ICS-40310

ICS-40310 Ultra-low Current, Low-Noise Microphone with Analog Output GENERAL DESCRIPTION The ICS-40310* is a high-performance MEMS microphone with a combination of very low power consumption, high SNR, and a tiny package. Running from a 1 V supply, the ICS-40310 consumes only 16 µA of current while providing a 64 dB SNR with an analog 4.5 kΩ impedance output. These features, combined with the benefits of MEMS technology, reflow solder compatibility, and a highly stable response over time and temperature, make the ICS-40310 an ideal microphone choice for always-on power-sensitive mobile devices. The ICS-40310 is pin-compatible with the INMP504 and INMP510. *Protected by U.S. Patents 7,449,356; 7,825,484; 7,885,423; and 7,961,897. Other patents are pending. FUNCTIONAL BLOCK DIAGRAM OUTPUT AMPLIFIER ICS-40310 APPLICATIONS • • • • • Dedicated “AlwaysOn” Microphone Smartphones Wearable Computing Devices Tablet Computers Bluetooth Headsets FEATURES • • • • • • • • Low Current Consumption: 16 µA Small Surface-Mount Package: 3.35 × 2.5 × 0.98 mm High SNR of 64 dBA Sensitivity of −37 dBV 0.9 V to 1.3 V Supply Single-Ended Analog Output Compatible with Sn/Pb and Pb-Free Solder Processes RoHS/WEEE Compliant ORDERING INFORMATION PART TEMP RANGE PACKAGING ICS-40310 EV_ICS-40310-FX 0°C to +70°C — 13” Tape and Reel OUTPUT POWER VDD GND TOP VIEW InvenSense reserves the right to change the detail specifications as may be required to permit improvements in the design of its products. InvenSense Inc. 1745 Technology Drive, San Jose, CA 95110 U.S.A +1(408) 988–7339 www.invensense.com BOTTOM VIEW Document Number: DS-ICS-40310-00 Revision: 1.2 Rev Date: 10/27/2014 ICS-40310 TABLE OF CONTENTS General Description ..................................................................................................................................................................... 1 Applications ................................................................................................................................................................................. 1 Features ....................................................................................................................................................................................... 1 Functional Block Diagram ............................................................................................................................................................ 1 Ordering Information ................................................................................................................................................................... 1 Table of Contents .................................................................................................................................................................................... 2 Specifications .......................................................................................................................................................................................... 3 Table 1. Electrical Characteristics ................................................................................................................................................ 3 Absolute Maximum Ratings .................................................................................................................................................................... 4 Table 2. Absolute Maximum Ratings ........................................................................................................................................... 4 ESD Caution ................................................................................................................................................................................. 4 Soldering Profile........................................................................................................................................................................... 5 Table 3. Recommended Soldering Profile*.................................................................................................................................. 5 Pin Configurations And Function Descriptions ....................................................................................................................................... 6 Table 4. Pin Function Descriptions............................................................................................................................................... 6 Typical Performance Characteristics....................................................................................................................................................... 7 Applications Information ........................................................................................................................................................................ 8 Output Impedance Consideration ............................................................................................................................................... 8 Codec and Amplifier Connections................................................................................................................................................ 8 Supporting Documents ........................................................................................................................................................................... 9 Evaluation Board User Guide ....................................................................................................................................................... 9 Application Notes ........................................................................................................................................................................ 9 PCB Design And Land Pattern Layout ................................................................................................................................................... 10 PCB Material And Thickness ...................................................................................................................................................... 10 Handling Instructions ............................................................................................................................................................................ 11 Pick And Place Equipment ......................................................................................................................................................... 11 Reflow Solder ............................................................................................................................................................................. 11 Board Wash................................................................................................................................................................................ 11 Outline Dimensions ............................................................................................................................................................................... 12 Ordering Guide .......................................................................................................................................................................... 13 Revision History ......................................................................................................................................................................... 13 Compliance Declaration Disclaimer ........................................................................................................................................... 14 Document Number: DS-ICS-40310-00 Revision: 1.2 Page 2 of 14 ICS-40310 SPECIFICATIONS TABLE 1. ELECTRICAL CHARACTERISTICS (TA = 0 to 70°C, VDD = 0.9 to 1.3 V, unless otherwise noted. All minimum and maximum specifications are guaranteed across temperature and voltage and are specified in Table 1, unless otherwise noted. Typical specifications are not guaranteed.) PARAMETER PERFORMANCE Directionality Sensitivity Signal-to-Noise Ratio (SNR) Equivalent Input Noise (EIN) Dynamic Range Frequency Response Total Harmonic Distortion (THD) Power Supply Rejection (PSR) Power-Supply Rejection Ratio (PSRR) Acoustic Overload Point POWER SUPPLY Supply Voltage (VDD) Supply Current (IS) CONDITIONS MIN 1 kHz, 94 dB SPL 20 Hz to 20 kHz, A-weighted 20 Hz to 20 kHz, A-weighted Derived from EIN and maximum acoustic input Low frequency −3 dB point High frequency −3 dB point 105 dB SPL 217 Hz, 100 mVp-p square wave superimposed on VDD = 1.0 V (Aweighted) 1 kHz, 100 mVp-p sine wave superimposed on VDD 10% THD −40 TYP Omni −37 64 30 MAX −34 UNITS dBV dBA dBA SPL 82 dB 90 16 1.3 Hz kHz % 2.5 -81 dBV −53 dB 112 dB SPL 0.9 VDD = 0.9 V 16 1.3 23 V µA VDD = 1.3 V 19.5 25 µA OUTPUT CHARACTERISTICS Output Impedance 2.9 4.5 10.5 kΩ Output DC Offset Voltage 500 570 650 mV Startup Time Output Current Limit Output to within 0.2 dB of final sensitivity 0.8 sec 25 μA Maximum Output Voltage 112 dB SPL input, RMS 112 mV Noise Floor 20 Hz to 20 kHz, A-weighted, RMS −101 dBV Note 1: See Figure 3 and Figure 4. Document Number: DS-ICS-40310-00 Revision: 1.2 Page 3 of 14 NOTES 1 ICS-40310 ABSOLUTE MAXIMUM RATINGS Stress above those listed as Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these conditions is not implied. Exposure to the absolute maximum ratings conditions for extended periods may affect device reliability. TABLE 2. ABSOLUTE MAXIMUM RATINGS PARAMETER Supply Voltage (VDD) RATING −0.3 V to +1.45 V Sound Pressure Level 160 dB SPL Mechanical Shock 10,000 g Vibration Per MIL-STD-883 Method 2007, Test Condition B Temperature Range Biased 0°C to +70°C Storage −55°C to +150°C ESD CAUTION ESD (electrostatic discharge) sensitive device. Charged devices and circuit boards can discharge without detection. Although this product features patented or proprietary protection circuitry, damage may occur on devices subjected to high energy ESD. Therefore proper ESD precautions should be taken to avoid performance degradation or loss of functionality. Document Number: DS-ICS-40310-00 Revision: 1.2 Page 4 of 14 ICS-40310 SOLDERING PROFILE CRITICAL ZONE TL TO TP tP TP TEMPERATURE RAMP-UP TL tL TSMAX TSMIN tS RAMP-DOWN PREHEAT t25°C TO PEAK TEMPERATURE TIME Figure 1. Recommended Soldering Profile Limits TABLE 3. RECOMMENDED SOLDERING PROFILE* PROFILE FEATURE Average Ramp Rate (TL to TP) Minimum Temperature (TSMIN) Minimum Temperature Preheat (TSMIN) Time (TSMIN to TSMAX), tS Ramp-Up Rate (TSMAX to TL) Time Maintained Above Liquidous (tL) Liquidous Temperature (TL) Peak Temperature (TP) Sn63/Pb37 1.25°C/sec max Pb-Free 1.25°C/sec max 100°C 100°C 150°C 200°C 60 sec to 75 sec 1.25°C/sec 45 sec to 75 sec 60 sec to 75 sec 1.25°C/sec ~50 sec 183°C 217°C 215°C +3°C/−3°C 260°C +0°C/−5°C Time Within +5°C of Actual Peak Temperature (tP) 20 sec to 30 sec 20 sec to 30 sec Ramp-Down Rate 3°C/sec max 3°C/sec max Time +25°C (t25°C) to Peak Temperature 5 min max 5 min max *The reflow profile in Table 3 is recommended for board manufacturing with InvenSense MEMS microphones. All microphones are also compatible with the J-STD-020 profile. Document Number: DS-ICS-40310-00 Revision: 1.2 Page 5 of 14 ICS-40310 PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS 2 GND 1 OUTPUT 3 VDD TOP VIEW (TERMINAL SIDE DOWN) Not to Scale Figure 2. Pin Configuration TABLE 4. PIN FUNCTION DESCRIPTIONS PIN NAME FUNCTION 1 2 OUTPUT GND Analog Output Signal Ground 3 VDD Power Supply. Bypass to GND with a 0.1 µF capacitor. Document Number: DS-ICS-40310-00 Revision: 1.2 Page 6 of 14 ICS-40310 15 10 10   15 NORMALIZED AMPLITUDE (dB) NORMALIZED AMPLITUDE (dB)   TYPICAL PERFORMANCE CHARACTERISTICS 5 0 -5 -10 -15 -20 5 0 -5 -10 -15 -20 -25 100 10 1k   FREQUENCY (Hz) 10k 10 100 1k   FREQUENCY (Hz) 10k Figure 4. Typical Frequency Response (Measured) Figure 3. Frequency Response Mask   0 -10 10 THD + N (%) PSRR (dB) -20 -30 -40 1 -50 -60 100 1k   FREQUENCY (Hz) 0.1 10k 90 Figure 5. Power-Supply Rejection Ratio (PSRR) vs. Frequency -5 OUTPUT AMPLITUDE (dBV) -10 -15 -20 -25 -30 -35 -40 90 95 100 105 110   INPUT AMPLITUDE (dB SPL) 115 120 Figure 7. Linearity Document Number: DS-ICS-40310-00 Revision: 1.2 100 105   (dB SPL) INPUT 110 Figure 6. THD + N vs. Input Level 0 -45 95 Page 7 of 14 115 120 ICS-40310 APPLICATIONS INFORMATION OUTPUT IMPEDANCE CONSIDERATION The ICS-40310 has an output impedance of 4.5 kΩ, which is significantly higher than the impedance of many other MEMS microphones. This higher output impedance enables the microphone to operate with a very low supply current, but also needs to be considered in the design of the signal chain following the microphone. The input impedance of the device to which the microphone’s output is connected should be much higher than 4.5 kΩ to ensure no loss of signal amplitude through the signal chain. A minimum input impedance of 47 kΩ is recommended for the device connected to the ICS-40310’s output. An input with this impedance will reduce the microphone’s output signal level by only 0.8 dB. CODEC AND AMPLIFIER CONNECTIONS The ICS-40310 output can be connected to a dedicated codec microphone input (see Figure 8), or to a high input impedance gain stage (see Figure 9). A 0.1 µF ceramic capacitor placed close to the ICS-40310 supply pin is used for testing and is recommended to adequately decouple the microphone from noise on the power supply. An AC-coupling capacitor is required at the output of the microphone. This capacitor creates a high-pass filter with a corner frequency at fC = 1/(2π × C × R) where R is the input impedance of the codec or amplifier. A codec input connected to the ICS-40310’s output should be high impedance, as described above in the Output Impedance Consideration section. The size of the AC-coupling capacitor should be chosen such that the high-pass filter that it forms at the codec’s input does not affect the microphone’s low frequency performance. For high-impedance (>47 kΩ) inputs, a 100 nF or larger AC-coupling capacitor will be sufficient. See Figure 8 for a schematic of this connection. Figure 9 shows the ICS-40310 connected to an op amp configured as a noninverting preamplifier. MICBIAS 0.1 µF VDD ADC OR CODEC 0.1 µF MINIMUM ICS-40310 INPUT OUTPUT GND Figure 8. ICS-40310 Connected to an ADC or Codec GAIN = (R1 + R2)/R1 R1 R2 VREF 0.9-1.3 V 0.1 µF VDD ICS-40310 OUTPUT GND AMP 0.1 µF MINIMUM 47 kΩ VREF Figure 9. ICS-40310 Connected to an Op Amp Document Number: DS-ICS-40310-00 Revision: 1.2 Page 8 of 14 VOUT ICS-40310 SUPPORTING DOCUMENTS For additional information, see the following documents. EVALUATION BOARD USER GUIDE UG-325, Analog Output MEMS Microphone Flex Evaluation Board APPLICATION NOTES AN-1003, Recommendations for Mounting and Connecting the InvenSense Bottom-Ported MEMS Microphones AN-1068, Reflow Soldering of the MEMS Microphone AN-1112, Microphone Specifications Explained AN-1124, Recommendations for Sealing InvenSense Bottom-Port MEMS Microphones from Dust and Liquid Ingress AN-1140, Microphone Array Beamforming AN-1165, Op Amps for Microphone Preamp Circuits AN-1181, Using a MEMS Microphone in a 2-Wire Microphone Circuit Document Number: DS-ICS-40310-00 Revision: 1.2 Page 9 of 14 ICS-40310 PCB DESIGN AND LAND PATTERN LAYOUT It is recommended that the PCB land pattern for the ICS-40310 be laid out to a 1:1 ratio to the solder pads on the microphone package, as shown in Figure 10. Take care to avoid applying solder paste to the sound hole in the PCB. A suggested solder paste stencil pattern layout is shown in Figure 11. The diameter of the sound hole in the PCB should be larger than the diameter of the sound port of the microphone. A minimum diameter of 0.5 mm is recommended. 1.52 0.68 1.22 0.61 Ø1.55 1.90 Ø0.95 0.61 0.90 Figure 10. PCB Land Pattern Layout (Dimensions shown in millimeters) 1.52 45° TYP 0.225 0.6 0.61 0.8 Ø1.55 1.22 Ø1.05 0.61 0.6 0.8 45° TYP Figure 11. Suggested Solder Paste Stencil Pattern Layout (Dimensions shown in millimeters) PCB MATERIAL AND THICKNESS The performance of the ICS-40130 is not affected by PCB thickness. The ICS-40310 can be mounted on either a rigid or flexible PCB. A flexible PCB with the microphone can be attached directly to the device housing with an adhesive layer. This mounting method offers a reliable seal around the sound port while providing the shortest acoustic path for good sound quality. Document Number: DS-ICS-40310-00 Revision: 1.2 Page 10 of 14 ICS-40310 HANDLING INSTRUCTIONS PICK AND PLACE EQUIPMENT The MEMS microphone can be handled using standard pick-and-place and chip shooting equipment. Take care to avoid damage to the MEMS microphone structure as follows: • Use a standard pickup tool to handle the microphone. Because the microphone hole is on the bottom of the package, the pickup tool can make contact with any part of the lid surface. • Do not pick up the microphone with a vacuum tool that makes contact with the bottom side of the microphone. Do not pull air out of or blow air into the microphone port. • Do not use excessive force to place the microphone on the PCB. REFLOW SOLDER For best results, the soldering profile must be in accordance with the recommendations of the manufacturer of the solder paste used to attach the MEMS microphone to the PCB. It is recommended that the solder reflow profile not exceed the limit conditions specified in Figure 1 and Table 3. BOARD WASH When washing the PCB, ensure that water does not make contact with the microphone port. Do not use blow-off procedures or ultrasonic cleaning. Document Number: DS-ICS-40310-00 Revision: 1.2 Page 11 of 14 ICS-40310 OUTLINE DIMENSIONS Figure 12. 3-Terminal Chip Array Small Outline No Lead Cavity 3.35 mm × 2.5 mm × 0.98 mm Body Dimensions shown in millimeters PIN 1 INDIC ATION PART NUMBE R 310 YYXXX DATE CODE LOT TR ACEABILITY Figure 13. Package Marking Specification (Top View) Document Number: DS-ICS-40310-00 Revision: 1.2 Page 12 of 14 ICS-40310 ORDERING GUIDE PART ICS-40310 TEMP RANGE 0°C to +70°C EV_ICS-40310-FX PACKAGE 3-Terminal LGA_CAV Flex Evaluation Board REVISION HISTORY REVISION DATE REVISION DESCRIPTION 05/15/2014 1.0 Initial Release 06/04/2014 1.1 Replaced Figure 12 10/27/2014 1.2 Updated Package Drawing Document Number: DS-ICS-40310-00 Revision: 1.2 Page 13 of 14 QUANTITY 10,000 PACKAGING 13” Tape and Reel ICS-40310 COMPLIANCE DECLARATION DISCLAIMER InvenSense believes the environmental and other compliance information given in this document to be correct but cannot guarantee accuracy or completeness. Conformity documents substantiating the specifications and component characteristics are on file. InvenSense subcontracts manufacturing, and the information contained herein is based on data received from vendors and suppliers, which has not been validated by InvenSense. This information furnished by InvenSense is believed to be accurate and reliable. However, no responsibility is assumed by InvenSense for its use, or for any infringements of patents or other rights of third parties that may result from its use. Specifications are subject to change without notice. InvenSense reserves the right to make changes to this product, including its circuits and software, in order to improve its design and/or performance, without prior notice. InvenSense makes no warranties, neither expressed nor implied, regarding the information and specifications contained in this document. InvenSense assumes no responsibility for any claims or damages arising from information contained in this document, or from the use of products and services detailed therein. This includes, but is not limited to, claims or damages based on the infringement of patents, copyrights, mask work and/or other intellectual property rights. Certain intellectual property owned by InvenSense and described in this document is patent protected. No license is granted by implication or otherwise under any patent or patent rights of InvenSense. This publication supersedes and replaces all information previously supplied. Trademarks that are registered trademarks are the property of their respective companies. InvenSense sensors should not be used or sold in the development, storage, production or utilization of any conventional or mass-destructive weapons or for any other weapons or life threatening applications, as well as in any other life critical applications such as medical equipment, transportation, aerospace and nuclear instruments, undersea equipment, power plant equipment, disaster prevention and crime prevention equipment. ©2014 InvenSense, Inc. All rights reserved. InvenSense, MotionTracking, MotionProcessing, MotionProcessor, MotionFusion, MotionApps, DMP, and the InvenSense logo are trademarks of InvenSense, Inc. Other company and product names may be trademarks of the respective companies with which they are associated. ©2014 InvenSense, Inc. All rights reserved. Document Number: DS-ICS-40310-00 Revision: 1.2 Page 14 of 14