B74111G0050M060

Transient Voltage Suppressors – TVS WL-CSP01005 Slim-line, General purpose type Series/Type: Ordering code: SD01005SL-GP101 B74111G0050M060 Date: Version: 2021-02-02 2 Content of header bars 1 and 2 of data sheet will be automatically entered in headers and footers! Please fill in the table and then change the color to "white". This ensures that the table disappears (invisible) for the customer PDF. Don't change formatting when entering or pasting text in the table and don't add any cell or line in and to it! Identification/Classification 1 (header 1 + top left header bar): Identification/Classification 2 (header 2 + bottom left header bar): Ordering code: (top right header bar) Series/Type: (top right header bar) Preliminary data (optional): Department: Date: Version: Prepared by: Release signed PD: Release signed QS: Modifications/Remarks: Transient Voltage Suppressors – TVS WL-CSP01005 Slim-line, General purpose type B74111G0050M060 SD01005SL-GP101 PPD ML PD 2021-02-02 2 Hr. Feichtinger Dr. Pecina Hr. Lic Storage temperature info updated, ESD air discharge rating added, C meas. condition changed from 1Mhz 0.5V to 1MHz 1V Reflow soldering footprint updated. Component pitch in tape defined.  TDK Electronics AG 2021. Reproduction, publication and dissemination of this publication, enclosures hereto and the information contained therein without TDK Electronics' prior express consent is prohibited. Transient Voltage Suppressors – TVS WL-CSP01005 Slim-line, General purpose type B74111G0050M060 SD01005SL-GP101 Features     Bidirectional ESD protection of one I/O line ESD protection to IEC 61000-4-2, VESD,max = 15 kV Surge protection to IEC 61000-4-5, IPP,max = 4.0 A Very low clamping voltage: VCL = 8.9 V (ITLP = 16 A, tp = 100 ns)  Very low leakage current (Ileak = 2 nA at 3.3 V)  Ultra small package with a height of 0.10 mm Applications       Cellular handsets Laptops Tablets Wearables Network communication devices Other portable devices with tight space requirements Schematics Pin Description A1 I/O Pin B1 GND Due to the symmetrical configuration no marking information is needed. A1 and B1 can be interchanged. Maximum ratings Rating Symbol Value Unit DC working voltage I/O to GND VRWM,max 5 V ESD air and contact discharge (acc. to IEC 61000-4-2 standard) VESD,max 15 kV Surge (8/20 μs) peak pulse current (acc. to IEC 61000-4-5 standard) IPP,max 4 A Ambient temperature Ta - 40 … +125 °C PPD ML PD Please read Cautions and warnings and Important notes at the end of this document. 2021-02-02 Page 2 of 11 Transient Voltage Suppressors – TVS WL-CSP01005 Slim-line, General purpose type B74111G0050M060 SD01005SL-GP101 Characteristics (TA = 25 °C) Parameter Symbol Conditions Minimum Typical Maximum Unit Breakdown voltage VBR IBR = 1 mA, I/O to GND 6 6.8 8 V Leakage current Ileak VRWM = 3.3 V 0.002 0.05 µA Ileak VRWM = 5 V 0.02 0.1 µA Capacitance Cj f = 1 MHz, 1.0 V 5 pF Clamping voltage Vclamp IPP = 8 A, TLP 7.6 V Vclamp IPP = 16 A, TLP 8.9 V Rdyn IPP range: 8 …16 A, TLP 0.16 Ω Dynamic resistance Note: Any operating voltage lower than VRWM results in lower leakage current. Typical I-V characteristics TLP I-V curve Dimensional drawing WL-CSP01005 SL Symbol Mean Tol. A 0.40 ±0.020 B 0.20 ±0.020 T 0.10 ±0.010 C 0.15 ±0.020 D 0.10 ±0.020 E 0.15 (typical) e 0.25 (typical) f 0.025 (typical) Dimensions in mm PPD ML PD Please read Cautions and warnings and Important notes at the end of this document. 2021-02-02 Page 3 of 11 Transient Voltage Suppressors – TVS WL-CSP01005 Slim-line, General purpose type B74111G0050M060 SD01005SL-GP101 Solder pad finish: Ni / Au Recommended reflow soldering footprint WL-CSP01005 SL Footprint dimensions A 0.25 B 0.15 C 0.10 Dimensions in mm Recommended soldering profiles Reflow soldering Temperature ranges for reflow soldering acc. to IEC 60068-2-58 recommendations. PPD ML PD Please read Cautions and warnings and Important notes at the end of this document. 2021-02-02 Page 4 of 11 Transient Voltage Suppressors – TVS WL-CSP01005 Slim-line, General purpose type B74111G0050M060 SD01005SL-GP101 Profile feature Symbol Sn-Pb eutectic assembly Pb-free assembly Preheat and soak – Temperature min. – Temperature max. – Time Tsmin Tsmax tsmin to tsmax 100 °C 150 °C 60 … 120 s 150 °C 200 °C 60 … 120 s Average ramp-up rate Tsmax to Tp 3 °C/s max. 3 °C/s max. Liquidous temperature Time at liquidous TL tL 183 °C 40 … 150 s 217 °C 40 … 150 s Peak package body temperature Tp1) 215 … 260 °C 235 … 260 °C Time (tp) above (Tp -5 °C ) tp 10 ... .40 s 10 ... 40 s Average ramp-down rate Tp to Tsmax 6 °C/s max. 6 °C/s max. maximum 8 min maximum 8 min Time 25 °C to peak temperature 1) Depending on package thickness Note: All temperatures refer to topside of the package, measured on the package body surface. Number of reflow cycles: 3 Iron soldering should be avoided, hot air methods are recommended for repair purposes. Soldering guidelines Recommended solder The use of no-clean solder products is recommended. In any case mild, non-activated fluxes should be used. Flux residues after soldering should be minimized. Storage conditions In order to maintain solderability the components must be stored in a non-corrosive atmosphere. Humidity, temperature and container materials are critical factors. Do not store the components where they are exposed to heat or direct sunlight. Otherwise the packing material may be deformed or the components may stick together, causing problems during mounting. After opening the factory seals, such as polyvinyl-sealed packages, use the components as soon as possible. The components should be left in the original packing. Touching the metallization of unsoldered components may change their soldering properties.  Storage temperature: -25 ... +45 °C  Relative humidity: