NTCS0805E3683JXT

NTCS0805E3.....T www.vishay.com Vishay BCcomponents SMD 0805, Glass Protected NTC Thermistors FEATURES • TCR ranging from -6 %/K at -40 °C to -2 %/K at 150 °C • Tolerance on R25 down to 1 %, and on B25/85 down to 1 % • Suitable for wave or reflow soldering • NiSn terminations • Fully glass coated and protected • cULus recognized, file E148885 (UL category XGPU2 / XGPU8) • AEC-Q200 qualified • Material categorization: for definitions of compliance please see www.vishay.com/doc?99912 LINKS TO ADDITIONAL RESOURCES 3D 3D 3D Models APPLICATIONS Design Tools QUICK REFERENCE DATA PARAMETER Resistance value at 25 °C Tolerance on R25-value B25/85-value Tolerance on B25/85-value Maximum dissipation at 25 °C Thermal time constant τ Dissipation factor D Operating temperature range at zero power Weight VALUE 1K to 680K ± 1; ± 2; ± 3; ± 5 3370 to 4125 ± 1; ± 3 210 ≈ 10 3.5 UNIT Ω % K % mW s mW/K -40 to +150 °C ≈ 0.008 g • Temperature sensing, protection and compensation in automotive, industrial, telecom and consumer applications. Examples are: - Battery chargers - Power supplies - Office equipment - LCD compensation - In-car entertainment DESCRIPTION Size 0805 (M2012) glass protected SMD chip thermistor with negative temperature coefficient (TCR) and matte tin (Sn) plated terminations. The device has no marking. PACKAGING AGENCY APPROVALS Available in 8 mm punched paper tape on reel package of 4000 units. Agency approval documents, please see: www.vishay.com/ppg?29044&documents CAUTIONS AND WARNINGS ON MOUNTING AND HANDLING DESIGN-IN SUPPORT For complete curve computation, please visit: www.vishay.com/thermistors/ntc-rt-calculator/ Please read the special instructions: see www.vishay.com/doc?29224. ELECTRICAL DATA AND ORDERING INFORMATION R25 (Ω) R25-TOL. (± %) B25/85 (K) B25/85-TOL. (± %) 1000 1500 2200 4700 5000 10 000 10 000 10 000 15 000 22 000 33 000 47 000 68 000 100 000 100 000 330 000 470 000 680 000 3, 5 3, 5 1, 2, 3, 5 1, 2, 3, 5 1, 2, 3, 5 1, 2, 3, 5 1, 2, 3, 5 1, 2, 3, 5 1, 2, 3, 5 1, 2, 3, 5 1, 2, 3, 5 1, 2, 3, 5 1, 2, 3, 5 1, 2, 3, 5 1, 2, 3, 5 1, 2, 3, 5 1, 2, 3, 5 1, 2, 3, 5 3370 3420 3600 3500 3480 3430 3570 3940 3700 3800 3920 3960 4100 3590 4100 3930 4025 4125 1 1 1 1 1 3 3 1 1 1 1 1 1 1 1 1 1 1 UL RECOG. ✓ ✓ ✓ ✓ ✓ ✓ ✓ ✓ ✓ ✓ ✓ ✓ ✓ ✓ SAP MATERIAL AND ORDERING NUMBER (1) NTCS0805E3102*LT NTCS0805E3152*LT NTCS0805E3222*MT NTCS0805E3472*MT NTCS0805E3502*LT NTCS0805E3103*LT NTCS0805E3103*MT NTCS0805E3103*HT NTCS0805E3153*MT NTCS0805E3223*HT NTCS0805E3333*HT NTCS0805E3473*HT NTCS0805E3683*XT NTCS0805E3104*MT NTCS0805E3104*XT NTCS0805E3334*HT NTCS0805E3474*XT NTCS0805E3684*XT Note (1) Replace * in SAP material number by J for ± 5 %, H for ± 3 %, G for ± 2 %, F for ± 1 % tolerance on R 25 Revision: 21-Sep-2021 Document Number: 29044 1 For technical questions, contact: nlr@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 NTCS0805E3.....T www.vishay.com Vishay BCcomponents DIMENSIONS T L1 W T L2 AND L3 MIN. L4 MIN. 2.0 ± 0.2 1.25 ± 0.15 0.8 ± 0.15 0.2 0.55 W L2 L4 L3 L1 SOLDERING CONDITIONS Soldering, handling, and mounting conditions are detailed in the instructions document: see www.vishay.com/doc?29224. Typical examples of a soldering processes that will provide reliable joints without damage, are shown below. Lead (Pb)-free Reflow Soldering Profile Reflow Soldering 10 s 300 ≈ 245 °C 215 °C 200 Temperature (°C) Temperature (°C) 250 10 s 180 °C 130 °C 150 40 s 100 2 K/s 50 0 0 50 100 150 40 s max. 300 260 °C 200 260 °C ≈ 245 °C 250 235 °C 200 ≈ 170 °C 20 s min. 150 ≈ 60 s 6 K/s max. limit normal ≈ 120 °C 100 2 K/s max. 50 0 250 0 50 100 150 Time (s) 200 250 300 350 Time (s) Dimensions of the solder lands 1.0 1.3 3.0 PACKAGING TAPE SPECIFICATIONS All tape specifications are in accordance with IEC 60286-3. Basic dimensions are given below. Carrier tape material is paper. PAPER TAPE T P0 PARAMETER P2 D0 E1 F W B0 A0 P1 DIMENSIONS OF PAPER TAPE in millimeters JWB288 T1 A0 (1) B0 (1) W E1 F D0 P0 (2) P1 P2 T tape thickness max. T1 cover tape thickness max. DIMENSION 1.7 ± 0.2 2.35 ± 0.1 8.0 ± 0.2 1.75 ± 0.1 3.5 ± 0.05 1.55 ± 0.05 4.0 ± 0.1 4.0 ± 0.1 2.0 ± 0.05 1.1 0.1 Notes (1) Measured 0.3 mm above base pocket (2) P pitch cumulative error over any 10 pitches ± 1.0 mm 0 Revision: 21-Sep-2021 Document Number: 29044 2 For technical questions, contact: nlr@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 Legal Disclaimer Notice www.vishay.com Vishay Disclaimer ALL PRODUCT, PRODUCT SPECIFICATIONS AND DATA ARE SUBJECT TO CHANGE WITHOUT NOTICE TO IMPROVE RELIABILITY, FUNCTION OR DESIGN OR OTHERWISE. Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively, “Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained in any datasheet or in any other disclosure relating to any product. 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ALL RIGHTS RESERVED Revision: 01-Jan-2022 1 Document Number: 91000