SUD23N06-31L
Vishay Siliconix
N-Channel 60 V (D-S), 175 °C MOSFET, Logic Level
FEATURES
PRODUCT SUMMARY
rDS(on) (Ω)
ID (A)a
0.031 at VGS = 10 V
23
0.045 at VGS = 4.5 V
19.5
VDS (V)
60
• TrenchFET® Power MOSFET
• 175 °C Junction Temperature
Available
RoHS*
COMPLIANT
TO-252
D
G
Drain Connected to Tab
G
D
S
S
Top View
N-Channel MOSFET
Ordering Information: SUD23N06-31L
SUD23N06-31L-E3 (Lead (Pb)-free)
ABSOLUTE MAXIMUM RATINGS TC = 25 °C, unless otherwise noted
Parameter
Gate-Source Voltage
Continuous Drain Current (TJ = 175 °C)b
TC = 25 °C
TC = 100 °C
Symbol
Limit
Unit
VGS
± 20
V
23
ID
16.5
IDM
50
Continuous Source Current (Diode Conduction)
IS
23
Avalanche Current
IAS
20
Pulsed Drain Current
Single Avalanche Energy (Duty Cycle ≤ 1 %)
Maximum Power Dissipation
L = 0.1 mH
TC = 25 °C
TA = 25 °C
EAS
20
mJ
100
PD
W
3a
TJ, Tstg
Operating Junction and Storage Temperature Range
A
- 55 to 175
°C
THERMAL RESISTANCE RATINGS
Parameter
Maximum Junction-to-Ambienta
Symbol
t ≤ 10 sec
Steady State
Maximum Junction-to-Case
RthJA
RthJC
Typical
Maximum
18
22
40
50
3.2
4
Unit
°C/W
Notes:
a. Surface Mounted on 1" x 1" FR4 board, t ≤ 10 sec.
* Pb containing terminations are not RoHS compliant, exemptions may apply.
Document Number: 72145
S-71660-Rev. C, 06-Aug-07
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SUD23N06-31L
Vishay Siliconix
SPECIFICATIONS TJ = 25 °C, unless otherwise noted
Parameter
Symbol
Test Conditions
Min
Typa
Max
2.0
3.0
Unit
Static
Drain-Source Breakdown Voltage
Gate Threshold Voltage
Gate-Body Leakage
V(BR)DSS
VGS = 0 V, ID = 250 µA
60
VGS(th)
VDS = VGS, ID = 250 µA
1.0
IGSS
VDS = 0 V, VGS = ± 20 V
± 100
VDS = 60 V, VGS = 0 V
1
VDS = 60 V, VGS = 0 V, TJ = 125 °C
50
Zero Gate Voltage Drain Current
IDSS
On-State Drain Currentb
ID(on)
VDS = 60 V, VGS = 0 V, TJ = 175 °C
VDS = 5 V, VGS = 10 V
VGS = 10 V, ID = 15 A
Drain-Source On-State Resistanceb
Forward
Transconductanceb
rDS(on)
gfs
V
nA
µA
250
50
A
0.025
0.031
VGS = 10 V, ID = 15 A, TJ = 125 °C
0.055
VGS = 10 V, ID = 15 A, TJ = 175 °C
0.069
VGS = 4.5 V, ID = 10 A
0.037
VDS = 15 V, ID = 15 A
20
Ω
0.045
S
Dynamica
Input Capacitance
Ciss
Output Capacitance
Coss
Reverse Transfer Capacitance
Crss
Total Gate Chargec
Qg
Gate-Source Chargec
Qgs
c
Gate-Drain Charge
Qgd
Turn-On Delay Timec
td(on)
Rise Timec
Turn-Off Delay Time
tr
c
Fall Timec
td(off)
670
VGS = 0 V, VDS = 25 V, f = 1 MHz
pF
140
60
11
VDS = 30 V, VGS = 10 V, ID = 23 A
17
nC
3
3
VDD = 30 V, RL = 1.3 Ω
ID ≅ 23 A, VGEN = 10 V, Rg = 2.5 Ω
tf
8
15
15
25
30
45
25
40
ns
Source-Drain Diode Ratings and Characteristics (TC = 25 °C)
Pulsed Current
ISM
Diode Forward Voltage
VSD
IF = 15 A, VGS = 0 V
1.0
1.5
V
Reverse Recovery Time
trr
IF = 15 A, di/dt = 100 A/µs
30
60
ns
50
A
Notes:
a. For design aid only; not subject to production testing.
b. Pulse test; pulse width ≤ 300 µs, duty cycle ≤ 2 %.
c. Independent of operating temperature.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation
of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability.
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Document Number: 72145
S-71660-Rev. C, 06-Aug-07
SUD23N06-31L
Vishay Siliconix
TYPICAL CHARACTERISTICS 25 °C unless noted
50
50
VGS = 10 thru 6 V
5V
40
I D - Drain Current (A)
I D - Drain Current (A)
40
30
20
4V
10
30
20
TC = 125 °C
10
25 °C
3V
- 55 °C
0
0
0
2
4
6
8
0
10
1
2
3
4
5
VDS - Drain-to-Source Voltage (V)
VGS - Gate-to-Source Voltage (V)
Output Characteristics
Transfer Characteristics
32
6
0.10
TC = - 55 °C
0.08
r DS(on) - On-Resistance (Ω)
g fs - Transconductance (S)
25 °C
24
125 °C
16
8
0
VGS = 4.5 V
0.04
VGS = 10 V
0.02
0.00
0
5
10
15
20
25
0
10
20
30
40
ID - Drain Current (A)
ID - Drain Current (A)
Transconductance
On-Resistance vs. Drain Current
50
10
V GS - Gate-to-Source Voltage (V)
1000
800
C - Capacitance (pF)
0.06
Ciss
600
400
200
Coss
Crss
0
0
VDS = 30 V
ID = 23 A
8
6
4
2
0
10
20
30
40
50
VDS - Drain-to-Source Voltage (V)
Capacitance
Document Number: 72145
S-71660-Rev. C, 06-Aug-07
60
0
2
4
6
8
10
12
Qg - Total Gate Charge (nC)
Gate Charge
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SUD23N06-31L
Vishay Siliconix
TYPICAL CHARACTERISTICS 25 °C unless noted
100
2.5
VGS = 10 V
ID = 15 A
I S - Source Current (A)
rDS(on) - On-Resistance
(Normalized)
2.0
1.5
1.0
TJ = 150 °C
TJ = 25 °C
10
0.5
0.0
- 50
1
- 25
0
25
50
75
100
125
150
TJ - Junction Temperature ( °C)
On-Resistance vs. Junction Temperature
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175
0
0.3
0.6
0.9
1.2
1.5
VSD - Source-to-Drain Voltage (V)
Source-Drain Diode Forward Voltage
Document Number: 72145
S-71660-Rev. C, 06-Aug-07
SUD23N06-31L
Vishay Siliconix
THERMAL RATINGS
100
25
*rDS(on) Limited
10 µs
100 µs
I D - Drain Current (A)
I D - Drain Current (A)
20
15
10
10
1 ms
10 ms
1
100 ms
dc
TC = 25 °C
Single Pulse
5
0
0.1
0
25
50
75
100
125
150
175
0.1
1
10
100
VDS - Drain-to-Source Voltage (V)
*VGS > minimum VGS at which rDS(on) is specified
TA - Ambient Temperature (°C)
Maximum Drain Current
vs. Ambient Temperature
Safe Operating Area
2
Normalized Effective Transient
Thermal Impedance
1
Duty Cycle = 0.5
0.2
0.1
0.1
0.05
0.02
Single Pulse
0.01 10- 4
10- 3
10- 2
10- 1
1
10
Square Wave Pulse Duration (sec)
Normalized Thermal Transient Impedance, Junction-to-Case
Vishay Siliconix maintains worldwide manufacturing capability. Products may be manufactured at one of several qualified locations. Reliability data for Silicon Technology and Package Reliability represent a composite of all qualified locations. For related documents such as package/tape drawings, part marking, and reliability
data, see http://www.vishay.com/ppg?72145.
Document Number: 72145
S-71660-Rev. C, 06-Aug-07
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Vishay
Disclaimer
All product specifications and data are subject to change without notice.
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or in any other disclosure relating to any product.
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information provided herein to the maximum extent permitted by law. The product specifications do not expand or
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therein, which apply to these products.
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Document Number: 91000
Revision: 18-Jul-08
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