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SD103BWS

SD103BWS

  • 厂商:

    TAK_CHEONG(德昌)

  • 封装:

  • 描述:

    SD103BWS - 200mW SOD-323 SURFACE MOUNT Small Outline Flat Lead Plastic Package Schottky Barrier Diod...

  • 数据手册
  • 价格&库存
SD103BWS 数据手册
TAK CHEONG ® SEMICONDUCTOR 200mW SOD-323 SURFACE MOUNT Small Outline Flat Lead Plastic Package Schottky Barrier Diode Absolute Maximum Ratings Symbol PD TSTG TJ VRM IF(AV) IFSM Power Dissipation TA = 25°C unless otherwise noted Value 200 -65 to +125 +125 SD103AWS SD103BWS SD103CWS 40 30 20 200 2 Units mW °C °C V V V mA A Parameter Storage Temperature Range Operating Junction Temperature Repetitive Peak Reverse Voltage Average Forward Rectified Current Peak Forward Surge Current (10uS square wave) These ratings are limiting values above which the serviceability of the diode may be impaired. Specification Features: Low Forward Voltage Drop Flat Lead SOD-323 Small Outline Plastic Package Surface Device Type Mounting RoHS Compliant Green EMC Matte Tin(Sn) Terminal Finish Band Indicates Cathode Weight: approx. 0.004g DEVICE MARKING CODE: Device Type SD103AWS SD103BWS SD103CWS Device Marking JV JW JX Electrical Characteristics Symbol TA = 25°C unless otherwise noted Parameter Test Condition Min SD103AWS SD103BWS SD103CWS VR=30V VR=20V VR=10V IF=20mA IF=200mA VR=0V f= 1MHz 0.37 ----0.60 Volts ----5 µA Limits Typ Max Unit Reverse Leakage Current IR VF Forward Voltage Ct Junction Capacitance --- 50 --- pF Number: DB-222 August 2010, Revision A Page 1 SD103AWS / SD103BWS / SD103CWS TAK CHEONG Typical Characteristics ® SEMICONDUCTOR 120 30 25 f = 1MHz Ta = 25℃ Io-Forward Current [mA] Total Capacitance [pF] 100 80 60 40 20 0 0 25 50 75 100 125 150 20 15 10 5 0 0 5 10 15 20 25 30 35 40 Ambient Temperature [℃ ] VR - Reverse Voltage [V] Figure 2. Total Capacitance Figure 1. Forward Current Derating Curve Figure 3. Forward Characteristics Figure 4. Forward Characteristics Number: DB-222 August 2010, Revision A Page 2 TAK CHEONG SOD-323 Package Outline ® SEMICONDUCTOR NOTES: 1. The above package outline is similar to JEITA SC-90. 2. Dimensions are exclusive of Burrs, Mold Flash & Tie Bar extrusions. Number: DB-222 August 2010, Revision A Page 3 TAK CHEONG ® D ISC LA I MER NOTIC E NOTICE The information presented in this document is for reference only. Tak Cheong reserves the right to make changes without notice for the specification of the products displayed herein. The product listed herein is designed to be used with ordinary electronic equipment or devices, and not designed to be used with equipment or devices which require high level of reliability and the malfunction of with would directly endanger human life (such as medical instruments, transportation equipment, aerospace machinery, nuclear-reactor controllers, fuel controllers and other safety devices), Tak Cheong Semiconductor Co., Ltd., or anyone on its behalf, assumes no responsibility or liability for any damagers resulting from such improper use of sale. This publication supersedes & replaces all information reviously supplied. For additional information, please visit our website http://www.takcheong.com, or consult your nearest Tak Cheong’s sales office for further assistance. Number: DB-100 April 14, 2008 / A
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