Si4567DY
Vishay Siliconix
N- and P-Channel 40-V (D-S) MOSFET
FEATURES
PRODUCT SUMMARY
VDS (V)
N-Channel
40
N-Channel
- 40
RDS(on) (Ω)
ID (A)a
0.060 at VGS = 10 V
5.0
0.070 at VGS = 4.5 V
4.7
0.085 at VGS = - 10 V
- 4.4
0.122 at VGS = - 4.5 V
- 3.7
Qg (Typ.)
5.6
6
• Halogen-free According to IEC 61249-2-21
Available
• TrenchFET® Power MOSFET
• 100 % Rg Tested
APPLICATIONS
• CCFL Inverter
D1
S2
SO-8
S1
1
8
D1
G1
2
7
D1
S2
3
6
D2
G2
4
5
D2
G2
G1
Top View
Ordering Information: Si4567DY-T1-E3 (Lead (Pb)-free)
Si4567DY-T1-GE3 (Lead (Pb)-free and Halogen-free)
S1
D2
N-Channel MOSFET
P-Channel MOSFET
ABSOLUTE MAXIMUM RATINGS TA = 25 °C, unless otherwise noted
Parameter
Symbol
N-Channel
P-Channel
Drain-Source Voltage
VDS
40
- 40
Gate-Source Voltage
VGS
Continuous Drain Current (TJ = 150 °C)
5
- 4.4
TC = 70 °C
4.7
- 3.7
ID
TA = 70 °C
IDM
Pulsed Drain Current (10 µs Pulse Width)
Source-Drain Current Diode Current
TC = 25 °C
TA = 25 °C
4.1
b, c
- 3.6b, c
3.3
b, c
- 2.9b, c
20
IS
2.3
- 2.5
1.5b, c
- 1.6b, c
- 20
ISM
20
Single Pulse Avalanche Current
IAS
7
12
EAS
2.5
7.2
TC = 25 °C
2.75
2.95
TC = 70 °C
1.75
1.90
Maximum Power Dissipation
L = 0.1 mH
TA = 25 °C
PD
1.95b, c
1.18b, c
1.25b, c
TJ, Tstg
Operating Junction and Storage Temperature Range
mJ
b, c
1.85
TA = 70 °C
A
- 20
Pulsed Source-Drain Current
Single Pulse Avalanche Energy
V
± 16
TC = 25 °C
TA = 25 °C
Unit
W
- 55 to 150
°C
THERMAL RESISTANCE RATINGS
N-Channel
Parameter
Maximum
Junction-to-Ambientb, d
Maximum Junction-to-Foot (Drain)
P-Channel
Symbol
Typ.
Max.
t ≤ 10 s
RthJA
57
67.5
54
64
Steady State
RthJF
35
45
33
42
Typ.
Max.
Unit
°C/W
Notes:
a. Based on TC = 25 °C.
b. Surface Mounted on 1" x 1" FR4 board.
c. t = 10 s.
d. Maximum under steady state conditions is 120 °C/W (N-Channel) and 110 °C/W (P-Channel).
Document Number: 73426
S09-0393-Rev. C, 09-Mar-09
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1
Si4567DY
Vishay Siliconix
SPECIFICATIONS TJ = 25 °C, unless otherwise noted
Parameter
Symbol
Test Conditions
Min.
Typ.a
Max.
Unit
Static
Drain-Source Breakdown Voltage
VDS Temperature Coefficient
VGS(th) Temperature Coefficient
Gate-Source Threshold Voltage
Gate-Body Leakage
VDS
ΔVDS/TJ
ΔVGS(th)/TJ
VGS(th)
IGSS
VGS = 0 V, ID = 250 µA
N-Ch
40
VGS = 0 V, ID = - 250 µA
P-Ch
- 40
ID = 250 µA
N-Ch
P-Ch
- 40
ID = 250 µA
N-Ch
- 4.6
3.5
On-State Drain Currentb
Drain-Source On-State Resistanceb
Forward Transconductanceb
IDSS
ID(on)
RDS(on)
gfs
V
IID = - 250 µA
P-Ch
VDS = VGS, ID = 250 µA
N-Ch
0.8
2.2
VDS = VGS, ID = - 250 µA
P-Ch
- 0.8
- 2.2
VDS = 0 V, VGS = ± 16 V
VDS = 40 V, VGS = 0 V
Zero Gate Voltage Drain Current
40
ID = - 250 µA
N-Ch
100
P-Ch
- 100
N-Ch
1
VDS = - 40 V, VGS = 0 V
P-Ch
-1
VDS = 40 V, VGS = 0 V, TJ = 55 °C
N-Ch
10
VDS = - 40 V, VGS = 0 V, TJ = 55 °C
P-Ch
- 10
VDS = 5 V, VGS = 10 V
N-Ch
20
VDS = - 5 V, VGS = - 10 V
P-Ch
- 20
VGS = 10 V, ID = 4.1 A
N-Ch
0.048
VGS = - 10 V, ID = - 3.6 A
P-Ch
0.068
0.085
VGS = 4.5 V, ID = 3.8 A
N-Ch
0.056
0.070
VGS = - 4.5 V, ID = - 2.9 A
P-Ch
0.097
0.122
VDS = 15 V, ID = 4.1 A
N-Ch
15
VDS = - 15 V, ID = - 3.6 A
P-Ch
7
nA
µA
A
0.060
Ω
S
Dynamica
Input Capacitance
Ciss
Output Capacitance
Coss
Reverse Transfer Capacitance
Crss
N-Channel
VDS = 20 V, VGS = 0 V, f = 1 MHz
P-Channel
VDS = - 20 V, VGS = 0 V, f = 1 MHz
VDS = 20 V, VGS = 10 V, ID = 5 A
Total Gate Charge
Gate-Source Charge
Qg
VDS = - 20 V, VGS = - 10 V, ID = - 5 A
355
P-Ch
480
N-Ch
50
P-Ch
80
N-Ch
29
P-Ch
56
N-Ch
8
12
P-Ch
12
18
3.7
6
9
P-Ch
6
N-Ch
1.1
P-Ch
1.5
N-Ch
1.4
P-Ch
2.7
Qgs
Gate-Drain Charge
Qgd
Gate Resistance
Rg
f = 1 MHz
pF
N-Ch
N-Channel
VDS = 20 V, VGS = 4.5 V ID = 5 A
P-Channel
VDS = - 20 V, VGS = - 4.5 V, ID = - 5 A
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N-Ch
N-Ch
1.6
3.4
5.2
P-Ch
2.8
5.7
8.6
nC
Ω
Document Number: 73426
S09-0393-Rev. C, 09-Mar-09
Si4567DY
Vishay Siliconix
SPECIFICATIONS TJ = 25 °C, unless otherwise noted
Parameter
Symbol
Test Conditions
Min.
Typ.a
Max.
Unit
Dynamica
td(on)
Turn-On Delay Time
N-Channel
VDD = 20 V, RL = 4 Ω
ID ≅ 1 A, VGEN = 10 V, Rg = 1 Ω
tr
Rise Time
td(off)
Turn-Off Delay Time
tf
Fall Time
P-Channel
VDD = - 20 V, RL = 4 Ω
ID ≅ - 1 A, VGEN = - 10 V, Rg = 1 Ω
td(on)
Turn-On Delay Time
N-Channel
VDD = 20 V, RL = 4 Ω
ID ≅ 1 A, VGEN = 4.5 V, Rg = 1 Ω
tr
Rise Time
tf
P-Channel
VDD = - 20 V, RL = 4 Ω
ID ≅ - 1 A, VGEN = - 4.5 V, Rg = 16 Ω
IS
TC = 25 °C
td(off)
Turn-Off Delay Time
Fall Time
N-Ch
8
13
P-Ch
10
15
N-Ch
20
30
P-Ch
16
25
N-Ch
23
35
P-Ch
19
30
N-Ch
27
42
P-Ch
10
15
N-Ch
74
110
P-Ch
23
35
N-Ch
95
145
140
P-Ch
93
N-Ch
31
48
P-Ch
30
45
N-Ch
33
50
P-Ch
25
38
ns
Drain-Source Body Diode Characteristics
Continuous Source-Drain Diode
Current
Pulse Diode Forward Current
a
Body Diode Voltage
ISM
N-Ch
2.3
P-Ch
- 2.5
N-Ch
20
P-Ch
VSD
A
- 20
IS = 1.5 A
N-Ch
0.8
1.2
IS = - 1.6 A
P-Ch
- 0.8
- 1.2
N-Ch
26
40
P-Ch
26
40
Body Diode Reverse Recovery Time
trr
Body Diode Reverse Recovery Charge
Qrr
N-Channel
IF = 2 A, dI/dt = 100 A/µs, TJ = 25 °C
N-Ch
26
40
P-Ch
22
35
Reverse Recovery Fall Time
ta
P-Channel
IF = - 2 A, dI/dt = - 100 A/µs, TJ = 25 °C
N-Ch
13
P-Ch
12
Reverse Recovery Rise Time
tb
N-Ch
13
P-Ch
14
V
ns
nC
ns
Notes:
a. Guaranteed by design, not subject to production testing.
b. Pulse test; pulse width ≤ 300 µs, duty cycle ≤ 2 %.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation
of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability.
Document Number: 73426
S09-0393-Rev. C, 09-Mar-09
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Si4567DY
Vishay Siliconix
N-CHANNEL TYPICAL CHARACTERISTICS 25 °C, unless otherwise noted
20
1.2
1.0
I D - Drain Current (A)
I D - Drain Current (A)
VGS = 10 thru 4 V
16
12
3V
8
4
0.8
0.6
TC = 125 ˚C
0.4
25 ˚C
0.2
- 55 ˚C
0
0.0
0.5
1.0
1.5
2.0
2.5
0.0
0.0
3.0
0.5
VDS - Drain-to-Source Voltage (V)
1.0
1.5
2.0
2.5
3.0
VGS - Gate-to-Source Voltage (V)
Output Characteristics
Transfer Characteristics
0.08
550
450
0.07
C - Capacitance (pF)
R DS(on) - On-Resistance (m Ω)
500
VGS = 4.5 V
0.06
VGS = 10 V
0.05
400
Ciss
350
300
250
200
150
0.04
Crss
100
Coss
50
0.03
0
0
4
8
12
16
20
0
16
24
32
ID - Drain Current (A)
VDS - Drain-to-Source Voltage (V)
On-Resistance vs. Drain Current and Gate Voltage
Capacitance
ID = 5 A
ID = 5 A
1.8
VDS = 20 V
VDS = 30 V
4
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1.5
VGS = 10 V
1.2
0.9
2
0
0.0
VGS = 4.5 V
(Normalized)
6
VDS = 10 V
R DS(on) - On-Resistance
8
40
2.1
10
V GS - Gate-to-Source Voltage (V)
8
2.5
5.0
7.5
10.0
12.5
0.6
- 50
- 25
0
25
50
75
100
125
Qg - Total Gate Charge (nC)
TJ - Junction Temperature (°C)
Gate Charge
On-Resistance vs. Junction Temperature
150
Document Number: 73426
S09-0393-Rev. C, 09-Mar-09
Si4567DY
Vishay Siliconix
N-CHANNEL TYPICAL CHARACTERISTICS
25 °C, unless otherwise noted
0.25
R DS(on) - Drain-to-Source On-Resistance (Ω)
20
I S - Source Current (A)
10
TJ = 150 ˚C
1
TJ = 25 ˚C
0.1
0.01
0.00
0.2
0.4
0.6
0.8
1.0
ID = 5 A
0.20
0.15
0.10
TA = 125 °C
0.05
TA = 25 °C
0.00
2
1.2
3
4
VSD - Source-to-Drain Voltage (V)
6
7
8
9
10
VGS - Gate-to-Source Voltage (V)
Source-Drain Diode Forward Voltage
On-Resistance vs. Gate-to-Source Voltage
0.4
50
0.2
40
0.0
Power (W)
VGS(th) Variance (V)
5
ID = 5 mA
- 0.2
- 0.4
30
20
ID = 250 µA
10
- 0.6
- 0.8
- 50
- 25
0
25
50
75
100
125
0
0.001
150
0.01
TJ – Temperature (°C)
0.1
1
10
Time (s)
Single Pulse Power, Junction-to-Ambient
Threshold Voltage
100
Limited by RDS(on)*
I D - Drain Current (A)
10
1 ms
1
10 ms
100 ms
0.1
1s
10 s
DC
TA = 25 °C
Single Pulse
0.01
0.1
1
10
100
VDS - Drain-to-Source Voltage (V)
* VGS > minimum V GS at which R DS(on) is specified
Safe Operating Area, Junction-to-Ambient
Document Number: 73426
S09-0393-Rev. C, 09-Mar-09
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Si4567DY
Vishay Siliconix
N-CHANNEL TYPICAL CHARACTERISTICS 25 °C, unless otherwise noted
6
5
ID - Drain Current (A)
4
3
2
1
0
0
25
50
75
100
125
150
TC - Case Temperature (˚C)
Current Derating*
3.5
1.25
3.0
Power Dissipation (W)
Power Dissipation (W)
1.00
2.5
2.0
1.5
1.0
0.75
0.50
0.25
0.5
0.0
0.00
0
25
50
75
100
125
TC - Case Temperature (˚C)
Power Derating, Junction-to-Foot
150
0
25
50
75
100
125
150
TA - Ambient Temperature (°C)
Power Derating, Junction-to-Ambient
* The power dissipation PD is based on TJ(max) = 150 °C, using junction-to-case thermal resistance, and is more useful in settling the upper
dissipation limit for cases where additional heatsinking is used. It is used to determine the current rating, when this rating falls below the package
limit.
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Document Number: 73426
S09-0393-Rev. C, 09-Mar-09
Si4567DY
Vishay Siliconix
N-CHANNEL TYPICAL CHARACTERISTICS 25 °C, unless otherwise noted
2
Normalized Effective Transient
Thermal Impedance
1
Duty Cycle = 0.5
0.2
Notes:
0.1
PDM
0.1
0.05
t1
t2
1. Duty Cycle, D =
0.02
t1
t2
2. Per Unit Base = R thJA = 120 °C/W
3. T JM - TA = PDMZthJA(t)
Single Pulse
4. Surface Mounted
0.01
10- 4
10- 3
10- 2
10- 1
1
Square Wave Pulse Duration (s)
10
100
600
Normalized Thermal Transient Impedance, Junction-to-Ambient
2
Normalized Effective Transient
Thermal Impedance
1
Duty Cycle = 0.5
0.2
0.1
0.1
0.05
0.02
Single Pulse
0.01
10- 4
10- 3
10- 2
10- 1
Square Wave Pulse Duration (s)
1
10
Normalized Thermal Transient Impedance, Junction-to-Case
Document Number: 73426
S09-0393-Rev. C, 09-Mar-09
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Si4567DY
Vishay Siliconix
P-CHANNEL TYPICAL CHARACTERISTICS 25 °C, unless otherwise noted
2.0
20
VGS = 10 thru 5 V
1.6
I D - Drain Current (A)
I D - Drain Current (A)
16
4V
12
1.2
0.8
TC = 125 °C
4
0.4
25 °C
0
0.0
0.0
0.0
8
- 55 °C
0.5
1.0
1.5
2.0
2.5
3.0
0.5
1.0
1.5
2.0
2.5
3.0
VGS - Gate-to-Source Voltage (V)
VDS - Drain-to-Source Voltage (V)
Output Characteristics
Transfer Characteristics
0.20
800
600
C - Capacitance (pF)
R DS(on) - On-Resistance (mΩ)
700
0.17
0.14
VGS = 4.5 V
0.11
400
300
200
VGS = 10 V
0.08
Ciss
500
Coss
100
0.05
Crss
0
0
4
8
12
16
20
0
8
ID - Drain Current (A)
16
1.8
ID = 5 A
ID = 3.6 A
VGS = 10 V
1.6
8
VDS = 10 V
6
RDS(on) - On-Resistance
(Normalized)
V GS - Gate-to-Source Voltage (V)
40
Capacitance
10
VDS = 20 V
4
VDS = 30 V
2
1.4
VGS = 4.5 V
1.2
1.0
0.8
2.5
5.0
7.5
Qg - Total Gate Charge (nC)
Gate Charge
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32
VDS - Drain-to-Source Voltage (V)
On-Resistance vs. Drain Current and Gate Voltage
0
0.0
24
10.0
12.5
0.6
- 50
- 25
0
25
50
75
100
125
150
TJ - Junction Temperature (°C)
On-Resistance vs. Junction Temperature
Document Number: 73426
S09-0393-Rev. C, 09-Mar-09
Si4567DY
Vishay Siliconix
P-CHANNEL TYPICAL CHARACTERISTICS
25 °C, unless otherwise noted
0.5
R DS(on) - Drain-to-Source On-Resistance ( Ω)
20
I S - Source Current (A)
10
TJ = 150 °C
1
TJ = 25 °C
0.1
ID = 3.6 A
0.4
0.3
0.2
0.1
TA = 25 °C
0.0
0.01
0.00
0.2
0.4
0.6
0.8
1.0
TA = 125 °C
2
1.2
3
4
VSD - Source-to-Drain Voltage (V)
5
6
7
8
9
10
VGS - Gate-to-Source Voltage (V)
Source-Drain Diode Forward Voltage
On-Resistance vs. Gate-to-Source Voltage
0.5
80
0.4
64
ID = 250 µA
0.2
Power (W)
VGS(th) Variance (V)
0.3
ID = 5 mA
0.1
48
32
0.0
- 0.1
16
- 0.2
- 0.3
- 50
- 25
0
25
50
75
100
125
0
0.001
150
0.01
TJ - Temperature (°C)
0.1
1
10
Time (s)
Single Pulse Power, Junction-to-Ambient
Threshold Voltage
100
Limited by RDS(on)*
1 ms
I D - Drain Current (A)
10
1
10 ms
0.1
0.01
0.1
100 ms
1s
10 s
DC
TA = 25 °C
Single Pulse
1
10
100
VDS - Drain-to-Source Voltage (V)
* VGS > minimum V GS at which R DS(on) is specified
Safe Operating Area, Junction-to-Ambient
Document Number: 73426
S09-0393-Rev. C, 09-Mar-09
www.vishay.com
9
Si4567DY
Vishay Siliconix
P-CHANNEL TYPICAL CHARACTERISTICS 25 °C, unless otherwise noted
6
5
ID - Drain Current (A)
4
3
2
1
0
0
25
50
75
100
125
150
TC - Case Temperature (°C)
Current Derating*
4.0
1.5
3.5
1.2
Power Dissipation (W)
Power Dissipation (W)
3.0
2.5
2.0
1.5
1.0
0.9
0.6
0.3
0.5
0.0
0.0
0
25
50
75
100
125
150
0
25
50
75
100
125
TC - Case Temperature (°C)
TA - Ambient Temperature (°C)
Power Derating, Junction-to-Foot
Power Derating, Junction-to-Ambient
150
* The power dissipation PD is based on TJ(max) = 150 °C, using junction-to-case thermal resistance, and is more useful in settling the upper
dissipation limit for cases where additional heatsinking is used. It is used to determine the current rating, when this rating falls below the package
limit.
www.vishay.com
10
Document Number: 73426
S09-0393-Rev. C, 09-Mar-09
Si4567DY
Vishay Siliconix
P-CHANNEL TYPICAL CHARACTERISTICS 25 °C, unless otherwise noted
2
Normalized Effective Transient
Thermal Impedance
1
Duty Cycle = 0.5
0.2
Notes:
0.1
PDM
0.1
0.05
t1
t2
1. Duty Cycle, D =
0.02
t1
t2
2. Per Unit Base = R thJA = 110 °C/W
3. T JM - TA = PDMZthJA(t)
Single Pulse
4. Surface Mounted
0.01
10 -4
10 -3
10 -2
10 -1
1
Square Wave Pulse Duration (s)
10
100
600
Normalized Thermal Transient Impedance, Junction-to-Ambient
2
Normalized Effective Transient
Thermal Impedance
1
Duty Cycle = 0.5
0.2
0.1
0.1
0.05
0.02
Single Pulse
0.01
10 -4
10 -3
10 -2
10 -1
Square Wave Pulse Duration (s)
1
10
Normalized Thermal Transient Impedance, Junction-to-Case
Vishay Siliconix maintains worldwide manufacturing capability. Products may be manufactured at one of several qualified locations. Reliability data for Silicon
Technology and Package Reliability represent a composite of all qualified locations. For related documents such as package/tape drawings, part marking, and
reliability data, see www.vishay.com/ppg?73426.
Document Number: 73426
S09-0393-Rev. C, 09-Mar-09
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Revision: 01-Jan-2022
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Document Number: 91000