ITG-1010

InvenSense Inc. 1745 Technology Drive, San Jose, CA 95110 U.S.A. Tel: +1 (408) 988-7339 Fax: +1 (408) 988-8104 Website: www.invensense.com Document Number: PS-ITG-1010A-00 Revision: 1.1 Release Date: 03/02/2015 ITG-1010 Product Specification Revision 1.1 Confidential & Proprietary 1 of 46 ITG-1010 Product Specification Document Number: PS-ITG-1010A-00 Revision: 1.1 Release Date: 03/02/2015 CONTENTS 1 DOCUMENT INFORMATION ..................................................................................................................... 4 1.1 1.2 1.3 1.4 2 FEATURES ................................................................................................................................................. 6 2.1 2.2 2.3 2.4 2.5 2.6 3 2 I C SERIAL INTERFACE .........................................................................................................................17 SERIAL INTERFACE CONSIDERATIONS ..............................................................................................22 7.1 7.2 8 BLOCK DIAGRAM ..................................................................................................................................15 OVERVIEW ...........................................................................................................................................15 THREE-AXIS MEMS GYROSCOPE WITH 16-BIT ADCS AND SIGNAL CONDITIONING ..................................15 2 I C AND SPI SERIAL COMMUNICATIONS INTERFACE ...............................................................................15 INTERNAL CLOCK GENERATION .............................................................................................................16 SENSOR DATA REGISTERS ...................................................................................................................16 FIFO ...................................................................................................................................................16 INTERRUPTS.........................................................................................................................................16 DIGITAL-OUTPUT TEMPERATURE SENSOR .............................................................................................16 BIAS AND LDO .....................................................................................................................................16 DIGITAL INTERFACE...............................................................................................................................17 6.1 7 PIN OUT AND SIGNAL DESCRIPTION.......................................................................................................13 TYPICAL OPERATING CIRCUIT ...............................................................................................................14 BILL OF MATERIALS FOR EXTERNAL COMPONENTS.................................................................................14 FUNCTIONAL OVERVIEW .......................................................................................................................15 5.1 5.2 5.3 5.4 5.5 5.6 5.7 5.8 5.9 5.10 6 SENSOR SPECIFICATIONS ....................................................................................................................... 7 ELECTRICAL SPECIFICATIONS.................................................................................................................. 8 ELECTRICAL SPECIFICATIONS, CONTINUED .............................................................................................. 9 2 I C TIMING CHARACTERIZATION ............................................................................................................10 SPI TIMING CHARACTERIZATION ...........................................................................................................11 ABSOLUTE MAXIMUM RATINGS ..............................................................................................................12 APPLICATIONS INFORMATION .............................................................................................................13 4.1 4.2 4.3 5 SENSORS ............................................................................................................................................... 6 DIGITAL OUTPUT .................................................................................................................................... 6 DATA PROCESSING ................................................................................................................................ 6 CLOCKING .............................................................................................................................................. 6 POWER .................................................................................................................................................. 6 PACKAGE ............................................................................................................................................... 6 ELECTRICAL CHARACTERISTICS .......................................................................................................... 7 3.1 3.2 3.3 3.4 3.5 3.6 4 REVISION HISTORY ................................................................................................................................. 4 PURPOSE AND SCOPE ............................................................................................................................ 5 PRODUCT OVERVIEW.............................................................................................................................. 5 APPLICATIONS ........................................................................................................................................ 5 SUPPORTED INTERFACES .....................................................................................................................22 LOGIC LEVELS ......................................................................................................................................22 ASSEMBLY ...............................................................................................................................................23 8.1 8.2 8.3 ORIENTATION OF AXES .........................................................................................................................23 PACKAGE DIMENSIONS .........................................................................................................................24 PACKAGE MARKING SPECIFICATION ......................................................................................................25 Confidential & Proprietary 2 of 46 ITG-1010 Product Specification 8.4 8.5 9 Document Number: PS-ITG-1010A-00 Revision: 1.1 Release Date: 03/02/2015 TAPE & REEL SPECIFICATION ................................................................................................................25 PCB DESIGN GUIDELINES.....................................................................................................................27 REGISTER MAP .......................................................................................................................................28 10 REGISTER DESCRIPTIONS ................................................................................................................30 10.1 10.2 10.3 10.4 10.5 10.6 10.7 10.8 10.9 10.10 10.11 10.12 10.13 10.14 10.15 10.16 10.17 11 REGISTERS 04-05, 07-08, 10-11- G YROSCOPE OFFSET TEMPERATURE COMPENSATION (TC)....................30 REGISTERS 19 TO 24 – GYROSCOPE OFFSET ADJUSTMENT ....................................................................30 REGISTER 25 – SAMPLE RATE DIVIDER .................................................................................................31 REGISTER 26 – CONFIGURATION ...........................................................................................................31 REGISTER 27 – GYROSCOPE CONFIGURATION.......................................................................................32 REGISTER 35 – FIFO ENABLE...............................................................................................................34 REGISTER 55 – INT PIN / BYPASS ENABLE CONFIGURATION...................................................................35 REGISTER 56 – INTERRUPT ENABLE ......................................................................................................36 REGISTER 58 – INTERRUPT STATUS ......................................................................................................37 REGISTERS 65 AND 66 – TEMPERATURE MEASUREMENT........................................................................38 REGISTERS 67 TO 72 – GYROSCOPE MEASUREMENTS ...........................................................................39 REGISTER 106 – USER CONTROL .........................................................................................................40 REGISTER 107 – POWER MANAGEMENT 1 .............................................................................................41 REGISTER 108 – POWER MANAGEMENT 2 .............................................................................................42 REGISTER 114 AND 115 – FIFO COUNT REGISTERS ..............................................................................43 REGISTER 116 – FIFO READ W RITE .....................................................................................................44 REGISTER 117 – W HO AM I ..................................................................................................................45 ENVIRONMENTAL COMPLIANCE ......................................................................................................46 Confidential & Proprietary 3 of 46 ITG-1010 Product Specification 1 Document Number: PS-ITG-1010A-00 Revision: 1.1 Release Date: 03/02/2015 Document Information 1.1 Revision Date Revision History Revision Description 12/24/2013 1.0 Initial Release 03/02/2015 1.1 Changed the top mark specification from IT10 to T36D C Confidential & Proprietary 4 of 46 ITG-1010 Product Specification 1.2 Document Number: PS-ITG-1010A-00 Revision: 1.1 Release Date: 03/02/2015 Purpose and Scope This document is a preliminary product specification, providing a description, specifications, and design related information for the three axis ITG-1010™ gyroscope. The device is housed in a small 3x3x0.9mm QFN package. 1.3 Product Overview The ITG-1010 is a single-chip, digital output, 3 Axis MEMS gyroscope IC which features a 512-byte FIFO. The FIFO can lower the traffic on the serial bus interface, and reduce power consumption by allowing the system processor to burst read sensor data and then go into a low-power mode. The gyroscope includes a programmable full-scale range of ±250, ±500, ±1000, and ±2000 degrees/sec, very low Rate noise at 0.01 dps/√Hz and extremely low power consumption at 3.2mA. Factory-calibrated initial sensitivity reduces production-line calibration requirements. Other industry-leading features include on-chip 16-bit ADCs, programmable digital filters, a precision clock with 1% drift from -40°C to 85°C, an embedded temperature sensor, and programmable interrupts. The 2 device features I C and SPI serial interfaces, a VDD operating range of 1.71 to 3.6V, and a separate digital IO supply, VDDIO from 1.71V to 3.6V. By leveraging its patented and volume-proven CMOS-MEMS fabrication platform, which integrates MEMS wafers with companion CMOS electronics through wafer-level bonding, InvenSense has driven the gyro package size down to a footprint and thickness of 3x3x0.9mm (16-pin QFN), to provide a very small yet high performance low cost package. The device provides high robustness by supporting 10,000g shock reliability. 1.4 Applications • • • • • Motion UI Handset gaming Location based services, points of interest, and dead reckoning Health and sports monitoring Power management Confidential & Proprietary 5 of 46 ITG-1010 Product Specification 2 Document Number: PS-ITG-1010A-00 Revision: 1.1 Release Date: 03/02/2015 Features The ITG-1010 MEMS gyroscope includes a wide range of features: 2.1 Sensors • • • • • • 2.2 Monolithic X-, Y-, Z-Axis angular rate sensor (gyros) integrated circuit Digital-output temperature sensor External sync signal connected to the FSYNC pin supports image, video and GPS synchronization Factory calibrated scale factor High cross-axis isolation via proprietary MEMS design 10,000g shock tolerant Digital Output • • • • • 2.3 2 Fast Mode (400kHz) I C serial interface 1 MHz SPI serial interface for full read/write capability 20 MHz SPI to read gyro sensor & temp sensor data. 16-bit ADCs for digitizing sensor outputs User-programmable full-scale-range of ±250, ±500, ±1000, and ±2000 °/sec Data Processing • • • • • 2.4 The total data set obtained by the device includes gyroscope data, temperature data, and the one bit external sync signal connected to the FSYNC pin. FIFO allows burst read, reduces serial bus traffic and saves power on the system processor. 2 FIFO can be accessed through both I C and SPI interfaces. Programmable interrupt Programmable low-pass filters Clocking • 2.5 On-chip timing generator clock frequency ±1% drift over full temperature range Power • • • • • 2.6 VDD supply voltage range of 1.71V to 3.6V 2 Flexible VDDIO reference voltage allows for multiple I C and SPI interface voltage levels Power consumption with three axes active: 3.2mA Sleep mode: 8μA Each axis can be individually powered down Package • • • 3x3x0.9mm footprint and maximum thickness 16-pin QFN plastic package MEMS structure hermetically sealed at wafer level RoHS and Green compliant Confidential & Proprietary 6 of 46 Document Number: PS-ITG-1010A-00 Revision: 1.1 Release Date: 03/02/2015 ITG-1010 Product Specification 3 Electrical Characteristics 3.1 Sensor Specifications Typical Operating Circuit of Section 4.2, VDD = 2.5V, VDDIO = 1.8V, TA=25°C. Parameter GYRO SENSITIVITY Full-Scale Range Conditions FS_SEL=0 FS_SEL=1 FS_SEL=2 FS_SEL=3 ±250 ±500 ±1000 ±2000 º/s º/s º/s º/s Sensitivity Scale Factor FS_SEL=0 FS_SEL=1 FS_SEL=2 FS_SEL=3 131 65.5 32.8 16.4 16 ±4.5 ±4 LSB/(º/s) LSB/(º/s) LSB/(º/s) LSB/(º/s) bits % % Best fit straight line; 25°C ±0.2 ±2 % % 25°C -10°C to +75°C ±15 ±15 º/s º/s GYRO NOISE PERFORMANCE Total RMS Noise Rate Noise Spectral Density GYRO MECHANICAL Mechanical Frequency FS_SEL=0 DLPFCFG=2 (92 Hz) At 10Hz 0.1 0.01 º/s-r m s º/s/√Hz GYRO START-UP TIME ZRO Settling DLPFCFG=0, to ±1º/s of Final From Sleep Mode to ready From Power On to ready Gyro ADC Word Length Sensitivity Scale Factor Tolerance Sensitivity Scale Factor Variation Over Temperature Nonlinearity Cross-Axis Sensitivity GYRO ZERO-RATE OUTPUT (ZRO) Initial ZRO Tolerance ZRO Variation Over Temperature TEMPERATURE SENSOR Range Sensitivity Room-Temperature Offset Linearity Min 25°C -10°C to +75° 25 Untrimmed 21°C TEMPERATURE RANGE Specification Temperature Range Confidential & Proprietary -10 7 of 46 Typical 27 Max 29 Unit kHz 35 50 ms ms -10 to +75 321.4 0 ±0.2 ºC LSB/ºC LSB °C +75 ºC Notes ITG-1010 Product Specification 3.2 Document Number: PS-ITG-1010A-00 Revision: 1.1 Release Date: 03/02/2015 Electrical Specifications Typical Operating Circuit of Section 4.2, VDD = 2.5V, VDDIO = 1.8V, TA = 25°C. Parameters Conditions Min VDD POWER SUPPLY Operating Voltage Range Power-Supply Ramp Rate Normal Operating Current Sleep Mode Current VDDIO REFERENCE VOLTAGE (must be regulated) Voltage Range Power-Supply Ramp Rate Normal Operating Current Monotonic ramp. Ramp rate is 10% to 90% of the final value Three Axes Active Monotonic ramp. Ramp rate is 10% to 90% of the final value 10pF load, 5MHz data rate. Does not include pull up resistor current draw as that is system dependent Max Units 1.71 3.6 V 1 100 ms 3.2 8 3.6 V 0.1 100 ms AD0 = 0 AD0 = 1 Output Leakage Current tINT, INT Pulse Width 300 µA 12 ms 1101000 1101001 DIGITAL INPUTS (FSYNC, AD0, SCLK, SDI, /CS) VIH, High Level Input Voltage VIL, Low Level Input Voltage CI, Input Capacitance DIGITAL OUTPUT (INT, SDO) VOH, High Level Output Voltage VOL1, LOW-Level Output Voltage VOL.INT1, INT Low-Level Output Voltage Notes mA µA 1.71 START-UP TIME FOR REGISTER READ/WRITE I2C ADDRESS Typical 0.7*VDDIO 0.3*VDDIO