End of Life. Last Available Purchase Date is 31-Dec-2014
Si9976
Vishay Siliconix
N-Channel Half-Bridge Driver
FEATURES
D
D
D
D
D
D
D
APPLICATIONS
Single Input for High-Side and Low-Side MOSFETs
20- to 40-V Supply
Static (dc) Operation
Cross-Conduction Protected
Undervoltage Lockout
ESD and Short Circuit Protected
Fault Feedback
D
D
D
D
D
D
D
Power Supplies
Motor Drives
Office Automation
Computer Peripherals
Industrial Controllers
Robotics
Medical Equipment
DESCRIPTION
The Si9976 is an integrated driver for an n-channel MOSFET
half-bridge. Schmitt trigger inputs provide logic signal
compatibility and hysteresis for increased noise immunity. An
internal low-voltage regulator allows the device to be powered
directly from a system supply of 20 to 40 volts. Both half-bridge
n-channel gates are driven directly with low-impedance
outputs. Addition of one external capacitor allows an internal
circuit to level shift both the power supply and logic signal for
the half-bridge high-side n-channel gate drive. An internal
charge pump replaces leakage current lost in the high-side
driver circuit to provide “static” (dc) operation in any output
condition. Protection features include an undervoltage
lockout, cross-conduction prevention logic, and a short circuit
monitor.
The Si9976 is available in both standard and lead (Pb)-free,
14-pin SOIC (surface mount) packages, specified to operate
over the industrial (−40 to 85_C) temperature range.
FUNCTIONAL BLOCK DIAGRAM
V+
Bootstrap
Regulator
V+3
Low Voltage
Regulator
VDD
4
VDD
Under Voltage
Lockout 2
CBoot
Under Voltage
Lockout 1
12
7
CAP
13
G1
S1
Short Circuit
& UVL Detect
8
FAULT
IN 5
LITTLE FOOT
VCC
Charge
Pump
2
250 ns
Delay
0.01 mF
300 ns
Delay
Substrate
EN 6
10
HalfBridge
Output
S
R
Q
9
G2
Enable Latch
GND
GND
Document Number: 70016
S-40757—Rev. F, 19-Apr-04
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1
Si9976
Vishay Siliconix
ABSOLUTE MAXIMUM RATINGS
Voltage on IN, EN (pins 5, 6)
with respect to ground . . . . . . . . . . . . . . . . . . . . . . . . . −0.3 to VDD +0.3 V
Voltage on VCC (pin 7) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.3 to +18 V
Voltage on V+, S1 (pins 3, 13) . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.3 to +50 V
Voltage on CAP, G1a (pins 2, 12) . . . . . . . . . . . . . . . . . . . . . . . . −0.3 to +60 V
Peak Output Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.5 A
Operating Temperature (TA) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −40 to 85_C
Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −50 to 150_C
Maximum Junction Temperature (TJ) . . . . . . . . . . . . . . . . . . . . . . . . . . . 125_C
Power Dissipationb . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 W
QJA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 100_C/Wb
Notes
a. Internally generated voltage for reference only.
b. Derate 10 mW/_C above 25_C.
c. PC board mounted with no forced air flow.
SPECIFICATIONSa
Test Conditions
UnlessOtherwise Specified
Parameter
Symbol
V+ = 20 to 40 V
TA = Operating Temperature Range
Limits
D Suffix −40 to 85_C
Minc
Typb
Maxc
Unit
1.0
V
Input
Input Voltage High (EN and IN)
VINH
Input Voltage Low (EN and IN)
VINL
4.0
Input Hysteresis Voltage
VH
Input Current—Input Voltage High
IINH
(EN and IN) VIN = 15 V
0.5
Input Current—Input Voltage Low
IINL
(EN and IN) VIN = 0 V
−1
S1 = V+, IOUT = −10 mA
10
12
S1 = GND, IOUT = −10 mA
12
15
1
mA
Output
Output Voltage High, G1d
Output Voltage High, G2e
Output Voltage Low, G1 and G2
VOUTH
VOUTL
S1 = GND, IOUT = 60 mA
Fault Output Voltage High
VOH
VCC = 4.5 V, IOUT = −0.2 mA
Fault Output Voltage Low
VOL
VCC = 4.5 V, IOUT = 0.6 mA
Undervoltage Lockout 1
UVL1
11
Undervoltage Lockout 2
UVL2
14
Capacitor Voltageg
VCAP
Capacitor Current
ICAP
1.2
3.5
V
4
0.3
V+ = 40V
3
1.0
55
S1 = GND, VCAP = 0 V
−10
S1 = GND, VCAP = 9 V
−2
mA
Supply
V+ Supply Range
20
40
I+ (H)
G2 High, No Load
1.7
3.5
I+ (L)
G2 Low, No Load, S1 = GND
2
4.5
VCC Supply Current
ICC
VCC = 16.5 V
VDD Supply Voltagef
VDD
V+ Supply Current
VCC Supply Range
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2
4.5
15
16
V
mA
16.5
V
10
mA
17.5
V
Document Number: 70016
S-40757—Rev. F, 19-Apr-04
Si9976
Vishay Siliconix
SPECIFICATIONSa
Test Conditions
UnlessOtherwise Specified
Parameter
Limits
D Suffix −40 to 85_C
V+ = 20 to 40 V
TA = Operating Temperature Range
Symbol
Minc
Typb
Maxc
Unit
Dynamic
Propogation Delay Time
Low to High Level
tPLH
50% IN to VOUT = 5 V, CL = 600 pF
Propogation Delay Time
High to Low Level
tPHL
Propogation Delay Time, Low to High Level, Enable-to-Fault Output
G1
350
G2
400
G1
150
G2
50
50% IN to FAULT = 2 V, S1 shorted to GND or V+
500
tr
1 to 10 V, CL = 600 pf
110
Output Fall Time (G1, G2)
tf
10 to 1 V, CL = 600 pf
50
Short Circuit Pulse Width
tSC
50% to 50% of VOUT
350
Output Rise Time (G1, G2)
ns
Notes
a. Refer to PROCESS OPTION FLOWCHART for additional information.
b. Typical values are for DESIGN AID ONLY, not guaranteed nor subject to production testing.
c. The algebraic convention whereby the most negative value is a minimum and the most positive a maximum.
d. To supply the output current of 10 mA on a dc basis, an external 13-V supply must be connected between the CAP pin and the S1 pin with the negative terminal
of the supply connected to S1. This is not needed in an actual application because output currents are supplied by the CBOOT capacitor. Voltage specified with
respect to V+.
e. For testing purposes, the 10-mA load current must be supplied by an external current source to the VDD pin to avoid pulling down the VDD supply.
f.
Internally generated voltage for reference only.
g. VCAP = (V+) + (VDD)
TRUTH TABLE
EN
IN
Condition
FAULT OUTPUT
G1 OUT
G2 OUT
1
0
Normal Operation
1
1
Normal Operation
0
Low
High
0
High
0
X
Low
Disabled
Xa
Low
Low
1
0
Load Shorted to V+
1b
Low
Low
1
1
Load Shorted to Ground
1b
Low
Low
1
1
Undervoltage on CBOOT
0
Low
Low
1
0
Undervoltage on CBOOT
0
Low
High
X
X
Undervoltage on VDDc
1
Low
Low
Notes
a. FAULT output retains previous state until ENABLE rising edge.
b. Latch FAULT condition, reset by ENABLE rising edge.
c. VDD is an internally generated low-voltage supply.
Document Number: 70016
S-40757—Rev. F, 19-Apr-04
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3
Si9976
Vishay Siliconix
PIN CONFIGURATION AND ORDERING INFORMATION
SOIC-14
NC
1
14
NC
CAP
2
13
S1
V+
3
12
G1
VDD
4
11
NC
IN
5
10
GND
EN
6
9
G2
VCC
7
8
FAULT
ORDERING INFORMATION
Part Number
Temperature Range
Package
−40 to 85_C
SOIC-14
Si9976DY
Si9976DY-T1
Si9976DY-T1—E3
Top View
PIN DESCRIPTION
Pin 1
No connection.
Pin 2: CAP
Connection for the positive terminal of the bootstrap capacitor
CBOOT. A 0.01-mF CBOOT capacitor can be used for most
applications.
Pin 3: V+
This is the only external power supply required for the Si9976,
and must be the same supply used to power the half-bridge it
is driving. The Si9976 powers it’s low-voltage logic, low-side
gate driver, and bootstrap/charge pump circuits from
self-contained voltage regulators which require only a
bootstrap capacitor on the CAP pin and a bypass capacitor on
the VDD pin.
No voltage sensing circuitry monitors V+ directly; however, the
low-voltage, internally generated VDD supply and the
bootstrap voltage (which are derived from V+) are directly
protected by undervoltage monitors.
Pin 4: VDD
Pin 7: VCC
If the FAULT output is used, the VCC pin must be connected to
the logic supply voltage in order to set the high level of the
FAULT output. If the FAULT output is not used, this pin may be
left open with no effect on internal fault sensing or protection
circuitry.
Pin 8: FAULT
The Fault output is latched high when a short-circuit output
condition is detected. FAULT will return low when the circuit is
reset using the EN pin. The FAULT output also indicates the
status of the undervoltage sense circuit on VDD, however the
fault condition is cleared automatically when the undervoltage
condition clears.
Pin 9: G2
This pin drives the gate of the external low-side power
transistor.
Pin 10: GND
The ground return for V+, logic reference, and connection for
source of external low-side power transistor.
Connection to the internally generated low-voltage supply
which must be bypassed to ground with a 0.01-mF capacitor.
Pin 11
No connection.
Pin 5: IN
Pin 12: G1
This pin drives the gate of the external high side power
transistor.
Logic input. A low level input turns off the high-side half-bridge
MOSFET and, after an internally set dead time, turns the
low-side half-bridge MOSFET on. A high input level has the
opposite effect. The input is compatible with 5-, 12- or 15-V
logic outputs.
Pin 6: EN
Enable input. A low EN input level prevents turn on of either
half-bridge MOSFET. If the Si9976 is internally disabled as a
result of an output short-circuit condition, a low-to-high
transition on EN is required to clear the fault and resume
operation. The input logic levels are the same as IN.
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Pin 13: S1
Connection for the source of the external high-side power
transistor, the drain of the external low-side power transistor,
the negative terminal of the bootstrap capacitor, and the
system load. The voltage on this pin is sensed by the circuitry
that monitors the load for shorts.
Pin 14
No connection.
Document Number: 70016
S-40757—Rev. F, 19-Apr-04
Si9976
Vishay Siliconix
DETAILED DESCRIPTION
Power On Conditioning
Short Circuit Protection
Bootstrap-type floating supplies require that the bootstrap
capacitor be charged at power on. In the case of the Si9976,
this is accomplished by pulsing the IN line low with the EN line
held high, thus turning on the low-side MOSFET and providing
the charging path for the capacitor.
This device is intended to be used only in a half-bridge which
drives inductive loads. A shorted load is presumed if the load
voltage does not make the intended transition within an
allotted time. Separate timing is provided for the two
transitions. A longer time is allowed for the high-side to turn on
(300 ns vs. 200 ns) since the propagation delays are longer.
Excessive capacitive loading can be interpreted as a short.
The value of capacitance that is needed to produce the
indication of a short depends on the load driving capability of
the power transistors.
Operating Voltage: 20 to 40 V
The Si9976 is intended to be powered by a single power
supply within the range of 20 to 40 V and is designed to drive
a totem pole pair of NMOS power transistors such as those
within the Si9955. The power transistors must be powered by
the same power supply as this driver. In addition to the
high-voltage power supply (20 to 40 V), the Si9976 must have
a power supply connected to the VCC terminal, if a fault output
signal is desired. This power supply provides operating
voltage for the fault output and allows the high output voltage
level to be compatible with system logic that monitors the fault
condition. The value of this power supply must be within the
range of 4.5 to 16.5 V to ensure functionality of the output.
Internal fault circuitry, which is used for shorted-load
protection, is not affected by this power supply.
Cross-Conduction Protection
The high-side power transistor can only be turned on after a
fixed time delay following the return to ground of the low-side
power transistor’s gate. The low-side transistor can only be
turned on after a fixed time delay following the high-side
transistor turn-off signal.
ESD Protection
Electrostatic discharge protection devices are between VDD
and GND, VCC and GND, and from terminals IN, EN, G2, and
FAULT to both VDD and GND. V+, CAP, S1, and G1 are not
ESD protected.
Fault Feedback
Detection of a shorted load sets a latch which turns off both the
high-side and the low-side power transistors. If VCC is present,
a one level will be present on the FAULT output. To reset the
system, the enable input, EN, must be lowered to a logic zero
and then raised to a logic one. The logic level of the input, IN,
will determine which power transistor will be turned on first after
reset. An undervoltage condition on VDD is not latched, but
causes a one level on the FAULT output, if VCC is present.
Undervoltage Lockout
Static (dc) Operation
During power up, both power transistors are held off until the
internal regulated power supply, VDD, is approximately one
Vbe from the final value, nominally 16 V. After power up, the
undervoltage lockout circuitry continues to monitor VDD. If an
undervoltage condition occurs, both the high-side and
low-side transistors will be turned off and the fault output will be
set high. When the undervoltage condition no longer exists,
normal function will resume automatically. Separate voltage
sensing of the bootstrap capacitor voltage allows a turn-on
signal to be sent to the high-side drive circuit if either the
bootstrap capacitor has full voltage, or the load voltage is high
(driven high by an inductive load or shorted high). The voltage
sensing circuit will allow the high-side power transistor to turn
on if an on signal is present and the voltage on the bootstrap
capacitor rises from undervoltage to operating voltage.
All components of a charge pump, except the holding
(bootstrap) capacitor, are included in the circuit. This charge
pump will provide current that is sufficient to overcome any
leakage currents which would reduce the enhancement
voltage of the high-side power transistor while it is on. This
allows the high-side power transistor to be on continuously.
When the low-side power transistor is turned on, additional
charge is restored to the bootstrap capacitor, if needed. The
maximum switching speed of the system at 50% duty cycle is
limited by the on time of the low-side power transistor. During
this time, the bootstrap capacitor charge must be restored.
However, if the duty cycle is skewed so that the on time of the
high-side power transistor is long enough for the charge pump
to completely restore the charge lost during switching, then the
on time of the low-side power transistor is not restricted.
Document Number: 70016
S-40757—Rev. F, 19-Apr-04
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5
Package Information
Vishay Siliconix
SOIC (NARROW): 14-LEAD (POWER IC ONLY)
MILLIMETERS
14
13
12
11
10
9
Dim
A
A1
B
C
D
E
e
H
L
Ø
8
E
2
3
4
5
6
7
D
A
e
B
Document Number: 72809
28-Jan-04
A1
0.25
(GAGE PLANE)
1
H
INCHES
Min
Max
Min
Max
1.35
1.75
0.053
0.069
0.10
0.20
0.004
0.008
0.38
0.51
0.015
0.020
0.18
0.23
0.007
0.009
8.55
8.75
0.336
0.344
3.8
4.00
0.149
0.157
1.27 BSC
0.050 BSC
5.80
6.20
0.228
0.244
0.50
0.93
0.020
0.037
0_
8_
0_
8_
ECN: S-40080—Rev. A, 02-Feb-04
DWG: 5914
C
ALL LEADS
L
Ø
0.101 mm
0.004″
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1
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Revision: 01-Jan-2022
1
Document Number: 91000