D/CRCW-P e3
www.vishay.com
Vishay
Semi-Precision Thick Film Chip Resistors
FEATURES
• Low temperature coefficient (± 50 ppm/K) and
tight tolerances (± 0.25 %)
• Stability at different environmental conditions
ΔR/R ≤ 1 % (1000 h rated power at 70 °C)
• AEC-Q200 qualified
• Material categorization: for definitions of compliance
please see www.vishay.com/doc?99912
LINKS TO ADDITIONAL RESOURCES
3D 3D
APPLICATIONS
3D Models
• Automotive
D/CRCW-P e3 standard thick film chip resistors are the
perfect choice for most fields of modern electronics where
high reliability and stability are of major concern. Typical
applications include automotive, telecommunications, and
industrial.
• Industrial
• Telecommunication
TECHNICAL SPECIFICATIONS
DESCRIPTION
Imperial size
Metric size code
Resistance
range
Resistance
tolerance
Temperature
coefficient
Rated
dissipation, P70 (1)
Operating
voltage,
Umax. ACRMS/DC
Permissible film
temperature,
D10/
D11/
D12/
D25/
CRCW1210-P CRCW1218-P CRCW2010-P CRCW2512-P
CRCW0402-P CRCW0603-P CRCW0805-P CRCW1206-P
e3
e3
e3
e3
e3
e3
e3
e3
0402
0603
0805
1206
1210
1218
2010
2512
RR1005M
RR1608M
RR2012M
RR3216M
RR3225M
RR3246M
RR5025M
RR6332M
100 Ω to
10 Ω to 10 MΩ
1 Ω to 1.1 MΩ 1 Ω to 10 MΩ
10 Ω to 10 MΩ
100 Ω to 1 MΩ
2.2 MΩ
± 1 %; ± 0.5 %; ± 0.25 %
± 100 ppm/K; ± 50 ppm/K
0.063 W
0.10 W
0.125 W
0.25 W
0.5 W
1.0 W
0.75 W
1.0 W
50 V
75 V
150 V
200 V
200 V
200 V
400 V
500 V
300 V
300 V
300 V
155 °C
ϑF max. (1)
Operating
temperature
range
Max. resistance
change at P70 for
resistance range,
|ΔR/R| after:
1000 h
8000 h
Permissible
voltage
against ambient
(insulation):
1 min, Uins
Failure rate:
FITobserved
-55 °C to +155 °C
≤1%
≤2%
75 V
100 V
200 V
300 V
≤ 0.1 x
300 V
10-9/h
Note
(1) Please refer to “Application Information” below
Revision: 25-Aug-2021
Document Number: 20036
1
For technical questions, contact: thickfilmchip@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
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APPLICATION INFORMATION
When the resistor dissipates power, a temperature rise above the ambient temperature occurs, dependent on the thermal
resistance of the assembled resistor together with the printed circuit board. The rated dissipation applies only if the permitted
film temperature is not exceeded.
These resistors do not feature a limited lifetime when operated within the permissible limits. However, resistance value drift
increasing over operating time may result in exceeding a limit acceptable to the specific application, thereby establishing a
functional lifetime.
TEMPERATURE COEFFICIENT AND RESISTANCE RANGE
TYPE / SIZE
D10/CRCW0402-P e3
D11/CRCW0603-P e3
D12/CRCW0805-P e3
D25/CRCW1206-P e3
CRCW1210-P e3
CRCW1218-P e3
CRCW2010-P e3
CRCW2512-P e3
Revision: 25-Aug-2021
TCR
TOLERANCE
RESISTANCE
E-SERIES
± 100 ppm/K
± 0.5 %
1 Ω to 1.1 MΩ
E24; E96
± 50 ppm/K
±1%
100 Ω to 1 MΩ
E24; E96
± 50 ppm/K
± 0.5 %
100 Ω to 1 MΩ
E24; E96
± 50 ppm/K
± 0.25 %
100 Ω to 1 MΩ
E24; E96
± 100 ppm/K
± 0.5 %
1 Ω to 10 MΩ
E24; E96
± 100 ppm/K
± 0.25 %
1 Ω to 10 MΩ
E24; E96
± 50 ppm/K
±1%
100 Ω to 10 MΩ
E24; E96
± 50 ppm/K
± 0.5 %
100 Ω to 10 MΩ
E24; E96
± 50 ppm/K
± 0.25 %
100 Ω to 1 MΩ
E24; E96
± 100 ppm/K
± 0.5 %
10 Ω to 10 MΩ
E24; E96
± 50 ppm/K
±1%
100 Ω to 10 MΩ
E24; E96
± 50 ppm/K
± 0.5 %
100 Ω to 10 MΩ
E24; E96
± 50 ppm/K
± 0.25 %
100 Ω to 1 MΩ
E24; E96
± 100 ppm/K
± 0.5 %
10 Ω to 10 MΩ
E24; E96
± 50 ppm/K
±1%
100 Ω to 10 MΩ
E24; E96
± 50 ppm/K
± 0.5 %
100 Ω to 10 MΩ
E24; E96
± 50 ppm/K
± 0.25 %
100 Ω to 1 MΩ
E24; E96
± 100 ppm/K
± 0.5 %
100 Ω to 1 MΩ
E24; E96
± 50 ppm/K
±1%
100 Ω to 1 MΩ
E24; E96
± 50 ppm/K
± 0.5 %
100 Ω to 1 MΩ
E24; E96
± 100 ppm/K
± 0.5 %
100 Ω to 2.2 MΩ
E24; E96
± 50 ppm/K
±1%
100 Ω to 2.2 MΩ
E24; E96
± 50 ppm/K
± 0.5 %
100 Ω to 2.2 MΩ
E24; E96
± 100 ppm/K
± 0.5 %
10 Ω to 10 MΩ
E24; E96
± 50 ppm/K
±1%
100 Ω to 10 MΩ
E24; E96
± 50 ppm/K
± 0.5 %
100 Ω to 10 MΩ
E24; E96
± 100 ppm/K
± 0.5 %
10 Ω to 10 MΩ
E24; E96
± 50 ppm/K
±1%
100 Ω to 10 MΩ
E24; E96
± 50 ppm/K
± 0.5 %
100 Ω to 10 MΩ
E24; E96
Document Number: 20036
2
For technical questions, contact: thickfilmchip@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
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PACKAGING
TYPE / SIZE
D10/CRCW0402-P e3
D11/CRCW0603-P e3
D12/CRCW0805-P e3
D25/CRCW1206-P e3
CRCW1210-P e3
CRCW1218-P e3
CRCW2010-P e3
CRCW2512-P e3
CODE
QUANTITY
ED = ET7
EE = EF4
EI = ET2
ED = ET3
EL = ET4
EE = ET8
EA = ET1
EB = ET5
EC = ET6
EA = ET1
EB = ET5
EC = ET6
EA = ET1
EB = ET5
EC = ET6
EA = ET1
EB = ET5
EC = ET6
EK = ET9
EF = E02
EG = E67
EH = E82
10 000
50 000
5000
10 000
20 000
50 000
5000
10 000
20 000
5000
10 000
20 000
5000
10 000
20 000
5000
10 000
20 000
4000
4000
2000
4000
PACKAGING STYLE
WIDTH
PITCH
8 mm
2 mm
PACKAGING
DIMENSIONS
Ø 180 mm / 7"
Ø 330 mm / 13"
Ø 180 mm / 7"
Ø 180 mm / 7"
Ø 285 mm / 11.25"
Ø 330 mm / 13"
Ø 180 mm / 7"
Ø 285 mm / 11.25"
Ø 330 mm / 13"
Ø 180 mm / 7"
Ø 285 mm / 11.25"
Ø 330 mm / 13"
Ø 180 mm / 7"
Ø 285 mm / 11.25"
Ø 330 mm / 13"
Ø 180 mm / 7"
Ø 285 mm / 11.25"
Ø 330 mm / 13"
Ø 180 mm / 7"
Ø 180 mm / 7"
2 mm
8 mm
4 mm
Paper tape acc. to
IEC 60286-3, Type 1a
Blister tape acc. to
IEC 60286-3, Type 2a
8 mm
4 mm
8 mm
4 mm
12 mm
4 mm
12 mm
12 mm
4 mm
4 mm
8 mm
4 mm
12 mm
Ø 180 mm / 7"
PART NUMBER AND PRODUCT DESCRIPTION
Part Number: CRCW040275R0DKEDP
C
R
C
W
0
4
0
2
7
5
R
0
D
K
E
D
P
TYPE / SIZE
RESISTANCE
TOLERANCE
TCR
PACKAGING
SPECIAL
CRCW0402
CRCW0603
CRCW0805
CRCW1206
CRCW1210
CRCW1218
CRCW2010
CRCW2512
R = decimal
K = thousand
M = million
C = ± 0.25 %
D = ± 0.5 %
F = ± 1.0 %
H = ± 50 ppm/K
K = ± 100 ppm/K
EA, EB,
EC, ED,
EE, EF,
EG, EH,
EI, EL,
EK
Up to 2 digits
P = semi-Precision
Product Description: D10/CRCW0402-P 100 75R 0.5 % ET7 e3
D10/CRCW0402-P
100
75R
0.5 %
ET7
e3
TYPE / SIZE
TCR
RESISTANCE
TOLERANCE
PACKAGING
LEAD (Pb)-FREE
D10/CRCW0402-P
D11/CRCW0603 -P
D12/CRCW0805-P
D25/CRCW1206-P
CRCW1210-P
CRCW1218-P
CRCW2010-P
CRCW2512-P
± 50 ppm/K
± 100 ppm/K
49K9 = 49.9 kΩ
5R1 = 5.1 Ω
± 0.25 %
± 0.5 %
±1%
ET1, ET2,
ET3, ET4,
ET5, ET6,
ET7, ET8,
ET9, EF4,
E02, E67,
E82
e3 = pure tin
termination finish
Revision: 25-Aug-2021
Document Number: 20036
3
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THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
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D/CRCW-P e3
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Vishay
DESCRIPTION
MATERIALS
Production is strictly controlled and follows an extensive set
of instructions established for reproducibility. A cermet film
layer and a glass-over are deposited on a high grade (Al2O3)
ceramic substrate with its prepared inner contacts. A
special laser is used to achieve the target value by smoothly
fine trimming the resistive layer without damaging the
ceramics. The resistor elements are covered by a protective
coating designed for electrical, mechanical and climatic
protection. The terminations receive a final pure tin on nickel
plating.
The result of the determined production is verified by an
extensive testing procedure on 100 % of the individual chip
resistors. Only accepted products are laid directly into
the tape in accordance with IEC 60286-3 Type 1a and
Type 2a (1).
Vishay acknowledges the following systems for the
regulation of hazardous substances:
• IEC 62474, Material Declaration for Products of and for the
Electrotechnical Industry, with the list of declarable
substances given therein (2)
• The Global Automotive Declarable Substance List
(GADSL) (3)
• The REACH regulation (1907/2006/EC) and the related list
of substances with very high concern (SVHC) (4) for its
supply chain
ASSEMBLY
The resistors are suitable for processing on automatic SMD
assembly systems. They are suitable for automatic
soldering using wave, reflow or vapor phase as shown in
IEC 61760-1 (1). The encapsulation is resistant to all
cleaning solvents commonly used in the electronics
industry, including alcohols, esters and aqueous solutions.
The suitability of conformal coatings, potting compounds
and their processes, if applied, shall be qualified by
appropriate means to ensure the long-term stability of the
whole system.
The resistors are RoHS-compliant, the pure tin plating
provides
compatibility
with
lead
(Pb)-free
and
lead-containing soldering processes. Solderability is
specified for 2 years after production or requalification. The
permitted storage time is 20 years. The immunity of the
plating against tin whisker growth has been proven under
extensive testing.
The products do not contain any of the banned
substances as per IEC 62474, GADSL, or the SVHC list,
see www.vishay.com/how/leadfree.
Hence the products fully comply with the following
directives:
• 2000/53/EC End-of-Life Vehicle Directive (ELV) and
Annex II (ELV II)
• 2011/65/EU Restriction of the Use of Hazardous
Substances
Directive
(RoHS)
with
amendment
2015/863/EU
• 2012/19/EU Waste Electrical and Electronic Equipment
Directive (WEEE)
Vishay pursues the elimination of conflict minerals from its
supply chain, see the Conflict Minerals Policy at
www.vishay.com/doc?49037.
APPROVALS
The resistors are qualified according to AEC-Q200.
Where applicable, the resistors are tested in accordance
with EN 140401-802 which refers to EN 60115-1,
EN 60115-8 and the variety of environmental test
procedures of the IEC 60068 (1) series.
RELATED PRODUCTS
For more information about products with standard TCR
and tolerance please refer to the “Standard Thick Film Chip
Resistors” datasheet (www.vishay.com/doc?20035).
The D/CRCW-P with SnPb termination plating is designed
for applications where lead bearing terminations are
mandatory. For ordering D/CRCW-P with SnPb terminations
please refer to latest edition of datasheet D/CRCW-P
(www.vishay.com/doc?20009).
Notes
(1) The quoted IEC standards are also released as EN standards with the same number and identical contents
(2) The IEC 62474 list of declarable substances is maintained in a dedicated database, which is available at http://std.iec.ch/iec62474
(3) The Global Automotive Declarable Substance List (GADSL) is maintained by the American Chemistry Council and available at www.gadsl.org
(4) The SVHC list is maintained by the European Chemical Agency (ECHA) and available at http://echa.europa.eu/candidate-list-table
Revision: 25-Aug-2021
Document Number: 20036
4
For technical questions, contact: thickfilmchip@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
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Vishay
FUNCTIONAL PERFORMANCE
Single Pulse
Axis Title
1000
10
1000
1st line
2nd line
100
2nd line
^
Pmax. - Pulse Load (W)
10000
CRCW2512-P
CRCW1218-P
CRCW2010-P
CRCW1210-P
D25/CRCW1206-P
D12/CRCW0805-P
D11/CRCW0603-P
D10/CRCW0402-P
1
100
0.1
0.01
0.000001
10
0.00001
0.0001
0.001
0.01
0.1
1
10
100
ti - Pulse Duration (s)
Maximum pulse load, single pulse; applicable if P → 0 and n < 1000 and Uˆ = Uˆ max.;
for permissible resistance change equivalent to 8000 h operation
Continuous Pulse
Axis Title
10000
CRCW2512-P
CRCW1218-P
CRCW2010-P
CRCW1210-P
D25/CRCW1206-P
D12/CRCW0805-P
D11/CRCW0603-P
D10/CRCW0402-P
100
10
1000
1st line
2nd line
2nd line
^
Pmax. - Continuous Pulse Load (W)
1000
1
100
0.1
0.01
0.000001
10
0.00001
0.0001
0.001
0.01
0.1
1
10
100
ti - Pulse Duration (s)
Maximum pulse load, continuous pulses; applicable if P ≤ P (ϑamb) and Uˆ = Uˆ max.;
for permissible resistance change equivalent to 8000 h operation
Pulse Voltage
Axis Title
2000
1800
1600
1400
1000
1200
1st line
2nd line
2nd line
^
Umax. - Pulse Voltage (V)
10000
CRCW2512-P
CRCW2010-P
D25/CRCW1206-P, CRCW1210-P, CRCW1218-P
D12/CRCW0805-P
D11/CRCW0603-P
D10/CRCW0402-P
1000
800
100
600
400
200
0
0.000001
10
0.00001
0.0001
0.001
0.01
0.1
1
10
ti - Pulse Duration (s)
Maximum pulse voltage, single and continuous pulses; applicable if Pˆ = Pˆ max.;
for permissible resistance change equivalent to 8000 h operation
Revision: 25-Aug-2021
Document Number: 20036
5
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Derating
Axis Title
1.2
CRCW2512-P, CRCW1218-P
CRCW2010-P
CRCW1210-P
D25/CRCW1206-P
D12/CRCW0805-P
D11/CRCW0603-P
D10/CRCW0402-P
2nd line
P - Power Dissipation (W)
1.0
1000
1st line
2nd line
0.8
10000
0.6
100
0.4
0.2
10
0
-70
-60
-50
-40
-30
-20
-10
0
10
20
30
40
50
60
70
ϑamb - Ambient Temperature (°C)
80
90
100 110 120 130 140 150 160
TESTS AND REQUIREMENTS
All executed tests are carried out in accordance with the
following specifications:
The testing also covers most of the requirements specified
by EIA/IS-703 and JIS-C-5201-1.
EN 60115-1, generic specification
The tests are carried out under standard atmospheric
conditions in accordance with IEC 60068-1, 4.3, whereupon
the following values are applied:
EN 60115-8
specification
(successor
of
EN 140400),
sectional
EN 140401-802, detail specification
Temperature: 15 °C to 35 °C
IEC 60068-2-xx, test methods
Relative humidity: 25 % to 75 %
The parameters stated in the Test Procedures and
Requirements table are based on the required tests and
permitted limits of EN 140401-802. The table presents only
the most important tests, for the full test schedule refer to
the documents listed above. However, some additional
tests and a number of improvements against those
minimum requirements have been included.
Air pressure: 86 kPa to 106 kPa (860 mbar to 1060 mbar).
A climatic category LCT / UCT / 56 is applied, defined by the
lower category temperature (LCT), the upper category
temperature (UCT), and the duration of exposure in the
damp heat, steady state test (56 days). The components are
mounted for testing on boards in accordance with EN
60115-8, 2.4.2 unless otherwise specified.
TEST PROCEDURES AND REQUIREMENTS
EN
60115-1
CLAUSE
IEC
60068-2
(1) TEST
METHOD
PROCEDURE
STABILITY CLASS 1 OR BETTER
TEST
Stability for product types:
D/CRCW-P e3
4.5
-
4.8
-
REQUIREMENTS PERMISSIBLE
CHANGE (ΔR)
1 Ω to 10 MΩ
Resistance
-
± 0.25 %; ± 0.5 %; ± 1 %
Temperature coefficient
At (20 / -55 / 20) °C and
(20 / 125 / 20) °C
± 50 ppm/K; ± 100 ppm/K
U = P 70 x R ≤ Umax.
1.5 h on; 0.5 h off
4.25.1
4.25.3
4.24
4.37
-
Endurance at 70 °C
70 °C; 1000 h
± (1 % R + 0.05 Ω)
70 °C; 8000 h
± (2 % R + 0.05 Ω)
-
Endurance at upper
category temperature
155 °C; 1000 h
± (1 % R + 0.05 Ω)
78 (Cab)
Damp heat, steady state
(40 ± 2) °C; (93 ± 3) % RH; 56 days
± (1 % R + 0.05 Ω)
Damp heat, steady state,
accelerated
(85 ± 2) °C; (85 ± 5) % RH;
U = 0.1 x P 85 x R ≤ 100 V;
1000 h
± (1 % R + 0.05 Ω)
67 (Cy)
Revision: 25-Aug-2021
Document Number: 20036
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TEST PROCEDURES AND REQUIREMENTS
EN
60115-1
CLAUSE
IEC
60068-2
(1) TEST
METHOD
PROCEDURE
REQUIREMENTS PERMISSIBLE
CHANGE (ΔR)
STABILITY CLASS 1 OR BETTER
TEST
Stability for product types:
1 Ω to 10 MΩ
D/CRCW-P e3
4.23
4.23.2
2 (Ba)
Climatic sequence:
Dry heat
125 °C; 16 h
4.23.3
30 (Db)
Damp heat, cyclic
55 °C; 24 h; ≥ 90 % RH; 1 cycle
4.23.4
4.23.5
4.23.6
4.23.7
1 (Ab)
13 (M)
30 (Db)
-
Cold
Low air pressure
Damp heat, cyclic
DC load
-55 °C; 2 h
8.5 kPa; 2 h; (25 ± 10) °C
55 °C; 5 days; > 90 % RH; 5 cycles
U = P 70 x R ≤ Umax.; 1 min
± (1 % R + 0.05 Ω)
1 (Aa)
Cold
-55 °C; 2 h
± (0.25 % R + 0.05 Ω)
± (0.25 % R + 0.05 Ω)
± (1 % R + 0.05 Ω)
4.19
14 (Na)
Rapid change
of temperature
30 min. at -55 °C and 30 min. at 125 °C
5 cycles
1000 cycles
4.13
-
Short time overload
U = 2.5 x P 70 x R ≤ 2 x Umax.;
whichever is the less severe; 5 s
± (2 % R + 0.05 Ω)
4.27
-
Single pulse high
voltage overload
Severity no. 4:
U = 10 x P 70 x R
or U ≤ 2 x Umax.;
whichever is the less severe;
10 pulses 10 μs / 700 μs
± (1 % R + 0.05 Ω)
4.39
-
Periodic electric overload
15 x P 70 x R
≤ 2 x Umax.;
whichever is the less severe;
0.1 s on; 2.5 s off; 1000 cycles
± (1 % R + 0.05 Ω)
no visible damage
4.38
-
Electrostatic discharge
(human body model)
IEC 61340-3-1 (1);
3 positive + 3 negative discharges;
ESD voltage according to the size
± (1 % R + 0.05 Ω)
Vibration
Endurance by sweeping;
10 Hz to 2000 Hz;
no resonance;
amplitude ≤ 1.5 mm or ≤ 200 m/s2;
7.5 h
± (0.25 % R + 0.05 Ω)
no visible damage
U=
4.22
6 (Fc)
Good tinning (≥ 95 % covered);
no visible damage
4.17
58 (Td)
4.18
58 (Td)
4.29
45 (XA)
4.32
21 (Uu3)
Shear (adhesion)
4.33
21 (Uu1)
Substrate bending
Depth 2 mm; 3 times
No visible damage,
no open circuit in bent position
± (0.25 % R + 0.05 Ω)
4.7
-
Voltage proof
U = 1.4 x Uins; 60 s
No flashover or breakdown
-
Flammability,
needle flame test
IEC 60695-11-5 (1);
10 s
No burning after 30 s
4.35
Solderability
Solder bath method,
Sn60Pb40; non-activated flux
(235 ± 5) °C; (2 ± 0.2) s
Solder bath method,
Sn96.5Ag3Cu0.5 or Sn99.3Cu0.7;
non-activated flux
(245 ± 5) °C or (250 ± 5) °C; (3 ± 0.3) s
Soldering bath method;
(260 ± 5) °C; (10 ± 1) s
Isopropyl alcohol;
+50 °C; method 2
D11/CRCW0603-P e3 and smaller: 9 N
D12/CRCW0805-P e3 to
CRCW2512-P e3: 45 N
Resistance to
soldering heat
Component solvent
resistance
± (0.25 % R + 0.05 Ω)
No visible damage
No visible damage
Note
(1) The quoted IEC standards are also released as EN standards with the same number and identical contents
Revision: 25-Aug-2021
Document Number: 20036
7
For technical questions, contact: thickfilmchip@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
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DIMENSIONS
L
T2
W
H
T1
DIMENSIONS AND MASS
TYPE / SIZE
D10/CRCW0402-P e3
L
(mm)
W
(mm)
1.0 ± 0.05
H
(mm)
T1
(mm)
T2
(mm)
MASS
(mg)
0.65
0.5 ± 0.05
0.35 ± 0.05
0.25 ± 0.05
0.2 ± 0.10
D11/CRCW0603-P e3 1.55 + 0.10 / - 0.05
0.85 ± 0.10
0.45 ± 0.05
0.3 ± 0.20
0.3 ± 0.20
2
D12/CRCW0805-P e3 2.0 + 0.20 / - 0.10
1.25 ± 0.15
0.45 ± 0.05
0.3 + 0.20 / - 0.10
0.3 ± 0.20
5.5
10
D25/CRCW1206-P e3 3.2 + 0.10 / - 0.20
1.6 ± 0.15
0.55 ± 0.05
0.45 ± 0.20
0.4 ± 0.20
CRCW1210-P e3
3.2 ± 0.20
2.5 ± 0.20
0.55 ± 0.05
0.45 ± 0.20
0.4 ± 0.20
16
CRCW1218-P e3
3.2 + 0.10 / - 0.20
4.6 ± 0.15
0.55 ± 0.05
0.45 ± 0.20
0.4 ± 0.20
29.5
CRCW2010-P e3
5.0 ± 0.15
2.5 ± 0.15
0.6 ± 0.10
0.6 ± 0.20
0.6 ± 0.20
25.5
CRCW2512-P e3
6.3 ± 0.20
3.15 ± 0.15
0.6 ± 0.10
0.6 ± 0.20
0.6 ± 0.20
40.5
SOLDER PAD DIMENSIONS
X
G
Y
Z
RECOMMENDED SOLDER PAD DIMENSIONS
WAVE SOLDERING
TYPE / SIZE
G
(mm)
Y
(mm)
X
(mm)
REFLOW SOLDERING
Z
(mm)
G
(mm)
Y
(mm)
X
(mm)
Z
(mm)
D10/CRCW0402-P e3
-
-
-
-
0.45
0.6
0.6
1.65
D11/CRCW0603-P e3
0.65
1.10
1.25
2.85
0.75
0.75
1.00
2.25
D12/CRCW0805-P e3
0.90
1.30
1.60
3.50
1.00
0.95
1.45
2.90
D25/CRCW1206-P e3
1.40
1.40
1.95
4.20
1.50
1.05
1.80
3.60
CRCW1210-P e3
1.80
1.45
2.95
4.70
1.70
1.10
2.80
3.90
CRCW1218-P e3
1.90
1.25
4.80
4.40
1.90
1.10
4.90
4.10
CRCW2010-P e3
3.40
1.65
2.85
6.70
3.50
1.45
2.80
6.40
CRCW2512-P e3
4.60
1.60
3.65
7.80
4.75
1.45
3.50
7.65
Note
• The rated dissipation applies only if the permitted film temperature is not exceeded. Furthermore, a high level of ambient temperature or of
power dissipation may raise the temperature of the solder joint, hence special solder alloys or board materials may be required to maintain
the reliability of the assembly.
The given solder pad dimensions reflect the considerations for board design and assembly as outlined e.g. in standards IEC 61188-5-x or
in publication IPC-7351. They do not guarantee any supposed thermal properties, particularly as these are also strongly influenced by many
other parameters. Still, the given solder pad dimensions will be found adequate for most general applications
Revision: 25-Aug-2021
Document Number: 20036
8
For technical questions, contact: thickfilmchip@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
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Revision: 09-Jul-2021
1
Document Number: 91000