is used to increase solderability in flow soldering, but if too much is applied, a large
(equivelent to chroline) of halogenated content. Flux hav-
amount of flux gas may be emitted and may detrimentally affect solderability. To minimize the amount of flux applied, it is recommended to use a flux-bubbling system.
1-3. Since the residue of water-soluble flux is easily dissolved by water content in the air, the
flux applied should be controlled at the optimum level.
residue on the surface of capacitors in high humidity conditions may cause a degrada-
(3)When using water-soluble flux, special care should be taken
tion of insulation resistance and therefore affect the reliability of the components. The
to properly clean the boards.
cleaning methods and the capability of the machines used should also be considered
carefully when selecting water-soluble flux.
Soldering
1-1. Preheating when soldering
Temperature, time, amount of solder, etc. are specified in accor-
Heating: Ceramic chip components should be preheated to within 100 to 130C of the sol-
dance with the following recommended conditions.
CAPACITORS
ing a strong acidity content should not be applied.
(2)When soldering capacitors on the board, the amount of
4
dering.
Cooling: The temperature difference between the components and cleaning process should
not be greater than 100C.
Ceramic chip capacitors are susceptible to thermal shock when exposed to rapid or concentrated heating or rapid cooling. Therefore, the soldering process must be conducted with
great care so as to prevent malfunction of the components due to excessive thermal shock.
And please contact us about peak temperature when you use
lead-free paste.
Recommended conditions for soldering
[Reflow soldering]
Temperature profile
TemperaturefCg
300
fPb free solderingg
Peak 260C max
10 sec max
200
Gradually
cooling
Preheating
100
150C
60 sec min
0
Heating above 230C
40 sec max
※Ceramic chip components should be preheated to
within 100 to 130C of the soldering.
※Assured to be reflow soldering for 2 times.
Caution
1. The ideal condition is to have solder mass (fillet) controlled to 1/2 to 1/3 of the thickness of the capacitor, as shown below:
Capacitor
Solder
PC board
2. Because excessive dwell times can detrimentally affect solderability, soldering duration should be kept as close to recommended times as possible.
[Wave soldering]
Temperature profile
TemperaturefCg
300
fPb free solderingg
Peak 260C max
10 sec max
200
Preheating
150C
Gradually
cooling
100
120 sec min
0
※Ceramic chip components should be preheated to
within 100 to 130C of the soldering.
※Assured to be wave soldering for 1 time.
※Except for reflow soldering type.
Caution
1. Make sure the capacitors are preheated sufficiently.
2. The temperature difference between the capacitor and melted solder should not be
greater than 100 to 130C
3. Cooling after soldering should be as gradual as possible.
4. Wave soldering must not be applied to the capacitors designated as for reflow soldering only.
93
5/6
PRECAUTIONS
Precautions on the use of Multilayer Ceramic Capacitors
Stages
Precautions
Technical considerations
[Hand soldering]
4. Soldering
Temperature profile
TemperaturefCg
400
fPb free solderingg
350C max
3 sec max
300
⊿Ｔ
200
Gradually
cooling
60 sec min
0
f※⊿ＴT190C f3216Type maxg, ⊿ＴT130C f3225
Type mingg
※It is recommended to use 20W soldering iron and
the tip is 1B or less.
※The soldering iron should not directly touch the
components.
※Assured to be soldering iron for 1 time.
Note: The above profiles are the maximum allowable
soldering condition, therefore these profiles are
not always recommended.
CAPACITORS
100
4
Caution
1. Use a 20W soldering iron with a maximum tip diameter of 1.0 mm.
2. The soldering iron should not directly touch the capacitor.
5.Cleaning
Cleaning conditions
1. When cleaning the PC board after the capacitors are all
mounted, select the appropriate cleaning solution according
to the type of flux used and purpose of the cleaning (e.g. to
remove soldering flux or other materials from the production
1. The use of inappropriate solutions can cause foreign substances such as flux residue to
adhere to the capacitor or deteriorate the capacitor's outer coating, resulting in a degradation of the capacitor's electrical properties (especially insulation resistance).
2. Inappropriate cleaning conditions (insufficient or excessive cleaning) may detrimentally
affect the performance of the capacitors.
process.)
2. Cleaning conditions should be determined after verifying,
through a test run, that the cleaning process does not affect
the capacitor's characteristics.
(1)Excessive cleaning
In the case of ultrasonic cleaning, too much power output can cause excessive vibration of
the PC board which may lead to the cracking of the capacitor or the soldered portion, or
decrease the terminal electrodes' strength. Thus the following conditions should be
carefully checked;
Ultrasonic output
Below 20 W/ b
Ultrasonic frequency
Below 40 kHz
Ultrasonic washing period 5 min. or less
6.Post cleaning processes
1. With some type of resins a decomposition gas or chemical
reaction vapor may remain inside the resin during the hardening period or while left under normal storage conditions resulting in the deterioration of the capacitor's performance.
2. When a resin's hardening temperature is higher than the
capacitor's operating temperature, the stresses generated by
the excess heat may lead to capacitor damage or destruction.
The use of such resins, molding materials etc. is not recommended.
7.Handling
Breakaway PC boards (splitting along perforations)
1. When splitting the PC board after mounting capacitors and
other components, care is required so as not to give any
stresses of deflection or twisting to the board.
2. Board separation should not be done manually, but by using
the appropriate devices.
Mechanical considerations
1. Be careful not to subject the capacitors to excessive mechanical shocks.
(1)If ceramic capacitors are dropped onto the floor or a hard
surface, they should not be used.
(2)When handling the mounted boards, be careful that the
mounted components do not come in contact with or bump
against other boards or components.
95
6/6
PRECAUTIONS
Precautions on the use of Multilayer Ceramic Capacitors
Stages
8.Storage conditions
Precautions
Technical considerations
1. If the parts are stored in a high temperature and humidity environment, problems such
Storage
1. To maintain the solderability of terminal electrodes and to keep
as reduced solderability caused by oxidation of terminal electrodes and deterioration of
the packaging material in good condition, care must be taken
taping/packaging materials may take place. For this reason, components should be used
to control temperature and humidity in the storage area. Hu-
within 6 months from the time of delivery. If exceeding the above period, please check
midity should especially be kept as low as possible.
solderability before using the capacitors.
YRecommended conditions
Below 40C
Humidity
Below 70% RH
The ambient temperature must be kept below 30C. Even under ideal storage conditions capacitor electrode solderability
decreases as time passes, so should be used within 6 months
from the time of delivery.
YCeramic chip capacitors should be kept where no chlorine or
CAPACITORS
Ambient temperature
4
sulfur exists in the air.
2. The capacitance value of high dielectric constant capacitors
(type 2 &3) will gradually decrease with the passage of time,
so this should be taken into consideration in the circuit design.
If such a capacitance reduction occurs, a heat treatment of
150C for 1hour will return the capacitance to its initial level.
97
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