Si1034X
Vishay Siliconix
N-Channel 20 V (D-S) MOSFET
FEATURES
PRODUCT SUMMARY
VDS (V)
RDS(on) ()
ID (mA)
5 at VGS = 4.5 V
200
7 at VGS = 2.5 V
175
9 at VGS = 1.8 V
150
10 at VGS = 1.5 V
50
20
• Halogen-free According to IEC 61249-2-21
Definition
• TrenchFET® Power MOSFET: 1.5 V Rated
• Low-Side Switching
• Low On-Resistance: 5
• Low Threshold: 0.9 V (typ.)
• Fast Switching Speed: 35 ns (typ.)
• 1.5 V Operation
• Gate-Source ESD Protected: 2000 V
• Compliant to RoHS Directive 2002/95/EC
SC-89
BENEFITS
S1
1
6
D1
G1
2
5
G2
D2
3
4
S2
Marking Code: L
Top View
•
•
•
•
•
Ease in Driving Switches
Low Offset (Error) Voltage
Low-Voltage Operation
High-Speed Circuits
Low Battery Voltage Operation
APPLICATIONS
Ordering Information: Si1034X-T1-GE3 (Lead (Pb)-free and Halogen-free)
• Drivers: Relays, Solenoids, Lamps, Hammers, Displays,
Memories
• Battery Operated Systems
• Power Supply Converter Circuits
• Load/Power Switching Cell Phones, Pagers
ABSOLUTE MAXIMUM RATINGS (TA = 25 °C, unless otherwise noted)
Parameter
Symbol
5s
Steady State
Drain-Source Voltage
VDS
20
Gate-Source Voltage
VGS
±5
Continuous Drain Current (TJ = 150 °C)a
TA = 25 °C
TA = 85 °C
Pulsed Drain Currentb
IS
Operating Junction and Storage Temperature Range
Gate-Source ESD Rating (HBM, Method 3015)
TA = 25 °C
TA = 85 °C
PD
V
190
180
140
130
IDM
Continuous Source Current (Diode Conduction)
Maximum Power Dissipationa
ID
Unit
650
450
380
280
250
145
130
mA
mW
TJ, Tstg
- 55 to 150
°C
ESD
2000
V
Notes:
a. Surface mounted on FR4 board.
b. Pulse width limited by maximum junction temperature.
Document Number: 71427
S10-2544-Rev. C, 08-Nov-10
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1
Si1034X
Vishay Siliconix
SPECIFICATIONS (TA = 25 °C, unless otherwise noted)
Parameter
Symbol
Test Conditions
Min.
Typ.
Max.
Unit
1.2
V
VDS = 0 V, VGS = ± 2.8 V
VDS = VGS, ID = 250 µA
0.40
± 0.5
± 1.0
VDS = 0 V, VGS = ± 4.5 V
± 1.0
± 3.0
VDS = 16 V, VGS = 0 V
1
500
Static
VGS(th)
Gate Threshold Voltage
Gate-Body Leakage
IGSS
Zero Gate Voltage Drain Current
IDSS
On-State Drain Currenta
ID(on)
Drain-Source On-State
VDS = 16 V, VGS = 0 V, TJ = 85 °C
VDS = 5 V, VGS = 4.5 V
RDS(on)
Resistancea
10
5
VGS = 2.5 V, ID = 175 mA
7
VGS = 1.8 V, ID = 150 mA
9
VDS = 10 V, ID = 200 mA
Diode Forward
Voltagea
VSD
IS = 150 mA, VGS = 0 V
µA
mA
VGS = 4.5 V, ID = 200 mA
gfs
nA
250
VDS = 1.5 V, ID = 40 mA
Forward Transconductancea
µA
10
0.5
S
1.2
V
Dynamicb
Total Gate Charge
Qg
Gate-Source Charge
Qgs
Gate-Drain Charge
Qgd
Turn-On Delay Time
td(on)
750
VDS = 10 V, VGS = 4.5 V, ID = 150 mA
50
VDD = 10 V, RL = 47
ID 200 mA, VGEN = 4.5 V, Rg = 10
tr
Rise Time
td(off)
Turn-Off Delay Time
pC
75
225
25
tf
Fall Time
ns
50
25
Notes:
a. Pulse test; pulse width 300 µs, duty cycle 2 %.
b. Guaranteed by design, not subject to production testing.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation
of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability.
TYPICAL CHARACTERISTICS (TA = 25 °C, unless otherwise noted)
600
0.5
TJ = - 55 °C
VGS = 5 V thru 1.8 V
500
I D - Drain Current (mA)
I D - Drain Current (A)
0.4
0.3
0.2
0.1
25 °C
400
125 °C
300
200
100
1V
0.0
0
1
2
3
4
VDS - Drain-to-Source Voltage (V)
Output Characteristics
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2
5
6
0
0.0
0.5
1.0
1.5
2.0
2.5
VGS - Gate-to-Source Voltage (V)
Transfer Characteristics
Document Number: 71427
S10-2544-Rev. C, 08-Nov-10
Si1034X
Vishay Siliconix
TYPICAL CHARACTERISTICS (TA = 25 °C, unless otherwise noted)
100
40
80
30
C - Capacitance (pF)
R DS(on) - On-Resistance (Ω)
VGS = 0 V
f = 1 MHz
20
VGS = 1.8 V
Ciss
60
40
10
Coss
20
VGS = 2.5 V
VGS = 4.5 V
0
50
100
150
200
0
250
4
8
12
16
I D - Drain Current (mA)
VDS - Drain-to-Source Voltage (V)
On-Resistance vs. Drain Current
Capacitance
5
20
1.60
VDS = 10 V
ID = 150 mA
4
1.40
3
2
VGS = 4.5 V
ID = 200 mA
(Normalized)
R DS(on) - On-Resistance
VGS - Gate-to-Source Voltage (V)
Crss
0
0
1
1.20
VGS = 1.8 V
ID = 175 mA
1.00
0.80
0
0.0
0.2
0.4
0.6
0.60
- 50
0.8
- 25
Q g - Total Gate Charge (nC)
0
25
50
75
100
125
TJ - Junction Temperature (°C)
Gate Charge
On-Resistance vs. Junction Temperature
50
1000
ID = 200 mA
R DS(on) - On-Resistance (Ω)
I S - Source Current (mA)
TJ = 125 °C
100
TJ = 25 °C
TJ = 50 °C
10
40
ID = 175 mA
30
20
10
1
0.0
0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
0
1
2
3
4
5
VSD - Source-to-Drain Voltage (V)
VGS - Gate-to-Source Voltage (V)
Surge-Drain Diode Forward Voltage
On-Resistance vs. Gate-to-Source Voltage
Document Number: 71427
S10-2544-Rev. C, 08-Nov-10
6
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3
Si1034X
Vishay Siliconix
0.3
3.0
0.2
2.5
ID = 0.25 mA
2.0
0.1
IGSS - (µA)
VGS(th) Variance (V)
TYPICAL CHARACTERISTICS (TA = 25 °C, unless otherwise noted)
0.0
1.5
- 0.1
1.0
- 0.2
0.5
VGS = 2.8 V
- 0.3
- 50
- 25
0
25
50
75
100
0.0
- 50
125
- 25
0
50
75
100
125
TJ - Temperature (°C)
TJ - Temperature (°C)
IGSS vs. Temperature
Threshold Voltage Variance vs. Temperature
BVGSS - Gate-to-Source Breakdown Voltage (V)
25
7
6
5
4
3
2
1
0
- 50
- 25
0
25
50
75
100
125
TJ - Temperature (°C)
BVGSS vs. Temperature
Normalized Effective Transient
Thermal Impedance
2
1
Duty Cycle = 0.5
0.2
Notes:
0.1
PDM
0.1
0.05
t1
t2
1. Duty Cycle, D =
t1
t2
2. Per Unit Base = RthJA = 500 °C/W
0.02
3. TJM - TA = PDMZthJA(t)
Single Pulse
0.01
10 -4
10 -3
4. Surface Mounted
10-2
10 -1
1
Square Wave Pulse Duration (s)
10
100
600
Normalized Thermal Transient Impedance, Junction-to-Ambient
Vishay Siliconix maintains worldwide manufacturing capability. Products may be manufactured at one of several qualified locations. Reliability data for Silicon
Technology and Package Reliability represent a composite of all qualified locations. For related documents such as package/tape drawings, part marking, and
reliability data, see www.vishay.com/ppg?71427.
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4
Document Number: 71427
S10-2544-Rev. C, 08-Nov-10
Package Information
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Vishay Siliconix
SC-89 6-Leads (SOT-563F)
E1/2
2
3
aaa
D
e1
4
C
2x
4
A
B
D
6
5
4
SECTION B-B
C
E/2
2
E
E1
3
6
2x
DETAIL “A”
aaa
C
1
5
2
2x
3
bbb
C
e
B
6x b
4
ddd
M
C
A–B D
L1
A1
L
A
A1
SEE DETAIL “A”
Notes
1. Dimensions in millimeters.
2. Dimension D does not include mold flash, protrusions or gate
burrs. Mold flush, protrusions or gate burrs shall not exceed
0.15 mm per dimension E1 does not include interlead flash
or protrusion, interlead flash or protrusion shall not exceed
0.15 mm per side.
3. Dimensions D and E1 are determined at the outmost extremes
of the plastic body exclusive of mold flash, the bar burrs, gate
burrs and interlead flash, but including any mismatch between
the top and the bottom of the plastic body.
4. Datums A, B and D to be determined 0.10 mm from the lead tip.
5. Terminal numbers are shown for reference only.
6. These dimensions apply to the flat section of the lead between
0.08 mm and 0.15 mm from the lead tip.
Revision: 11-Aug-14
DIM.
MILLIMETERS
MIN.
NOM.
A
0.56
0.58
MAX.
0.60
A1
0
0.02
0.10
b
0.15
0.22
0.30
0.18
c
0.10
0.14
D
1.50
1.60
1.70
E
1.50
1.60
1.70
1.25
E1
1.15
1.20
e
0.45
0.50
0.55
e1
0.95
1.00
1.05
L
0.25
0.35
0.50
L1
0.10
0.20
0.30
C14-0439-Rev. C, 11-Aug-14
DWG: 5880
Document Number: 71612
1
For technical questions, contact: analogswitchtechsupport@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Application Note 826
Vishay Siliconix
RECOMMENDED MINIMUM PADS FOR SC-89: 6-Lead
0.051
0.012
0.020
(0.300)
(0.500)
0.019
(0.478)
0.031
(0.798)
0.069
(1.753)
(1.300)
0.051
(0.201)
Recommended Minimum Pads
Dimensions in Inches/(mm)
Return to Index
Return to Index
APPLICATION NOTE
Document Number: 72605
Revision: 21-Jan-08
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21
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Revision: 01-Jan-2022
1
Document Number: 91000