ICS‐40638
High AOP Analog MEMS Microphone with Differential Output
GENERAL DESCRIPTION
APPLICATIONS
The ICS‐40638 is an analog MEMS microphone with very high
dynamic range and capable of operation up to 105°C. The ICS‐
40638 includes a MEMS microphone element, an impedance
converter, and a differential output amplifier.
Other high‐performance specifications include 138 dB SPL
acoustic overload point, tight ±1 dB sensitivity tolerance and
enhanced immunity to both radiated and conducted RF
interference.
The ICS‐40638 is available in a small 3.50 mm × 2.65 mm ×
0.98 mm bottom port surface‐mount package.
Automotive
Still and video cameras
IoT devices
FEATURES
SPEC
PERFORMANCE
SNR
Current
AOP
63 dBA
170 µA
138 SPL
Differential non‐inverting analog output
−43 dBV sensitivity (differential)
±1 dB sensitivity tolerance
Extended frequency response from 35 Hz to 20 kHz
Enhanced RF immunity
−81 dB PSRR
3.50 × 2.65 × 0.98 mm surface‐mount package
Compatible with Sn/Pb and Pb‐free solder processes
RoHS/WEEE compliant
FUNCTIONAL BLOCK DIAGRAM
ORDERING INFORMATION
PART
ICS‐40638
EV_ICS‐40638‐FX
TEMP RANGE
PACKAGING
−40°C to +105°C
—
13” Tape and Reel
InvenSense, Inc. reserves the right to change the
detail specifications as may be required to permit
improvements in the design of its products.
InvenSense Inc.
1745 Technology Drive, San Jose, CA 95110 U.S.A
+1(408) 988–7339
www.invensense.com
Document Number: DS‐000281
Revision: 1.1
Rev Date: 4/15/2020
ICS‐40638
TABLE OF CONTENTS
General Description ..................................................................................................................................................................... 1
Applications ................................................................................................................................................................................. 1
Features ....................................................................................................................................................................................... 1
Functional Block Diagram ............................................................................................................................................................ 1
Ordering Information ................................................................................................................................................................... 1
Table of Contents .................................................................................................................................................................................... 2
Specifications .......................................................................................................................................................................................... 3
Table 1. Electrical Characteristics ................................................................................................................................................ 3
Absolute Maximum Ratings .................................................................................................................................................................... 4
Table 2. Absolute Maximum Ratings ........................................................................................................................................... 4
ESD Caution ................................................................................................................................................................................. 4
Soldering Profile ........................................................................................................................................................................... 5
Table 3. Recommended Soldering Profile* .................................................................................................................................. 5
Pin Configurations And Function Descriptions ....................................................................................................................................... 6
Table 4. Pin Function Descriptions ............................................................................................................................................... 6
Typical Performance Characteristics ....................................................................................................................................................... 7
Applications Information ........................................................................................................................................................................ 8
Codec Connection ........................................................................................................................................................................ 8
Supporting Documents ........................................................................................................................................................................... 9
Evaluation Board User Guide ....................................................................................................................................................... 9
Application Notes ........................................................................................................................................................................ 9
PCB Design And Land Pattern Layout ................................................................................................................................................... 10
PCB Material And Thickness ...................................................................................................................................................... 10
Handling Instructions ............................................................................................................................................................................ 11
Pick And Place Equipment ......................................................................................................................................................... 11
Reflow Solder ............................................................................................................................................................................. 11
Board Wash ............................................................................................................................................................................... 11
Outline Dimensions ............................................................................................................................................................................... 12
Ordering Guide .......................................................................................................................................................................... 12
Revision History ......................................................................................................................................................................... 13
Compliance Declaration Disclaimer ...................................................................................................................................................... 14
Page 2 of 14
Document Number: DS‐000281
Revision: 1.1
ICS‐40638
SPECIFICATIONS
TABLE 1. ELECTRICAL CHARACTERISTICS
TA = 25°C, VDD = 1.52 to 3.63 V, unless otherwise noted. Typical specifications are not guaranteed.
PARAMETER
CONDITIONS
MIN
TYP
MAX
PERFORMANCE
Directionality
Omni
Output Polarity
Non‐Inverted
Sensitivity
1 kHz, 94 dB SPL, differential
−44
−43
−42
Signal‐to‐Noise Ratio (SNR)
20 kHz bandwidth, A‐weighted
63
Equivalent Input Noise (EIN)
20 kHz bandwidth, A‐weighted
31
Derived from EIN and acoustic
Dynamic Range
107
overload point
Total Harmonic Distortion (THD)
105 dB SPL
0.2
1 kHz, 100 mV p‐p sine wave
‐81
Power Supply Rejection Ratio (PSRR)
superimposed on VDD = 2.75 V
217 Hz, 100 mVp‐p square wave
−111
Power Supply Rejection (PSR)
superimposed on VDD = 2.75 V
Acoustic Overload Point
10% THD
138
POWER SUPPLY
Supply Voltage (VDD)
Standard mode
1.52
3.63
Supply Current (IS)
VDD = 1.8 V
170
190
OUTPUT CHARACTERISTICS
Differential Output Impedance
355
Output Common Mode Voltage
OUTPUT+ and OUTPUT‐
1.0
Between OUTPUT+ and OUTPUT−
10
Output Differential Offset
Startup Time
Maximum Output Voltage
Noise Floor
Output to within ±0.5 dB of stable
sensitivity
138 dB SPL input
20 Hz to 20 kHz, A‐weighted, rms
Page 3 of 14
Document Number: DS‐000281
Revision: 1.1
15
1.0
−106
20
UNITS
dBV
dBA
dBA SPL
dB
NOTES
%
dB
dBV
dB SPL
V
µA
Ω
V
mV
ms
V rms
dBV
ICS‐40638
ABSOLUTE MAXIMUM RATINGS
Stress above those listed as Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only
and functional operation of the device at these conditions is not implied. Exposure to the absolute maximum ratings conditions for
extended periods may affect device reliability.
TABLE 2. ABSOLUTE MAXIMUM RATINGS
PARAMETER
RATING
Supply Voltage (VDD)
−0.3 V to +3.63 V
Mechanical Shock
10,000 g
Vibration
Per MIL‐STD‐883 Method 2007, Test Condition B
Temperature Range
Operating
−40°C to +105°C *
Storage
−55°C to +150°C
*Operating range guarantees mic functionality. Some performance may be reduced near temperature limits.
ESD CAUTION
ESD (electrostatic discharge) sensitive device.
Charged devices and circuit boards can
discharge without detection. Although this
product features patented or proprietary
protection circuitry, damage may occur on
devices subjected to high energy ESD.
Therefore proper ESD precautions should be
taken to avoid performance degradation or
loss of functionality.
Page 4 of 14
Document Number: DS‐000281
Revision: 1.1
ICS‐40638
SOLDERING PROFILE
CRITICAL ZONE
TL TO TP
tP
TP
TEMPERATURE
RAMP-UP
TL
tL
TSMAX
TSMIN
tS
RAMP-DOWN
PREHEAT
t25°C TO PEAK TEMPERATURE
TIME
Figure 1. Recommended Soldering Profile Limits
TABLE 3. RECOMMENDED SOLDERING PROFILE*
PROFILE FEATURE
Average Ramp Rate (TL to TP)
Sn63/Pb37
1.25°C/sec max
Pb‐Free
1.25°C/sec max
100°C
100°C
150°C
200°C
60 sec to 75 sec
1.25°C/sec
45 sec to 75 sec
183°C
60 sec to 75 sec
1.25°C/sec
~50 sec
217°C
215°C +3°C/−3°C
260°C +0°C/−5°C
Time Within +5°C of Actual Peak
Temperature (tP)
20 sec to 30 sec
20 sec to 30 sec
Ramp‐Down Rate
3°C/sec max
3°C/sec max
Time +25°C (t25°C) to Peak Temperature
5 min max
5 min max
Minimum Temperature
(TSMIN)
Maximum Temperature
Preheat
(TSMAX)
Time (TSMIN to TSMAX), tS
Ramp‐Up Rate (TSMAX to TL)
Time Maintained Above Liquidous (tL)
Liquidous Temperature (TL)
Peak Temperature (TP)
*Note: The reflow profile in Table 3 is recommended for board manufacturing with InvenSense MEMS microphones. All microphones
are also compatible with the J‐STD‐020 profile
Page 5 of 14
Document Number: DS‐000281
Revision: 1.1
ICS‐40638
PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS
3
4
OUTPUT−
GND
GND
2
OUTPUT+
5
1
VDD
Figure 2. Pin Configuration (Top View, Terminal Side Down)
TABLE 4. PIN FUNCTION DESCRIPTIONS
PIN
NAME
FUNCTION
1
2
OUTPUT+
OUTPUT−
Analog Output Signal+
Analog Output Signal−
3
4
5
GND
GND
VDD
Ground
Ground
Power Supply
Page 6 of 14
Document Number: DS‐000281
Revision: 1.1
ICS‐40638
TYPICAL PERFORMANCE CHARACTERISTICS
20
THD+N (%)
NORMALIZED AMPLITUDE (dB)
10.0
10
0
1.0
0.1
‐10
‐20
0.0
10
100
1000
FREQUENCY (Hz)
10000
90
Figure 3. Typical Frequency Response (Measured)
130
140
‐40.0
0
‐20
‐41.0
SENSITIVITY (dBV)
‐40
PSRR (dB)
110
120
INPUT AMPLITUDE (dB SPL)
Figure 4. THD + N vs. Input Amplitude
‐60
‐80
‐42.0
‐43.0
‐44.0
‐100
‐45.0
‐120
100
1000
FREQUENCY (Hz)
‐40
10000
‐20
0
20
40
TEMPERATURE (°C)
10.0
1.0
0.1
0.0
‐40
‐20
0
20
40
TEMPERATURE (°C)
60
80
100
Figure 7. THD vs. Temperature
Page 7 of 14
Document Number: DS‐000281
Revision: 1.1
60
Figure 6. Sensitivity vs. Temperature
Figure 5. Power‐Supply Rejection Ratio (PSRR) vs. Frequency
THD @ 105dB SPL (%)
100
80
100
ICS‐40638
APPLICATIONS INFORMATION
CODEC CONNECTION
The ICS‐40638 output can be connected to a dedicated codec microphone input (see Figure 8) or to a high input impedance gain
stage. A 0.1 µF ceramic capacitor placed close to the ICS‐40638 supply pin is used for testing and is recommended to adequately
decouple the microphone from noise on the power supply. A dc blocking capacitor is required at the output of the microphone. This
capacitor creates a high‐pass filter with a corner frequency at
fC = 1/(2π × C × R)
where R is the input impedance of the codec.
A minimum value of 2.2 μF is recommended in Figure 8 for codecs, which may have a very low input impedance at some PGA gain
settings.
Figure 8. ICS‐40638 Connected to a Differential‐Input Codec
Page 8 of 14
Document Number: DS‐000281
Revision: 1.1
ICS‐40638
SUPPORTING DOCUMENTS
For additional information, see the following documents.
EVALUATION BOARD USER GUIDE
AN‐000012, Differential Analog Output MEMS Microphone Flex Evaluation Board
APPLICATION NOTES
AN‐100, MEMS Microphone Handling and Assembly Guide
AN‐1003, Recommendations for Mounting and Connecting the InvenSense Bottom‐Ported MEMS Microphones
AN‐1112, Microphone Specifications Explained
AN‐1124, Recommendations for Sealing InvenSense Bottom‐Port MEMS Microphones from Dust and Liquid Ingress
AN‐1140, Microphone Array Beamforming
AN‐1165, Op Amps for Microphone Preamp Circuits
AN‐000161, ESD Design and Test Guidelines for MEMS Microphones
Page 9 of 14
Document Number: DS‐000281
Revision: 1.1
ICS‐40638
PCB DESIGN AND LAND PATTERN LAYOUT
Lay out the PCB land pattern for the ICS‐40638 at a 1:1 ratio to the solder pads on the microphone package (see Figure 9.) Take care
to avoid applying solder paste to the sound hole in the PCB. Figure 10 shows a suggested solder paste stencil pattern layout.
The response of the ICS‐40638 is not affected by the PCB hole size, as long as the hole is not smaller than the sound port of the micro‐
phone (0.375 mm in diameter). A 0.5 mm to 1 mm diameter for the hole is recommended.
Align the hole in the microphone package with the hole in the PCB. The exact degree of the alignment does not affect the
performance of the microphone as long as the holes are not partially or completely blocked.
0.522x0.725(4X)
Ø1.625
Ø1.025
1.675
0.838
0.822
1.252
Figure 9. Recommended PCB Land Pattern Layout
0.422x0.625(4X)
Ø1.625
Ø1.125
1.675
0.1(4x)
0.822
1.252
Figure 10. Recommended Solder Paste Stencil Pattern Layout
PCB MATERIAL AND THICKNESS
The performance of the ICS‐40638 is not affected by PCB thickness. The ICS‐40638 can be mounted on either a rigid or flexible PCB.
A flexible PCB with the microphone can be attached directly to the device housing with an adhesive layer. This mounting method
offers a reliable seal around the sound port while providing the shortest acoustic path for good sound quality.
Page 10 of 14
Document Number: DS‐000281
Revision: 1.1
ICS‐40638
HANDLING INSTRUCTIONS
PICK AND PLACE EQUIPMENT
The MEMS microphone can be handled using standard pick‐and‐place and chip shooting equipment. Take care to avoid damage to the
MEMS microphone structure as follows:
Use a standard pickup tool to handle the microphone. Because the microphone hole is on the bottom of the package, the
pickup tool can make contact with any part of the lid surface.
Do not pick up the microphone with a vacuum tool that makes contact with the bottom side of the microphone.
Do not pull air out of or blow air into the microphone port.
Do not use excessive force to place the microphone on the PCB.
REFLOW SOLDER
For best results, the soldering profile must be in accordance with the recommendations of the manufacturer of the solder paste used to
attach the MEMS microphone to the PCB. It is recommended that the solder reflow profile not exceed the limit conditions specified
in Figure 1 and Table 3.
BOARD WASH
When washing the PCB, ensure that water does not make contact with the microphone port. Do not use blow‐off procedures or
ultrasonic cleaning.
Page 11 of 14
Document Number: DS‐000281
Revision: 1.1
ICS‐40638
OUTLINE DIMENSIONS
d
3.50
(4X)
0.10
0.522X0.725 (4x)
j 0.10 m C A B
A
PIN 1
CORNER
0.125
PIN 1
CORNER
0.82
Ø1.625
Ø1.025
(2.45)
2.65
2.650
1
2
5
4
Ø0.375
0.950
1.675
1.33
3
0.300
0.125
B
(3.30)
1.040
1.513
3.500
BOTTOM VIEW
TOP VIEW
f
0.10 C
0.98
(0.254)
SIDE VIEW
C
Figure 11. 5‐Terminal Chip Array Small Outline No Lead Cavity
3.50 mm × 2.65 mm × 0.98 mm Body
Dimensions shown in millimeters
Figure 12. Package Marking Specification (Top View, not to scale)
ORDERING GUIDE
PART
ICS‐40638
EV_ICS‐40638‐FX
TEMP RANGE
−40°C to
+105°C
—
PACKAGE
5‐Terminal LGA_CAV
QUANTITY
10,000
PACKAGING
13” Tape and Reel
Flexible Evaluation Board
—
Page 12 of 14
Document Number: DS‐000281
Revision: 1.1
ICS‐40638
REVISION HISTORY
REVISION DATE
REVISION
DESCRIPTION
11/1/2018
0.1
Initial Preliminary Version
1/29/2020
1.0
Initial Release
4/15/2020
1.1
Corrected typos
Page 13 of 14
Document Number: DS‐000281
Revision: 1.1
ICS‐40638
COMPLIANCE DECLARATION DISCLAIMER
InvenSense believes the environmental and other compliance information given in this document to be correct but cannot
guarantee accuracy or completeness. Conformity documents substantiating the specifications and component characteristics are on
file. InvenSense subcontracts manufacturing, and the information contained herein is based on data received from vendors and
suppliers, which has not been validated by InvenSense.
This information furnished by InvenSense, Inc. (“InvenSense”) is believed to be accurate and reliable. However, no responsibility is assumed by InvenSense for its use,
or for any infringements of patents or other rights of third parties that may result from its use. Specifications are subject to change without notice. InvenSense
reserves the right to make changes to this product, including its circuits and software, in order to improve its design and/or performance, without prior notice.
InvenSense makes no warranties, neither expressed nor implied, regarding the information and specifications contained in this document. InvenSense assumes no
responsibility for any claims or damages arising from information contained in this document, or from the use of products and services detailed therein. This includes,
but is not limited to, claims or damages based on the infringement of patents, copyrights, mask work and/or other intellectual property rights.
Certain intellectual property owned by InvenSense and described in this document is patent protected. No license is granted by implication or otherwise under any
patent or patent rights of InvenSense. This publication supersedes and replaces all information previously supplied. Trademarks that are registered trademarks are
the property of their respective companies. InvenSense sensors should not be used or sold in the development, storage, production or utilization of any conventional
or mass‐destructive weapons or for any other weapons or life threatening applications, as well as in any other life critical applications such as medical equipment,
transportation, aerospace and nuclear instruments, undersea equipment, power plant equipment, disaster prevention and crime prevention equipment.
©2019 InvenSense. All rights reserved. InvenSense, MotionTracking, MotionProcessing, MotionProcessor, MotionFusion, MotionApps, DMP, AAR, and the InvenSense
logo are trademarks of InvenSense, Inc. The InvenSense logo is a trademark of InvenSense Corporation. Other company and product names may be trademarks of
the respective companies with which they are associated.
©2019 InvenSense. All rights reserved.
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Document Number: DS‐000281
Revision: 1.1
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