SUD80460E
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Vishay Siliconix
N-Channel 150 V (D-S) 175 °C MOSFET
FEATURES
TO-252
TO
• ThunderFET® power MOSFET
• Maximum 175 °C junction temperature
Drain connected to tab
• 100 % Rg and UIS tested
• Material categorization:
for definitions of compliance please see
www.vishay.com/doc?99912
APPLICATIONS
S
D
D
• Boost converter
G
Top View
• LED backlighting
• Synchronous rectification
PRODUCT SUMMARY
VDS (V)
RDS(on) max. () at VGS = 10 V
• Power supplies
150
• DC/AC inverter
0.0447
Qg typ. (nC)
10.5
ID (A)
42 d
Configuration
G
S
N-Channel MOSFET
Single
ORDERING INFORMATION
Package
TO-252
Lead (Pb)-free and halogen-free
SUD80460E-GE3
ABSOLUTE MAXIMUM RATINGS (TA = 25 °C, unless otherwise noted)
PARAMETER
SYMBOL
LIMIT
Drain-source voltage
VDS
150
Gate-source voltage
VGS
± 20
Continuous drain current
TC = 25 °C
TC = 125 °C
Pulsed drain current (t = 100 μs)
Continuous source-drain diode current
Single pulse avalanche current a
L = 0.1 mH
Single pulse avalanche energy a
Maximum power dissipation
TC = 25 °C
TC = 125 °C
Operating junction and storage temperature range
ID
42 d
40
IS
42 d
IAS
25
EAS
31.25
TJ, Tstg
Soldering recommendations (peak temperature) c
V
18.1
IDM
PD
UNIT
65.2 b
21.7 b
-55 to +175
260
A
mJ
W
°C
THERMAL RESISTANCE RATINGS
PARAMETER
Maximum junction-to-ambient (PCB mount) c
Maximum junction-to-case (drain)
Steady state
SYMBOL
MAXIMUM
RthJA
50
RthJC
2.3
UNIT
°C/W
Notes
a. Duty cycle 1 %.
b. See SOA curve for voltage derating.
c. When mounted on 1" square PCB (FR4 material).
d. Package limited.
S16-2150-Rev. A, 17-Oct-16
Document Number: 76248
1
For technical questions, contact: pmostechsupport@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
SUD80460E
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Vishay Siliconix
SPECIFICATIONS (TJ = 25 °C, unless otherwise noted)
PARAMETER
SYMBOL
TEST CONDITIONS
MIN.
TYP.
MAX.
UNIT
VDS
VGS = 0 V, ID = 250 μA
150
-
-
V
VGS(th)
VDS = VGS , ID = 250 μA
2
-
4
V
IGSS
VDS = 0 V, VGS = ± 20 V
-
-
250
nA
VDS = 150 V, VGS = 0 V
-
-
1
VDS = 150 V, VGS = 0 V, TJ = 125 °C
-
-
150
VDS = 150 V, VGS = 0 V, TJ = 175 °C
-
-
5
mA
ID(on)
VDS 10 V, VGS = 10 V
30
-
-
A
RDS(on)
VGS = 10 V, ID = 8.3 A
-
0.0372
0.0447
gfs
VDS = 15 V, ID = 8.3 A
-
11
-
S
-
560
-
-
148
-
Static
Drain-source breakdown voltage
Gate-source threshold voltage
Gate-source leakage
Zero gate voltage drain current
On-state drain current a
Drain-source on-state
resistance a
Forward transconductance a
Dynamic
IDSS
μA
b
Input capacitance
Ciss
Output capacitance
Coss
VDS = 50 V, VGS = 0 V, f = 1 MHz
pF
Reverse transfer capacitance
Crss
-
8
-
Total gate charge
Qg
-
10.5
16
Gate-source charge
Qgs
VDS = 75 V, VGS = 10 V, ID = 8.3 A
-
2.7
-
Gate-drain charge
Qgd
-
3.1
-
Gate resistance
Rg
f = 1 MHz
1.44
7.2
14.4
-
8
16
-
20
30
-
15
25
tf
-
30
50
Pulse diode forward current (t = 100 μs)
ISM
-
-
42
Body diode voltage
VSD
-
0.85
1.5
V
-
68
102
ns
-
0.21
0.32
μC
Turn-on delay time
Rise time
Turn-off delay time
Fall time
td(on)
tr
td(off)
VDD = 75 V, RL = 10.7 , ID 7 A,
VGEN = 10 V, Rg = 1
nC
ns
Drain-Source Body Diode Characteristics
Body diode reverse recovery time
trr
Body diode reverse recovery charge
Qrr
IF = 7 A, VGS = 0 V
IF = 7 A, di/dt = 100 A/μs
Reverse recovery fall time
ta
-
56
-
Reverse recovery rise time
tb
-
12
-
IRM(REC)
-
5.5
10
Body diode peak reverse recovery charge
A
ns
A
Notes
a. Pulse test; pulse width 300 μs, duty cycle 2 %.
b. Guaranteed by design, not subject to production testing.
c. Independent of operating temperature.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation
of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability.
S16-2150-Rev. A, 17-Oct-16
Document Number: 76248
2
For technical questions, contact: pmostechsupport@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
SUD80460E
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Vishay Siliconix
TYPICAL CHARACTERISTICS (25 °C, unless otherwise noted)
Axis Title
Axis Title
10000
30
TC = 125 °C
VGS = 10 V thru 8 V
1000
1st line
2nd line
VGS = 6 V
15
100
10
VGS = 5 V
45
1000
1st line
2nd line
20
2nd line
ID - Drain Current (A)
VGS = 7 V
25
2nd line
ID - Drain Current (A)
10000
60
30
100
TC = 25 °C
15
5
TC = -55 °C
VGS = 4 V
0
10
0.5
1
1.5
10
0
2
2
4
VGS - Gate-to-Source Voltage (V)
2nd line
Output Characteristics
Transfer Characteristics
Axis Title
Axis Title
1500
0.05
1st line
2nd line
1000
VGS = 10 V
0.04
100
2nd line
C - Capacitance (pF)
10000
0.03
10000
1200
1000
900
Ciss
600
100
300
Coss
Crss
0.02
10
0
5
10
15
20
25
0
10
0
30
20
40
60
80
ID - Drain Current (A)
2nd line
VDS - Drain-to-Source Voltage (V)
2nd line
On-Resistance vs. Drain Current and Gate Voltage
Capacitance
Axis Title
1st line
2nd line
VDS = 120 V
4
100
2
0
10
0
3
6
9
12
VGS = 10 V, ID = 8.3 A
2.0
1000
1.7
1st line
2nd line
1000
VDS = 35 V
2nd line
RDS(on) - On-Resistance (Normalized)
VDS = 75 V
8
6
10000
2.3
10000
ID = 8.3 A
100
Axis Title
10
2nd line
VGS - Gate-to-Source Voltage (V)
8
VDS - Drain-to-Source Voltage (V)
2nd line
0.06
2nd line
RDS(on) - On-Resistance (Ω)
6
1st line
2nd line
0
0
1.4
1.1
100
0.8
0.5
10
-50
-25
0
25
50
75
100 125 150
Qg - Total Gate Charge (nC)
2nd line
TJ - Junction Temperature (°C)
2nd line
Gate Charge
On-Resistance vs. Junction Temperature
S16-2150-Rev. A, 17-Oct-16
Document Number: 76248
3
For technical questions, contact: pmostechsupport@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
SUD80460E
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Vishay Siliconix
TYPICAL CHARACTERISTICS (25 °C, unless otherwise noted)
Axis Title
Axis Title
100
0.2
10000
10000
TJ = 150 °C
1000
1
1st line
2nd line
TJ = 25 °C
0.1
100
0.01
0.001
0.15
1000
0.1
100
0.05
0.2
0.4
0.6
0.8
1.0
TJ = 25 °C
0
10
0
TJ = 150 °C
1.2
10
4
5
6
7
9
10
VSD - Source-to-Drain Voltage (V)
2nd line
VGS - Gate-to-Source Voltage (V)
2nd line
Source-Drain Diode Forward Voltage
On-Resistance vs. Gate-to-Source Voltage
Axis Title
Axis Title
3.5
25
10000
2nd line
gfs - Transconductance (S)
2.9
1st line
2nd line
1000
2.6
2.3
100
2.0
1.7
10
-50 -25
0
25
50
10000
TC = -55 °C
ID = 250 μA
3.2
2nd line
VGS(th) (V)
8
20
TC = 25 °C
1000
15
1st line
2nd line
2nd line
IS - Source Current (A)
10
1st line
2nd line
2nd line
RDS(on) - On-Resistance (Ω)
ID = 8.3 A
TC = 125 °C
10
100
5
0
75 100 125 150 175
10
0
5
10
15
TJ - Temperature (°C)
2nd line
ID - Drain Current (A)
2nd line
Threshold Voltage
Transconductance
20
25
Axis Title
100
ID limited
100 μs
10
1000
Limited by RDS(on)
1
(1)
1 ms
10 ms
DC, 10 s,
1 s, 100ms 100
1st line
2nd line
2nd line
ID - Drain Current (A)
10000
IDM limited
0.1
TC = 25 °C
Single pulse
BVDSS limited
0.01
0.1
(1)
1
10
100
10
1000
VDS - Drain-to-Source Voltage (V)
VGS > minimum VGS at which RDS(on) is specified
Safe Operating Area, Junction-to-Ambient
S16-2150-Rev. A, 17-Oct-16
Document Number: 76248
4
For technical questions, contact: pmostechsupport@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
SUD80460E
www.vishay.com
Vishay Siliconix
TYPICAL CHARACTERISTICS (25 °C, unless otherwise noted)
Axis Title
10000
21
1000
1st line
2nd line
2nd line
ID - Drain Current (A)
28
14
100
7
0
10
0
25
50
75
100
125
150
175
TC - Case Temperature (°C)
2nd line
Current Derating a
Axis Title
ID = 1 mA
190
180
2nd line
IDAV (A)
1000
1st line
2nd line
2nd line
VDS - Drain-to-Source Voltage (V)
100
10000
200
25 °C
10
150 °C
100
170
160
10
-50 -25
0
25
50
75 100 125 150 175
TJ - Temperature (°C)
2nd line
Drain Source Breakdown vs. Junction Temperature
1
0.000001
0.00001
0.0001
0.001
0.01
Time (s)
2nd line
IDAV vs. Time
Note
a. The power dissipation PD is based on TJ max. = 25 °C, using junction-to-case thermal resistance, and is more useful in settling the upper
dissipation limit for cases where additional heatsinking is used. It is used to determine the current rating, when this rating falls below the
package limit.
S16-2150-Rev. A, 17-Oct-16
Document Number: 76248
5
For technical questions, contact: pmostechsupport@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
SUD80460E
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Vishay Siliconix
TYPICAL CHARACTERISTICS (25 °C, unless otherwise noted)
2
Normalized Effective Transient
Thermal Impedance
1
Duty Cycle = 0.5
0.2
0.1
0.1
0.05
0.02
Single Pulse
0.01
10 -4
10 -3
10 -2
10 -1
1
Square Wave Pulse Duration (sec)
10
100
1K
Normalized Thermal Transient Impedance, Junction-to-Ambient
2
Normalized Effective Transient
Thermal Impedance
1
Duty Cycle = 0.5
0.2
0.1
0.1
0.02
0.05
Single Pulse
0.01
10 -4
10 -3
10 -2
10 -1
Square Wave Pulse Duration (sec)
1
10
1 00
Normalized Thermal Transient Impedance, Junction-to-Case
Vishay Siliconix maintains worldwide manufacturing capability. Products may be manufactured at one of several qualified locations. Reliability data for Silicon
Technology and Package Reliability represent a composite of all qualified locations. For related documents such as package/tape drawings, part marking, and
reliability data, see www.vishay.com/ppg?76248.
S16-2150-Rev. A, 17-Oct-16
Document Number: 76248
6
For technical questions, contact: pmostechsupport@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Package Information
www.vishay.com
Vishay Siliconix
TO-252AA Case Outline
VERSION 1: FACILITY CODE = Y
E
A
C2
H
D
D1
L3
b3
e
b2
e1
L
gage plane height (0.5 mm)
L4
b
L5
E1
C
A1
MILLIMETERS
DIM.
MIN.
A
2.18
MAX.
2.38
A1
-
0.127
b
0.64
0.88
b2
0.76
1.14
b3
4.95
5.46
C
0.46
0.61
C2
0.46
0.89
D
5.97
6.22
D1
4.10
-
E
6.35
6.73
E1
4.32
-
H
9.40
10.41
e
2.28 BSC
e1
4.56 BSC
L
1.40
1.78
L3
0.89
1.27
L4
-
1.02
L5
1.01
1.52
Note
• Dimension L3 is for reference only
Revision: 03-Oct-2022
Document Number: 71197
1
For technical questions, contact: pmostechsupport@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Package Information
www.vishay.com
Vishay Siliconix
VERSION 2: FACILITY CODE = N
E
e
A
b3
E1
E1/2
c2
θ
e
L4
L5
L6
H
D
L3
D1
θ
0.25
(3°)
DETAIL "B"
C A B
(3°)
DETAIL "B"
A1
C
L
(L1)
b1
SEATING
C
PLANE
θ
L2
GAUGE
PLANE
H
C
(b)
c1
3x b
2x e
c
2x b2
MILLIMETERS
MILLIMETERS
DIM.
A
MIN.
2.18
MAX.
DIM.
MIN.
2.39
L
1.50
A1
-
0.13
L1
b
0.65
0.89
L2
MAX.
1.78
2.74 ref.
0.51 BSC
b1
0.64
0.79
L3
b2
0.76
1.13
L4
-
1.02
b3
4.95
5.46
L5
1.14
1.49
c
0.46
0.61
L6
0.65
0.85
c1
0.41
0.56
0°
10°
1
0°
15°
2
25°
35°
c2
0.46
0.60
D
5.97
6.22
D1
5.21
-
E
6.35
6.73
E1
4.32
e
H
2.29 BSC
9.94
0.89
1.27
Notes
• Dimensioning and tolerance confirm to ASME Y14.5M-1994
• All dimensions are in millimeters. Angles are in degrees
• Heat sink side flash is max. 0.8 mm
• Radius on terminal is optional
10.34
ECN: E22-0399-Rev. R, 03-Oct-2022
DWG: 5347
Revision: 03-Oct-2022
Document Number: 71197
2
For technical questions, contact: pmostechsupport@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Application Note 826
Vishay Siliconix
RECOMMENDED MINIMUM PADS FOR DPAK (TO-252)
0.224
0.243
0.087
(2.202)
0.090
(2.286)
(10.668)
0.420
(6.180)
(5.690)
0.180
0.055
(4.572)
(1.397)
Recommended Minimum Pads
Dimensions in Inches/(mm)
Return to Index
Return to Index
APPLICATION NOTE
Document Number: 72594
Revision: 21-Jan-08
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3
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Revision: 01-Jan-2022
1
Document Number: 91000