ICS-40300

ICS-40300 High SPL Analog Microphone with Extended Low Frequency Response APPLICATIONS GENERAL DESCRIPTION The ICS-40300* is a low-noise, high SPL MEMS microphone with extended low frequency response. The ICS-40300 consists of a MEMS microphone element and an impedance converter amplifier. The ICS-40300 low frequency response makes it an excellent choice for applications requiring precise phase matching. The ICS-40300 is pin compatible with the INMP401 and INMP411 microphones, providing an easy upgrade path. The ICS-40300 has a linear response up to 130 dB SPL. It offers low frequency extension down to 6 Hz, resulting in excellent phase characteristics in the audio range. Low current consumption enables long battery life for portable applications. The ICS-40300 is available in a 4.72 mm × 3.76 mm × 3.5 mm surface-mount package. It is reflow solder compatible with no sensitivity degradation. *Protected by U.S. Patents 7,449,356; 7,825,484; 7,885,423; and 7,961,897. Other patents are pending. FUNCTIONAL BLOCK DIAGRAM • • • • • • Active Noise-Cancelling Headsets Teleconferencing Systems Studio Microphones Live Microphones Security and Surveillance Photoacoustic Gas Sensing FEATURES • • • • • • • • • • • • 4.72 × 3.76 × 3.5 mm Surface-Mount Package Extended Frequency Response from 6 Hz to 20 kHz 130 dB SPL Acoustic Overload Point Sensitivity of −45 dBV ±2 dB Sensitivity Tolerance Omnidirectional Response High SNR of 63 dBA Low Current Consumption: 20 Hz kHz Dynamic Range Frequency Response Total Harmonic Distortion (THD) Power-Supply Rejection (PSR) Power-Supply Rejection Ratio (PSRR) Acoustic Overload Point POWER SUPPLY Supply Voltage (VDD) Supply Current (IS) Derived from EIN and maximum acoustic input Low frequency −3 dB point High frequency −3 dB point 105 dB SPL 217 Hz, 100 mVP-P square wave superimposed on VDD = 1.8 V 1 kHz, 100 mVP-P sine wave superimposed on VDD = 1.8 V 10% THD 0.2 % −80 dBV −55 dB 130 dB SPL 1.5 VDD = 1.8 V VDD = 3.3 V 1 180 210 3.63 V 220 250 µA µA OUTPUT CHARACTERISTICS Output Impedance (ZOUT) 200 Ω Output DC Offset 0.8 V Maximum Output Voltage 130 dB SPL input 0.355 V rms Noise Floor 20 Hz to 20 kHz, A-weighted, rms −108 dBV Note 1: See Figure 3 and Figure 4. Document Number: DS-ICS-40300-00 Revision: 1.3 Page 3 of 15 1 ICS-40300 ABSOLUTE MAXIMUM RATINGS Stress above those listed as Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these conditions is not implied. Exposure to the absolute maximum ratings conditions for extended periods may affect device reliability. TABLE 2. ABSOLUTE MAXIMUM RATINGS PARAMETER Supply Voltage (VDD) RATING −0.3 V to +3.63 V Sound Pressure Level 160 dB Mechanical Shock 10,000 g Vibration Per MIL-STD-883 Method 2007, Test Condition B Temperature Range Biased* Storage −40°C to +85°C −55°C to +150°C * ICS-40300 is able to operate at 105C without permanent damage to the device, but device specifications are not guaranteed. ESD CAUTION ESD (electrostatic discharge) sensitive device. Charged devices and circuit boards can discharge without detection. Although this product features patented or proprietary protection circuitry, damage may occur on devices subjected to high energy ESD. Therefore proper ESD precautions should be taken to avoid performance degradation or loss of functionality. Document Number: DS-ICS-40300-00 Revision: 1.3 Page 4 of 15 ICS-40300 SOLDERING PROFILE CRITICAL ZONE TL TO TP tP TP TEMPERATURE RAMP-UP TL tL TSMAX TSMIN tS RAMP-DOWN PREHEAT t25°C TO PEAK TEMPERATURE TIME Figure 1. Recommended Soldering Profile Limits TABLE 3. RECOMMENDED SOLDERING PROFILE* PROFILE FEATURE Average Ramp Rate (TL to TP) Sn63/Pb37 1.25°C/sec max Pb-Free 1.25°C/sec max 100°C 100°C 150°C 200°C 60 sec to 75 sec 1.25°C/sec 45 sec to 75 sec 183°C 60 sec to 75 sec 1.25°C/sec ~50 sec 217°C 215°C +3°C/−3°C 260°C +0°C/−5°C Time Within +5°C of Actual Peak Temperature (tP) 20 sec to 30 sec 20 sec to 30 sec Ramp-Down Rate 3°C/sec max 3°C/sec max Time +25°C (t25°C) to Peak Temperature 5 min max 5 min max Minimum Temperature (TSMIN) Minimum Temperature Preheat (TSMIN) Time (TSMIN to TSMAX), tS Ramp-Up Rate (TSMAX to TL) Time Maintained Above Liquidous (tL) Liquidous Temperature (TL) Peak Temperature (TP) *Note: The reflow profile in Table 3 is recommended for board manufacturing with InvenSense MEMS microphones. All microphones are also compatible with the J-STD-020 profile Document Number: DS-ICS-40300-00 Revision: 1.3 Page 5 of 15 ICS-40300 PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS OUTPUT GND 2 1 GND GND 3 6 VDD 4 5 GND BOTTOM VIEW Not to Scale Figure 2. Pin Configuration TABLE 4. PIN FUNCTION DESCRIPTIONS PIN NAME FUNCTION 1 OUTPUT 2 GND Analog Output Signal Ground 3 GND Ground 4 GND Ground 5 VDD Power Supply 6 GND Ground Document Number: DS-ICS-40300-00 Revision: 1.3 Page 6 of 15 ICS-40300 TYPICAL PERFORMANCE CHARACTERISTICS 15 20   (dB)   AMPLITUDE NORMALIZED NORMALIZED   AMPLITUDE   (dB) 20 10 5 0 15 10 5 0 ‐5 ‐10 -5 10 1 100 1k 1 10k 10 100 1k 10k FREQUENCY  (Hz) FREQUENCY  (Hz) Figure 4. Frequency Response (Measured) Figure 3. Frequency Response Mask 0 ‐5 ‐10 OUTPUT LEVEL     (dBV) THD + N (%) 10 1 ‐15 ‐20 ‐25 ‐30 ‐35 ‐40 ‐45 0.1 90 100 110 120 130 -50 140 90 100 110 INPUT AMPLITUDE (dB SPL)  Figure 5. THD + N vs. Input Level 130 140 Figure 6. Linearity 1.4 0 124  dB   SPL 128  dB   SPL 132dB     SPL 136  dB   SPL 140  dB   SPL 1.0 -10   1.2 -20 0.8 PSRR (dB)   OUTPUT (V) 120 INPUT LEVEL (dB SPL)  -30 0.6 -40   0.4 -50 0.2 -60 0.0 0 0.5 TIME (ms) 1.0 100 1k 10k FREQUENCY  (Hz) Figure 8. Power Supply Rejection Ratio vs. Frequency Figure 7. Clipping Characteristics Document Number: DS-ICS-40300-00 Revision: 1.3 10 Page 7 of 15 ICS-40300 30 60 15 PHASE (DEGREES) PHASE  (DEGREES)   45 30 15 -15 0 -15 0 -30 10 100 1k 10k -80 -100 -120 -140   AMPLITUDE SPECTRAL DENSITY (dBV/√Hz) -60 10   1 100 FREQUENCY (Hz) 1k 10k Figure 11. Noise Spectrum Amplitude Spectral Density Document Number: DS-ICS-40300-00 Revision: 1.3 100 1k Figure 10. Phase Variation From Typical Response Figure 9. Phase Response (Measured) -160 10 FREQUENCY (Hz) FREQUENCY   (Hz) Page 8 of 15 10k ICS-40300 APPLICATIONS INFORMATION CONNECTING TO AUDIO CODECS The ICS-40300 output can be connected to a dedicated codec microphone input (see Figure 12) or to a high input impedance gain stage (see Figure 13.) A 0.1 µF ceramic capacitor placed close to the ICS-40300 supply pin is used for testing and is recommended to adequately decouple the microphone from noise on the power supply. A DC-blocking capacitor is required at the output of the microphone. This capacitor creates a high-pass filter with a corner frequency at fC = 1/(2π × C × R) where R is the input impedance of the codec. A minimum value of 22 µF is recommended in Figure 12 because the input impedance of some codecs can be as low as 2 kΩ at their highest PGA gain setting, which results in a high-pass filter corner frequency at 3.6 Hz. At lower gain settings, where the codec input impedance is also lower, a smaller AC-coupling capacitor can be used. Figure 13 shows the ICS-40300 connected to an op amp configured as a non-inverting preamplifier. MICBIAS 0.1 µF VDD ADC OR CODEC 22 µF MINIMUM ICS-40300 INPUT OUTPUT GND Figure 12. ICS-40300 Connected to a Codec GAIN = (R1 + R2)/R1 R1 R2 VREF 1.8-3.3 V 0.1 µF VDD ICS-40300 OUTPUT GND AMP 1 µF MINIMUM VOUT 47 kΩ VREF Figure 13. ICS-40300 Connected to an Op Amp DYNAMIC RANGE CONSIDERATIONS To fully utilize the 99 dB dynamic range of the ICS-40300 in a design, the preamp, ADC, or codec circuit following it must be chosen carefully. A typical codec may have a 100 dB dynamic range with VDD = 3.3 V. To match the dynamic ranges between the microphone and the ADC input of the codec, some gain must be added to the ICS-40300 output. For example, at the 130 dB SPL maximum acoustic input, the ICS-40300 outputs a −9 dBV rms signal. The full-scale input voltage of a codec may be 0 dBV; therefore, 9 dB of gain must be added to the signal to match the dynamic range of the microphone with the dynamic range of the codec. Document Number: DS-ICS-40300-00 Revision: 1.3 Page 9 of 15 ICS-40300 SUPPORTING DOCUMENTS For additional information, see the following documents. EVALUATION BOARD USER GUIDE UG-445, Analog Output MEMS Microphone Flex Evaluation Board APPLICATION NOTES (GENERAL) AN-1003, Recommendations for Mounting and Connecting the InvenSense Bottom-Ported MEMS Microphones AN-1068, Reflow Soldering of the MEMS Microphone AN-1112, Microphone Specifications Explained AN-1124, Recommendations for Sealing InvenSense Bottom-Port MEMS Microphones from Dust and Liquid Ingress AN-1140, Microphone Array Beamforming AN-1165, Op Amps for Microphone Preamp Circuits AN-1181, Using a MEMS Microphone in a 2-Wire Microphone Circuit APPLICATION NOTE (PRODUCT-SPECIFIC) AN-0284 Low-Noise Directional Studio Microphone Reference Design Document Number: DS-ICS-40300-00 Revision: 1.3 Page 10 of 15 ICS-40300 PCB DESIGN AND LAND PATTERN LAYOUT The recommended PCB land pattern for the ICS-40300 should be laid out to a 1:1 ratio to the solder pads on the microphone package, as shown in Figure 14. Take care to avoid applying solder paste to the sound hole in the PCB. A suggested solder paste stencil pattern layout is shown in Figure 15. The diameter of the sound hole in the PCB should be larger than the diameter of the sound port of the microphone. A minimum diameter of 0.5 mm is recommended. ø0.90 (3×) 2.62 ø1.10 ø1.68 2.54 2.40 1.20 ø0.70 (2×) 1.27 0.79 Figure 14. PCB Land Pattern Layout Dimensions shown in millimeters Figure 15. Suggested Solder Paste Stencil Pattern Layout Dimensions shown in millimeters PCB MATERIAL AND THICKNESS The performance of the ICS-40300 is not affected by PCB thickness. The ICS-40300 can be mounted on either a rigid or flexible PCB. A flexible PCB with the microphone can be attached directly to the device housing with an adhesive layer. This mounting method offers a reliable seal around the sound port while providing the shortest acoustic path for good sound quality. Document Number: DS-ICS-40300-00 Revision: 1.3 Page 11 of 15 ICS-40300 HANDLING INSTRUCTIONS PICK AND PLACE EQUIPMENT The MEMS microphone can be handled using standard pick-and-place and chip shooting equipment. Take care to avoid damage to the MEMS microphone structure as follows: • Use a standard pickup tool to handle the microphone. Because the microphone hole is on the bottom of the package, the pickup tool can make contact with any part of the lid surface. • Do not pick up the microphone with a vacuum tool that makes contact with the bottom side of the microphone. Do not pull air out of or blow air into the microphone port. • Do not use excessive force to place the microphone on the PCB. REFLOW SOLDER For best results, the soldering profile must be in accordance with the recommendations of the manufacturer of the solder paste used to attach the MEMS microphone to the PCB. It is recommended that the solder reflow profile not exceed the limit conditions specified in Figure 1 and Table 3. BOARD WASH When washing the PCB, ensure that water does not make contact with the microphone port. Do not use blow-off procedures or ultrasonic cleaning. Document Number: DS-ICS-40300-00 Revision: 1.3 Page 12 of 15 ICS-40300 OUTLINE DIMENSIONS 4.42 REF 4.82 4.72 4.62 3.30 REF REFERENCE CORNER 0.90 DIA. (PINS 1, 5, 6) 3.86 3.76 3.66 1 2 4 5 0.68 REF BOT TOM VIEW 3.23 REF 0.24 REF Figure 16. 4-Terminal Chip Array Small Outline No Lead Cavity 4.72 × 3.76 × 3.50 mm Body Dimensions shown in millimeters PART NUMBER PIN 1 INDICATION 300 YYXXXX DATE CODE LOT TRACEABILITY CODE Figure 17. Package Marking Specification (Top View) Document Number: DS-ICS-40300-00 Revision: 1.3 1.10 DIA. 6 1.20 BSC TOP VIEW SIDE VIEW 1.68 DIA. 3 2.40 BSC 3.46 REF 3.60 3.50 3.40 0.79 BSC 2.62 BSC Page 13 of 15 1.27 BSC 0.25 DIA. (THRU HOLE) 0.61 REF 0.70 DIA. (PINS 2, 4) 2.54 BSC ICS-40300 ORDERING GUIDE PART ICS-40300 TEMP RANGE −40°C to +85°C PACKAGE 6-Terminal LGA_CAV EV_ICS-40300-FX QUANTITY 2,000 PACKAGING 13” Tape and Reel Flex Evaluation Board REVISION HISTORY REVISION DATE REVISION DESCRIPTION 5/15/2014 1.0 Initial Release 08/18/2015 1.1 Updated reel quantity in Ordering Guide 5/9/2018 1.2 Updated Stencil Mask 7/17/2018 1.3 Enviromental Performance Document Number: DS-ICS-40300-00 Revision: 1.3 Page 14 of 15 ICS-40300 COMPLIANCE DECLARATION DISCLAIMER InvenSense believes the environmental and other compliance information given in this document to be correct but cannot guarantee accuracy or completeness. Conformity documents substantiating the specifications and component characteristics are on file. InvenSense subcontracts manufacturing, and the information contained herein is based on data received from vendors and suppliers, which has not been validated by InvenSense. This information furnished by InvenSense, Inc. (“InvenSense”) is believed to be accurate and reliable. However, no responsibility is assumed by InvenSense for its use, or for any infringements of patents or other rights of third parties that may result from its use. Specifications are subject to change without notice. InvenSense reserves the right to make changes to this product, including its circuits and software, in order to improve its design and/or performance, without prior notice. InvenSense makes no warranties, neither expressed nor implied, regarding the information and specifications contained in this document. InvenSense assumes no responsibility for any claims or damages arising from information contained in this document, or from the use of products and services detailed therein. This includes, but is not limited to, claims or damages based on the infringement of patents, copyrights, mask work and/or other intellectual property rights. Certain intellectual property owned by InvenSense and described in this document is patent protected. No license is granted by implication or otherwise under any patent or patent rights of InvenSense. This publication supersedes and replaces all information previously supplied. Trademarks that are registered trademarks are the property of their respective companies. InvenSense sensors should not be used or sold in the development, storage, production or utilization of any conventional or mass-destructive weapons or for any other weapons or life threatening applications, as well as in any other life critical applications such as medical equipment, transportation, aerospace and nuclear instruments, undersea equipment, power plant equipment, disaster prevention and crime prevention equipment. ©2018 InvenSense. All rights reserved. InvenSense, MotionTracking, MotionProcessing, MotionProcessor, MotionFusion, MotionApps, DMP, AAR, and the InvenSense logo are trademarks of InvenSense, Inc. ©2018 InvenSense. All rights reserved. Document Number: DS-ICS-40300-00 Revision: 1.3 Page 15 of 15