ICS-43434
Multi-Mode Microphone with I2S Digital Output
GENERAL DESCRIPTION
APPLICATIONS
•
•
•
•
•
•
•
2
The ICS-43434 is digital I S output bottom port microphone. The
complete ICS-43434 solution consists of a MEMS sensor, signal
conditioning, an analog-to-digital converter, decimation and
antialiasing filters, power management, and an industry standard
24-bit I²S interface. The I²S interface allows the
ICS-43434 to connect directly to digital processors, such as DSPs
and microcontrollers, without the need for an audio codec in the
system.
The ICS-43434 has multiple modes of operation: High
Performance, Low Power (AlwaysOn) and Sleep. The ICS-43434
has high SNR and 120 dB SPL AOP in all operational modes.
The ICS-43434 has a high SNR of 65 dBA and a wideband frequency
response. The sensitivity tolerance of the ICS-43434 is ±1 dB,
which enables high-performance microphone arrays without
the need for system calibration.
The ICS-43434 is available in a small 3.50 mm × 2.65 mm ×
0.98 mm surface-mount package. The ICS-43434 is functioncompatible with the ICS-43432 while providing equivalent
electro-acoustic performance at lower power consumption and
in a smaller package.
FUNCTIONAL BLOCK DIAGRAM
FEATURES
LR
GND
VDD
Sensitivity
SNR
Current
AOP
Sample Rate
−26 dB FS ±1 dB
65 dBA
490 µA
120 dB SPL
23 – 51.6 kHz
−26 dB FS ±1 dB
64 dBA
230 µA
120 dB SPL
6.25 – 18.75 kHz
•
•
Digital I²S interface with high precision 24-bit data
Wide frequency response from 60 Hz to 20 kHz
High power supply rejection: −100 dB FS
Small 3.50 mm × 2.65 mm × 0.98 mm surface-mount
package
Compatible with Sn/Pb and Pb-free solder processes
RoHS/WEEE compliant
PART
I2S
SERIAL
PORT
ICS-43434
EV_ICS-43434-FX
SCK
TEMP RANGE
PACKAGING
−40°C to +85°C
—
13” Tape & Reel
SD
WS
InvenSense reserves the right to change the detail
specifications as may be required to permit
improvements in the design of its products.
LOW-POWER
MODE
FILTER
HARDWARE
CONTROL
HIGH PERFORMANCE
MODE
•
•
•
•
ICS-43434
POWER
MANAGEMENT
SPEC
ORDERING INFORMATION
ADC
Wearables
Smart Televisions
Remote Controls
IoT Devices
Teleconferencing Systems
Gaming Consoles
Security Systems
InvenSense Inc.
1745 Technology Drive, San Jose, CA 95110 U.S.A
+1(408) 988–7339
www.invensense.com
Document Number: DS-000069
Revision: 1.2
Release Date: 08/29/2016
ICS-43434
TABLE OF CONTENTS
General Description ..................................................................................................................................................................... 1
Applications .................................................................................................................................................................................. 1
Features ....................................................................................................................................................................................... 1
Functional Block Diagram ............................................................................................................................................................. 1
Ordering Information ................................................................................................................................................................... 1
Table of Contents .................................................................................................................................................................................... 2
Specifications .......................................................................................................................................................................................... 4
Table 1. Acoustical/Electrical Characteristics – General .............................................................................................................. 4
Table 2. Acoustical/Electrical Characteristics – High-Performance Mode ................................................................................... 4
Table 3. Acoustical/Electrical Characteristics – Low-Power Mode .............................................................................................. 5
Table 4. Digital Filter Characteristics ............................................................................................................................................ 5
Table 5. I²S Digital INPUT/Output ................................................................................................................................................ 6
Timing Diagram ............................................................................................................................................................................ 7
Absolute Maximum Ratings .................................................................................................................................................................... 8
Table 6. Absolute Maximum Ratings ............................................................................................................................................ 8
ESD Caution .................................................................................................................................................................................. 8
Soldering Profile ........................................................................................................................................................................... 9
Table 7. Recommended Soldering Profile .................................................................................................................................... 9
Pin Configurations And Function Descriptions ...................................................................................................................................... 10
Table 8. Pin Function Descriptions ............................................................................................................................................. 10
Typical Performance Characteristics ..................................................................................................................................................... 11
Theory of Operation .............................................................................................................................................................................. 12
Power Management ................................................................................................................................................................... 12
Startup and Normal Operation ....................................................................................................................................... 12
Standby Mode ................................................................................................................................................................. 12
Synchronizing Microphones ....................................................................................................................................................... 12
I²S Data Interface ....................................................................................................................................................................... 12
Data Output Mode .......................................................................................................................................................... 12
Data Word Length ........................................................................................................................................................... 12
Data Word Format .......................................................................................................................................................... 12
Data Output Format ........................................................................................................................................................ 13
Digital Microphone Sensitivity ................................................................................................................................................... 13
Digital Filter Characteristics ....................................................................................................................................................... 14
High-Pass Filter ............................................................................................................................................................... 14
Low-Pass Decimation Filter ............................................................................................................................................. 14
Applications Information ....................................................................................................................................................................... 15
Low-Power Mode ....................................................................................................................................................................... 15
Document Number: DS-000069
Revision: 1.2
Page 2 of 21
ICS-43434
Sleep Mode ................................................................................................................................................................................ 15
SD Output Drive Strength ........................................................................................................................................................... 15
Power Supply Decoupling .......................................................................................................................................................... 15
Supporting Documents .......................................................................................................................................................................... 16
Evaluation Board User Guide ..................................................................................................................................................... 16
Application Notes ....................................................................................................................................................................... 16
PCB Design And Land Pattern Layout .................................................................................................................................................... 17
PCB Material And Thickness ....................................................................................................................................................... 17
Handling Instructions ............................................................................................................................................................................ 18
Pick And Place Equipment .......................................................................................................................................................... 18
Reflow Solder ............................................................................................................................................................................. 18
Board Wash ................................................................................................................................................................................ 18
Outline Dimensions ............................................................................................................................................................................... 19
Ordering Guide ........................................................................................................................................................................... 19
Revision History .......................................................................................................................................................................... 20
Compliance Declaration Disclaimer ...................................................................................................................................................... 21
Document Number: DS-000069
Revision: 1.2
Page 3 of 21
ICS-43434
SPECIFICATIONS
TABLE 1. ACOUSTICAL/ELECTRICAL CHARACTERISTICS – GENERAL
TA = 25°C, VDD = 1.8 to 3.3 V, fS = 48 kHz, CLOAD = 30 pF unless otherwise noted. Typical specifications are not guaranteed.
PARAMETER
CONDITIONS
MIN
TYP
MAX
UNITS
PERFORMANCE
Directionality
Omni
Output Polarity
Input acoustic pressure vs.
Non-Inverted
output data
Supply Voltage (VDD)
1.65
3.63
V
Sleep Mode Current (IS)
fS < 3.125 kHz
12
20
µA
TABLE 2. ACOUSTICAL/ELECTRICAL CHARACTERISTICS – HIGH-PERFORMANCE MODE
NOTES
TA = 25°C, VDD = 1.8 to 3.3 V, fS = 48 kHz, CLOAD = 30 pF unless otherwise noted. Typical specifications are not guaranteed.
PARAMETER
CONDITIONS
MIN
TYP
MAX
UNITS
NOTES
Sensitivity
1 kHz, 94 dB SPL
−27
−26
−25
dB FS
1
Signal-to-Noise Ratio (SNR)
20 kHz bandwidth, A-weighted
65
dBA
Equivalent Input Noise (EIN)
20 kHz bandwidth, A-weighted
29
dBA SPL
Dynamic Range
Derived from EIN and acoustic
91
dB
overload point
Total Harmonic Distortion (THD)
105 dB SPL
0.2
1
%
Power Supply Rejection (PSR)
217 Hz, 100 mV p-p square wave
superimposed on VDD = 1.8 V, A
−99
dB FS
weighted
Power Supply Rejection—Swept
1 kHz sine wave, VDD = 1.8 V
−106
dB FS
Sine
Acoustic Overload Point
10% THD
120
dB SPL
20 Hz to 20 kHz, A-weighted,
Noise Floor
−90
dB FS
rms
Supply Current (IS)
VDD = 1.8 V, no load
490
550
µA
Note 1: Sensitivity is relative to the RMS level of a sine wave with positive amplitude equal to 100% 1s density and negative amplitude equal to 0% 1s density.
Document Number: DS-000069
Revision: 1.2
Page 4 of 21
ICS-43434
TABLE 3. ACOUSTICAL/ELECTRICAL CHARACTERISTICS – LOW-POWER MODE
TA = 25°C, VDD = 1.8 to 3.3 V, fS = 16 kHz, CLOAD = 30 pF unless otherwise noted. Typical specifications are not guaranteed.
PARAMETER
CONDITIONS
MIN
TYP
MAX
UNITS
NOTES
Sensitivity
1 kHz, 94 dB SPL
−27
−26
−25
dB FS
1
Signal-to-Noise Ratio (SNR)
20 kHz bandwidth, A-weighted
64
dBA
Equivalent Input Noise (EIN)
20 kHz bandwidth, A-weighted
30
dBA SPL
Dynamic Range
Derived from EIN and acoustic
90
dB
overload point
Total Harmonic Distortion (THD)
105 dB SPL
0.2
1
%
Power Supply Rejection (PSR)
217 Hz, 100 mV p-p square wave
superimposed on VDD = 1.8 V, A
−98
dB FS
weighted
Power Supply Rejection—Swept
1 kHz sine wave, VDD = 1.8 V
−100
dB FS
Sine
Acoustic Overload Point
10% THD
120
dB SPL
20 kHz bandwidth, A-weighted,
Noise Floor
−90
dB FS
rms
Supply Current (IS)
VDD = 1.8 V, no load
230
300
µA
Note 1: Sensitivity is relative to the RMS level of a sine wave with positive amplitude equal to 100% 1s density and negative amplitude equal to 0% 1s density.
TABLE 4. DIGITAL FILTER CHARACTERISTICS
PARAMETER
Group Delay
Pass Band Ripple
Stop Band Attenuation
Pass Band
Document Number: DS-000069
Revision: 1.2
CONDITIONS
Acoustic input to digital output –
2
includes filter and I S serial
output
MIN
TYP
2/fS
sec.
±0.3
58
dB
dB
fs = 48 kHz
20
kHz
Page 5 of 21
MAX
UNITS
NOTES
ICS-43434
TABLE 5. I²S DIGITAL INPUT/OUTPUT
–40°C < TA < +85°C, 1.8 V < VDD < 3.3 V, unless otherwise noted.
PARAMETER
CONDITIONS
MODE SWITCHING
Sleep Time
Time from fS falling
< 3.125 kHz
Wake-Up Time
High-Performance mode,
Sleep Mode to
fWS > 21.875 kHz, output
within 1 dB of final sensitivity,
power on
Wake-Up Time
Low-Power Mode, Sleep Mode
to fWS > 6.25 kHz, output
within 1 dB of final sensitivity,
power on
Switching time
Between Low-Power and
High-Performance Modes
INPUT/OUTPUT
SCK period (tSCP)
Input clock period
Sampling Frequency (fS)
Sleep Mode
Low-Power Mode
High-Performance Mode
SCK high (tSCH)
MIN
MAX
UNITS
NOTES
1
ms
20
ms
20
ms
10
ms
303
6.25
23
50
2500
3.125
18.75
51.6
ns
kHz
kHz
kHz
ns
SCK low (tSCL)
50
ns
WS setup (tWSS)
0
ns
WS hold (tWSH)
20
ns
SCK Duty Cycle
From SCK falling to valid SD
data
From SCK falling to SD output
tristated
SCK rise time (10% to 90%
level)
SCK fall time (90% to 10%
level)
40
60
75
%
ns
76
ns
25
ns
1
25
ns
1
Voltage Input Low (VIL)
0
0.3 × VDD
V
Voltage Input High (VIH)
0.7 × VDD
VDD
V
Voltage Output Low (VOL)
0
0.35 × VDD
V
Voltage Output High (VOH)
0.65 × VDD
VDD
V
Maximum Load
fS = 48 kHz
85
pF
SD Data Valid (tSDV)
SD Data Disable (tSDD)
tRISE
tFALL
DIGITAL INPUT
SD DIGITAL OUTPUT
Note 1: Guaranteed by design
Document Number: DS-000069
Revision: 1.2
Page 6 of 21
ICS-43434
TIMING DIAGRAM
Figure 1. Serial Data Port Timing
Document Number: DS-000069
Revision: 1.2
Page 7 of 21
ICS-43434
ABSOLUTE MAXIMUM RATINGS
Stress above those listed as Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only
and functional operation of the device at these conditions is not implied. Exposure to the absolute maximum ratings conditions for
extended periods may affect device reliability.
TABLE 6. ABSOLUTE MAXIMUM RATINGS
PARAMETER
RATING
Supply Voltage (VDD)
−0.3 V to +3.63 V
Digital Pin Input Voltage
−0.3 V to VDD + 0.3 V or 3.63 V, whichever is less
Sound Pressure Level
160 dB
Mechanical Shock
10,000 g
Vibration
Per MIL-STD-883 Method 2007, Test Condition B
Temperature Range
Biased
−40°C to +85°C
Storage
−55°C to +150°C
ESD CAUTION
Document Number: DS-000069
Revision: 1.2
ESD (electrostatic discharge) sensitive device.
Charged devices and circuit boards can
discharge without detection. Although this
product features patented or proprietary
protection circuitry, damage may occur on
devices subjected to high energy ESD.
Therefore proper ESD precautions should be
taken to avoid performance degradation or
loss of functionality.
Page 8 of 21
ICS-43434
SOLDERING PROFILE
CRITICAL ZONE
TL TO TP
tP
TP
TEMPERATURE
RAMP-UP
TL
tL
TSMAX
TSMIN
tS
RAMP-DOWN
PREHEAT
t25°C TO PEAK TEMPERATURE
TIME
Figure 2. Recommended Soldering Profile Limits
TABLE 7. RECOMMENDED SOLDERING PROFILE
PROFILE FEATURE
Average Ramp Rate (TL to TP)
Preheat
Sn63/Pb37
1.25°C/sec max
Minimum Temperature
100°C
(TSMIN)
Minimum Temperature
150°C
(TSMIN)
Time (TSMIN to TSMAX), tS 60 sec to 75 sec
Pb-Free
1.25°C/sec max
100°C
200°C
60 sec to 75 sec
Ramp-Up Rate (TSMAX to TL)
1.25°C/sec
1.25°C/sec
Time Maintained Above Liquidous (tL)
45 sec to 75 sec
~50 sec
Liquidous Temperature (TL)
Peak Temperature (TP)
183°C
217°C
215°C +3°C/−3°C
260°C +0°C/−5°C
Time Within +5°C of Actual Peak
Temperature (tP)
20 sec to 30 sec
20 sec to 30 sec
Ramp-Down Rate
3°C/sec max
3°C/sec max
Time +25°C (t25°C) to Peak Temperature 5 min max
5 min max
*The reflow profile in Table 7 is recommended for board manufacturing with InvenSense MEMS microphones. All microphones are
also compatible with the J-STD-020 profile
Document Number: DS-000069
Revision: 1.2
Page 9 of 21
ICS-43434
PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS
Figure 3. Pin Configuration (top view, terminal side down)
TABLE 8. PIN FUNCTION DESCRIPTIONS
PIN
NAME
TYPE
FUNCTION
1
WS
Input
Serial Data-Word Select for I²S Interface.
2
LR
Input
Left/Right channel select. When set low, the microphone outputs its signal in the left
This pin includes an internal 100 kΩ pull-down resistor. If the pin is pulled to VDD in
channel of the I²S frame. When set high, the microphone outputs its signal in the right
standby mode, then VDD/100 kΩ current will sink through the pin.
channel.
3
GND
Ground
Ground. Connect to ground on the PCB.
4
5
SCK
VDD
Input
Power
Serial Data Clock for I²S Interface.
Power, 1.65 to 3.63 V. This pin should be decoupled to GND with a 0.1 μF capacitor.
6
SD
Output
Serial Data Output for I²S Interface. This pin tristates when not actively driving the
appropriate output channel. The SD trace should have a 100 kΩ pull-down resistor to
discharge the line during the time that all microphones on the bus have tristated their
outputs.
Document Number: DS-000069
Revision: 1.2
Page 10 of 21
ICS-43434
TYPICAL PERFORMANCE CHARACTERISTICS
30
10
THD+N (%)
NORMALIZED AMPLITUDE (dB)
LOW-POWER MODE
10
20
0
-10
HIGH-PERFORMANCE MODE
1
0.1
-20
0.01
-30
10
100
1000
90
10000
110
120
130
INPUT AMPLITUDE (dB SPL)
FREQUENCY (Hz)
Figure 5. Total Harmonic Distortion + Noise (THD+N) vs. Input SPL
Figure 4. Typical Frequency Response (Measured)
0
0
OUTPUT AMPLITUDE (dB FS)
LOW-POWER MODE
-20
HIGH-PERFORMANCE MODE
-40
PSR (dB FS)
100
-60
-80
-10
-20
-30
-100
-40
-120
100
1,000
90
10,000
100
110
FREQUENCY (Hz)
Figure 7. Linearity
Figure 6. PSR vs. Frequency, 100 mV p-p Swept Sine Wave
Document Number: DS-000069
Revision: 1.2
120
INPUT AMPLITUDE (dB SPL)
Page 11 of 21
ICS-43434
THEORY OF OPERATION
POWER MANAGEMENT
The ICS-43434 has three power states: high-performance mode, low-power mode and standby mode.
Startup and Normal Operation
2
The start-up time of the ICS-43434 is less than 20 ms. The I S data from the microphone is valid to be used as soon as the data is
being output. The part is in normal operation (high-performance and low-power modes) when SCK and WS are active.
Standby Mode
The microphone enters standby mode when the frequency of SCK falls below about 200 kHz. It is recommended to enter standby
mode by stopping both the SCK and WS clock signals and pulling those signals to ground to avoid drawing current through the WS
pin’s internal pull-down resistor. The timing for exiting standby mode is the same as normal startup.
It is not recommended to supply active clocks (WS and SCK) to the ICS-43434 while there is no power supplied to VDD. Doing this
continuously turns on ESD protection diodes, which may affect long-term reliability of the microphone.
SYNCHRONIZING MICROPHONES
Stereo ICS-43434 microphones are synchronized by the WS signal, so audio captured from two microphones sharing the same clock
2
will be in sync. The two microphones will synchronously sample the acoustic signals at the beginning of the I S frame (WS falling
edge).
I²S DATA INTERFACE
The slave serial data port’s format is I²S, 24-bit, twos complement. There must be 64 SCK cycles in each WS stereo frame. The LR
control pin determines whether the ICS-43434 outputs data in the left or right channel. When set to the left channel, the data will be
output following WS’s falling edge and when set to output on the right channel, data will be output following WS’s rising edge.
For a stereo application, the SD pins of the left and right ICS-43434 microphones should be tied together as shown in Figure 8. The
format of a stereo I²S data stream is shown in Figure 9. Figure 10 and Figure 11 show the formats of a mono microphone data
stream for left and right microphones, respectively.
Data Output Mode
The output data pin (SD) is tristated when it is not actively driving I²S output data. SD immediately tristates after the LSB
is output so that another microphone can drive the common data line.
The SD trace should have a pull-down resistor to discharge the line during the time that all microphones on the bus have tristated
their outputs. A 100 kΩ resistor is sufficient for this, as shown in Figure 8. If the SD line needs to be discharged faster than a 100 kΩ
resistor can, a smaller resistor, such as 10 kΩ, can be used.
Data Word Length
The output data word length is 24 bits per channel.
Data Word Format
The default data format is I²S (twos complement), MSB-first. In this format, the MSB of each word is delayed by one SCK cycle from
the start of each half-frame.
Document Number: DS-000069
Revision: 1.2
Page 12 of 21
ICS-43434
FROM VOLTAGE
REGUL ATOR
(1.8V TO 3.3V)
SD
WS
SCK
SYSTEM MASTER
(DSP, MICROCONTROLLER,
CODEC)
0.1µF
0.1µF
VDD
LR
LEFT
ICS-43434
VDD
VDD
SCK
SCK
WS
WS
SD
SD
100kΩ
GND
LR
RIGHT
ICS-43434
GND
Figure 8. System Block Diagram
Figure 9. Stereo Output I²S Format
Figure 10. Mono Output I²S Format Left Channel (LR = 0)
Figure 11. Mono Output I²S Format Right Channel (LR = 1)
Data Output Format
The output data word length is 24 bits/channel. The data word format is 2’s complement, MSB-first.
The output data pin (SD) is tri-stated when it is not actively driving output data. SD will immediately tri-state after the LSB is output
so that another microphone can drive the common data line.
DIGITAL MICROPHONE SENSITIVITY
The sensitivity of a digital output microphone is specified in units of dB FS (decibels relative to a full-scale digital output). A 0 dB FS
sine wave is defined as a signal whose peak just touches the full-scale code of the digital word (see Figure 5). This measurement
convention means that signals with a different crest factor may have an RMS level higher than 0 dB FS. For example, a full-scale
square wave has an RMS level of 3 dB FS.
Document Number: DS-000069
Revision: 1.2
Page 13 of 21
ICS-43434
1.0
0.8
DIGITAL AMPLITUDE (D)
0.6
0.4
0.2
0
–0.2
–0.4
–0.6
–0.8
–1.0
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
TIME (ms)
0.9
1.0
Figure 11. 1 kHz, 0 dB FS Sine Wave
The definition of a 0 dB FS signal must be understood when measuring the sensitivity of the ICS-43434. An acoustic input signal of a
1 kHz sine wave at 94 dB SPL applied to the ICS-43434 results in an output signal with a −26 dB FS level. This means that the output
digital word peaks at −26 dB below the digital full-scale level. A common misunderstanding is that the output has an RMS level of
−29 dB FS; however, this is not the case because of the definition of a 0 dB FS sine wave.
There is no commonly accepted unit of measurement to express the instantaneous level of a digital signal output from the
microphone, as opposed to the RMS level of the signal. Some measurement systems express the instantaneous level of an individual
sample in units of D, where 1.0 D is digital full scale (see Figure 11). In this case, a −26 dB FS sine wave has peaks at 0.05 D.
For more information about digital microphone sensitivity, see the AN-1112 Application Note, Microphone Specifications Explained.
DIGITAL FILTER CHARACTERISTICS
The ICS-43434 has an internal digital bandpass filter. A high-pass filter eliminates unwanted low frequency signals. A low-pass
decimation filter scales the pass band with the sampling frequency and performs required out-of-band noise reduction.
High-Pass Filter
The ICS-43434 incorporates a high-pass filter to remove DC and low frequency components. This high pass filter has a −3 dB corner
frequency of 24 Hz and does not scale with the sampling rate.
Low-Pass Decimation Filter
The analog-to-digital converter in the ICS-43434 is a single-bit, high order, sigma-delta (Σ-Δ) running at a high oversampling ratio.
The noise shaping of the converter pushes the majority of the noise well above the audio band and gives the microphone a wide
dynamic range. However, it does require a good quality low-pass decimation filter to eliminate the high frequency noise.
The pass band of the filter extends to 0.417 × fS and, in that band, has only ±0.3 dB of ripple. A 48 kHz sampling rate results in a pass
band of 20 kHz and a half amplitude corner at 24 kHz; the stop-band attenuation of the filter is 58 dB. Note that these filter
specifications scale with sampling frequency.
Document Number: DS-000069
Revision: 1.2
Page 14 of 21
ICS-43434
APPLICATIONS INFORMATION
LOW-POWER MODE
Low Power Mode (LPM) enables the ICS-43434 to be used in an AlwaysOn listening mode for keyword spotting and ambient sound
analysis. The ICS-43434 will enter LPM when the sampling frequency is between 6.25 and 18.75 kHz. In this mode, the microphone
consumes only 230 µA while retaining high electro-acoustic performance.
When one microphone is in LPM for AlwaysOn listening, a second microphone sharing the same data line may be powered down. In
this case, where one microphone is powered up and another is powered down by disabling the VDD supply or in sleep mode by
reducing the frequency of a separate clock source, the disabled microphone does not present a load to the signal on the LPM
microphone’s DATA pin.
SLEEP MODE
The microphone enters sleep mode when the sampling frequency falls below 3.125 kHz. In this mode, the microphone data output is in
a high impedance state. The current consumption in sleep mode is 12 µA.
The ICS-43434 enters sleep mode within 1 ms of the sampling frequency falling below 3.125 kHz. The microphone wakes up
from sleep mode and begins to output data 32,768 SCK cycles after the clock becomes active. For a 3.072 MHz clock (fS = 48 kHz), the
microphone starts to output data in 10.7 ms. For a 2.4 MHz clock (fS = 37.5 kHz), the microphone starts to output data in 13.7 ms.
The wake-up time (Table 5) indicates the time from when the clock is enabled to when the ICS-43434 outputs data within 1 dB of its
settled sensitivity.
SD OUTPUT DRIVE STRENGTH
The SD data output pin must drive a load that includes the PCB trace and the tri-stated inputs of the other ICS-43434 SD pins
connected to that same trace. The tri-stated load capacitance of the ICS-43434 SD pin is about 6 pF. The ICS-43434 has been
designed to drive a load of 85 pF.
POWER SUPPLY DECOUPLING
For best performance and to avoid potential parasitic artifacts, placing a 0.1 µF ceramic type X7R or better capacitor between
Pin 5 (VDD) and ground is strongly recommended. The capacitor should be placed as close to Pin 3 as possible.
The connections to each side of the capacitor should be as short as possible, and the trace should stay on a single layer with no vias.
For maximum effectiveness, locate the capacitor equidistant from the power and ground pins or, when equidistant placement is not
possible, slightly closer to the power pin. Thermal connections to the ground planes should be made on the far side of the capacitor,
as shown in Figure 12.
VDD GND
CAPACITOR
TO V DD
TO GND
Figure 12. Recommended Power Supply Bypass Capacitor Layout
Document Number: DS-000069
Revision: 1.2
Page 15 of 21
ICS-43434
SUPPORTING DOCUMENTS
For additional information, see the following documents.
EVALUATION BOARD USER GUIDE
2
AN-000088, Bottom-Port I S Output MEMS Microphone Evaluation Board
APPLICATION NOTES
AN-100, MEMS Microphone Handling and Assembly Guide
AN-1003, Recommendations for Mounting and Connecting the InvenSense Bottom-Ported MEMS Microphones
AN-1112, Microphone Specifications Explained
AN-1124, Recommendations for Sealing InvenSense Bottom-Port MEMS Microphones from Dust and Liquid Ingress
AN-1140, Microphone Array Beamforming
Document Number: DS-000069
Revision: 1.2
Page 16 of 21
ICS-43434
PCB DESIGN AND LAND PATTERN LAYOUT
The recommended PCB land pattern for the ICS-43434 should be laid out to a 1:1 ratio to the solder pads on the microphone
package, as shown in Figure 13. Take care to avoid applying solder paste to the sound hole in the PCB. A suggested solder paste
stencil pattern layout is shown in Figure 14. The diameter of the sound hole in the PCB should be larger than the diameter of the
sound port of the microphone. A minimum diameter of 0.5 mm is recommended.
Figure 13. PCB Land Pattern Layout
Dimensions shown in millimeters
Figure 14. Suggested Solder Paste Stencil Pattern Layout
Dimensions shown in millimeters
PCB MATERIAL AND THICKNESS
The performance of the ICS-43434 is not affected by PCB thickness. The ICS-43434 can be mounted on either a rigid or flexible PCB.
A flexible PCB with the microphone can be attached directly to the device housing with an adhesive layer. This mounting method
offers a reliable seal around the sound port while providing the shortest acoustic path for good sound quality.
Document Number: DS-000069
Revision: 1.2
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ICS-43434
HANDLING INSTRUCTIONS
PICK AND PLACE EQUIPMENT
The MEMS microphone can be handled using standard pick-and-place and chip shooting equipment. Take care to avoid damage to the
MEMS microphone structure as follows:
• Use a standard pickup tool to handle the microphone. Because the microphone hole is on the bottom of the package, the
pickup tool can make contact with any part of the lid surface.
• Do not pick up the microphone with a vacuum tool that makes contact with the bottom side of the microphone.
Do not pull air out of or blow air into the microphone port.
• Do not use excessive force to place the microphone on the PCB.
REFLOW SOLDER
For best results, the soldering profile must be in accordance with the recommendations of the manufacturer of the solder paste used to
attach the MEMS microphone to the PCB. It is recommended that the solder reflow profile not exceed the limit conditions specified
in Figure 2 and Table 7.
BOARD WASH
When washing the PCB, ensure that water does not make contact with the microphone port. Do not use blow-off procedures or
ultrasonic cleaning.
Document Number: DS-000069
Revision: 1.2
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ICS-43434
OUTLINE DIMENSIONS
0.98
2.65
PIN #1
REFERENCE
CORNER
0.75
0.125 0.300
PIN #1
REFERENCE
CORNER
0.600 (5X)
0.125
0.522 (5X)
0.300
3.50
1.513
3.20 2.88
1.040
ø0.375
R0.16
R0.125
1.325
0.23 (REF)
R0.240
ø1.025
ø1.625
2.35
2.03
Figure 15. 6-Terminal Chip Array Small Outline No Lead Cavity
3.50 × 2.65 × 0.98 mm Body
Dimensions shown in millimeters
PART NUMBER
PIN 1 INDICATION
434
YYXXX
DATE CODE
LOT TRACEABILITY CODE
Figure 16. Package Marking Specification (Top View)
ORDERING GUIDE
PART
ICS-43434
TEMP RANGE
−40°C to +85°C
PACKAGE
6-Terminal LGA_CAV
QUANTITY
10,000
PACKAGING
13” Tape and Reel
EV_ICS-43434-FX
Flex Evaluation Board
Document Number: DS-000069
Revision: 1.2
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ICS-43434
REVISION HISTORY
REVISION DATE
REVISION
DESCRIPTION
4/26/2016
1.0
Initial version
6/3/2016
1.1
Updated Ordering Quantity
8/29/2016
1.2
Updated HPM SNR, EIN and Dynamic Range value
Document Number: DS-000069
Revision: 1.2
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ICS-43434
COMPLIANCE DECLARATION DISCLAIMER
InvenSense believes the environmental and other compliance information given in this document to be correct but cannot
guarantee accuracy or completeness. Conformity documents substantiating the specifications and component characteristics are on
file. InvenSense subcontracts manufacturing, and the information contained herein is based on data received from vendors and
suppliers, which has not been validated by InvenSense.
This information furnished by InvenSense is believed to be accurate and reliable. However, no responsibility is assumed by
InvenSense for its use, or for any infringements of patents or other rights of third parties that may result from its use. Specifications
are subject to change without notice. InvenSense reserves the right to make changes to this product, including its circuits and
software, in order to improve its design and/or performance, without prior notice. InvenSense makes no warranties, neither
expressed nor implied, regarding the information and specifications contained in this document. InvenSense assumes no
responsibility for any claims or damages arising from information contained in this document, or from the use of products and
services detailed therein. This includes, but is not limited to, claims or damages based on the infringement of patents, copyrights,
mask work and/or other intellectual property rights.
Certain intellectual property owned by InvenSense and described in this document is patent protected. No license is granted by
implication or otherwise under any patent or patent rights of InvenSense. This publication supersedes and replaces all information
previously supplied. Trademarks that are registered trademarks are the property of their respective companies. InvenSense sensors
should not be used or sold in the development, storage, production or utilization of any conventional or mass-destructive weapons
or for any other weapons or life threatening applications, as well as in any other life critical applications such as medical equipment,
transportation, aerospace and nuclear instruments, undersea equipment, power plant equipment, disaster prevention and crime
prevention equipment.
©2016 InvenSense, Inc. All rights reserved. InvenSense, MotionTracking, MotionProcessing, MotionProcessor, MotionFusion,
MotionApps, Digital Motion Processor, AAR and the InvenSense logo are trademarks of InvenSense, Inc. Other company and product
names may be trademarks of the respective companies with which they are associated.
©2016 InvenSense, Inc. All rights reserved.
Document Number: DS-000069
Revision: 1.2
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